The second edition of the 2024 Chroma Precision Machinery and Measurement Technology Paper Award, organized by the Chroma Foundation and co-organized by the Industrial Technology Research Institute (ITRI), has concluded successfully.Having kicked off in June 2023, the competition lasted for 9 months. The final review and awards ceremony took place on March 14, 2024, bringing together elites from academia, industry, and research to commend the winners. The number of submissions for this year's competition increased by 55% compared to the first year. Students from 25 universities and 35 research institutes participated enthusiastically. The submitted papers covered a wide range of topics, including semiconductor optical inspection technology, electric power conversion and drive control technology, key components and modules in power electronics, electric vehicle powertrain testing technology, thermal interface material / thermal resistance measurement technology, micron-level precision machinery technology, integrated photonics chip testing technology, machine learning (ML) applications in precision testing or control technology, microwave and millimeter-wave measurement technology, and semiconductor testing for AI and ML, totaling ten main themes.Fostering the Next Generation of InnovatorsChroma ATE Chairman Leo Huang emphasized the award's commitment to nurturing the next generation of talent. "The Chroma Paper Award aims to inspire young minds to explore creative applications in precision measurement," said Huang. "By encouraging collaboration between academia and industry, we can cultivate exceptional talent to address the evolving R&D needs of Taiwan's technology sector and fuel future innovation."Chroma ATE Chairman Leo Huang delivering the opening speechGroup photo of distinguished guests and judges at the banquetGroup photo of student participants with Chroma Foundation Chairman Paul YingPaper Award Activity Series: Tech Industry Advocacy and Career Consultation FairOn the day of the final review, Chroma concurrently held the Tech Industry Advocacy and Career Consultation Fair, inviting all participating students and their advisors to take part. At the event, Chroma's R&D leads, product managers, and technical specialists shared their insights on various topics, including Chroma's role in the tech industry, corporate sustainability, career paths from novice engineer to R&D leader, and technological innovation. Six of Chroma's technical experts provided face-to-face career consultations, drawing a large number of students and creating a lively atmosphere at the venue.Gold Award WinnersThe coveted gold award was given to a team from the Department of Power Mechanical Engineering at National Tsing Hua University. Yu-Hsiang Wen, Wei-Chen Kuo, Yi-Kuo Wu, Chun-Yu Wu, and Yu-Chen Wu were recognized for their paper titled "Development of a Full-field Real-time Stress and Strain Measurement System". Their faculty advisors were Professor Dr. Wei-Chung Wang and Dr. Po-Chi Sung.Chroma ATE Chairman Leo Huang (2nd from right) and Gold Award students with Professor Wang Wei-Chung (1st from left).The detailed list of winners can be found on the official website of the Chroma Paper Award.Closing the ceremony, I-Shih Tseng, President of Chroma's Integrated Systems BU, gave a speech: "Generative AI has made people anxious, everyone may be wondering when they will be replaced by AI. However, no matter how technology changes, the need for precise and reliable measurements will always exist. My advice to students is that going to a large company may seem promising, but you may be put in a very small position and stay there for a lifetime.At Chroma, we offer a dynamic and highly challenging work environment. Our colleagues are constantly challenged by Wall Street's "Big 7". For us, every time we have a breakthrough project, we see these technologies being promoted all over the world, going on to shape a better future. We really enjoy the process of making breakthroughs, and we hope that more people can join us in this experience."Group photo of the participants at the 2nd Chroma Paper Award ceremony and banquet

Rugged embedded computer brand—Cincoze has launched two new compact embedded computers in the Rugged Computing—DIAMOND product line. The DA-1200 is a palm-sized device suitable for most industries' basic applications and at a price point that has made it a popular choice among customers for many years. With this latest performance boost, it will likely remain a top choice. The DV-1100 supports the latest 13th/12th generation Intel Core CPUs, providing powerful performance in a streamlined configuration and maximizing cost-effectiveness. It is recommended for industrial sites with high-performance computing needs but limited installation space, such as smart manufacturing, machine vision, and railway computing.Powerful & Tiny Computer – DA-1200Powerful & Tiny Computer – DA-1200The DA-1200 industrial embedded computer has a 12W ultra-low power consumption Intel Alder Lake-N processor and supports 16GB DDR5 4800 MHz memory. Equipped with two M.2 Key B slots (convertible to M.2 Key E with an adapter card), the DA-1200 can cover all wireless communication needs (5G, WIFI, GNSS, etc.) and caters to storage options such as 2.5″ SSD, half-slim SSD, and M.2 SSD. The palm-sized DA-1200 is only 150 x 105 x 52.3 mm, packing the maximum application flexibility into a tiny package.The DA-1200 is easy to install and maintain. It supports wall mount, side mount, and DIN-rail mount options for ease of installation in space-constrained applications. To make setup and adjustment easier for customers, all the key settings and switches—the reset switch, AT/ATX switch, and SIM card slot are all accessible on the front panel maintenance area, making them more convenient. It is an entry-level choice that inherits the rugged DNA of the Cincoze industrial computer lineup. It works across a wide temperature range (-40 to 70°C) and wide voltage range (9 to 48V), complying with the US military shock resistant vibration standard MIL-STD-810H and the EMC test standard for industrial environments (EN IEC 61000-6-2 and EN IEC 61000-6-4).High-performance & Cost-effective Computer – DV-1100High-performance & Cost-effective Computer – DV-1100The DV-1100 supports the latest 13th/12th generation Intel Core CPU and up to 32GB of DDR5 4800 MHz memory and provides high-speed NVMe SSD storage for maximizing processing capabilities. Measuring only 224.1 x 162 x 62mm and supporting 2.5G LAN and 10G USB3.2 Gen2x1, the DV-1100 is the smallest high-performance Cincoze model and an ideal choice for industrial applications such as machine vision and real-time image monitoring that require a computer with a small footprint and high-speed communications. The DV-1100 has built-in M.2 Key B and Key E slots, and I/O and IGN functions can be added using exclusive Cincoze CMI and CFM modules.The DV-1100 passes and complies with several industry certifications or standards, such as EN 50155 (EN 50121-3-2 only) for railway computing, the US military shock-resistance and vibration standard MIL-STD-810H, and the EMC test standard for industrial environments (EN IEC 61000-6-2 and EN IEC 61000-6-4). To ensure we provide our customers with industry-leading quality, the entire Cincoze Rugged Computing—DIAMOND series can not only operate in a wide temperature range (-40 to 70°C) but also pass our stringent internal testing, including a rigorous four cold starts over 17 hours at -40°C. This test challenges current industry limits and ensures the DV-1100 can reliably maintain stable operation in harsh environments.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded Phase Change Memory (ePCM) to support next-generation embedded processing devices. This new process technology, co-developed by ST and Samsung Foundry, delivers a leap in performance and power consumption for embedded processing applications while allowing larger memory sizes and higher levels of integrating analog and digital peripherals. The first next-generation STM32 microcontroller based on the new technology will start sampling to selected customers in the second half of 2024, with production planned for the second half of 2025.Remi El-Ouazzane, President of Microcontrollers, Digital ICs and RF products Group at STMicroelectronics, said: "As a leading innovator in the semiconductor industry, ST has pioneered and brought to our customers FD-SOI and PCM technologies for automotive and aerospace applications. We are now taking the next step to bring the benefits of these technologies to developers of industrial applications starting with our next-generation STM32 microcontrollers."Technology benefitsCompared to ST 40nm embedded non-volatile memory (eNVM) technology used today, 18nm FD-SOI with ePCM vastly improves key figures of merit:*More than 50% better performance-to-power ratio*2.5-times higher non-volatile memory (NVM) density enabling larger on-chip memories*Three times higher digital density for integration of digital peripherals such as AI and graphics accelerators and state-of-the-art security and safety features*3dB improvement in noise figure for enhanced RF performance in wireless MCUsThe technology is capable of 3V operation to supply analog features such as power management, reset systems, clock sources, and digital/analog converters. It is the only sub-20 nm technology supporting this capability.The technology also delivers the reliability required for demanding industrial applications thanks to the robust high-temperature operation, radiation hardening, and data retention capabilities already proven in automotive applications.Additional information on FD-SOI and PCM is available on ST.com.Benefits to STM32 microcontroller developers and customers Microcontrollers based on this technology will bring developers a new class of high-performance, low-power, and wireless MCUs. The large memory sizes support the growing needs of edge AI processing, multi-protocol RF stacks, over-the-air updates, and advanced security features. The high performance and large memory size capabilities will give developers using microprocessors today the option to use more highly integrated and cost-effective microcontrollers for their designs. It will allow further steps in power efficiency for ultralow power devices where ST's portfolio is industry-leading today.The first microcontroller based on this technology will integrate the most advanced ARM Cortex-M core, providing enhanced performance for machine learning and digital signal processing applications. It will offer fast and flexible external memory interfaces, and advanced graphic capabilities and will integrate numerous analog and digital peripherals. It will also have the advanced, certified security features already introduced on ST's latest MCUs.18nm FD-SOI with embedded Phase Change Memory (ePCM) to deliver a leap in performance and power consumption

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed a new high-performance device that punches above its weight by combining the performance, scalability, and security of microprocessor-based systems that are typically more complex with the simplicity and integration of microcontrollers (MCUs).Using these new STM32H7 MCUs, producers of equipment like smart appliances, smart-building controllers, industrial automation, and personal medical devices can evolve their products more quickly and cost-effectively as end-user demands continue to increase. Examples include adding richer, colorful user interfaces and performing multiple functions simultaneously, which is usually achieved with microprocessors (MPUs)."Our STM32 is already the world's most popular Arm Cortex-M microcontroller family, and the latest STM32H7 devices let designers address even more use cases within this powerful ecosystem," said Patrick Aidoune, General Purpose MCU Division General Manager, STMicroelectronics. "Its MPU-like qualities deliver outstanding core performance with the peripheral integration and convenience of an MCU, at a cost-effective price point.""With a dedicated graphics processor and fast memory interfaces on-chip, these MCUs are perfectly aligned with our mission to push the boundaries of what's possible in embedded displays," commented Kamil Kozlowski, CEO of Riverdi, a lead customer for the STM32H7R/S MCUs. Riverdi has chosen the devices to power its next generation of display modules. "The MCUs promise to enhance the visual performance and responsiveness of future displays, enabling more engaging and interactive user experiences. This represents a significant step forward in our journey to provide cutting-edge display solutions to our customers."ST's new STM32H7R and STM32H7S microcontrollers come with robust security features, needed to address Internet of Things (IoT) applications. They include protection against physical attacks, memory protection, code isolation to protect the application at runtime, and platform authentication. The STM32H7S devices provide further security enhancement by integrating immutable root of trust, debug authentication, and hardware cryptographic accelerators that support the latest algorithms to prevent unauthorized access to code and data. With these security features, the devices are targeting up to SESIP3 and PSA Level 3 certifications, meeting the highest industry standards for cyber protection.The STM32H7 MCUs combine the highest-performing Arm Cortex-M core ST that has yet to be announced (Cortex-M7 running at up to 600MHz) with minimal on-chip memory and high-speed external interfaces. They let engineers build systems with extra performance and flexibility using simple, low-cost microcontroller development tools. The devices available are further divided into the STM32H7R3/S3 general-purpose MCUs and the STM32H7R7/S7 with enhanced graphics-handling capabilities. Developers can share software extensively between the two lines, enabling efficient use of project resources and faster time to market for new products.Michela Menting, Senior Research Director from ABI Research, said: "IoT hardware security is the holy grail for created trusted devices. The difficulty has been to offer a high level of security for MCU-based embedded hardware while cost-effectively achieving MPU performance; three criteria that are not often seen together in the market. The new STM32H7 MCUs appear to offer just that, with security front and center, built to perform the multi-application requirements of privacy-hungry markets in the consumer and industrial space."ST's new STM32H7 MCUs are scheduled to enter volume production from April 2024. Sample requests and pricing information are available from local ST sales offices.The STM32H7S8-DK demonstration and development platform, and the affordable and extendable NUCLEO-H7S3L8 MCU board, are available to accelerate building applications using the new devices.For more information, please go to www.st.com/stm32h7rs-product-overview.New STM32H7R/S microcontrollers raise embedded-application performance to new levels for next-generation smart devices in factories, buildings, infrastructure, eHealth

According to statistics, the global number of connected devices reached 16 billion by 2023, more than double the global population! However, there are many device manufacturers who have yet to adopt security by design principles leading to hacking and privacy risks at the population level. To protect consumers many governments consider device security as a crucial national security issue and are in the process of legislating for its implementation. This trend will impact the entire electronics industry, from IP, chips, software and end devices, posing a challenge for stakeholders to comply with various security regulations and laws.In response, Arm has incorporated cybersecurity requirements mandated by different regulations, including those from the EU and the UK, into the new version of PSA Certified Level 1 v3.0 document. Leveraging its large security ecosystem, Arm assists stakeholders in preparing early for compliance.Irresistible Legislative Trends for StakeholdersPSA (Platform Security Architecture) Certified, initiated by Arm in 2018 to address various underlying security issues, has become a common security platform in the IoT industry, with a total of 200 PSA Certified products globally.Regarding the latest legislative trends in security, Rob Coombs, Security Director, Arm & PSA Certified (PSA JSA) Chair, mentioned that in Europe, governments are formulating baseline cybersecurity regulations. For Taiwanese companies operating in the European market, preparing before the laws are enforced is crucial.The UK's Product Security Telecommunications Infrastructure (PSTI) Act is the fastest approaching regulation, set to come into effect this April. Additionally, the EU's Radio Equipment Directive (RED) has cybersecurity requirements that will come into force in August 2025. A couple of years further out is the Cybersecurity Resilience Act (CRA) that is currently under legislation. In the United States, state laws have already banned default passwords, such as California's SB-327. PSA Certified brings all of these requirements together in a new section of PSA Certified Level 1. OEMs can answer the Level 1 requirements to see if they comply or assess the gap that needs to be fixed. They can optionally get a third party assessment from a test laboratory to get an impartial assessment."For PSTI, manufacturers can use the PSA Certified Level 1 certification to document whether their submitted chip/device/software designs comply with the security requirements, allowing third-party labs to review their answers. As for EU's RED and CRA, the new version of PSA Certified Level 1 document also includes the draft requirements from regulations, enabling companies to prepare this year without waiting for the regulations and standards to take effect. As PSA Certified is widely accepted in the industry as a security solution, using it as a design foundation will help companies address upcoming security regulatory issues in a more cost-effective and simpler manner."Assisting OEMs in Overcoming Challenges to Security DesignIn addition to various security standards, OEMs now face new regulatory issues, making security design for IoT devices more challenging. Rob Coombs believes that regulations will be a more significant concern for stakeholders because this involves whether products can be sold. Therefore, whether products can adhere to security principles from the outset will be the starting point for the design challenges that stakeholders face.However, on the other hand, the complexity of the entire OEM value chain is even more challenging. Chip manufacturers are responsible for providing Hardware Root of Trust (RoT), which includes security functions such as encryption and keys. The software layer, such as FreeRTOS LTS or one of the Linux platforms, is responsible for executing OTA updates and secure communication. Typically, OEMs combine the software platform of their choice with a main System on Chip (SoC), then add their own application code. It is challenging for OEMs to answer product level security requirements when they have not designed the chip or platform software.To overcome this issue, PSA Certified uses composition which means that the OEM can reuse a pre-certified chip or software platform. They only have to answer a smaller set of security questions that focuses on their device application code. Growing cybersecurity regulation will force all device makers to adopt security by design practices, PSA Certified makes that as easy as possible by dividing up the problem into chip + system software + deviceOne way that security is better on Arm is the availability to chip vendors of open source trusted firmware for MCUs and MPUs. This provides a consistent set of crypto and secure storage APIs available to OEMs from many chip manufacturers. Providers of key middleware components such as Other The Air (OTA) updates and Transport Layer Security (TLS) can use these standardized interfaces to the chip's hardware security to better protect devices and services.Rob Coombs likened it to, "Just as PCs have BIOS and TPM, chips based on the Arm architecture have a PSA Certified RoT to achieve secure boot and PSA Crypto API to standardize crypto functions."Building a Strong Security Ecosystem Starting from the Root of Trust (RoT)Anurag Gupta, Director Business Development, Platform Security Architecture at Arm, added that PSA Certified has three different levels of certification for the chip. PSA Certified Level 1 indicates that the chip has a hardware RoT and the chip vendors written assessment responses were passed by the lab. PSA Certified Level 2 involves chip testing in the lab for basic software attacks and is suitable for most connected devices. PSA Certified Level 3 demonstrates protection from substantial physical and software attacks on the RoT, assessed in the lab by passing penetration testing.Therefore, OEMs can choose the appropriate security level according to their needs, whether it only needs to pass software attacks or needs to pass both software and hardware attacks. "This is the first time in the industry that there is a common language for OEMs to tell chip manufacturers what security level chips they need, which is a significant step forward for security design."Moreover, since many software engineers are not familiar with hardware security technologies, defined PSA Certified APIs make it easier for developers to leverage the security features provided in chips. Developers who choose a chip that supports PSA Certified APIs can use hardware security functions on different chips with the same code, greatly simplifying product development.Rob Coombs stated that PSA Certified is independent of architecture, and certification is not exclusive to chips based on the Arm architecture; it is applicable to other architectures as well. However, Arm's various security offerings, such as TrustZone technology and availability of optimized trusted firmware with common APIs have been optimized for PSA, making chips based on the Arm architecture best suited to a security by design approach and PSA Certified.Therefore, under Arm's promotion for many years, PSA Certified has not only been adopted by leading chip manufacturers but has also been widely expanded to many software and device manufacturers, constructing a powerful security ecosystem.At the same time, Arm continues to strengthen its security technologies. In addition to adding Memory Tagging Extension (MTE) protection methods to newer Arm processors, which effectively reduce serious security errors such as memory security violations and memory corruption, significantly reducing the chances of being attacked, Arm will also later this year transition to Long Term Stable for Trusted Firmware, making security solutions on the Arm architecture even more attractive.*Visit the PSA Certified website: https://www.psacertified.org/ *Download the 2023 PSA Certified Security Report - Regulations and Security: The Multiplier Effects, to understand the insights from PSA Certified founders and partners on the security of connected devices amidst increasing security investment costs due to rising security demands.*Watch the video of the "Arm Security Summit 2024" to understand how Arm assists industries in designing a more secure world on Arm.*To learn more about certifying products, visit: https://www.psacertified.org/development-resources/certification-resources/The 2023 PSA Certified Security Report - Regulations and Security: The Multiplier Effects

With net zero carbon emissions becoming a global commitment, an automotive industry revolution gets well underway. TAIPEI AMPA and AUTOTRONICS TAIPEI 2024 will take place April 17-20 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) in concurrence with 2035 E-Mobility Taiwan at the same venue. The three joint exhibitions will cast a spotlight on Taiwan's all-round automotive industry ecosystem as well as local and foreign iconic manufacturers' product roadmaps and technological strengths to help event participants capture next-generation mobility market opportunities.Already a key event catching the attention of the global automotive industry as well as the mobility technology sector, TAIPEI AMPA and the joint exhibitions will gather close to 1,000 exhibitors hosting 2,700 booths. Centered on "RE:SHAPING THE AUTOMOTIVE INDUSTRY," the event will focus on four themes: "RE:DUCE," "RE:THINK," "RE:SECURE" and "RE:CONNECT." Not only will visitors gain a perspective on international industry trends but they will also see how Taiwan's innovations and achievements give a new look and feel to automobiles and motorcycles.RE:DUCE – a look into the automotive industry's carbon reduction and sustainable development strategiesWith ESG being at the center of the automotive industry's attention, leading automakers growingly choose to work with partners that make ESG a priority. In response to the trend, Taiwan-based manufacturers are also making efforts toward carbon reduction and sustainable development so as to capture preemptive green supply chain opportunities. Continuing to promote ESG, the Taiwan External Trade Development Council (TAITRA), organizer of TAIPEI AMPA and the joint exhibitions, will set up an alternative fuel vehicles and solutions pavilion at this year's event for hydrogen cars and new energy vehicle components. The aim is to uncover the development potential of clean energy sources for vehicles. Moreover, TAITRA also has a series of "ESG Achievement" activities planned, including the awarding of "Golden ESG Achievement" and "Green ESG Achievement" marks to exhibitors showing noteworthy EGS actions. There will also be a platform for companies to share their sustainable development strategies and accomplishments, allowing visibility on the mobility industry's efforts and commitments toward sustainability and carbon neutrality. RE:THINK – a grasp on the latest international trendAutomotive industry transformation is something of great urgency as cars go electric and get smart. To help the industry prepare for the impact, TAITRA will hold an international forum during the event period. Keynote speakers from home and abroad will shed light on the development trends of automotive safety systems and new energy cars. There will also be an abundance of event activities. For example, the "guided tour" activity will have industry specialists or key opinion leaders (KOL) guide visitors on a tour of the exhibitions. The tours will be planned based on industry backgrounds to allow visitors to instantly grasp the key products and technologies at the exhibitions while broadening and deepening their understanding. RE:SECURE – a search for new automotive safety solutions Continuing automotive technology advances and supply chain changes introduce never-before-seen challenges to safety – the core of mobility. In line with the "RE:SECURE" theme, which highlights road and vehicle safety, an automotive safety equipment and system pavilion will be set up at the event, showcasing active and passive safety systems as well as solutions from iconic automotive cybersecurity firms. There will also be an automotive safety consultation service booth to help companies understand new generation automotive safety regulations and critical issues.RE:CONNECT – a reinvention of a value chain for the future mobility eraBurgeoning ICT developments allow automotive systems to incorporate more and more innovative materials and technologies. Procurement meetings between the traditional automotive industry and various industries have become a new business model. At this year's event, procurement meetings will more actively bridge exhibitors and international buyers, accelerating their connection with the global industry ecosystem and helping them tap worldwide opportunities. Vehicle modification is an art form that makes use of automotive components. The "Speed & Crafts" special exhibition will showcase winners of the motorcycle modification contest and present Taiwan's state-of-the-art modification craftsmanship. "Talent Transistors" will match young talents seeking career opportunities in the industry with potential employers, helping drive talent flow and boost market competitiveness.A global-scale mobility event for an all-round automotive industry ecosystemAn automotive industry revolution driven by sustainability, smartization and safety is well underway. Joint industry-government-academia efforts worldwide will speed up the revolution. The TAIPEI AMPA, AUTOTRONICS TAIPEI and 2035 E-Mobility Taiwan 2024 event will cast a spotlight on the new global supply chain and shape a 360º mobility ecosystem. Visitors of the event will explore cutting-edge automotive industry developments.For more information visit https://www.taipeiampa.com.tw/en/TAIPEI AMPA, AUTOTRONICS TAIPEI and 2035 E-Mobility Taiwan 2024 – an annual global-scale automotive industry eventPhoto: TAITRA

Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024. Cincoze will display its range of world-class industrial embedded computing products around the theme of "Comprehensive AI Edge Computing Solutions," encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Fanless Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.Rugged Embedded ComputersRugged Embedded ComputersCincoze Rugged Computing – DIAMOND product line is for harsh industrial environments where many computers would struggle. The seven computers in the range have wide temperature, wide voltage, and industrial-grade protections, while each model offers different performance, expandability, size, power efficiency, and industry certifications. Every model supports additional I/O and functions through Cincoze's exclusive modular expansion technology for maximum application flexibility.Industrial Panel PCs & MonitorsIndustrial Panel PCs & MonitorsCincoze Display Computing – CRYSTAL product line consists of six different series, including industrial panel PCs (CV-100/P series) and monitors (CV-100/M series) for general use in harsh industrial environments, sunlight-readable panel PCs (CS-100/P series) and monitors (CS-100/M series) for use in high brightness environments or outdoors, and open frame panel PCs (CO-100/P series) and monitors (CO-100/M series) for seamless integration in advanced machine equipment. The CRYSTAL line offers a range of screen sizes, display ratios, touch methods, resolution, brightness, and other options to provide a complete and comprehensive selection.Embedded GPU ComputersEmbedded GPU ComputersCincoze GPU Computing – GOLD product line is for rapidly evolving AI technologies by providing the computing power needed for machine learning and AIoT in industrial environments. Cincoze will showcase the GM-1000 and GP-3100 series in the GPU Computing – GOLD product line. The GM-1000 is a high-performance computer that supports an MXM GPU and is best suited for machine vision applications with limited installation space. The GP-3100 is Cincoze's flagship model that supports up to two full-length graphics cards with the addition of a GPU Expansion Box and can perform sophisticated and complex visual inspection or autonomous driving. The GP-3100 has three patents for its heat dissipation, expansion, and GPU card mounting bracket designs, not only solving customer pain points but also winning many awards.New ProductsThe New Products Zone will showcase a number of the latest products with the latest Intel Raptor Lake processor. The biggest highlight is the new Machine Computing – DIN RAIL PC (MD Series) product line, specially tailored for control cabinets, further filling out Cincoze's range for smart manufacturing. In addition to its excellent processing performance, expansion capabilities allow adding I/O, storage, and expansion sockets according to application needs, providing more options and flexibility.Embedded World Exhibition InformationItemDetailDateTue. – Thu., April 9 - 11, 2024PlaceExhibition Center, Nuremberg, GermanyStandHall 1, Stand 1-260TimeApril 9: 09:00-18:00April 10: 09:00-18:00April 11: 09:00-17:00

Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is set to make a significant debut at Embedded World 2024 (Hall 3, Booth 3-230) in Nuremberg, Germany from April 9th to 11th, 2024. With a thematic focus on 'Embedded Solutions for Resilient Guidance and Steady Progress', Darveen presents a comprehensive display across three exhibition areas, showcasing a diverse range of industrial embedded product solutions meticulously designed for various industrial applications.Visit Darveen's booth and check out our latest products at the exhibition, including:Vehicle Mount ComputersAt the forefront of port terminal digitization, Darveen introduces its latest vehicle mount computers featuring high-performance Intel 12th-generation processors. Additionally, ARM-based Android vehicle mount computers and all-in-one vehicle computers for railways equipped with M12 waterproof and lockable connectors will be showcased. These cutting-edge solutions promise to revolutionize fleet management or machinery for ports, forklifts, trucks, mining vehicles, and agricultural vehicles to a new level.Rugged TabletsDarveen's rugged tablet computers epitomize exceptional durability and stability, complying with stringent testing standards such as IP67 and MIL-STD-810H military specifications. Building upon a year of innovation, Darveen introduces high-performance models powered by Intel 12th generation processors and boasting 1,000 nits brightness, significantly enhancing operational efficiency for law enforcement, public sector entities, and field workforce operations.IoT Automation SolutionsDarveen also showcases the latest embedded computers and industrial panel PCs, serving as the cornerstone of IoT-driven automation. These solutions cater to diverse applications in smart factories, industrial automation, warehouse management, and smart city infrastructure.Join us at Booth 3-230 at Embedded World from April 9th to 11th, 2024!Explore Darveen's Cutting-Edge Embedded Computing Solutions for Industrial Applications

SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.HBM (High Bandwidth Memory) is a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed compared to conventional DRAM products. HBM3E, the extended version of HBM3, is the fifth generation of HBM following HBM, HBM2, HBM2E and HBM3.SK Hynix (or "the company", www.skhynix.com) being the first provider of HBM3E, a product with the best-performing DRAM chips, extends its earlier success with HBM3. The company expects successful volume production of HBM3E and its experiences as the industry's first provider of HBM3 to help cement its leadership in the AI memory space.To build a successful AI system that processes a huge amount of data quickly, a semiconductor package should be composed in a way that numerous AI processors and memories are multi-connected. Global big tech companies have been increasingly requiring stronger performance of AI semiconductors and SK Hynix expects its HBM3E to be their optimal choice that meets such growing expectations.The latest product is the industry's best in all the aspects required for AI memory including speed and heat control. It processes up to 1.18TB of data per second, equivalent to processing more than 230 full-HD movies (5GB each), in a second.As AI memory operates at an extremely high speed, controlling heat is another key qualification required for AI memories. SK Hynix's HBM3E also comes with a 10% improvement in heat-dissipation performance, compared with the previous generation, following the application of the advanced MR-MUF process.MR-MUF (Mass Reflow Molded Underfill) is the process of stacking semiconductor chips, injecting liquid protective materials between them to protect the circuit between chips, and hardening them. The process has proved to be more efficient and effective for heat dissipation, compared with the method of laying film-type materials for each chip stack. SK Hynix's advanced MR-MUF technology is critical to securing a stable mass production on the supply side of the HBM ecosystem as pressure on the chips being stacked can be reduced, while warpage control is also improved with the adoption of this process.Sungsoo Ryu, Head of HBM Business at SK Hynix, said that mass production of HBM3E has completed the company's lineup of industry-leading AI memory products. "With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider."SK Hynix begins volume production of the industry's first HBM3E

NEXCOM, a leading industrial computer manufacturer, has long been dedicated to edge computing and industrial IoT solutions. Its Mobile Computing Solutions Business Unit (MCS) focuses on the Edge AI railway and in-vehicle application fields.This week, NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA.NEXCOM will be showcasing at booth #339 its full range of IP67 Rating and high-performance AI-powered rugged edge railway and in-vehicle computing solutions focusing on the AI transportation market, including smart bus & rail transit, AI-aided public works, smart AI patrol, material-handling management, and earth-moving vehicles. Among the foregoing, NEXCOM's expertise in railway solutions powered by the NVIDIA Jetson platform for edge AI and robotics is a must-see. Its AI-ISV providers harness the NVIDIA Jetson modules and comprehensive NVIDIA JetPack software stack. Combined with NEXCOM railway computers and its NEXCOM Accelerator Linux (NAL), these capabilities have helped lead to the creation of several innovative railway applications like 3D sensor-based perception and predictive maintenance systems, pantograph inspection systems, and solutions for crowd/people counting management. These solutions contribute to safer, more efficient, and intelligent railway operations.Using the NVIDIA Jetson platform to help create a robust and high-performance railway and in-vehicle solutionIn recent years, NEXCOM has combined its solid hardware strength with the software technology of upstream computing partners to develop a variety of high-performance Edge AI computing platform products for smart railway and in-vehicle applications. In addition to meeting NVIDIA Partner Network requirements, NEXCOM was also selected as an NPN member due to its expertise in the design of its IP67 Rating Railway computer with the full line-up of NVIDIA Jetson Orin modules and high-performance computing platforms.Leo Chang, associate vice president of NEXCOM's MCS Business Unit, said that the company has incorporated a diverse product portfolio of NVIDIA technology that includes the NVIDIA Jetson AGX Orin, NVIDIA Jetson Orin NX, and NVIDIA Jetson Xavier NX. These products have been deployed in AI solutions in collaboration with international local railway operators and several cities across Europe and Asia, and NEXCOM is continuously expanding further.NEXCOM continues to strengthen the application of terminal Edge AI software-defined edge computing solutions to create a more convenient and safe smart living environment for human society.Through continuous focus on improving edge computing technology and using AI computing power to assist partners in building efficient and stable AI railway and in-vehicle transportation systems in harsh environments, NEXCOM's solutions have spread to several cities overseas. At the beginning of the year, NEXCOM signed a cooperative agreement on intelligent transportation applications for railways with solution application providers in Germany and Hong Kong. By participating in the NVIDIA GTC conference, NEXCOM aims to build more international transportation project cooperation.In the face of the intelligent trend that will be developed in multiple aspects of edge applications, NEXCOM's Edge AI computing product line covers multiple fields such as AI transportation, smart retail, urban governance, and manufacturing. NEXCOM will continue to strengthen the layout of AI technology in vertical fields in the terminal Edge AI software-defined edge computing solution, and continue to use NVIDIA technology, to expand the Edge AI computing platform product items, improve the diversity and performance of AIoT solutions, assist customers in quickly building efficient AI application systems, and successfully promote digital transformation. NEXCOM aims to bring humans a more convenient and safer smart living environment.NEXCOM is going to join the NVIDIA GTC global AI conference, taking place from March 18 to 21 at the San Jose Convention Center in California, USA