In the past few years Tatung Co. has been working with Microsoft to develop Tatung Cloud, which carries a strategic mission to support a variety of business goals, as well as to realize a more satisfying customer experience. Pillared by the Microsoft Azure platform, Tatung Cloud has implemented Tatung IoT services in various enterprise and commercial sectors. "Smart Living" is a recent milestone that fulfills Retails Beacon and Tatung Smart Appliances.Now the customers can enjoy a pleasant experience when shopping online or in Tatung 3C retail stores, and when using Tatung's home appliances such as smart TV, air conditioning, air purifier, and rice cookers. Tatung Cloud brings the status and controls of all the smart appliances to the users, proactively tracks and learns the user behaviors, and is able to provide recommendations of the best efficient configurations and service reminders.The collaborations of Tatung and Microsoft also take place in the fields of Smart and Green Energy Management and Connected Product Management. As the leading advocate for renewable energy and smart energy, Tatung has a wide portfolio of energy products and solutions. For example, Tatung provides end to end solar systems with solar substations for the connection to the grid. It allows decentralized power grid with micro grid management in the regions. The company now owns more than 500 solar system sites in Taiwan. All the solar systems are monitored and managed by Tatung Cloud, then connected to Microsoft Azure Cloud. We leverage the Data Analytics and Machine Learning services in the Azure platform to constantly refine the efficiency and accuracy of the power generation forecast, and other service performances.With the initial success, Tatung looks forward to the continuous collaboration with Microsoft Azure team and expects to create more "smart" value to both companies and to our customers. Together with Microsoft, we will also extend and scale out the successful work we have achieved in Taiwan, to the global market.

Photolithography process, including the steps of photoresist coating, exposure and development, plays a critical role in the manufacturing of semiconductor devices. Accordingly, how to properly control and monitor environmental quality during photolithography process through technologies such as high-precision process environment control and aerosol micro-pollutant removal is instrumental to raising process yield and equipment availability.In light of this, CHD Tech, founded on the core technologies of state-of-the-art air quality control, crafted high-precision micro-control equipment for fabrication environment including thermal control units (TCU) and thermal AMC units (TAU) by refining the high-precision temperature and humidity control technologies as well as particle and airborne molecular contamination (AMC) removal technologies used in clean rooms. It also leverages its core technologies to provide customers with solutions to improve and service old systems for the purpose of ensuring equipment availability and process yield.The needs to maintain and improve existing equipment at 8-inch wafer fab plants in Greater China and the large investments into building new semiconductor foundries in China have spurred considerable demand for clean photolithography process environment. In response to such demand for refinement and improvement in clean fabrication environment technologies, CHD Tech will bring customers more efficient solutions with shorter time-to-market, commented Chih-Wen Cheng, general manager, CHD Tech.There are already quite a few vendors based in Japan and Korea specializing in micro-control technologies for semiconductor manufacturing process environment. Some of them have even become partners with well-known providers of exposure machines or development/coating equipment because of their strong capabilities in temperature and humidity control. Rather than competing head-on with these worthy opponents, CHD Tech decided to gear its development toward a niche market - total solution for mini-environment. In addition to temperature and humidity control, CHD Tech also broadens its product roadmap to include particle/AMC cleaning coupled with automated detection and online analytical systems for organic gases, thereby making itself a total solution provider of micro-control technologies for semiconductor process environment.It should be noted that for the purpose of satisfying a range of environmental control requirements imposed by the photolithography process and helping production equipment engineers effectively troubleshoot, CHD Tech began to offer services including system diagnostics, technology refinement and maintenance improvement in 2012, highlighting the early system diagnostics, quick error detection and response, preventive maintenance and service work can help customers avoid unexpected production shutdown and minimize loss.CHD Tech's experienced service teams help customers perfect their fabrication processWhen commenting on CHD Tech's advantages, Cheng said with operation bases and service teams stationed throughout Taiwan and China, CHD Tech is able to offer prompt technical support to help customers resolve issues within eight hours on average so that customers are assured of the reliability of their photolithography process environment. Furthermore, the CHD Tech service teams comprise professionals with extensive experiences in photolithography process or exposure machine, development and coating equipment. Not only can they help raise maintenance efficiency but they can also provide professional advice on how to improve customers' fabrication environment and enhance operation performance of various process equipment.To enable high-efficiency customer service, CHD Tech maintains a complete inventory of spare parts including leading brand fans, evaporators, expansion valves, gate valves, refrigerant and compressors. In the case that any module of customers' equipment encounters a problem, CHD Tech can quickly replace the failed module with a working spare unit without having to conduct time-consuming on-site repair. This unique service model allows a wide range of issues to be resolved in no time, thereby shortening production downtime and minimizing losses.By providing services on a regular basis, CHD Tech is able to stay aware of any additional needs customers may have, maintain long-term relationships to increase customer retention and build tight collaboration with production equipment engineers, which fosters tremendous values for the future. Therefore, CHD Tech will continue to devote efforts to such overhaul service even though it may take some time to have real contribution to revenues, emphasized Cheng.In summary, CHD Tech takes pride in being a total solution provider of micro-control and micro-measurement technologies for semiconductor fabrication process. It is able to achieve a temperature control precision of ±0.01 degree and a humidity control precision of ±0.5%, likely the only vendor in Greater China capable of doing so. More importantly, CHD Tech is actively targeting tool vendors based in Germany, Japan and the US starting with capturing opportunities in the business of process equipment modification. CHD Tech endeavors to demonstrate its value during the collaboration with these tool vendors and subsequently make its way to becoming a qualified supplier for them. The strategy combining both aggressive and steady approaches is generating results. CHD Tech has made itself a supplier of standard thermal control units to a leading German semiconductor coating and exposure machine manufacturer. It is also being advised and validated by a major American semiconductor process equipment maker to become an official supply partner.CHD Tech's maintenance service for photolithography equipment

Indium Corporation has launched Indium10.1HF Solder Paste, a new solder paste specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance.Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste with a flux chemistry engineered to improve reliability with:- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities- Solder beading minimization- Very low bridging, slump, and solder balling- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes- High print transfer efficiency with low variationIndium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN 14582.For more information about Indium10.1HF Solder Paste, visit www.indium.com/indium10.1HF.For more information about Indium Corporation, visit www.indium.com.Indium Corporation launches new halogen-free, ultra-low voiding Indium10.1HF solder paste

Gorilla, the leader of Video Intelligence and IoT Technology, has been invited to showcase its cutting-edge facial recognition technology through its Smart Greeting Solution at the premier international IT forum, WCIT 2017. The Smart Greeting Solution applies facial video analytics and deep learning algorithms to identify VIP guests from the moving crowd in the event venues.At WCIT 2017, Gorilla demonstrates the integration of its proprietary and patented to smart machines and embedded systems. The Smart Greeting Solution has the ability to scan and identify VIP guests from the thousands of walk-in visitors in real-time, by comparing facial features with the VIP guest profiles from the database. Once the system verifies the guest, a personal message will be pushed to a big screen to greet the guest.Gorilla's latest facial recognition technology can be used in both open and constrained environments. In an open-environment, the system conducts watch list of the public area, captures facial features at any angle, and identifies authorized guests seamlessly from a distance while in motion without needing to interact with the camera which could be used for crime detection and monitoring public spaces, as well as delivering customer experiences that drive engagement for the retail and hospitality industry. The same biometric technology can also be utilized to enhance security and access control, which requires the identified person to stand still at a specific entry point for the camera to scan in a constrained environment. The solution offers scalable computing and efficiency to perform analysis based on a comprehensive database of profile information with facial features."Gorilla's comprehensive cloud computing infrastructure is designed to increase computing power and efficiencies to provide better performance and accuracy for deep-learning and video analytics technology," said Dr. Spincer Koh, CEO, Gorilla Technology.Businesses are relying on the wealth of information collected by smart machines and embedded systems to make critical decisions, as they provide valuable feedback for improving processes and operational efficiencies. For this reason, the demand for intelligent video analytics will continue to progress and drive innovation as industries realize the benefits of data collection. These factors will ultimately contribute to growth opportunity for a range of applications and adoption across various industries.About GorillaGorilla Technology, a privately held company established in 2000, is a global leader in video intelligence and IoT technology. It develops a wide range of video-centric and content management applications including smart retail, smart school, smart enterprise, smart surveillance, and broadcast media. With VeMo technology, Gorilla applies its machine learning and deep learning algorithms, enabling automation of digital streams processing and comprehensive video analytics to create value-added services for expanding business opportunities.Identify VIP's from thousands of walk-in visitors. Send push notification greeting messages.

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, today unveiled its latest 0.18-micron CMOS based Ultra Low Leakage (180nm ULL) process technology. Together with its partner, VeriSilicon Holding Co Ltd, to jointly announce the release of 180nm ULL physical IP design kit to serve the fast growing Internet-Of-Things (IoT) Sensor Hub IC market application.SilTerra's 0.18-micron ULL technology offers its thin gate CMOS devices with extreme low leakage current, which is 95% less than the generic 0.18-micron CMOS device leakage current. The merit of designing with ultra low leakage CMOS device is to prolong the battery life of the IoT edge devices, such as Smart Metering, Temperature / Humidity Sensor, RF Proximity Tag, Smart lighting, Smart Tag / Beacon as well as wearable sport gadgets.This technology is developed with reduced process masking steps and supported with multi-Vt options which enable our customers to optimize their chip design for performance and power consumption.The 180nm ULL technology features the smaller and silicon proven 2.97 square micron 6TSRAM bitcell which is suitable for the high density embedded memory design. In addition, the technology offers modular process option such as RFCMOS passive and active devices, as well as embedded Flash memory, which is ideal for single System-On-Chip (SoC) solution for IoT sensor hub IC design.To align with SilTerra 180nm ULL technology launched, VeriSilicon releases the full package of ultra low power physical IP design kit which includes 7 tracks standard cell library, Memory compilers and Programmable Circuit Under Pad (CUP) IO library. The silicon validated design kit would enable customer to shorten design cycle time and lowering the design risk."Internet of Things (IoT) is the next innovation wave that is going to reinvent every industry of our world, with 50 billion IoT devices expected to be deployed by 2020. SilTerra has been very focused in developing technology roadmap and IPs to help our customers design critical IoT building blocks such as microcontrollers (MCU), sensors (MEMS), and Bluetooth Low Energt (BLE). Today I am pleased to announce the release of SilTerra 0.18-micron ULL technology and its associated PDK and IP's specially for customers who need extreme low power and cost effective technology based on SilTerra's mature, proven, high-volume 0.18-micron technology platform to design IoT applications such as remote sensors, wearable, smart meters, and low-power embedded systems. We believe this platform provides the best cost/performance and time to market advantage to our customers to accelerate their business in the fast growing IoT market." quoted Yit Loong Lai, Executive Vice President of Sales & Marketing of SilTerra.For additional information on SilTerra or its services, please visit www.silterra.com

Since the elimination of lead (Pb) from most solders in the last 20 years, new challenges for solder and electronics assembly have arisen, as solder has been redefined by its evolving applications in a wide variety of electronics assembly markets.Indium Corporation, the global leader for high-reliability solders, recently partnered with 3S Silicon Tech Incorporated, to provide a technology forum featuring technical discussions on Achieving Solder Joint Reliability for Automotive Applications. The event took place at Sheraton Hsinchu Hotel in ZhuBei city, Taiwan, on August 11, 2017.At the event, technical experts from both companies detailed high-reliability technology and materials for automotive applications, including alloys and low-temperature solders, reliable materials for system-in-package (SiP) applications, power semiconductor development and applications in the automotive market, and vacuum oven reflow technology and applications.Dr. Ning-Cheng Lee, Indium Corporation Vice President of Technology, shared detailed information on how high-reliability soldering alloys and low-temperature solder paste can be used for module and SiP applications.SiP technology combines various components or chips into one silicon module. This unique technology has the advantages of high-performance and lower manufacturing costs. SiP modules are being adopted by electronics and automotive industries at an increasing rate, especially for use in infotainment systems.Key elements of Dr. Lee's presentation included recent developments by Indium Corporation's Research and Development team. The developments discussed included:- High-reliability alloys, which perform better than SAC for automotive applications, enable reliable solder interconnect when thermal cycling up to 150 degree C. Indium Corporation's Indalloy 276 and Indalloy 271 deliver this solution.- Low-temperature alloy Sn20In2.8Ag can be used to reduce thermal stress and warpage issues for assembly.- Indium Corporation provides a variety of high-temperature Pb-free offerings for power semiconductor die-attach in the form of silver- (Ag) and copper- (Cu) sintering pastes, as well as the standard HTPbF solder pastes, BiAgX and HT-BiAgX.Reliability, along with high thermal and electrical conductivity are major concerns for automotive electronics. With the increasing use of powerful motors in electric vehicles, the need for high-reliability, especially under extreme-temperature thermal cycling and high-temperature operation, is more critical than ever. The automotive industry requires a Pb-free solder paste that can achieve high reliability while also meeting the fine-feature printing circuit board requirements needed by mobile device manufacturers.Dr. Lee's insights explained how silver-sintering materials applied in the final joint as low-porosity, pressureless sintering of nano-Ag solder for high-temperature semiconductor die-attach can significantly reduce thermal fatigue stress and also produce very low-voiding results. This technology is also beneficial for high-temperatures and electrical conductivity. Dr. Lee also provided a view into low-temperature solder material development.Through this seminar, it is clear that Indium Corporation is in the forefront of R&D technology as it seeks to produce advanced materials that achieve the reliability requirements of the automotive industry.Dr. Ning-Cheng Lee, Vice President of Indium Corporation, talks about high reliable soldering alloys and low temperature solder paste for SiP packaging.

Leading semiconductor test equipment supplier Advantest Corporation's (TSE: 6857) VOICE 2017 Developer Conference this past May marked the event entering its second decade with 113 technical breakout sessions, two Partners' Expos, 29 technology kiosks and multiple networking opportunities for members of the semiconductor test industry.This year's 11th edition featured dual sessions on May 16-17 in Palm Springs, Calif., and on May 26 in Shanghai, China, where the event had been held once before. Altogether, more than 450 people attended the events, over half of whom represented Advantest customers and partners.At the US event, there were 88 technical presentations while the China conference had 25 papers. Forty-five% of the papers in Palm Springs and 60% in Shanghai were either written or co-authored by customers. In total, VOICE 2017 featured technical papers from 22 companies representing 12 countries. The papers were reviewed by a technical committee that included 41 Advantest customers from 19 companies.VOICE is made possible by the organizational work of a Steering Committee, made up of volunteer representatives from Advantest and its customers, and the support of event sponsors, which reached a new high of 25 companies this year including 10 new sponsors. Industry organizations including SEMI, the Global Semiconductor Alliance (GSA), VLSIresearch, IC Insights and IHS also returned to support VOICE in 2017.Best paper awardsAt each VOICE conference, attendees vote to select the best technical presentations. This year, VOICE went paperless with all voting and feedback done with the mobile app. At the US event, Edwin Lowery, Shiyang Deng and Aether Lee, all from Advantest, won for their paper on "Instrument Synchronization in SmarTest 8: RF to MX to DC to Digital." In China, Zhaoyang Wang of NXP and co-authors Lydia Jiang, Kai Kang, Qiannan Ren and Peng Wang from Advantest were recognized for their presentation on "Testing Automotive Airbag System Devices on the V93000."VOICE 2018VOICE 2018 will take place in the US and Taiwan; watch for more details coming soon at https://voice.advantest.com.

Digital transformation in manufacturing is one of the key topics for the upgrading and transformation of Taiwan industries. It also shows new types of business models are emerging and leveraging the disruptive technologies. While industry 4.0 being welcomed overwhelmingly by the governments around the globe such as "Made In China 2025" and "Internet Plus", the enterprises learn to quickly response to the market using the powerful features of product lifecycle management (PLM) software and advanced IT technology for analyzing the data gathered by smart sensors.Faced with the obstacles to Taiwan's continued industrial development, the supply chains and ecosystems are providing the quick adjustment for introducing end products, making a quick grab for market share or return on investment because there is an urgent need for many companies.However, building the culture of digitalization in various organizations are not easy tasks. The current digitalization investments from enterprise may not reflect the real revenue growth yet. Companies worry more about how things going for the Industry 4.0 development. In this interview, we invite Mr. Leo Liang, Senior Vice President and Managing Director of Greater China, Siemens PLM Software, to talk about his observation and viewpoints of smart manufacturing.The disruptive innovations can profoundly affect the functioning of existing industries by changing company's value chains. And the Internet of Things (IoT) technology is one of the major driving forces to enable innovation breaking the information barriers between supply chains and ecosystems. Leo highlights, lower cost manufacturing is no longer the only thing. The recent focus shifts in thinking- of understanding consumers' needs. Through the innovative PLM software systems, it transforms the needs to a realistic product and enables the power for change. Uber, AirBnB and several business innovations like mobile payment services have uncovered many good examples for great benefits in different business sectors.Siemens PLM Software provides complete product portfolios to demonstrate real values of digital transformation through Digital Twin. Digital Twin is not only a tool set of computer simulation models that provide the means to design, validate and optimize products in the virtual world. Today, Leo talks continuously, Digital Twin expands to manufacturing process or production facility. These technologies use data from sensors that are installed on physical objects to represent their real time status, working condition or position to help fabricating the new production lines to provide the flexibility for achieving the goal of smart manufacturing.MindSphere industrial clouds fulfill the needs of enterpriseAdvances in IT technologies of Siemens PLM Software have made it possible to broaden the scope of the Digital Twin to include many more capabilities, information, inputs and outputs from new product initiatives to flexible factory design. For strengthening enterprises new product development to the market much faster than ever, Siemens build MindSphere, an open IoT operating system (PaaS) and cloud infrastructure for industry. The large volumes of data generated during the production process in the Manufacturing Execution System (MES) level by IoT sensors or legacy systems need to be saved, and analyzed in real time and turned big data into smart data. And the open architecture will allow for a whole new dimension of services leveraging cloud solutions to capture process parameters, machine conditions and presented the statistical results using smartphone. This contributes to improved asset management and energy efficiency through data analysis and simulation.Meanwhile, combining with end products and delivering to end users, it will help to track real response of consumers. The collected information will link to MindSphere cloud platforms to make product design, manufacturing process improvement and exploring better use cases as a Closed Loop Manufacturing system for further increasing productivity, flexibility and shorter times to market.MindSphere enables manufacturing companies to streamline and digitalize their entire business process through the cloud technology, seamlessly integrating with the systems to develop important decision. Gathering real time manufacturing parameters to monitor the details of each process can begin at any point in the factory, from product design to service, and can extend digitalization gradually, depending on current needs of companies. MindSphere allows analyzing production assets and products as they perform and providing the insights into the entire value chain for continuous optimization. This will help customers of Siemens PLM Software to develop consistent data models and streamline the manufacturing process, product development and shorten the time to market.Taking the machinery maintenance as an effective ROI example, downtime is a serious threat to any manufacturing business. Through MindSphere cloud services, maintenance managers take preventive measures before crises occur in order to maintain machine tool and spare parts availability, Leo adds. It will turn passive maintenance to preventive maintenance strategy and gain results showing in financial reports.Acquiring Mentor Graphics to extend product offerings for servicing more industriesTo further accelerate the innovation for Siemens' customers and help them find the paths to digital transformation to drive production efficiencies and optimize the operation of their products in the markets, Siemens has made a significant move into the software space with acquisitions including UGS, LMS, Camstar, Polarion, and CD-adapco in the past few years. With recent acquisition of Mentor Graphics, Siemens will continue its proven paths of new technology into the industry's product lifecycle management software suite. Mentor Graphics is a leading EDA solution provider with well established electronics IC, systems design, simulation and printed circuit board manufacturing solutions. The combination provides mechanical, thermal, electronic and embedded software tools to the companies that develop products and strengthen the core competence.Comparing with other industries within the sectors including financial, insurance and retail services, manufacturing industry has more challenges while going digital transformation. Most of original traditional solutions for factories are not fully digital offerings. Even today, collecting control information of some legacy systems or machinery is still difficult to get. The industry shifts are creating new business models and moving from delivering a product to delivering smart, connected products as a service to customers. This trends of connected products and connected customers help fuel innovation. And Siemens PLM Software provides complete solutions and tool sets to work with customers to push toward digitalization of all aspects of manufacturing.Leo also highly suggests enterprises continuously to develop new products with new ideas leveraging the cloud technology for fast responding user's versatile tastes and preferences. The momentum needs to maintain both in manufacturing process and product design.With Siemens PLM Software solutions, manufacturing companies have better insight into every process's performance. All the software tool sets and product portfolio of Siemens offerings are proven and integrated practices in Siemens factories. This will benefit Siemens's customers bridging the gap to digital transformation and save the time for developing time-to-market products.Leo Liang, Siemens PLM Software Senior Vice President and Managing Director of Greater China, outlines the digitalization challenges for enterprises

Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste - a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.Indium11.8HF-SPR specifically addresses the move toward type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.Indium11.8HF-SPR benefits:- Halogen-free per IEC 61249-2-21 test method EN14582- High-transfer efficiency through small apertures (≤ 0.66AR)- Long stencil life (>12 hours)- Eliminates hot and cold slump to inhibit bridging and solder beading defects- Avoids the potential for HIP and graping defects with a unique oxidation barrierIndium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.comIndium Corporation.

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of its Switchtec PAX advanced fabric Gen3 PCIe switch providing high-performance fabric connectivity for scalable, multi-host systems and just a bunch of flash (JBOF) supporting single root input/output (I/O) virtualization (SR-IOV), NVMe and multi-function endpoints. The new device will be showcased in Microsemi's booth #213 at the Flash Memory Summit Aug. 8-10, 2017.Hyperconverged systems are evolving towards composable/disaggregated infrastructures (C/DI) such as rack scale architecture to meet the rapidly changing demands on resources and storage capacity of next-generation applications. PAX advanced fabric PCIe switches provide a scalable, low latency and cost-effective solution to the disaggregation of computing, networking, graphics processing units (GPUs) and storage resources. These PAX PCIe switches, which are flexibly interconnected with configurable high-speed fabric links, virtualize PCIe domains and SR-IOV endpoints. System development is simplified through a fabric application programming interface (API) and the ability to utilize off-the-shelf NVMe host drivers, significantly reducing time-to-market for complex multi-host systems."As we work closely with industry leaders, it became clear there's demand for Microsemi to expand our PCIe switch portfolio to support next-generation disaggregated architectures," said Derek Dicker, vice president and business unit manager for performance storage at Microsemi. "Our PAX advanced fabric PCIe switch is pin-compatible to our PSX storage and PFX fanout PCIe switches, providing our customers a simple upgrade path to building SR-IOV-enabled and composable disaggregated systems while supporting our ability to gain market share."According to market research firm IDC, the total worldwide addressable opportunity for vendors with C/DI is US$34.5 billion in 2017. The firm also expects this opportunity will grow at a modest compound annual growth rate (CAGR) of 7.4% and reach US$45 billion in 2020. Microsemi's Switchtec PAX advanced fabric PCIe switch is well-aligned to these growth trends, as it enables customers to leverage the device for the development of next-generation C/DIs.Microsemi's Switchtec PAX family comprises switches from 96 lanes to 24 lanes, providing:- High-performance PCIe fabric connectivity overcoming the limitations of the PCIe Specification for rack scale multi-host systems- Multi-host sharing of SR-IOV and multifunction endpoints- Virtualization of PCIe domains and SR-IOV NVMe solid state drives (SSDs)- Software development kit (SDK) for virtualization of other SR-IOV endpoints, and for enclosure management- The most flexible port bifurcation in the industry, from x2 to x16 lanes per port- The highest port density, with up to 48 ports- Advanced error reporting- Error containment for surprise-plug and unplug to prevent system crashes- Advanced diagnostics and debug features to identify, diagnose and fix problems- Separate Refclk Independent SSC (SRIS) for cabled PCIe and lower cost system designsProduct AvailabilityMicrosemi's Switchtec PAX advanced fabric PCIe switches are sampling now to lead customers. For more information, visit https://www.microsemi.com/products/storage/switchtec-pcie-storage-switches/switchtec-pcie-advanced-fabric-switches or contact sales.support@microsemi.com.