Gorilla, the leader of Video Intelligence and IoT Technology, has been invited to showcase its cutting-edge facial recognition technology through its Smart Greeting Solution at the premier international IT forum, WCIT 2017. The Smart Greeting Solution applies facial video analytics and deep learning algorithms to identify VIP guests from the moving crowd in the event venues.At WCIT 2017, Gorilla demonstrates the integration of its proprietary and patented to smart machines and embedded systems. The Smart Greeting Solution has the ability to scan and identify VIP guests from the thousands of walk-in visitors in real-time, by comparing facial features with the VIP guest profiles from the database. Once the system verifies the guest, a personal message will be pushed to a big screen to greet the guest.Gorilla's latest facial recognition technology can be used in both open and constrained environments. In an open-environment, the system conducts watch list of the public area, captures facial features at any angle, and identifies authorized guests seamlessly from a distance while in motion without needing to interact with the camera which could be used for crime detection and monitoring public spaces, as well as delivering customer experiences that drive engagement for the retail and hospitality industry. The same biometric technology can also be utilized to enhance security and access control, which requires the identified person to stand still at a specific entry point for the camera to scan in a constrained environment. The solution offers scalable computing and efficiency to perform analysis based on a comprehensive database of profile information with facial features."Gorilla's comprehensive cloud computing infrastructure is designed to increase computing power and efficiencies to provide better performance and accuracy for deep-learning and video analytics technology," said Dr. Spincer Koh, CEO, Gorilla Technology.Businesses are relying on the wealth of information collected by smart machines and embedded systems to make critical decisions, as they provide valuable feedback for improving processes and operational efficiencies. For this reason, the demand for intelligent video analytics will continue to progress and drive innovation as industries realize the benefits of data collection. These factors will ultimately contribute to growth opportunity for a range of applications and adoption across various industries.About GorillaGorilla Technology, a privately held company established in 2000, is a global leader in video intelligence and IoT technology. It develops a wide range of video-centric and content management applications including smart retail, smart school, smart enterprise, smart surveillance, and broadcast media. With VeMo technology, Gorilla applies its machine learning and deep learning algorithms, enabling automation of digital streams processing and comprehensive video analytics to create value-added services for expanding business opportunities.Identify VIP's from thousands of walk-in visitors. Send push notification greeting messages.
SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, today unveiled its latest 0.18-micron CMOS based Ultra Low Leakage (180nm ULL) process technology. Together with its partner, VeriSilicon Holding Co Ltd, to jointly announce the release of 180nm ULL physical IP design kit to serve the fast growing Internet-Of-Things (IoT) Sensor Hub IC market application.SilTerra's 0.18-micron ULL technology offers its thin gate CMOS devices with extreme low leakage current, which is 95% less than the generic 0.18-micron CMOS device leakage current. The merit of designing with ultra low leakage CMOS device is to prolong the battery life of the IoT edge devices, such as Smart Metering, Temperature / Humidity Sensor, RF Proximity Tag, Smart lighting, Smart Tag / Beacon as well as wearable sport gadgets.This technology is developed with reduced process masking steps and supported with multi-Vt options which enable our customers to optimize their chip design for performance and power consumption.The 180nm ULL technology features the smaller and silicon proven 2.97 square micron 6TSRAM bitcell which is suitable for the high density embedded memory design. In addition, the technology offers modular process option such as RFCMOS passive and active devices, as well as embedded Flash memory, which is ideal for single System-On-Chip (SoC) solution for IoT sensor hub IC design.To align with SilTerra 180nm ULL technology launched, VeriSilicon releases the full package of ultra low power physical IP design kit which includes 7 tracks standard cell library, Memory compilers and Programmable Circuit Under Pad (CUP) IO library. The silicon validated design kit would enable customer to shorten design cycle time and lowering the design risk."Internet of Things (IoT) is the next innovation wave that is going to reinvent every industry of our world, with 50 billion IoT devices expected to be deployed by 2020. SilTerra has been very focused in developing technology roadmap and IPs to help our customers design critical IoT building blocks such as microcontrollers (MCU), sensors (MEMS), and Bluetooth Low Energt (BLE). Today I am pleased to announce the release of SilTerra 0.18-micron ULL technology and its associated PDK and IP's specially for customers who need extreme low power and cost effective technology based on SilTerra's mature, proven, high-volume 0.18-micron technology platform to design IoT applications such as remote sensors, wearable, smart meters, and low-power embedded systems. We believe this platform provides the best cost/performance and time to market advantage to our customers to accelerate their business in the fast growing IoT market." quoted Yit Loong Lai, Executive Vice President of Sales & Marketing of SilTerra.For additional information on SilTerra or its services, please visit www.silterra.com
Since the elimination of lead (Pb) from most solders in the last 20 years, new challenges for solder and electronics assembly have arisen, as solder has been redefined by its evolving applications in a wide variety of electronics assembly markets.Indium Corporation, the global leader for high-reliability solders, recently partnered with 3S Silicon Tech Incorporated, to provide a technology forum featuring technical discussions on Achieving Solder Joint Reliability for Automotive Applications. The event took place at Sheraton Hsinchu Hotel in ZhuBei city, Taiwan, on August 11, 2017.At the event, technical experts from both companies detailed high-reliability technology and materials for automotive applications, including alloys and low-temperature solders, reliable materials for system-in-package (SiP) applications, power semiconductor development and applications in the automotive market, and vacuum oven reflow technology and applications.Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, shared detailed information on how high-reliability soldering alloys and low-temperature solder paste can be used for module and SiP applications.SiP technology combines various components or chips into one silicon module. This unique technology has the advantages of high-performance and lower manufacturing costs. SiP modules are being adopted by electronics and automotive industries at an increasing rate, especially for use in infotainment systems.Key elements of Dr. Lee's presentation included recent developments by Indium Corporation's Research and Development team. The developments discussed included:- High-reliability alloys, which perform better than SAC for automotive applications, enable reliable solder interconnect when thermal cycling up to 150 degree C. Indium Corporation's Indalloy 276 and Indalloy 271 deliver this solution.- Low-temperature alloy Sn20In2.8Ag can be used to reduce thermal stress and warpage issues for assembly.- Indium Corporation provides a variety of high-temperature Pb-free offerings for power semiconductor die-attach in the form of silver- (Ag) and copper- (Cu) sintering pastes, as well as the standard HTPbF solder pastes, BiAgX and HT-BiAgX.Reliability, along with high thermal and electrical conductivity are major concerns for automotive electronics. With the increasing use of powerful motors in electric vehicles, the need for high-reliability, especially under extreme-temperature thermal cycling and high-temperature operation, is more critical than ever. The automotive industry requires a Pb-free solder paste that can achieve high reliability while also meeting the fine-feature printing circuit board requirements needed by mobile device manufacturers.Dr. Lee's insights explained how silver-sintering materials applied in the final joint as low-porosity, pressureless sintering of nano-Ag solder for high-temperature semiconductor die-attach can significantly reduce thermal fatigue stress and also produce very low-voiding results. This technology is also beneficial for high-temperatures and electrical conductivity. Dr. Lee also provided a view into low-temperature solder material development.Through this seminar, it is clear that Indium Corporation is in the forefront of R&D technology as it seeks to produce advanced materials that achieve the reliability requirements of the automotive industry.Dr. Ning-Cheng Lee, Vice President of Indium Corporation, talks about high reliable soldering alloys and low temperature solder paste for SiP packaging.
Leading semiconductor test equipment supplier Advantest Corporation's (TSE: 6857) VOICE 2017 Developer Conference this past May marked the event entering its second decade with 113 technical breakout sessions, two Partners' Expos, 29 technology kiosks and multiple networking opportunities for members of the semiconductor test industry.This year's 11th edition featured dual sessions on May 16-17 in Palm Springs, Calif., and on May 26 in Shanghai, China, where the event had been held once before. Altogether, more than 450 people attended the events, over half of whom represented Advantest customers and partners.At the US event, there were 88 technical presentations while the China conference had 25 papers. Forty-five% of the papers in Palm Springs and 60% in Shanghai were either written or co-authored by customers. In total, VOICE 2017 featured technical papers from 22 companies representing 12 countries. The papers were reviewed by a technical committee that included 41 Advantest customers from 19 companies.VOICE is made possible by the organizational work of a Steering Committee, made up of volunteer representatives from Advantest and its customers, and the support of event sponsors, which reached a new high of 25 companies this year including 10 new sponsors. Industry organizations including SEMI, the Global Semiconductor Alliance (GSA), VLSIresearch, IC Insights and IHS also returned to support VOICE in 2017.Best paper awardsAt each VOICE conference, attendees vote to select the best technical presentations. This year, VOICE went paperless with all voting and feedback done with the mobile app. At the US event, Edwin Lowery, Shiyang Deng and Aether Lee, all from Advantest, won for their paper on "Instrument Synchronization in SmarTest 8: RF to MX to DC to Digital." In China, Zhaoyang Wang of NXP and co-authors Lydia Jiang, Kai Kang, Qiannan Ren and Peng Wang from Advantest were recognized for their presentation on "Testing Automotive Airbag System Devices on the V93000."VOICE 2018VOICE 2018 will take place in the US and Taiwan; watch for more details coming soon at https://voice.advantest.com.
Digital transformation in manufacturing is one of the key topics for the upgrading and transformation of Taiwan industries. It also shows new types of business models are emerging and leveraging the disruptive technologies. While industry 4.0 being welcomed overwhelmingly by the governments around the globe such as "Made In China 2025" and "Internet Plus", the enterprises learn to quickly response to the market using the powerful features of product lifecycle management (PLM) software and advanced IT technology for analyzing the data gathered by smart sensors.Faced with the obstacles to Taiwan's continued industrial development, the supply chains and ecosystems are providing the quick adjustment for introducing end products, making a quick grab for market share or return on investment because there is an urgent need for many companies.However, building the culture of digitalization in various organizations are not easy tasks. The current digitalization investments from enterprise may not reflect the real revenue growth yet. Companies worry more about how things going for the Industry 4.0 development. In this interview, we invite Mr. Leo Liang, Senior Vice President and Managing Director of Greater China, Siemens PLM Software, to talk about his observation and viewpoints of smart manufacturing.The disruptive innovations can profoundly affect the functioning of existing industries by changing company's value chains. And the Internet of Things (IoT) technology is one of the major driving forces to enable innovation breaking the information barriers between supply chains and ecosystems. Leo highlights, lower cost manufacturing is no longer the only thing. The recent focus shifts in thinking- of understanding consumers' needs. Through the innovative PLM software systems, it transforms the needs to a realistic product and enables the power for change. Uber, AirBnB and several business innovations like mobile payment services have uncovered many good examples for great benefits in different business sectors.Siemens PLM Software provides complete product portfolios to demonstrate real values of digital transformation through Digital Twin. Digital Twin is not only a tool set of computer simulation models that provide the means to design, validate and optimize products in the virtual world. Today, Leo talks continuously, Digital Twin expands to manufacturing process or production facility. These technologies use data from sensors that are installed on physical objects to represent their real time status, working condition or position to help fabricating the new production lines to provide the flexibility for achieving the goal of smart manufacturing.MindSphere industrial clouds fulfill the needs of enterpriseAdvances in IT technologies of Siemens PLM Software have made it possible to broaden the scope of the Digital Twin to include many more capabilities, information, inputs and outputs from new product initiatives to flexible factory design. For strengthening enterprises new product development to the market much faster than ever, Siemens build MindSphere, an open IoT operating system (PaaS) and cloud infrastructure for industry. The large volumes of data generated during the production process in the Manufacturing Execution System (MES) level by IoT sensors or legacy systems need to be saved, and analyzed in real time and turned big data into smart data. And the open architecture will allow for a whole new dimension of services leveraging cloud solutions to capture process parameters, machine conditions and presented the statistical results using smartphone. This contributes to improved asset management and energy efficiency through data analysis and simulation.Meanwhile, combining with end products and delivering to end users, it will help to track real response of consumers. The collected information will link to MindSphere cloud platforms to make product design, manufacturing process improvement and exploring better use cases as a Closed Loop Manufacturing system for further increasing productivity, flexibility and shorter times to market.MindSphere enables manufacturing companies to streamline and digitalize their entire business process through the cloud technology, seamlessly integrating with the systems to develop important decision. Gathering real time manufacturing parameters to monitor the details of each process can begin at any point in the factory, from product design to service, and can extend digitalization gradually, depending on current needs of companies. MindSphere allows analyzing production assets and products as they perform and providing the insights into the entire value chain for continuous optimization. This will help customers of Siemens PLM Software to develop consistent data models and streamline the manufacturing process, product development and shorten the time to market.Taking the machinery maintenance as an effective ROI example, downtime is a serious threat to any manufacturing business. Through MindSphere cloud services, maintenance managers take preventive measures before crises occur in order to maintain machine tool and spare parts availability, Leo adds. It will turn passive maintenance to preventive maintenance strategy and gain results showing in financial reports.Acquiring Mentor Graphics to extend product offerings for servicing more industriesTo further accelerate the innovation for Siemens' customers and help them find the paths to digital transformation to drive production efficiencies and optimize the operation of their products in the markets, Siemens has made a significant move into the software space with acquisitions including UGS, LMS, Camstar, Polarion, and CD-adapco in the past few years. With recent acquisition of Mentor Graphics, Siemens will continue its proven paths of new technology into the industry's product lifecycle management software suite. Mentor Graphics is a leading EDA solution provider with well established electronics IC, systems design, simulation and printed circuit board manufacturing solutions. The combination provides mechanical, thermal, electronic and embedded software tools to the companies that develop products and strengthen the core competence.Comparing with other industries within the sectors including financial, insurance and retail services, manufacturing industry has more challenges while going digital transformation. Most of original traditional solutions for factories are not fully digital offerings. Even today, collecting control information of some legacy systems or machinery is still difficult to get. The industry shifts are creating new business models and moving from delivering a product to delivering smart, connected products as a service to customers. This trends of connected products and connected customers help fuel innovation. And Siemens PLM Software provides complete solutions and tool sets to work with customers to push toward digitalization of all aspects of manufacturing.Leo also highly suggests enterprises continuously to develop new products with new ideas leveraging the cloud technology for fast responding user's versatile tastes and preferences. The momentum needs to maintain both in manufacturing process and product design.With Siemens PLM Software solutions, manufacturing companies have better insight into every process's performance. All the software tool sets and product portfolio of Siemens offerings are proven and integrated practices in Siemens factories. This will benefit Siemens's customers bridging the gap to digital transformation and save the time for developing time-to-market products.Leo Liang, Siemens PLM Software Senior Vice President and Managing Director of Greater China, outlines the digitalization challenges for enterprises
Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste - a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.Indium11.8HF-SPR specifically addresses the move toward type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.Indium11.8HF-SPR benefits:- Halogen-free per IEC 61249-2-21 test method EN14582- High-transfer efficiency through small apertures (≤ 0.66AR)- Long stencil life (>12 hours)- Eliminates hot and cold slump to inhibit bridging and solder beading defects- Avoids the potential for HIP and graping defects with a unique oxidation barrierIndium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.comIndium Corporation.
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of its Switchtec PAX advanced fabric Gen3 PCIe switch providing high-performance fabric connectivity for scalable, multi-host systems and just a bunch of flash (JBOF) supporting single root input/output (I/O) virtualization (SR-IOV), NVMe and multi-function endpoints. The new device will be showcased in Microsemi's booth #213 at the Flash Memory Summit Aug. 8-10, 2017.Hyperconverged systems are evolving towards composable/disaggregated infrastructures (C/DI) such as rack scale architecture to meet the rapidly changing demands on resources and storage capacity of next-generation applications. PAX advanced fabric PCIe switches provide a scalable, low latency and cost-effective solution to the disaggregation of computing, networking, graphics processing units (GPUs) and storage resources. These PAX PCIe switches, which are flexibly interconnected with configurable high-speed fabric links, virtualize PCIe domains and SR-IOV endpoints. System development is simplified through a fabric application programming interface (API) and the ability to utilize off-the-shelf NVMe host drivers, significantly reducing time-to-market for complex multi-host systems."As we work closely with industry leaders, it became clear there's demand for Microsemi to expand our PCIe switch portfolio to support next-generation disaggregated architectures," said Derek Dicker, vice president and business unit manager for performance storage at Microsemi. "Our PAX advanced fabric PCIe switch is pin-compatible to our PSX storage and PFX fanout PCIe switches, providing our customers a simple upgrade path to building SR-IOV-enabled and composable disaggregated systems while supporting our ability to gain market share."According to market research firm IDC, the total worldwide addressable opportunity for vendors with C/DI is US$34.5 billion in 2017. The firm also expects this opportunity will grow at a modest compound annual growth rate (CAGR) of 7.4% and reach US$45 billion in 2020. Microsemi's Switchtec PAX advanced fabric PCIe switch is well-aligned to these growth trends, as it enables customers to leverage the device for the development of next-generation C/DIs.Microsemi's Switchtec PAX family comprises switches from 96 lanes to 24 lanes, providing:- High-performance PCIe fabric connectivity overcoming the limitations of the PCIe Specification for rack scale multi-host systems- Multi-host sharing of SR-IOV and multifunction endpoints- Virtualization of PCIe domains and SR-IOV NVMe solid state drives (SSDs)- Software development kit (SDK) for virtualization of other SR-IOV endpoints, and for enclosure management- The most flexible port bifurcation in the industry, from x2 to x16 lanes per port- The highest port density, with up to 48 ports- Advanced error reporting- Error containment for surprise-plug and unplug to prevent system crashes- Advanced diagnostics and debug features to identify, diagnose and fix problems- Separate Refclk Independent SSC (SRIS) for cabled PCIe and lower cost system designsProduct AvailabilityMicrosemi's Switchtec PAX advanced fabric PCIe switches are sampling now to lead customers. For more information, visit https://www.microsemi.com/products/storage/switchtec-pcie-storage-switches/switchtec-pcie-advanced-fabric-switches or contact sales.support@microsemi.com.
Fifth-generation wireless technology (5G) is attracting a lot of public attention. These industrial communication standards are under developing and preparing to launch for the public services from 2020. Japan, China, Korea and Taiwan governments set several 5G action plans aiming to gain the leadership in the deployment of 5G networks. There are some substantial investments in new infrastructure and testing results show the possibility to provide 5G services earlier in some cities.The business opportunity for 5G is massively related to Internet of Things (IoT), an evolution that will take the internet applications into new territories including self-driving vehicles, robotics, biomedical medicine, automated factories, smart cities and the development of massive sensor networks in various public services. It will speed up the velocity to change our daily life and gain benefits from offering convenience in the modern cities.In the other hand, it has the critical importance of electromagnetic (EM) field interactions in human body recently. The new developed type of medicine to use specific frequencies modulate cellular function to restore or maintain health been recognized. The development of biomedical electronics and advanced medical solutions will be the next big steps for Taiwan technology industries.Nearly all of these wireless technologies put radio frequency energy right on the human body, increasing exposure to radio waves among us. The interaction between human and electromagnetic fields have been highly considered by research institutes and technology industries. Auden Techno Corp and IEEE EMC Taipei Chapter join together to host the event named "Next generation smart life with Bio-electromagnetics and advanced telecommunication technology forum" at Evergreen International Convention Center of Chang Yung-Fa Charity Foundation on July 6th 2017, featuring a variety of technology sessions and various afternoon sessions with three major tracks. This is also the second consecutive year that both organizations to host this event together.The morning sessions with keynote speeches covering several main themes of IoT education program, Electromagnetic measurement system for 5G millimeter wave frequency bands, Bioelectronic medicine for seizure treatments and 5G massive MIMO design and verification.Auden Techno Corp, founded 1981, provides long time R&D services to help customers to build and manufacture antenna systems to fit the requirements of mobile communications, automotive electronics, smart home and industrial applications. For providing better service to the customers with complete front-end design, pre-development testing and product authentication, Auden invests several compliance testing laboratories cross Taiwan straits including the first SAR (specific absorption rate) testing Lab in Taiwan. By actively leveraging the testing lab efforts and RF technology core strength, Auden tries to help Taiwan ICT industry to shorten the gap to develop bioelectronics medical devices aiming the professional medical solutions especially the business opportunities of FDA regulated Class 3 medical devices.NTU advanced IoT education programs cultivate young talentsThe keynote speech of Professor Ruey-Beei Wu is focus on the education programs for cultivating the young talents aiming IoT and cloud solutions. Professor Wu served as the President of the Institute for Information Industry (III), Taiwan government funded software technology research and development institutes. He is very familiar with Taiwan ICT industries. His presentation starts from the technology trends and current stage of IoT development. While market research revealing smart services as a key success factor of IoT innovation, he highlights the importance of cultivating cross-domain experience for Taiwan young talents. And it is the sure pursuit for the universities to enable industrial collaboration and offer training programs for the innovative talents.As changing application landscape makes it vital for the IoT services to continuously evolve and pursue greater achievements through innovation and education. According to the research reports, the big five IoT applications are manufacturing, healthcare, retail, energy and transportation. Wu points the smart manufacturing services will have the best opportunity in Taiwan. He started to design IoT education programs in the Department of Electrical Engineering of National Taiwan University (NTU) since 2016. This cornerstone program includes the 42-hour classes for introducing of IoT industry and the last 12 hours for term report and corporative project demonstration. In the program, there is one 12-hour session called hands-on design involving different creative IoT ideas and design implementation. The students use open source software and some simple hardware development kits to build a working system such as car parking automatic billing service. Those creative ideas mostly come up with their own experiences in everyday life. The final term report session is even more excitements for the students to compete and learn by demonstrating the design implementation. Through this program, students could learn IoT software programming, web interface and technology to access sensors making them become to be a creator or innovator in IoT, not just a simply consumer, Wu highlighted.In 2017, the new courses with development of IoT capstone programs, Professor Wu kicks off on special project program to let students to choose the various topics with more fun in developing new system concepts and information infrastructures. These advanced IoT education programs have been widely recognized and try to set cooperative plans to integrate with high school summer camps or experimental programs. It starts from small ideas of everyday living environment and gains the experience to show students for developing the specific services to solve the specific problems. These programs will also help the next emerging technology development like artificial intelligence or immersive reality.Upbeat SAR testing systems for 5G frequency bandsThe 5G mobile device RF exposure and equipment authorization requirements under 6 GHz frequency bands have under developed in FCC and IEEE. Especially the standards to provide additional guidance for SAR measurements that addresses devices operating in the sub-6 GHz range and how RF exposure compliance should be reported and the availability of testing systems are all urged to kow by industries and technology community. The chipset makers, system design houses are introducing different implementation to try to take lead in the industry. The standards, regulated compliance, testing instrument are the key to verify the design they have.Professor Niels Kuster founded IT IS Foundation and Schmid & Partner Engineering AG(SPEAG). Both organizations have developed instrumentation, methods, and procedures for international standards to ensure that SAR measurement standards are implemented for evaluating compliance of wireless products with electromagnetic exposure guidelines.Auden cooperated with SPEAG for 20 years and represented in Taiwan and China market to introduce SPEAG series testing instruments or systems including cSAR3D, EM Phantom, DAK, TDS and Sim4Life systems.The keynote speech of Professor Kuster gets participants' attentions on the topic named "Novel Electromagnetic System for Demonstration of Compliance of 5G Millimeter Wave Near-Field Sources with Safety Guidelines". His presentation is trying to demonstrate the results for audiences to show recent development of electromagnetic systems for measuring SAR and power density in millimeter wave (MM wave) environments.Professor Kuster highlights the status of current SPEAG systems measure SAR to 10GHz. Using the existing design of E-field probe and maintaining the same Phantom surface is in the SPEAG systems. But the calibration system needs to be redesigned for fitting the new requirements. The draft proposal sent to FCC and had early discussion. It will have a draft to be released in October 2017.The SAR testing systems with frequency bands between 10 to 110 Ghz have started to design and evaluate in SPEAG. The calibration systems and E-field probes will have brand new concept to implement. And the simulation algorithm and testing optimization is also addressed and good results in the beginning stage. The schedule to release the draft will be the end of 2017.There are several cool topics in the forum to get attentions. Professor Jyh-Yih Hsu, National Chung-Hsing University - Department of Applied Economics, talks the topic of exploring business models in the development of IoT and big data analytics. His speech provides the unique angle of Taiwan manufacturing service providers strengthening in the semi-automation management scope and establishment of production know-how in various sectors. He observes the unique position of Taiwan manufacturing with the capability of flexible and adaptive manufacturing process to win the orders from international brands.In the MIMO antenna design session, Mr. Kin-Lu Wong, Professor of NSYSU Antenna Lab, presented the testing results of various antenna design for mobile devices in the sub-6 GHz spectrum bands. His presentation shows ways to more efficiently access the radio spectrum over the design with 4 or even 8 to 12 antennas in the new smartphone models or other mobile devices.The motivation behind his study is the exponential growth in wireless applications. The effective bandwidth will need to reach at least 2 Gbps for improving the user's experience in the 5G era. The momentum in designing, testing and implementing these various kinds of systems will be continuing to take bold steps within the coming years. Although the standards still under associating with different organizations, it might not be that far away because some companies are talking they will have 5G systems up and running by 2020. We will follow these trends and continue to see the new things to change our everyday life in the future.Afternoon session hosting three parallel tracks to provide further viewpointsThere are three parallel tracks and total 18 discussed topics to choose from participants in the afternoon sessions. In the 5G communication track, Professor Cheng-Nan Chiu, Communications Engineering Department of Yuan Ze University, as a moderator to introduce speakers to give speech covering topics of 5G technology roadmaps, measurement methods, antenna applications from LTE-M to NB (Narrow Band) IOT & LPWAN Technology. Professor Niels Kuster also gives another presentation named "Combined HPC-enabled computational platform with an advanced scanning system for evaluating performance and EMC in the near- and far-field of 5G Millimeter Wave Transmitters.In the Biomedical Application and Electromagnetic track, the moderator JianJang Huang, professor of Communications Engineering Department, Yuan Ze University, invites speakers from Taiwan National Health Research Institutes to address topics of Application and Safety test of Electrical Stimulator, Aesthetic Medicine and Phased array dipole antenna for cancer treatment modality. Dr. Erdem Ofli, Product Head (IT'IS Foundation and ZMT) also give his speech of "Simulation Platform and Validated Hardware Solutions for Active Implant MRI Safety Assessment According to ISO/TS10974".The IoT and application track, hosted by Professor Ding-Bing Lin, invites speakers from ITRI, Institute for Information Industry and UL. The topics include IoT in mass transportation systems, THREAD and IoT development, big data analytics and platform. The participants have the chance to get to know the trends of IoT and digitalization development of different industries.With the share the viewpoints of invited talented speakers and professors, this forum is trying to provide the technology development of 5G, Bio medical and electromagnetic. And the hottest topic of IoT development to help Taiwan technology industries and research institutes to explore the further opportunities of Taiwan.Prof. Dr. Ding-Bing Lin, the Chairman of IEEE Taipei Chapter EMC SocietyDr. Yu-Bin Chang, the Chairman of Auden Techno. Corp.Auden bridging electromagnetic development and IoT solutions
Clientron Corp., a world leading provider of POS systems, announced it will be displaying its full range of POS product innovations to comply with multi-payment solutions and various POS peripherals at RetailNOW 2017, the largest annual gathering of the POS Ecosystem, from grocery and hospitality to retail and other specialties, which will take place on Aug. 7-8.During this show, Clientron will present the innovative Duo650, which is distinguished from common POS by featuring two upright touch displays bonded back-to-back to enhance the experience of interaction between consumers and clerks. The touch control function on the customer display also enables customers to perform some operations such as seat selection at movie theaters or airport check-in counters. Furthermore, stores can use the displays for advertisements to boost their return.Another focus of the show will be Clientron's all new multi-functional Bello series featuring high integration with 12" / 15" / 15.6" touch screen options, supporting dual customer displays as well as a built-in NFC smart card reader with EMV L1/ L2 for user experience enhancement. Bello just won the"Taiwan Excellence Award 2017" this year for its innovation and the best quality design, which makes it stand out from numerous products as the best choice for POS applications.In addition, Clientron will showcase its butterfly light-weight POS terminal Wing650 with a flexible dual-hinge stand; the mainstream Ares650 and the high performance Ares756 powered by the Intel Skylake Core i3/i5/i7 quad-core processors with an advanced ultra-slim system design. Moreover, we will be exhibiting the most economical POS terminal PT3200, which is equipped with an Intel power efficient quad-core processor to offer a fanless system with a long life span that carries an affordable price tag. Also at this event, a variety of extended POS peripherals will be exhibited."Seizing the booming opportunity for multi-payment solutions, Clientron delivers flexible integrated POS systems and customer-centric design services that support retailers to meet the ever-changing demands of their customers and improve overall business operation," said Kelly Wu, President & CEO of Clientron Corp.To know more about Clientron's design, manufacturing capabilities and services, please visit Clientron at booth #740, Paris Las Vegas. Clientron website: www.clientron.comClientron to show its all new POS terminals at RetailNOW 2017
Gorilla Technology, a global provider of video intelligence and IoT technology, today announced the launch of a range of cloud-based solutions within a single platform enabling restauranteurs to easily manage store operations. With Gorilla's technology, the restaurant business can improve in-store communication, efficiencies and customer satisfaction through real-time data analytics extracted from smart signage, staff management systems, and video surveillance feeds.At the RLPSA Conference, Gorilla will be demonstrating its latest developments and implementations to the restaurant business:- Smart RetailSeamlessly manage in-store analytics extracted from video feeds, advertising content to deliver personalized experiences with analysis of customer behavior, feedback collection, traffic and people flow in queuing area.- Attendance Management and Mobile LearningCentralized management system to effectively track and enable physical and remote clock-ins/out hours with two-factor authentication and accurately identify authorized staff in a secure environment. Deliver training remotely using mobile learning solution to keep staff informed and up-to-date on company announcements or news.- Smart SurveillanceGroundbreaking real-time analytics technology for asset protection to monitor, track, analyze, perform watch lists for VIPs or unwelcome guests, intrusion detection in restricted areas, and alert staff to guard against loss and shrinkage."Gorilla offers all-in-one solution of in-store analytics, staff management, and video surveillance to help restaurant owners manage every aspect of their business with less manual effort, which allows them to focus on increasing profitability and catering to guests,"said Dr. Spincer Koh, CEO, Gorilla Technology.Visit Gorilla Technology at the Annual RLSPA Conference at the M Resort, Booth#100 in Las Vegas from July 31 to Aug 01 to learn more about the restaurant management solution.About Gorilla TechnologyGorilla Technology, a privately held company established in 2000, is a global leader in video intelligence and IoT technology. It develops a wide range of video-centric and content management applications including smart retail, smart school, smart enterprise, smart surveillance, and broadcast media. With VeMo technology, Gorilla applies its machine learning and deep learning algorithms, enabling automation of digital streams processing and comprehensive video analytics to create value-added services for expanding business opportunities.Gorilla's video intelligence solution transforms the restaurant business with innovative technology.