This year at Computex, Act Power has revealed the Project-X series of developer boards. This ground breaking new concept of developer boards will not just allow you to develop an idea, but it will allow you to take this idea straight to production without the need of changing the hardware.Most developer boards in the market today are not ready to be productized and require a lengthy process of hardware development and tweaking that can set a project back months. With Project-X you can build your solution on top, without the need to go back to the drawing board, courtesy of a standardised mezzanine connector. This enables quick prototyping and testing of the features you need, on an already tested and proven hardware platform. This is what truly sets Project-X apart from the competition today.Not only does the use of mezzanine boards shorten the time to market significantly, but it also helps save money on engineering related costs and it can significantly reduce the development time. A range of developer friendly mezzanine boards will be on offer to get you started. ACT POWER will also work with you to create retail ready solutions that fits your product needs, ranging from customized mezzanine boards to IoT modules, all the way to housings and power supplies.Project-X is ideally suited for anything from prototype runs to smaller pre-production runs, through to full-scale production. The first Project-X board which will be unveiled at Computex will be an entry-level PICO-ITX based board with an ARM Cortex-A7 processor. A higher-end solution based on an Intel Atom processor is planned for later in the year.Both platforms can be customized to suit your needs with other pin-to-pin compatible processor options on a case to case basis. Additionally, RAM and storage options are also flexible to fit your needs.Act Power's Computex booth is as K1315.

Global IT security suffered a serious blow in May. Following the phishing attack on Google documents via false App link, the globally epidemic ransomware named WannaCry has caused vast infections to Windows devices. It is reported that over a hundred nations have been hacked. World-renowned enterprises and organizations such as NHS, Renault, and Telephonica were attacked and consequently their operations halted. Taiwan has also become one of the hit areas during this wave of attacks.IT security is a priority concern for any entrepreneur. Founder and President of team+, Kuo, Cheng-Hsiang indicated that under the architecture of private cloud, servers are installed within the enterprise. Data transmission in a closed-loop system may mitigate leaks of confidentiality. Besides, data and file uploading are centralized for management. Even if an individual PC is inadvertently infected in the ransomware disasters, the enterprise can still mitigate its loss and risk significantly because all of its files have been backed up in team+.Moreover, the encryption technology of team+ has obtained the "FIPS 140-2," an international certification issued by the United States National Institute of Standards and Technology (NIST), the first real-time communication platform from Taiwan to be recognized by the Public Key Cryptography Standards (PKCS) for meeting the deployment requirements of the US government.team+ is deeply appreciated by a large number of enterprises. More than 4,000 enterprises are using team+ such as Taiwan High Speed Rail, Taichung Tzu Chi Hospital, China Airlines and Innolux. team+ supports not only the establishment of private cloud for an enterprise to utilize its own security credential without passing any certification of ISP but also multiple mechanisms such as database encryption settings, TLS message encryption, identity verification, anti-assembling mechanisms, remote deleting of App content, access control audit, MDM camera device control, and watermark of file so as to fulfill the needs of IT security, the top concern by any enterprise.team+ has developed a comprehensive API mechanism for its clients to implement the mobilization of in-house digitized system with ease. The API can be utilized to connect ERP, CRM, POS, and factory production monitoring system. Kuo also indicated that the TDT of team+ offers 100% local service to deal with a particular scenario at every enterprise and come up with flexible and customized services to satisfy individual requirements of smart applications desired by each enterprise for the upgrade of operating performance. On the contrary, most of foreign and domestic active brands of private cloud provide standard specifications only.team+ is honorably invited by MOEA to exhibit in InnoVEX area where 244 companies from 20 countries will demonstrate their top-notch technologies including cloud computing, IoT, AR/VR, Big Data, and AI. These key technologies are essential for all the industries in their innovation and digital transformation. Under the premise of well-advised considerations of cost, IT security, and high performance, team+ can be your most accountable partner to realize step-by-step digital transformation at your enterprise.

There are many consumer-related technological trends entering the automotive market in the past few decades: LED lighting, LCD/OLED displays, WiFi, Bluetooth, to name a few. I-PEX Connectors are known for connecting these consumer-based devices. Those devices are much smaller in the consumer market, so are the connectors. To use those small connectors in the automotive market, they have to be converted to Automotive Grade. The I-PEX Automotive Division has been developing its own connectors using its knowledge of the manufacturing process for automotive components.The I-PEX ISH Connector Series is the first successful SMT connector using a 0.5mm terminal by I-PEX Automotive. This series was designed especially for the automotive market from scratch. I-PEX had heard that automotive device manufactures wanted to use consumer connectors, but they did not meet automotive standards, such as USCAR.The ISH Connector Series was first adopted by multiple headlight manufacturers. They had high demand for high heat (125 degrees C) and vibration (10G) in order to be able to use on a PCB in ECU in an LED headlight unit.The connection reliability is ideal for many other automotive devices such as inverters, converters, battery monitoring units, multi-view camera systems, clusters and more. The wide variety of pin options, from 3-pin through 20-pin (40-pin been developed), should cover design needs.I-PEX ISH Connector Series

Shuttle is displaying digital signage and self-service kiosk applications, including multi-display video wall, vending machines, and two Instagram (IG) printing machines, at Computex 2017. In addition, two new mini PCs for VR gaming, cloud-based warehouse tracking and smart long-term care solution will be demonstrated its comprehensive suite of service. Shuttle is at Nangang Exhibition Hall, Booth No. L1217a.XH270 to install four 2.5-inch HDDsWith a compact 3-liter design, the XH270 supports both Intel Skylak and Kabylake processor platforms to support 4K ultra HD video playback and support up to three independent displays. In response to market demand for storage space, the XH270 has a new mechanism design and can support up to four 2.5-inch hard drive installation.XC60J with 8 COM portsEquipped with the latest Intel Apollo Lake SoC 14nm processor, XC60J is the first 3-liter XPC slim with fanless design, powered by Intel Celeron J3355. This compact machine can support up to eight COM ports to power highly interactive Kiosk, vending machine, and POS. Seven RS232 and one RS232/RS422/RS485 ports which support 5V/12V can connect to barcode scanners, receipt printers, and mobile payment devices(such as QR code, Apply pay).XH110G with PCI-E x16For storage and high-end graphics card markets, Shuttle debuts our latest 3-liter Slim PC XH110G with support new single-slot design to install multi-display graphics card to power 3x3 video walls. This model also supports both Intel Kabylake and Skylake processors. The XH110G is a 3-liter model with strong graphics support via PCI-E x16 expansion slot for various add-on cards such as graphics card (multi-display), capture card, multi-network card, drawing graphics card, or more. Featuring compact size, excellent cooling technology, low-power consumption, and impressive performance, makes XH110G is very suitable for workstation or surveillance and video wall applications.DKA1GU with 4 HDMI 2.0 supportThe 1-liter slim PC DKA1GU is equipped with the latest Intel Kabylake CPUs and with adding AMD Radeon RX460 Graphics card then users can have better graphics ability in this small form factor. This model is the first 1-liter slim PC which can support up to four independent displays via four HDMI video outputs. The DKA1GU is an impressively versatile and high-performance player made to by easily integrated into a variety of digital signage markets. Its slim metal chassis, including VESA mount capability, versatile connectivity makes the DKA1GU ideal for digital signage, surveillance, kiosk, and other professional applications.VR ready mini PCsIn addition to the variety of XPC products for vertical applications, Shuttle also launched two mini PCs for VR ready: SZ270R8 and KA1Gh series. The famously compact barebones mini-PCs are only 1/3 the size of traditional tower PCs but without lacking in performance or durability. The SZ270R8 features a 13-liter design with support for Intel Skylake and Kabylake 95W processors, 4xDDR4 2133/2400 MHz (up to 64GB), four 3.5-inch hard drives, and support up to 120mm of height graphics cards. Equipped with Shuttle's I.C.E 2 heat pipe technology and an 80 Plus Silver certified 500W power supply, the SZ270R8 can be used in mini-server, graphics workstations and gaming. There are two SKUs of KA1GH series, including KA1GH7 (Core-i7) and KA1GH5 (Corei5). This series is powered by the latest Intel Kabylake-H processor with NVIDIA GeForce GTX 1060 Graphics to deliver brilliant performance and breakthrough VR experience. Compared in size to a gaming console, the KA1GH series is designed for compact, portable and stylish case to game anywhere.

China's leading motherboard brand Colorful Technology will highlight its iGame gaming series at Computex 2017, aiming to deliver the ultimate user experiences to professional e-sports gamers. The product series showcased at Computex this year is an indication of Colorful's rigorous attitude concerning e-sports gamers' needs. Take the motherboard BIOS for example. iGame motherboards have solid firmware performance which continues to improve. This is also the main reason why the iGame mid-to-high end motherboards can establish a firm market position in China while steadily expanding into international markets.The vendors remaining in the DIY computer market now are mainly very competitive players. Colorful has targeted its iGame motherboards toward a mid-to-high end position and decided to focus on gaming applications three years ago. In recent years, Colorful has been engaging in e-sports events including CGU and OWAPAC and sponsorships of e-sports teams, especially the deal with the RNG team this year. This shows Colorful is placing great importance on the gaming industry.iGame motherboards not only feature unique customized ID designs for e-sports competition events and teams but also introduce intricate modifications to the motherboard spec. For example, Colorful uses two chips to provide dual USB I/O ports for gaming while maintaining the quick charging capability. Furthermore, at the time when Intel launched its Optane memory, Colorful immediately worked with Intel to use the new memory technology in its latest generation motherboards. It also selected the Killer series network card chips, which are more favored by gamers. Colorful iGame motherboards are packed with world-class motherboard features and design concepts and therefore present users a highly cost-effective choice that meets all use scenarios of high-end motherboards.The Colorful team that designed the iGame motherboards decided to upgrade to GamerVoice 2.0, which includes adjustable RGB light and replaceable audio chip. That is, users can choose to replace the audio chip with a more professional chip based on his or her preference. In addition, the use of professional Japanese Nichicon speaker capacitor, Faraday cage shielding case, audio armor system, audio gold-plating interface, advanced audio circuit segmentation & shielding technology and top-notch materials brings 120dB SNR game audio effect and the capability to drive headphones with 600?[ resistance to catch every detail and deliver perfect audio experiences.As to the e-sports USB interface, special-purpose chips Fintek F75503 and Fintek F75501 were added near the mouse and the keyboard to optimize the performance of the gaming devices. This optimization enables the e-sports USB ports to provide superior connectivity so the gaming mouse and keyboard can perform at their best. Users will be able to experience faster and smoother mouse movements during games. Furthermore, iGame Z270 Ymir-X supports on/off charge and quick charge, configurable through BIOS settings, so it can charge mobile devices even when the computer is turned off.iGame Z270 Ymir-X is equipped with a debug monitor screen that can display hardware temperature, voltage and other working conditions of the motherboard. In addition to achieving a metallic effect on a plastic shell, iGame Z270Ymir X also makes use of wire drawing in its design. The cooler hardware and software is also consistently designed with wire drawing. The LED lighting and fiberglass transparent board on the south bridge heat sink enables an effect mimicking lava when the motherboard lights up. These are the features that veteran gamers rave about.iGame Z270 Ymir-X is available for purchase through Colorful's online store on JD.com. Visitors to COMPUTEX 2017 are welcome to Colorful's booth M1019A to see the product exhibition.Colorful presents the iGame Z270 Ymir-X gaming motherboard

The leading global motherboard manufacturer, ASRock, is pleased to announce exciting new products for Computex 2017. ASRock will be demonstrating new DIY motherboards including its highly anticipated Intel X299 platform and Mini-ITX AM4 boards, as well as Micro-STX Mini PCs and the X10 IoT Router. ASRock welcomes visitors to experience all this and more at booth L0810 of the Taipei Nangang Exhibition Center in Taipei, Taiwan from May 30 to June 3, 2017.Intel X299 Flagship MotherboardASRock will be showing its fantastic new motherboard collection based on the powerful Intel X299. The Fatal1ty X299 Professional Gaming i9 is the first motherboard in the world to feature 10Gb/s LAN, for extreme internet bandwidth and responsive gaming. The convenience of USB 3.1 Type-C onboard header that offers new USB power delivery protocol to supply up to 12V/3A of power output, allowing you to charge portable devices faster than ever!Outstanding features of the Fatal1ty X299 Professional Gaming i9 and X299 Taichi motherboards include Dr. MOS with SPS (Smart Power Stage) technology with digital PWM 13 phase on board power for ultra-stable PC performance in demanding situations. Triple Ultra M.2 PCIe Gen3 x4 32Gb/s storage along with gamers' must-have Intel Dual LAN and Intel 802.11ac WiFi. BIOS Flashback onboard button that serve users pretty well for updating BIOS effortlessly. Plus the extreme precision and control of the Hyper BCLK Engine III third generation clock generator chip to satisfy serious tech geeks.Join ASRock at Computex for the Fatal1ty X299 Professional Gaming i9 stunning show, and witness the breathtaking gaming and graphics performance of these new X299 boards, plus a 10Gb/s networking live demo.Intel X299 Mini-ITX MotherboardIntel's X299 chipset used to be represented by a bulky EATX or ATX motherboard, because the CPU, chipset, memory and whole layout required an extra-large PCB to contain the extreme performance. ASRock's R&D team has worked very hard to defy logics and build a motherboard with a small size but huge performance, and now we have succeeded in breaking the limitations to fit the whole X299 package onto a mini-ITX form factor PCB, hence the world's first and only mini-ITX X299 motherboard is born!X299E-ITX/ac is built around an X299 chipset, which unlocks the hidden performance of Intel LGA 2066 socket CPUs, giving the overall performance a huge boost. Regardless of its tiny size, other points worth mentioning are 4 SO-DIMM memory slots, 10-layer PCB, two Intel Gigabit LANs, dual band 2.4/5GHz 802.11ac WiFi and Bluetooth 4.2, and onboard amazing six SATA ports. Furthermore, ASRock is incredibly to make triple M.2 sockets onboard for satisfy insanely fast SSDs.AMD AM4 Ryzen Mini-ITX MotherboardPacking all the power of AMD's new AM4 series into an astonishingly compact space-saving Mini-ITX footprint, ASRock will also be launching and demonstrating the new Fatal1ty X370 Gaming-ITX/ac and the Fatal1ty AB350 Gaming-ITX/ac. Apart from the chilling killer design, two boards come with two HDMI outputs, 802.11ac WiFi solution, 8-CH with Realtek ALC 1220 codec, heatsinks that effectively improve heat dissipation and promotes overall performance.DeskMini GTX / RX Mini PCsASRock will be showing the slim but powerful DeskMini RX/GTX PC Series, based around new Micro-STX form factor motherboards. In addition, the compact new Z270M-STX MXM motherboard will also be on display. Despite their compact size these Micro-STX products offer outstanding performance, and they support powerful CPUs, and a wide range of expansion and connectivity options. Key features include MXM graphics card support and Triple Ultra M.2 for SSD storage.IOT Router X10Surging to the forefront of the Internet of Things (IoT) wave, the ASRock X10 is a revolutionary advance on old-fashioned internet gateway routers. It features ZigBee wireless for control, automation, scheduling and monitoring of home lighting, home appliances such as air conditioning, and home security systems.ASRock announces the new X299 series motherboard line up, featuring the latest and greatest technology as well as performance to exceed the ultimate experience.Meet ASRock at ComputexASRock will have something fresh for everyone at Computex 2017. Get in touch today and join us to see for yourself in Taipei, Taiwan, between May 30 and June 3, 2017.Contact InformationPeter LiuMarketing Department TEL: +886-2-28965588 ext.11682 FAX: +886-2-28931557 http://www.asrock.com Peter2_Liu@asrock.com.tw

StorArt Technology, a leading NAND flash controller solution provider, announced the launch of its NVMe-1.2 SSD controller, SA3801, with PCIe3.0x2 lanes providing 2GB/s interface, high-bandwidth, IOPS and low-latency performance.The SA3801 supports 2D & 3D NAND flash from all major NAND Flash suppliers, 4 channels with 8 CEs and provides flexible data capacity options up to 2TB. With StorArt's new LDPC engine, Global Wear Leveling, End-to-End Data Protection, HMB and temperature sensor, the SA3801 offers excellent data reliability, endurance boost and enhancement. In addition, by leveraging StorArt's flash management, the outstanding sequential/random read/write performance and better lifetime extension compared to other SSD controllers can be achieved.Applications- PC/Ultra-book- IPC- Consumer electronics- Hyperscale datacenterKey Features- PCIe 3.0 x 2 lanes- NVMe 1.2- Support NAND flash - 1x/1y/1z nm & 3D NAND MLC/TLC- Support ONFi4.0, Toggle2.0, up to 533MHZ- Support 4 channels with 8 chip selection, up to 2TB support- Storart's new LDPC technology secures NAND endurance and reliability- Support End-to-End protection for internal data path- Support DDR3/DDR3L/DDR4- Support HMBAbout StorArt TechnologyStorArt Technology Co., Ltd is founded in February 2012. Headquartered in Hsinchu Science Park, StorArt's focus is to develop embedded NAND flash controllers, including SSD, UFS, eMMC, eMCP, uSD and SD controllers.

The coming of IoT (Internet of Things) has seen the smart city become a key field for IoT development. Many developed cities around the world, including Taipei, have responded to the requirements of a fast-changing society by making "smart city" a key objective in their development plans. Several wireless communications technologies have emerged as a result of rapid developments in IoT. The favored technology is LPWAN (Low-Power Wide-Area Network), due to its long range, low power consumption, and low cost. LoRaWAN, operated on the unlicensed radio spectrum, is among the LPWAN communications technologies considered to be one of the most potential.The LoRa Alliance has acquired more than 460 members since it was founded in March 2015, and is one of the fastest-developing alliances in the technology industry. Members are working closely to promote the LoRaWAN protocol. The LoRaWAN protocol offers unique advantages in terms of bi-directionality, security, mobility, and positioning accuracy. The technology mainly operates in free global radio spectrum, including 433, 868, and 915 MHz. The four main components are the terminal, base station, server, and cloud. Bi-directional transfer of application data is supported to provide a simple communications system with long-range, long-battery life, high capacity, and low cost. The main applications for LoRaWAN are smart power/water meters, smart agriculture, smart factories, and air-quality monitoring where small amounts of data are collected. Transmission range is between 3~5km in urban areas and up to 20km in open areas. China, for example, has in one instance integrated IoT technology into manhole covers for subsidence or hazard detection.TUV Rheinland is the first independent third-party laboratory accredited by the LoRa Alliance, and one its founding members as well. Its laboratories in Pleasanton (US), Leek (Netherlands), Yokohama (Japan), Seoul (Korea), and Taipei (Taiwan) can all provide EU/US Class A testing services for LoRaWAN. International buyers can therefore apply for certification at the laboratory closest to their location. LoRaWAN testing is relatively simple, covering a mere 10+ items. In addition to compliance with regional spectrum, most of the testing is focused on product interoperability and LoRa Alliance product compliance.The maturing of IoT wireless connectivity and a mobile-technology application environment has led to IDC and Gartner forecasting that the total number of IoT smart-connected devices will grow to 25 billion by 2020. Many ICT vendors are now squeezed into unlicensed radio spectra, and they have placed their bets on different technology alliances and are waiting to see which technology will prevail in the mainstream. TUV Rheinland currently has a presence in mainstream wired and wireless sensing network standards such as Bluetooth, zigbee, Qi, LoRaWAN, Sigfox, MirrorLink, DALI (Digital Addressable Lighting Interface), and KNX (building automation technology), and thus can provide vendors with the full range of testing and certification services.TUV Rheinland's Taiwan telecom laboratories have garnered many "first and only" achievements in Taiwan on Bluetooth, zigbee, DALI, and KNX communications technology certifications: first to be approved by the Bluetooth Alliance; only Bluetooth laboratory capable of conducting Bluetooth IC testing; first and only zigbee and KNX approved laboratory; only DALI laboratory in Taiwan (only 4 in the world), and authorized to perform testing for the new DALI 2 standard. Wireless laboratories in the Greater China region are located in Taipei, Hong Kong, Guangzhou, Shanghai, and Shenzhen. These laboratories are approved by the relevant accreditation bodies in the EU, US, Canada, Japan, Taiwan, Egypt, and Sudan. Please contact local laboratories for the latest communications technology certifications.

Business Insider estimates 94 million connected cars to ship in 2021, which represents approximately 82% of all cars shipped that year alone. There are currently two types of ways cars are connected. Embedded cars utilize a built-in radio and antenna connecting to local cellular networks. Tethered cars use a wireless connected device, typically a cell phone to provide the data connectivity. These vehicles achieve this via Bluetooth or a USB cable.In addition to data connectivity, cars have GPS for navigation and emergency services, satellite radio (Sirius), hands-free calling, sensor and data gathering (tire-pressure monitors), and key-less entry/start. Some of these systems (tire-pressure monitoring) can utilize an embedded or board level antenna; however, other critical (emergency services) or data intensive systems (navigation, satellite radio) require an external application specific antenna. I-PEX Connectors offers a robust and diverse product offering to suit RF interconnectivity needs within all of these systems utilizing I-PEX's patented iFit MHF Series.The MHF family of connectors provides automotive OEM module manufacturers a right-sized solution for their RF needs. While the frequency ranges from DC to 15GHz (MHF5L), the majority of the frequencies used in automotive, DC to 6 GHz, can be realized with the MHF I family. In addition to a mated board height maximum of 2.5 mm (1.8mm OD wire) to 3mm (2.0mm OD wire), the MHF I Micro RF Coaxial Connector offers the most versatility in choosing the right cable for your application. Please consult with your I-PEX Connector representative to confirm compatibility.Repeatability and consistency are critical to ensuring device operation. The MHF Series consistently has a 1.3 VSWR max from DC-3 GHz and a 1.5 VSWR max from 3GHz-6GHz. To assist with durability, I-PEX offers a 4-pad layout in addition to the 3-pad configuration.I-PEX Connectors understands that automotive applications present unique problems that stationary RF systems do not encounter, particularly shock and vibration. Cars are in motion, roads are uneven, and this generates mechanical harmonics that could cause connectors to disengage over time. Coming soon in 2017 is the MHF LK system. This innovative solution will be available in cable sizes (1.13 mm OD & 1.37 mm OD) to suit various insertion loss and cable length needs. Additionally, the initial mating disengagement force of 28.3 N outperforms the standard MHF I Series of 17.2 N. Even at 30 cycles, the MHF LK, at 15.1 N, performs better than the MHF 1, at 6.4 N.I-PEX MHF LK

As the applications of connected cars surge rapidly, Lite-On Technology, which has been deeply rooting in the automotive OE (original equipment) market for almost 40 years, aggressively leverages its existing technology advantages and group synergies to move into the development of key products, including ADAS, T-Box, sensor fusion, and DSRC (dedicated short-range communications). With the early results have been achieved, Lite-On is very optimistic about its future growth driven by the brand new opportunities.A Long-Time Player in the OE MarketAutomotive Electronics and Smart Vehicle Applications are the two business units (BUs) that Lite-On has for the car electronics market. Their main products are LED lighting module, camera module, vehicle motor electrical control module, and head-up display, in-car entertainment product, respectively.According to Michael Wang, GM of Automotive Electronics SBU at Lite-On, the BU was formerly known as Dun Young Technology, which was founded in 1979 and is the first automotive electronics company in Taiwan. Dun Young started its business from manufacturing cruise control system and ECU (electronic control unit) for Chrysler. Unlike most of the Taiwan companies that target at the AM (aftermarket) market, Dun Young has been a long-time player in the OE market ever since its establishment. The long-stand relationship with major car makers and the higher technical barriers have set it apart from the rest of Taiwan's electronics industry.Take its LED lighting module as an example, the first case that Lite-on won was the adoption by Toyota in 2001. Before that, it took as long as four years for Lite-On to get its products approved. But, the effort bears fruit. With zero DPPM during the four-year product lifetime at Toyota, Lite-On successfully gained reputation in the market and started to expand its business to other car makers. Because of early deployment and widespread adoption, Lite-On now has won 15% shares of worldwide car lighting market, with customers from Europe, the US, Japan, and China. Additionally, it also accounts for 25% shares of the motor control market in China. With its strong competence, the BU has achieved exceptional annual revenue growth over the past five years.Allen Liao, GM of Smart Vehicle Applications BU at Lite-On also indicated that the predecessor of the BU was PLDS (Philips & Lite-On Digital Solutions Corp.), which specialized in optical disc drive (ODD) products. Because of absorbing the automotive design and manufacturing capabilities from Philips' team in Europe, it has moved into the in-car entertainment market from consumer ODD for a long time, and is the first company that provides wireless charging products for mobile phones in the automotive OE market.Recently, the BU has expanded its product lines to head-up displays. The new product was delivered to European car makers three years ago, and will be shipped to Japanese and Korean car makers from this year. Similar to Automotive Electronics BU, Smart Vehicle Applications BU also only targets at the OE market.Exploring New Opportunities with ADAS, T-Box, and moreRegarding the emerging connected car market, Liao said that a smart car is just like a smartphone with four wheels. With this concept in mind, the integration of new technologies into automotive is aimed to address consumers' increasing requirements for entertainment, convenience, and safety. Wang also stressed that the two BUs will work together to develop T-Box, ADAS, sensor fusion, and DSRC products by leveraging Lite-On's strengths in camera module, wireless communications, and optical fields.T-Box is the first product that Lite-On makes inroads into connected cars. "As many car makers are moving towards this direction, T-Box has great growth potentials because it can provide rich and real-time information as well as services with relative simple designs," Wang pointed out. "It is expected that many new business models and services such as fleet management will be created by deploying T-Box in the future."Lite-On has already shipped T-Box to a China-Japan joint venture, with around 300,000 units in the early stage. It is estimated that the amount will be increased to 1 million units for the customer's whole product lines. Meanwhile, Lite-On is now in talk with major car makers in Germany and Taiwan.In the V2V (vehicle to vehicle) communication field, Lite-On has teamed up with Taiwan's ITRI (Industrial Technology Research Institute) to jointly develop DSRC products. According to Tony An, GM of New Business Development & Marketing, DSRC is a wireless communication standard featured with low latency. It is mainly driven by the US and the regulations will be finalized by 2019. Lite-On and ITRI already completes the sample development, and will start testing in the US from next month. As for the China market, which favors to use LTE-based communication technology to enable V2V applications, Lite-On has signed cooperation agreement with China Automotive Technology & Research Center to have early deployment for this.Regarding ADAS, one of the most promising products in smart cars, Wang said that Automotive Electronics BU is aggressively expanding the business of camera modules, and will work with Smart Vehicle Applications BU to co-develop radar/lidar and sensor fusion technologies, in a bid to build comprehensive ADAS solutions.Finally, Tony added that the automotive OE market requires longer cycle time for product development. Eyeing on the strong growth potentials in the future, Lite-On has to invest earlier and expand its scale. Therefore, Lite-On announced last year that it will invert over NT$ 10 billion to establish an operation center in Nan-Tze Export Processing Zone. The expansion of production capacity for LED lighting, body control and camera modules will be included in its first-phase plan, as well as the cultivation of RD talents. Moreover, Lite-On actively enhances its global deployment by setting up a RD center in Singapore in the third quarter this year, in an effort to accommodate global talents and extend the opportunities to work with local institutes.Lite-On, GM of Automotive Electronics SBU, Michael WangLite-On, GM of Smart Vehicle Applications BU, Allen LiaoLite-On and ITRI jointly develop DSRC products for V2V applications