Clientron Corp., a global leading provider of thin client, POS, and embedded systems, is pleased to announce that the R800 thin client has won a "Taiwan Excellence 2018" award for its innovation and best quality design, which makes it stand out from numerous products as the best choice for virtual desktop solutions. Recipients of the awards were selected from more than 1,200 products produced by 578 companies based on the following five key indicators: R&D, Design, Quality, Marketing, and Made-in-Taiwan.On top of excellent quality and innovate design, the R800 thin client features a reliable embedded platform, and durability with a capacitive-touch power button for switching on/off the system without a mechanical part. To enable flexible expansion, the R800 offers 4K ultra-high-definition (UHD), supporting triple displays with two DisplayPorts and one HDMI port. In addition, the R800 features an innovative rotating ports-on-foot design with two built-in USB ports for expansion. Moreover, the R800 supports optional PoE+ modules to provide up to 25W of power for the device and also offers optional TPM 2.0 modules that are critical to providing a secure computing environment."Clientron has been focusing on vertical integration industries for years to make a win-win situation for our customers. We are the leading thin client provider and the award-winning R800 thin client also affirmed Clientron's innovative design in virtual desktops solution. The R800 thin client features ultra-compact design with stylish enclosure, and flexible system design for user experience enhancement that is the main reason why it has been awarded," said Kelly Wu, the President & CEO of Clientron Corp.Clientron will utilize its experience and know-how in professional embedded platform design, as well as agile manufacturing abilities and quick service support to constantly expand its presence through vertical integration of different industries, and provide clients from various fields with the best solutions for smart embedded platformsThe R800 is a high-performance and flexible thin client which can be adopted for banking, government, education and medical care solutions. For more product details, please contact Clientron's sales team or visit our website www.clientron.com.Kelly Wu, the President & CEO of Clientron, attended the 26th Taiwan Excellence Award Ceremony

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced two new modules that enable its T2000 IPS system to test high-voltage and high-power devices used in the power trains of electric vehicles (EV/HV). The new enhanced MMXHE (multifunction mixed high voltage) and MFHPE (multifunction floating high power) modules enable massively parallel, high-performance testing by leveraging Advantest's innovative multifunctional pin design, which allows unprecedented flexibility in assigning test resources to any pin."As electric vehicles evolve, it is increasingly important to provide test solutions that support higher voltages to ensure the reliability of power-train parts," said Satoru Nagumo, executive vice president of Advantest's ADS Business Group. "Our new modules for the T2000 IPS system were developed to meet the testing needs of advanced analog devices for the rapidly growing automotive electronics market."The MMXHE and MFHPE modules optimize testing efficiency and lower the cost of test by providing 64 output channels and 36 output channels respectively. Each pin has multiple measurement capabilities, which minimizes the number of relays on the loadboard for streamlined operation and a simpler loadboard design.The modules can measure voltages up to 300 V with accuracy up to the order of 100 uV, as required in testing ICs in power trains, controls and sensors of EV/HVs. Module resources can be stacked or ganged, giving customers the ability to adjust the tester's functionality and throughput to achieve their desired performance. This versatility helps to ensure the long-term usability of the T2000 IPS tester.The system's capabilities include highly accurate testing of parametric measurement units (PMU), high-voltage digital functions, differential voltages, time measurements, Iddq, and arbitrary waveform generator/digitizer functions. With the T2000 IPS, each of these tests is assigned to a single pin, resulting in faster processing and higher throughput.Advantest will showcase the new T2000 IPS modules in its exhibit at the SEMICON Japan trade show, December 13-15 in Tokyo.

ABB and Hewlett Packard Enterprise (HPE) today announced a strategic global partnership that combines ABB's industry-leading digital offerings, ABB Ability, with HPE's innovative hybrid information technology (IT) solutions. The partnership will provide customers with solutions that generate actionable insights from vast amounts of industrial data to increase the efficiency and flexibility of their operations and create competitive advantage.Customers will benefit from ABB's deep domain expertise in operations technologies (OT) and HPE's leadership in information technologies (IT). ABB and HPE will deliver joint industry solutions that merge OT and IT to turn industrial data into insights and automatic action, combining widely-adopted cloud platforms like Microsoft Azure with IT systems running in corporate data centers and at the edge of the network. Employing the right mix of IT platforms will accelerate data processing in industrial plants and at the same time enable effective control of industrial processes across locations."This strategic partnership marks the next level of the digital industrial transformation. Together, we will bring intelligence from cloud-based solutions to on-premises deployments in industrial plants and data centers for greater uptime, speed and yield," said ABB CEO Ulrich Spiesshofer. "ABB and HPE will deliver solutions that span the entire range of computing required by enterprises today, from the edge to the cloud to the core."With an installed base of 70 million connected devices, 70,000 digital control systems and 6,000 enterprise software solutions, ABB is a trusted leader in the industrial space, and has a four-decade-long history of creating digital solutions for customers. HPE in turn is a global leader in helping customers optimize their IT environments with secure, software-defined technologies that seamlessly integrate across traditional IT, multiple public and private clouds and the intelligent edge to drive key business outcomes."This alliance between two global leaders is unprecedented in terms of breadth and depth, and it will be ground-breaking for the progress of the Industrial Internet of Things," said Meg Whitman, CEO, HPE. "Together with ABB, we will shape a digital industrial future where everything computes, equipping machines with intelligence to collaborate, allowing plants to flexibly adapt to changing demands, and enabling global supply chains to instantaneously react to incidents. This partnership will create exciting business opportunities for our joint customers."To provide a true end-to-end experience for customers, the ABB-HPE partnership will include co-innovation, co-development, joint go to market and service.Research firm IDC forecasts that worldwide spending on the Internet of Things (IoT) will grow to $1.4 trillion in 2021 from an expected $800 billion in 2017. The largest investments are being made in areas such as manufacturing, transportation and utilities. To tap into the opportunities of the IoT, companies are investing in new solutions that digitize their industrial equipment and integrate it with their broader IT environments. By joining forces, ABB and HPE are bringing together the capabilities needed to accelerate this transformation.Computing where it is requiredRunning data acquisition, analytics and control processes near industrial equipment helps customers avoid the latency, security and reliability issues associated with data communication through remote IT systems. ABB and HPE will jointly develop, market and service digital industrial solutions that help customers:- Create deep insights and automatic action from industrial data - by running ABB Ability applications on enterprise-grade IT systems close to the industrial equipment to accelerate the processing of vast amounts of data; and- Manage and control industrial processes across the supply chain - by leveraging hybrid IT to provide a seamless experience from edge to cloud to core, making critical data available across locations.The partnership will enable ABB Ability solutions to run on hybrid platforms such as HPE ProLiant for Microsoft Azure Stack, enabling customers to deploy applications to their preferred location - on HPE infrastructure in industrial plants and data centers or in the Microsoft Azure public cloud - to meet the specific requirements regarding performance, security or cross-site collaboration.ABB and HPE will also deliver joint solutions for data centers, including:- Data center automation - to enable data center power, cooling and building systems automatically adapt to changing IT demands or incidents. To that end, ABB and HPE will integrate ABB Ability Data Center Automation, which controls, monitors and optimizes mission-critical data center facilities infrastructure, with HPE OneView, HPE's IT infrastructure automation software.- Secure edge data center - specifically designed to run in harsh industrial environments, bringing enterprise-grade IT capacity closer to the point of data collection and machine control. This solution is being developed in collaboration between ABB, HPE and Rittal, the world's largest manufacturer of IT racks, and will be an off-the-shelf ready IT data center solution for industrial customers enabling real-time insight and action.The partnership was announced today at the HPE Discover conference in Madrid, where both companies demonstrated their first jointly developed solutions and prototypes.

Taiwan-based Delta Group, a supplier of power, thermal management and automation solutions, is showcasing its latest integrated solutions and framework for smart manufacturing at the SPS/IPC/Drives/Nuremberg 2017 (SPS 2017) exhibition in Germany.This framework covers new automation technologies and products, including a cloud-based IIoT platform as well as data transmission, industrial control, drive devices and motion systems, and flexible production solutions that create a path toward smart manufacturing, the company said.Delta is also highlighting its EtherCAT motion controller AH10EMC for smart machines. This new motion controller facilitates motion control system with up to 32 axes of motion drives synchronously, while controlling other devices and transmitting equipment data onto a management platform via EtherNet/IP network for remote monitoring."Delta seeks to provide 'new' smart manufacturing models with our strong capabilities in the industrial automation field," said Andy Liu, general manager of Delta's Industrial Automation Business Group. "With our two decades of experience in this industry, Delta has successfully assisted many customers build highly automated machines and factories with our complete range of automation products, software, and solutions. Now, we think it's time to take it to a higher level on which flexible, smart, green manufacturing can be implemented to enhance customer competitiveness while solving the issue of worldwide labor shortages. For example, Delta's Smart Manufacturing Model Production Line for power supplies in Wujiang plant, China consists of six robot workstations with 30 SCARA robots for a complete operation that enhances quality, flexibility, and production efficiency, achieving up to 60% manpower replacement."The highlights at Delta's booth include: The Smart Factory Monitoring Solution which features the DIACloud platform and data transmission devices (e.g. routers, Ethernet switches) for equipment data collection and analysis to achieve real-time monitoring of the facility and production process. If users add the DIAView SCADA System into the solution, they can acquire detailed machine operation information and analysis to achieve live monitoring and management of all facilities, production lines and factories, according to Delta.Delta's Multi-Angle Insertion Robot Workstation integrates the articulated robot DRV90L series and robot controller DCV series for multi-angle insertion operation, as well as the machine vision system DMV 2000 series for work piece detection. The DMV2000 series is equipped with four lenses for various inspection tasks (e.g. appearance and color); it can quickly identify the size, color and position of each workpiece, and enable the robot controller to command the robot to execute precise and accurate pick-and-place and insertion operation, said Delta.

The global printed circuit board (PCB) industry went into a slightly decline in 2016. According to the research report from the Industrial Economics and Knowledge Center (IEK), the value of PCB production in 2016 was US$ 58.2 billion, representing a 1.9% decline compared to the previous year. But 2017 has brought about a change as the industry faces both challenges and opportunities. The recently released iPhone 8 and iPhone X require high-end HDI (High Density Interconnect) PCBs using advanced technologies such as mSAP (modified semi-additive process), which is a substrate-like PCB (SLP) process.These new flagship smartphones combine the cutting edge features of bezel-less OLED display screens with larger batteries which require more PCBs in the same space, including flexible printed circuit boards (FPC) and Rigid-Flex PCBs. These advanced PCB products have become a massive growth momentum driving the future PCB market towards a very promising direction.Process equipment and material suppliers play an important role in facing the challenges posed by mSAP. The need to control costs continues to be a priority for PCB makers, while new technologies which enter the landscape provide revenue opportunities but require manufacturers to partner with leading process solution providers. In a recent interview with Mr. Arik Gordon, Corporate Vice President and President of Orbotech's PCB Division, he talks about the development of new process-enabling solutions for mSAP PCB manufacturing. Orbotech has been developing leading yield-enhancing solutions for the manufacture of electronics products for over 30 years. Through its long-turn partnership with Taiwan PCB makers, Orbotech has helped the Taiwanese EMS industry to maintain its leading position in electronics manufacturing.However, the yield improvement process of mSAP PCBs is more challenging than the yield improvement process of other technologies, Gordon mentioned. mSAP production relies on equipment offering fine resolution (L/S=10/15µm) with high imaging quality and performance. This critical fine resolution process translates into more steps and greater complexity in the manufacturing process, with attendant process variations that kill the yields. The yield ramp-up challenges take time to overcome, and this raises the overall cost of the mSAP process.Working continuously with PCB makers has enabled Orbotech to develop a wide range of solutions designed specifically to make the demanding requirements of mSAP and advanced HDI PCBs. Orbotech offers an entire suite of solutions for the mass production of mSAP, including DI (Direct Imaging), AOI (Automated Optical Inspection) and AOS (Automated Optical Shaping) - the 3D shaping of opens, shorts and nicks. Furthermore, some of Orbotech's solutions, such as inkjet printers, are not dedicated for mSAP technology but are highly suitable and in great demand from PCB makers.New released Ultra Dimension Series - A revolution in the AOI room workflowOrbotech launched the Ultra Dimension Series, the 4-in-1 AOI solution, and the new manufacturing workflow of the AOI room at TPCA 2017 Show in Taipei. The Ultra Dimension is a single solution that combines four different systems - high precision high quality pattern inspection, single scan laser via (LV) inspection, remote Multi-Image Verification (RMIV) and automated 2D metrology - in one piece of equipment. Orbotech's Ultra Dimension creates a whole that is greater than the sum of its parts, as each part works in perfect synergy with the others. In doing this, Orbotech also creates new quality and functionality standards for the AOI workflow. This new AOI solution allows manufacturers of advanced PCBs using mSAP the flexibility to inspect a variety of applications and materials, and reduces the total cost of ownership (TCO).Gordon highlights that Orbotech's Remote Multi-Image Verification feature enables the remote verification of multiple image defects, which are automatically and simultaneously acquired during the AOI inspection process in PCB manufacturing fabs. This technology provides benefits to the In-Process Quality Control (IPQC) inspection operators who accurately differentiate between real and false defects, which are then sent to offline RMIV stations. The Ultra Dimension with RMIV also reduces the number of verification stations required, thereby freeing up valuable floor space in the AOI room and allowing manufacturers to cut their overall labor and operational costs significantly.Smart Factory software solutions boosting data analytics technologiesSoftware systems are more important than ever in the age of Industry 4.0, Gordon mentioned the further development of advanced technology trends. Orbotech Smart Factory software suite is an Industry 4.0 compliant manufacturing solutions that optimizes production services and data management. The software suite connects to all Orbotech's solutions and collects production data. It enables seamless integration into the production environment, serving as an interface with systems like MES.Meanwhile, Orbotech's InCAM series products are software solutions for rigid, flex and rigid-flex PCB production. InCAM is a dedicated CAM solution that combines analysis and editing capabilities with automatic production data optimization to perform high-precision CAM tooling PCB manufacturing. InCAM provides features with automatic design-for-manufacture optimization to help PCB manufacturers achieving high yields and a competitive edge for next generation product design.Continuous innovation in smartphones enables new features, and mSAP PCBs are being used in more and more of the leading global smartphone brands.With more than one billion handsets a year, it is likely that this trend will have an enormous impact on the manufacturers of PCBs and components for smartphones, and Taiwanese PCB makers have already started preparing their production to fit these requirements.It will be interesting to see how the market will develop over the next two or three years and how this trend will affect growth, especially of Chinese smartphone brands. The major Chinese vendors have been busy establishing signature products following the government's push for more innovation. Gordon sees that the positive development of the PCB market will expand Orbotech's presence in Asia, and that PCB makers both in China and Taiwan will continue strengthening their market position in close collaboration with Orbotech.Arik Gordon, Corporate Vice President and President of Orbotech's PCB division, is very optimistic to see Orbotech solutions in advanced PCB sectors and gain high market share.

Balazs, the leader of Air Liquide analytical service offerings for its electronics customers, expands its activities in Asia and introduces new laboratory and services capabilities in Taiwan. Utilizing experience and expertise from its extensive history in the semiconductor industry, Balazs Asia will be able to support the semiconductor and high technology industries in Asia through a local laboratory, chemists and experts.This Taiwan-based laboratory comes after several decades of experience and presence in the USA with extensive expertise in identifying ultra-low level contamination in a variety of gases, liquids, solids and materials used by high technology and semiconductor industries. Beyond simply performing chemical analyses and providing results, the global Balazs offer and capabilities helps customers solve chemistry and contamination related issues.Balazs Asia has established its office and laboratories in the Central Taiwan Science Park (CTSP) of Taichung, Taiwan. Utilizing the same analytical methods and drawing on expertise from their current laboratories, the Balazs Asia lab will start serving customers immediately. With a local presence, the analysis expertise of Balazs Asia looks forward to serving customers and growing its services portfolio throughout Taiwan and Asia.Scott Anderson, General Manager of Balazs Asia, commented: "In solving problems and providing complete answers, Balazs helps customers understand their various process steps, possible contamination, and gain insight into their product with improved control and yield among other benefits. It is this type of partnership and problem solving with customers that has gained Balazs thousands of customers throughout the world with many industries."Balazs expands its advanced analytical services footprint in Taiwan

The current manufacturing system using the power semiconductor equipment control driver has reached the goal of power consumption optimization, and such semiconductor components are extremely sensitive to damages caused by short-circuiting; therefore, there is a need to achieve the protection effect with a faster response speed. Accordingly, the performance demands for fuses are relatively stricter. If such short-circuit protection elements are absent, then these important power system faces the risks of machine malfunction and shutdown.For semiconductor equipment protection demands, CONQUER introduces the BMC series of fuses. Its product design is equipped with the low heat of fusion value (I2t) for overload current fast response in order to achieve the performance demand of high isolation capability with safe malfunctioning current cut-off in order to satisfy the protection performance. The product complies with the lead-free and halogen-free standards of RoHS, and it also qualifies for the international safety standards of the U.S. UL and Canada CAS with the Recognized Component and the China Compulsory Certification.CONQUER ELECTRONICS CO., LTD. is the most outstanding fuse manufacturer in Taiwan, its manufactured fuse components are widely used in various types of electronic equipment in the markets of industry, computation, automobile, consumer electronics, telecommunication, military, aviation and medical devices. We are specialized in branded products and OEM manufacturing, integration of research and development, design, manufacturing, marketing and services of fuse related components and products. We are committed to the green manufacturing process through technologies complying with the international environmental protection regulations along with the goal on automatic production and research and development of inspection equipment. With our consistent satisfaction of customer demands and enhancement of the safety of passive components, we are able to compete with international giants in the industry and to engage with the most advanced technologies in order to become the world-class professional research and manufacturing giant of fuses. For relevant details about Conquer, please visit our internet website at: http://www.conquer.com.tw.For the broad applications of the semiconductor equipment industry, including power rectifier, motor driver, AC/DC driver, power converter, Uninterrupted Power Supply (UPS) system, vehicle AC charging module, etc., the BMC Series product is the most ideal application choice.

Taiwan based digital TV modulator maker VATek announced it is working with leading manufacturers testing its new flagship modulator product. In response to the growing demands of DVB-t2 head-ends, the company is about to introduce VATek 3rd Gen modulator chips to the market before the end of the year. These soon-to-be released DVB-T2 modulator chips will be industry's first announced non-FPGA DVB-T2 solution that can help manufactures to build the most competitive digital TV modulators.VATek has been a driving force behind the movement of TV modulation technology, and it is now raising the bar by addressing the unique challenges to integrate DVB-T2 function into its newest product line. DVB-T2 is the latest commercial operated digital TV standard as an extension of existing DVB-T, allows a better use of the spectral resources. The technology has been widely used in many countries especially in Europe and Southeast Asia. The implementation of DVB-T2 relied on complex signal processing that keeps DVB-T2 head-end products' price very unfriendly. VATek has successfully built the very first non-FPGA DVB-T2 modulator - A3 & B3 modulator chips, which are going to be the most cost-effective solution in the market. Besides that, some additional features have been upgraded to the new chips. Including new stream engine in A3, capable to edit, filter or add PSI in real-time. The B3 ENMODER equipped with new H.264 @ 60fps encoder that make video looks better on TVs. After the reveal of DVB-T2 engineering sample earlier at Broadcast Asia, Singapore, VATek is starting to work with leading manufacturers to conduct the final test to the new chips, plans to bring the chips to market before the end of this year.VATek is deeply engaged with several manufactures to develop digital TV modulator based on the VATek's ENMODER turnkey platform, which already been introduced to the manufactures in 2017. The technical detail of the solution is fully open-source, helps manufactures to develop competitive head-end products and integrated with hospitality system to deploy advanced digital TV services to through coax cable network. The ENMODER based products are already been installed in the hotels, schools in many countries.VATek is also planning to bring its advance broadcast technology to different application fields. The company is working on the project to design an Android broadcasting platform that connects VATek USB modulator to SoCs and easily transforms any Android devices into a smart broadcaster or digital signage system. This can be the game changer to the media delivery industry.VATek powered the revolution of digital TV. it pioneered first generation digital TV standards, and now, we are leading the way to DVB-T2 and bring the industry to a new era. VATek products are revolutionizing the way engineers design headend product, allowing broadcasting system became simple and smart in ways never before imagined. For more information, visit VATek's website.VATek DVB-T2 modulator

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership in Energy and Environmental Design) Gold recognition from the U.S. Green Building Council. The state-of-the-art fab achieved the highest combined score among all 300mm foundry fabs in China, including a perfect score for Water Efficiency. This milestone further demonstrates UMC's commitment to green building and environmentally sustainable operations.M.L. Liao, vice president in charge of manufacturing resources integration and the environmental committee at UMC said, "UMC has initiated and implemented green measures not only to enhance energy-conservation for existing fabs, but also to ensure that new fabs meet and exceed the latest green building standards. Fab 12X's LEED Gold certification is a significant milestone in our efforts to promote sustainable manufacturing. Going forward, UMC will continue to fulfill its responsibility as a corporate citizen and base its development on green building concepts to promote the formation of a low-carbon, sustainable society."UMC's Fab 12X is southern China's first 300mm foundry facility. The fab is in mass production for 40nm and 28nm technologies, with a maximum design capacity of 50,000 wafers per month. The Xiamen based fab is a short distance from Taiwan, allowing seamless support from UMC's Taiwan headquarters. Fab 12X offers diversified 300mm manufacturing in addition to UMC's two other 300mm fabs in Taiwan and Singapore, and complements Hejian fab in Suzhou, China, which provides 8" foundry services.UMC can be found on the web at http://www.umc.com.

Benefiting from steadily growing demand in automotive electronics, telecommunication and network equipment, green energy and power supply markets, leading aluminum electrolytic capacitor manufacturer Lelon Electronics has posted record-breaking revenues two months in a row. September consolidated revenues reached NT$696 million, up 33.1% on year and 7.2% from the previous month. Cumulative revenues for the first nine months of 2017 totaled NT$5.22 billion, up 16.4% from the corresponding period of last year.Lelon enjoyed a significant increase in sales of polymer capacitors and snap-in aluminum electrolytic capacitors in the first nine months of the year thanks to steady growth of telecommunication and network equipment, green energy and power supply markets. Shipments of polymer capacitors soared more than 50% from the level of the previous year and sales of snap-in aluminum electrolytic capacitors also hiked nearly 40%.With respect to its strategy for polymer capacitors, the acquisition of polymer capacitor manufacturing equipment from Matsuki Polymer and the completion of its capacity expansion projects will make Lelon a non-Japan-based leading provider of SMD polymer capacitors. Recently launched Apple iPhones come with the support for quick charging, which is officially confirmed to also work with third-party chargers. Apple's continuing advancement in charging technologies is giving a boost to the quick charging market. Quick chargers impose more stringent requirements than conventional chargers in terms of their operating conditions and therefore need to use polymer capacitors to ensure higher product reliability and safety. The booming quick charging market will help make polymer capacitors a major growth driver of Lelon's revenues.Lelon has been stepping up efforts toward high-end electronics and power supply markets in recent years. Among them, original automotive electronics will be a focus of its strategy. Having made its way into the supply chain for tier-1 American and European automotive electronics providers, Lelon will strive to penetrate into the Japan market in the future. Advancing IoT technologies are pushing the demand for smart telematics systems. The number of electronic control units (ECU) will grow with developments in ADAS, autonomous driving, IoV and electric cars. The number of automotive displays which present safety information collected by ADAS is expected to top 50 million units with a total value reaching US$11.6 billion by 2017 and US$21 billion by 2022, a growth rate of nearly 10%, according to IHS. In particular, center information displays and instrument panels will account for the largest share of market value. With the demand for automotive displays steadily on the rise, the aluminum electrolytic capacitor market can expect to grow as well.The market of telecommunication and network equipment also fuels Lelon's growth momentum. Lelon has been performing outstandingly in China thanks to long-term partnerships and R&D collaborations between the company and local ICT solution providers. China is actively building up its 5G infrastructure and has announced the completion of phased 5G development and testing objectives with commercial operation planned for 2020. The market of telecommunication and network equipment will keep expanding with China's 5G investments ramping up.Lelon has amassed excellent manufacturing and development capabilities. Its R&D team has engaged in long-term collaboration with Industrial Technology Research Institute in Taiwan to jointly research on critical technologies. It is also actively participating in research projects of customers and material suppliers to develop products catering to market needs. Japanese technical consultants are employed to help refine Lelon's technology and quality systems. Its flexible production model enables the production line to be adjusted quickly to accommodate order changes so it can agilely meet customer's delivery schedule and provide a stable supply.Lelon's subsidiary aluminum foil producer Liton Technology is expected to generate higher second-half 2017 revenues compared to the first half thanks to strong market demand and added production capacity. Lidon Electronics Technology, a joint venture by Liton and China's largest formed foil producer HEC Technology, will also ramp up production of low voltage etched aluminum foil with plans to add capacity by 200,000 to 300,000 square meters of etched aluminum foil after volume production kicks off early next year.Lelon is shifting development focus toward high-end products, targeting high-growth sectors including original automotive electronics, advanced telecommunication equipment and cloud data centers. The company will endeavor to develop new products to meet market demands and can enjoy significant growth this year with these markets continuing to expand.