The rising popularity of generative AI is spurring demand for high-performance computing. This in turn fuels demand for edge system components and related applications, all of which bring along stringent testing requirements. Chroma ATE, an industry leader in the power test & measurement industry, has also secured a prominent position in the increasingly critical field of semiconductor component testing. To address the continually rising testing needs of domestic and international customers, Chroma recently hosted the Chroma ATE Semiconductor Test Seminar in Hsinchu, Taiwan, one of Asia's premier tech hubs. The event focused on sharing Chroma's next-generation solutions for GaN and RF component testing, all set to provide customers with exceptional test performance.Continued Excellence in ATE Market, Focusing on AI, IoT, GaN/SiC Power Component Testing DemandsGeorge Chang, President of Chroma's Semiconductor Test Equipment BU, stressed the significance of this event—the second of its kind—during his introductory remarks. He explained that the challenging journey Chroma ATE has undertaken in the global semiconductor test equipment field for over two decades was a major reason for hosting this seminar. As of December 2023, Chroma had over four thousand semiconductor test systems deployed globally, firmly establishing itself in the top four of the global semiconductor Automated Test Equipment (ATE) market.Eugene Lin, Vice President of Chroma's Semiconductor Test Equipment BU, discussed the recent growth in the markets of AI, IoT, and third-generation semiconductors (GaN/SiC). With the expanding demand for semiconductor components, particularly in AI and IoT applications, he highlighted the complementary relationship between these two markets. As IoT devices and AI applications become more widespread, Edge AI, enabling real-time computation directly from endpoint devices, is proving to be a vital emerging technology. Chroma's advanced SoC test system, the 3680, is well-suited for Edge AI and IoT communication chip testing, meeting the high-speed and high-precision mixed-signal testing requirements of AI chips. When coupled with the wireless/RF function board HDRF2, it can perform tests on RF chips for satellite-based navigation such as GPS, BeiDou, and Galileo, as well as common wireless network technologies like Bluetooth, Wi-Fi, and LPWAN. Catering specifically to GaN/SiC component testing, the Chroma 3650-S2 is purpose-built to meet the high-power needs of these applications.Power Performance Comparison, Precise Measurement of Leakage Current Emerges as KeySpancer Lee, Senior Manager of Product Marketing at Chroma's Semiconductor Test Equipment BU, delved into the challenges of testing GaN components. As power levels continue to escalate, the leakage current in GaN components increasingly impacts the power performance of the overall system. Achieving precise measurements at the scale of nanoamperes (nA) is crucial, especially given the rapid switching speeds involved. This is why for engineers, precise measurement capabilities are indispensable when it comes to automated test equipment (ATE). Mr. Lee highlighted that the Chroma 3650-S2 addresses the need for accurate measurement of small currents. To handle the high-frequency characteristics of GaN components, the pulse signals provided by the test platform meet the requirements of being small, precise, and fast. This capability enables engineers to observe the overall performance of the component. Since its launch in 2022, the tester has been capable of handling voltage levels of 3000V, which had already been upgraded to 3750V in 2023. Anticipations are set for the system to surpass the 4000V milestone in 2024, thereby fully meeting the test requirements for high-power applications.Addressing IoT and 5G Demands, Introducing New HDRF2 RF Test Module Lenskin Tsai, Director of Business Development at ADIVIC Technology, a Chroma Group subsidiary, shared insights into wireless and RF signal measurement. ADIVIC specializes in wireless communication measurement and is a key subsidiary within the Chroma Group. Mr. Tsai explained that the Chroma 3680 test platform, when paired with the HDRF2 module, assists customers in meeting their wireless and RF testing requirements even with limited resources. In recent years, the high cost of testing has significantly impacted the 5G sector, leading to fewer investments by industry players. However, based on Chroma's observations, this challenge has been acknowledged on a global level by the 3rd Generation Partnership Project (3GPP), the global mobile communications standards organization. As part of future spectrum planning, the organization plans to open up the 7-24GHz frequency band in a bid to reduce testing costs. At the same time, Chroma ATE has initiated the development of its next generation of RF test modules to continue meeting the wireless signal testing needs of both domestic and international service providers.Beyond Hardware – Chroma ATE Provides Customers with Platform Conversion ToolsShih-Fang Zeng, Technical Support Manager at Chroma's Semiconductor Test Equipment BU, approached the topic from the angle of a very tangible customer need: platform conversion. He explained to the audience how to transition from competitors' semiconductor test platforms to the 3680. Mr. Zeng pointed out that traditionally, platform conversions could take around three to six months, potentially causing missed market opportunities. The conversion process does indeed present numerous challenges. However, by adopting Chroma's comprehensive conversion solution, customers can complete the transition in about a month, with relatively simple steps. Relevant information during the conversion process is displayed directly on the system to aid customers in making adjustments, enhancing efficiency while reducing conversion costs.As a key player in the global ATE market, Chroma ATE remains proactive in responding to market trends and customer demands. By targeting applications with high-growth potential in the semiconductor market, Chroma is poised to expand its market footprint, with efficient platform conversion support as a crucial asset. The company is well-positioned to sustain stable performance and maintain its leadership in AI, IoT, and third-generation semiconductor testing.Chroma ATE's Semiconductor Test Equipment BU General Manager, George Chang, stated that as of December 2023, Chroma had shipped over four thousand semiconductor test equipment units globally. In terms of global ATE market rankings, Chroma sits among the top four playersLive demonstration of the Chroma 3680 Advanced SoC Test System and HDRF2 RF Test ModuleThe Chroma ATE Semiconductor Test Seminar attracted nearly 200 industry expertsLive demonstration of the Chroma 3650-S2 High-Performance Power IC Test Platform

Chenbro, recognized as a global leader in server chassis products and solutions, achieved two Gold Awards at the 2023 MUSE Design Awards together with three Gold Awards at the 2023 TITAN Innovation Awards, in recognition of its innovative product design of Tri-load high-density storage server chassis series.Following the success of the RM25324 2U Dual-load high-density storage server chassis, honored with the 2022 iF Design Award and COMPUTEX Best Choice Award, Chenbro introduces the 4U Tri-load series. The tri-load design is optimized for easy maintenance and operation stability of data center servers, with exceptional thermal management and load-bearing mechanisms. The user-oriented product design has earned wide acclaim from international design awards and gained recognition from global customers. Flexible Configurations of High-Density Server Storage Meet Diverse Demand of Data CenterTypically, it may take two or three 2U storage servers to support 36 3.5-inch hard drives. With Chenbro's new Tri-load series, users can install up to 36 or 48 hard drives in a 4U server chassis, supporting interfaces such as SAS, SATA, and NVMe Gen4. This product series fulfills the high-capacity storage needs of the data centers, optimizing server cabinet rack space to maximize efficiency and reduce costs.To address various application scenarios, the Tri-load series offers three different configurations. The RM43736 server chassis accommodates 36x 3.5 drive bays for storage while the RM43736 8T4S model supports 28 3.5-inch and eight 2.5-inch hard drives (with NVMe Gen 4 interface for flash devices). The upcoming RM43748 model, set to launch in 2024, can host 24 3.5-inch and 24 2.5-inch hard drives. Chenbro also provides customization services catering to diverse application needs based on clients' requirements.Moreover, the Chenbro RM25324 Dual-load product will further support EEB motherboard installation and the ATX motherboard. With ATX and EEB motherboard accommodation, Chenbro provides more flexibility for diverse market demand.Innovative Tri-Load Design Enables Front-Side and Dual-Side Access to Hard DrivesChenbro innovatively redefines the accessibility of server HDD by adopting a Tri-load setup with front and dual-side configurations. The motherboard placement is moved to the rear of the server, complemented by an exclusive airflow-guided thermal mechanism for optimal temperature control. Internal tests have shown stable working temperatures for front and dual-side hard drives, around 35-40 degrees Celsius, enhancing operation stability and the overall system lifespan.Considering the front and dual-side hard drive installation, which concentrates the chassis weight in the front half, Chenbro collaborated with partners to design an exclusive server slide rail capable of supporting the entire system's weight of 25 kilograms. Even under the load of installing up to 48 HDDs in the Tri-load products, maintenance personnel can effortlessly and safely pull out the chassis from the cabinet for HDD replacement without the risk of tilting. The tri-load access and toolless design ensures convenient maintenance when repairing or installing a new HDD.Exclusive Design for Improved Thermal Performance and Safer Server MaintenanceWith the rapid growth of data created, consumed, and stored, there is a simultaneous surge in demand for high-density storage servers in data centers. To maximize storage capacity within limited server space, designs in 2U and 4U products often adopt a front and rear hard drive configuration strategy. Front-access hard drives feature an easily replaceable hot-swappable design. In contrast, rear-access hard drives, constrained by structural limitations, require opening the top cover or accessing the narrow rear of the cabinet for replacement in case of malfunction.The traditional design may present two usage limitations. Firstly, due to inadequate cooling in such server chassis, the air temperature inside the server rises to around 40 degrees Celsius after passing through the front-access hard drives and mid-section motherboard. The rear hard drives operate at approximately 55 to 59 degrees Celsius, nearing the upper 60-degree Celsius limit. Secondly, replacing rear-access hard drives is more challenging, increasing time and effort for equipment maintenance.Aligning with AI Applications for Server Deployment in Data CentersAdapting to changing industry demands, Chenbro continuously innovates product design based on user needs, offering diverse server chassis solutions. Chenbro offers flexible, stable, and compatible server enclosure solutions for various motherboard brands. Customers can deploy server products or solutions based on specific hard drive configuration requirements in data centers or AI applications.In response to the Generative AI applications, servers must install more GPGPU cards than general-purpose servers. The market is gradually installing 8 to 10 GPGPU cards as a standard. Chenbro is also focused on the product development of advanced AI server chassis solutions to align with diverse AI applications to help customers in their AI journey.Chenbro Tri-load Family won the MUSE Design Awards and TITAN Innovation AwardsWith Chenbro's new Tri-load series, users can install up to 36 or 48 hard drives in a 4U server chassis, supporting interfaces such as SAS, SATA, and NVMe Gen4

Munich, Germany and Durham, N.C. – January 23, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon's general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems."As the demand for silicon carbide devices continues to increase, we are following a multi-source strategy to secure access to a high-quality, global and long-term supply base of 150mm and 200mm SiC wafers. Our prolonged partnership with Wolfspeed further strengthens Infineon's supply chain resilience for the coming years," said Jochen Hanebeck, CEO of Infineon Technologies. "We have been working with Wolfspeed for more than 20 years to bring the promise of silicon carbide to the automotive, industrial and energy markets, and to help customers leverage this energy-efficient technology to foster decarbonization."The adoption of silicon carbide-based power solutions is rapidly growing across multiple markets. Silicon carbide solutions enable smaller, lighter and more cost-effective designs, converting energy more efficiently to unlock new clean energy applications. To better support these growing markets, Infineon is continuously diversifying its supplier base to secure access to high-quality silicon carbide substrates."Wolfspeed is the world's leader in silicon carbide production. We are the catalyst in the industry transition to silicon carbide, providing high-quality materials to key customers like Infineon, a leading supplier in both the automotive and industrial markets, while also scaling our capacity footprint," said Wolfspeed president and CEO Gregg Lowe. "Industry estimates indicate demand for silicon carbide devices, as well as the supporting material, will grow substantially through 2030, representing a $20 billion annual opportunity. We are very pleased to continue our partnership with Infineon and to serve as a major supplier of silicon carbide wafers in the years ahead."Infineon & Wolfspeed Supply Agreement

The AI wave continues to sweep across industries worldwide. The NVIDIA Jetson, an AI computing platform that can provide powerful computing for edge devices, boasts a full product line, high performance, and a robust ecosystem. It has become a top choice for optimizing operational efficiency in many vertical fields, and it is already leaving its mark in smart cities, industrial manufacturing, healthcare, retail logistics, and systems of other fields.While the NVIDIA Jetson is a performance powerhouse, its benefits are only seen when it is paired with the right peripheral software and hardware. EDOM Technology, a longtime authorized distributor of NVIDIA Jetson and various components and modules, provides tech support and value-added services through a complete industry and product ecosystem. EDOM helps customers reduce development costs, accelerate market launches, and enhance market competitiveness.NVIDIA Jetson is a complete System on Module (SOM) designed specifically for edge computing architecture that includes GPU and CPU and supports plug-and-play. EDOM Technology said one can look at the NVIDIA Jetson's product architecture in terms of hardware, software, and ecosystem. First, the hardware. NVIDIA launched its first-gen Jetson TK1 in 2014. Then, as it started developing into the edge AI market, NVIDIA continued to improve its Jetson product line. Now, after years of development and improvement, the Jetson line has been expanded with the Orin, Orin NX, AGX Xavier, Xavier NX, TX2, and Nano, and includes products with different combinations of GPU and CPU for different computing capabilities, from basic to intermediate and high-end. In addition, NVIDIA also provides Orin Nano and AGX Orin developer boards with pre-configured OS to help customers optimize the dev process.Next, the software. NVIDIA launched the JetPack SDK designed specifically for the Jetson series, which it continues to update. JetPack 6.0, set to launch in the near future, will support an updated version of Linux Kernel Upstream, various Linux distros, flexible individual software module update functions, as well as more software library support and boosts to security. JetPack further raises the NVIDIA Jetson series to new heights in the field of human-computer interaction, bringing to NVIDIA Jetson the high scalability of generative AI. Users can get the latest open-source generative AI models at the Jetson Generative AI Lab and run them directly on Jetson without going through the cloud. And then there is the ecosystem level. NVIDIA has worked with distributors and software and hardware suppliers to build a complete network ecosystem, ensuring that device developers have complete support for peripheral software and hardware when using NVIDIA products. This lowers product dev barriers and, notably, shortens time to market.With its many advantages — comprehensive software, hardware, and ecosystem services, NVIDIA Jetson's application fields have rapidly expanded, making it the mainstream edge AI product for the smart systems of today. Already it has been adopted by more than 1.2 million developers and more than 10,000 field operators. In both market acceptance and application maturity, it ranks first in the industry, giving industry operators in various fields a greater sense of ease when considering their choices and introducing the product to their operations.However, as already mentioned, the performance powerhouse that is NVIDIA Jetson requires adequate peripheral software and hardware support to meet the needs of certain customers in certain fields. That is where EDOM Technology comes in: it uses its robust industry and product ecosystem to help customers complete the dev process. EDOM Technology has been involved deeply in science and tech for many years. While distributing a complete product line, covering everything from power management, active and passive devices, and MCUs to image sensors, it also has software and hardware customers across several areas and can help bridge the gaps for customers in different fields to complete product development with precision and efficiency.For example, in the early stages of product development, for instance, the design of the baseboard and I/O interface, EDOM's FAE team can provide professional information and support; it can also provide suggestions on peripheral components for NVIDIA Jetson based on the product application fields. And, importantly, their all-in-one service shortens product development time. One notable recent case is their helping several industrial computer manufacturers in Taiwan to complete AI Boxes for different fields. EDOM Technology pointed out that these industrial computer manufacturers are key partners. With tech and product support provided by EDOM Technology, these manufacturers completed the development of AI Box products using NVIDIA Jetson as their computing cores.For customers who may have different expertise but are still interested in launching vertical field application solutions, EDOM Technology can connect with manufacturers in other fields to provide the necessary tech support services. For instance, introducing hardware vendors to independent software vendors (ISVs) and ISV vendors to system customers so that customers can focus their resources on their own expertise while benefiting others in the industry at the same time. Bridging services like EDOM's are particularly important in the AI era. EDOM Technology stated that the development of AI has picked up pace in recent years. AI solutions need to integrate a variety of hardware and software to achieve smooth performance. Just look at generative AI and the market attention it has attracted recently. This technology requires a wide range of software and hardware, and NVIDIA has also launched an SDK just for that purpose. EDOM Technology can respond to customer needs, intermediary ISVs, and hardware manufacturers, and lower the product dev threshold.Lastly, EDOM Technology pointed out that the smart trend has gained traction in recent years, and the market demand for AI, which is crucial for smart systems, has grown enormously. If one looks at the overall industry development, it seems that NVIDIA Jetson is still the mainstream computing platform in the edge computing market. EDOM Technology's complete product line and industry ecosystem bridging services can help customers in many fields effectively tackle challenges and capitalize on the many opportunities offered in the AI era.

SK Hynix Inc. (or "the company", www.skhynix.com) announced today that it recorded an operating profit of KRW346 billion in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses.The company posted revenues of KRW11.31 trillion, operating profit of KRW346 billion (operating profit margin at 3%), and net loss of KRW1.38 trillion (net profit margin at negative 12%) for the three months ended December 31, 2023. (Based on K-IFRS)SK Hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising. "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said.The financial results of the last quarter helped narrow the operating loss for the entire year to KRW7.73 trillion (operating profit margin at negative 24%) and net loss to KRW9.14 trillion (with net profit margin at negative 28%). The revenues were KRW32.77 trillion.SK Hynix said that sales of its main products, DDR5 and HBM3, increased by more than four and five times, respectively, compared with a year earlier, as the company took advantage of its market-leading technology in the DRAM space to actively respond to customer demand. In the NAND space, where recovery is relatively slow, the company prioritized streamlining investments and costs.SK Hynix will now proceed with mass production of HBM3E, a main AI memory product, and ongoing development of HBM4 smoothly while supplying high-performance, high-capacity products such as DDR5 and LPDDR5T to server and mobile markets in a timely manner, to meet increasing demand for high-performance DRAM.The company also plans to make its technological leadership stronger by preparing high-capacity server module MCRDIMM* and mobile module LPCAMM2** to respond to the ever-increasing demand for AI servers and on-device AI adoption.*MCR DIMM (Multiplexer Combined Ranks Dual In-line Memory Module): A module product with multiple DRAMs bonded to a motherboard, in which two ranks, basic information processing units, operate simultaneously, resulting in improved speed.**LPCAMM2(Low Power Compression Attached Memory Module 2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.For NAND, the company aims to continue to improve profitability and stabilize the business by expanding sales of premium products such as eSSD.For the year 2024, SK Hynix will focus on improving profitability and efficiency through sales of value-added products, while minimizing an increase in capital expenditure for a stable operation of the business."We achieved a remarkable turnaround, marking the first operating profit in the fourth quarter following a protracted downturn, thanks to our technological leadership in the AI memory space," said Kim Woohyun, Vice President and Chief Financial Officer (CFO) at SK Hynix. "We are now ready to grow into a total AI memory provider by leading changes and presenting customized solutions as we enter an era for a new leap forward."Unit: Billion KRWSK Hynix Financial Results (K-IFRS), FY2023 (KRWb) 20232022YoYRevenues32,76644,622-27%Operating Profit-7,7306,809(turn to loss)Operating Profit Margin-24%15%-39%pNet Income-9,1382,242(turn to loss) Source: Company, January 2024SK Hynix Financial Results (K-IFRS), FY2023 4Q (KRWb) 2023 4Q2023 3QQoQ2022 4QYoYRevenues11,3069,06625%7,67247%Operating Profit346-1,792(turn to profit)-1,912(turn to profit)Operating Profit Margin3%-20%23%p-25%28%pNet Income-1,380-2,18537%-3,73563% Source: Company, January 2024

With the global development of AI technology, there is a significant increase in demand for high-performance servers in both cloud computing and data center applications. Chenbro has proudly introduced next-generation server chassis solutions tailored for the latest Intel and AMD platforms to meet market demand. The cutting-edge enclosure solutions support cloud servers equipped with Gen5, providing a transmission speed twice as fast as Gen4 servers for achieving the highest levels of system performance. Additionally, Chenbro offers various hard-drive configuration options that support the complex growth of cloud-computing and hyper-scale data centers for customers worldwide.Chenbro's customer-centric design concept prioritizes both technical and business requirements from the customer and market demand, offering unique and competitive server chassis products optimized for flexibility, scalability, reliability, and compatibility. Given the increasing operating temperatures of server processors, exceptional attention to thermal mechanisms in the design process is required. Tailor-made designs to Intel and AMD platforms, Chenbro optimizes airflow channels and offers the option to incorporate liquid cooling modules based on requirements. This meticulous chassis design ensures highly stable and reliable server deployment.Chenbro's RB151 and RB251 T-shaped (Eagle Stream) barebone servers are pre-installed with Intel motherboards, powered by 4th Gen Intel® Xeon® Scalable processors to support highly demanding cloud computing applications. The RM151 and RM251 L-shaped server chassis products are compatible with Intel Eagle Stream and AMD Genoa platform designs for big-data computing workloads. Unlike traditional square motherboard versions, the RB151/RB251 series with a T-shaped board and the RM151/RM251 series with an L-shaped board utilize proprietary motherboards. Both series are now available for global partners.RB151/RB251 T-shaped Series for Mainstream Storage, Enterprise Workloads and Cloud DemandsThe RB151/RB251 T-Shaped barebone series is designed to make Intel's latest Eagle Stream platform available, supporting the 4th Gen Xeon Scalable CPU (Sapphire Rapids) for significant computing performance. It offers flexible I/O options, diverse storage choices, and high reliability. The T-shaped motherboard design, with power configurations on both sides, enhances thermal performance compared to standard models.The RB151/RB251 T-Shaped (Eagle Stream) barebone series offers customers and partners 1U and 2U form factors. The RB25124 model is designed for enterprise workloads, computing projects, and cloud services. It has an Intel server motherboard supporting up to two 4th Gen Xeon Scalable processors and 32 DDR5 memory slots. The RB25124 supports up to 24 hot-swap 2.5-inch SAS/SATA hard drives at the front for extensive data storage. Users can enhance performance by replacing them with 24 hot-swap NVMe Gen4 SSDs. Customization services include mixed installations of SAS/SATA/NVMe Gen4 interfaces. It also features six high-performance fans in the middle section and two redundant 2000W power modules at the rear. The backplane supports data stream expansion cards compliant with OCP specifications.As for 1U barebone, the RB15112 model is designed to be equipped with the same motherboard and fan configurations as the RB25124. The RB15112 accommodates 12 SAS/SATA interface HDDs or 12 NVMe Gen4 interface SSDs in the front and features 1+1 redundant 1600W power modules with backup mechanisms in the rear of the server.RM151/RM251 L-shaped Series to Meet Different Application NeedsThe RM151/RM251 L-shaped server chassis series suits Intel Eagle Stream and AMD Genoa platforms. The RM15104, RM15112, RM25112, and RM25124 are designed with different storage configurations. The RM15104 supports 4 hot-swap 3.5-inch SAS/SATA interface HDDs, while the RM15112 accommodates 12 hot-swap 2.5-inch NVMe Gen4 interface SSDs. Both have a rear section with a redundant 1600W power supply.Moving to the 2U chassis, the RM25112 can handle 12 hot-swap 3.5-inch SAS/SATA/NVMe Gen 4 interface HDDs, and the RM25124 is designed for 24 hot-swap 2.5-inch NVMe Gen4 SSDs, equipped with high-efficiency 1+1 redundant, 1600W power supplies. The RM151/RM251 series is an ideal choice for complex business-critical workloads. It is engineered for maximum compute-to-storage density requirements, including enterprise workloads and compute-intensive and data-intensive workloads for cloud requirements.Embracing Flexibility and Compatibility to Develop Server Enclosure SolutionsThe RB151/RB251 T-shaped and RM151/RM251 L-shaped series effectively bring sufficient storage capacity for faster and more advanced computing applications for enterprise and cloud requirements. Additionally, Chenbro offers customization services to customers with a mix of storage configurations, allowing users to strike an optimal balance between cost, capacity, and performance.Chenbro introduced the "Reference Motherboard Program" years ago to address motherboard compatibility. The program collaborates with global motherboard partners and conducts pre-testing and verification to ensure the chassis integrates seamlessly with various motherboards and processors. This streamlined program offers customers a more convenient and rapid service, contributing to a mutually beneficial situation.With the growing global focus on ESG issues, major technology giants like Intel and NVIDIA have unveiled new-generation platforms for green data centers, such as DC-MHS, OCSP, and MGX. Chenbro is actively collaborating with global customers and partners to develop a next-generation server chassis aligning with these new standards to accelerate time to market in server deployment with eco-friendly practices.RB151/RB251 T-shaped Series for Mainstream Storage, Enterprise Workloads and Cloud DemandsThe RM151/RM251 L-shaped server chassis series suits Intel Eagle Stream and AMD Genoa platforms

Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range. Two newly launched industrial computers (P2202 Series and P1201), released in 2023, have been widely favored by customers for their thin and light design, especially in mobile devices (AGV/AMR), control cabinets, and other space-constrained applications. Among their striking designs, the One Computer / Two Purposes function has attracted particular attention. They are not only slim embedded computers but, through the patented CDS (Convertible Display System, Patent no. M482908) technology, can also be transformed into panel PCs. They provide performance, screen size, display ratio, and touch options for various application environments, thereby creating diverse and flexible HMI and KIOSK applications.Slim, High-performance Embedded Computers - P2202 SeriesThe P2202 Series includes two models: P2202 and P2202E with PCIe expansion. They are equipped with an Intel Core i3/i5 U-Series (Alder Lake-P) CPU and support up to 64GB of DDR5 4800MHz memory. The slim design (254.5 x 190 x 41.5 mm, Model: P2202) has rich native I/O and can also support 4G, Wi-Fi, and Bluetooth wireless modules through the built-in Mini PCIe and M.2 Key E slots. The P2202E also has a PCIe x4 slot which supports 75W expansion cards. Moreover, Cincoze's exclusive modular expansion design allows users to add additional functions, such as PoE and IGN. The P2202 Series adheres to Cincoze's consistently high-quality requirements, so in addition to being adaptable to wide temperatures (-40 to 70 degrees Celcius) and voltages (9 to 48VDC), it has also successfully passed a variety of vibration and shock reliability tests, including sinusoidal vibration (1G), random vibration (5G), and shock resistance (50G). At the same time, it has passed industrial environment EMC standards (EN 61000-6-2 and EN 61000-6-4), reflecting the reliability of the P2202 Series.Cincoze P1201Power Efficient, Rugged Embedded Computer - P1201The P1201 has an Intel Atom x6425E (Elkhart Lake) quad-core processor and supports up to 32GB of DDR4 3200MHz memory. The native I/O (1 GbE LAN, USB3.2 Gen2, COM, and DIO) meets most application needs, while the built-in M.2 Key E slot supports a Wi-Fi 6 / Intel CNVi / Bluetooth module, and the Mini PCIe slot supports a GNSS/4G module, achieving complete wireless communication coverage. The P1201 is power-efficient while maintaining the strictest quality requirements. It is adaptable to wide temperatures (-40 to 70 degrees Celcius) and voltages (9 to 48VDC), has passed sinusoidal vibration (1G), random vibration (5G), and shock resistance (50G) tests, and meets the EMC standards for industrial environments (EN 61000-6-2 and EN 61000-6-4) and U.S. UL safety certification. These tests and certifications ensure that the P1201 can operate stably and reliably in various harsh industrial environments.Cincoze all-round panel PCAll-round Panel PC (Industrial, Outdoor, Open Frame)Cincoze's patented CDS technology allows customers to connect the slim embedded computers (P2202 Series and P1201) to a display module that meets the needs of specific applications. The three ranges of display modules form three different ranges of panel PCs, including industrial panel PCs (CV+P Series) with a range of display sizes (8.4" to 24") for general industrial environments, sunlight-readable panel PCs (CS+P) with high brightness (up to 1,800 nits) for outdoor use, and open frame panel PCs (CO+P) with an adjustable mounting bracket (Patent no. D224544, D224545) for easy installation in equipment machines. CDS also has the advantage of plug-and-play, making field-side maintenance and future upgrades easier while ensuring robust support for industrial site operations.

In 2019, Amazon, Apple, Google, and Zigbee Alliance members came together to form Project Connected Home over Internet Protocol (CHIP), a working group building a new standard that enables IP-based communication across smart home devices, mobile apps, and cloud services, and ultimately unites the smart home.In 2021, the Zigbee Alliance rebranded as the Connectivity Standards Alliance (CSA), and Project CHIP rebranded to Matter. These rebrands were necessary as the new Matter mark authenticates devices, ensuring that any object built on this standard is reliable by nature, secure by design, and compatible at scale.Fast forward to today, and Matter is here! Officially released in October 2022, the Alliance and Matter have seen tremendous growth with 600+ members, 750+ Matter-certified devices, and multiple updates to Matter. Before we dive into these updates, let's learn more about what the Matter standard is and why Matter matters.What Exactly is Matter?Matter is an application layer protocol developed specifically to address device interoperability within the smart home, more specifically across different smart home device platforms. That means your Amazon Alexa can work with your Google Home or Apple HomeKit. Beyond interoperability, its other biggest benefits include simplified device setup, significantly better reliability and latency, and improved security through standardization.Matter is designed to support existing protocols, such as Thread, Wi-Fi, Bluetooth Low Energy, Zigbee, and Z-Wave, allowing flexibility to manufacturers and consumers alike.For developers, Matter simplifies product development while lowering development and operational costs. Since Matter is completely open source, anybody can read and propose changes to source code, resulting in collaboration from the industry, improved quality, and expedited processes. With Matter, device manufacturers only need a single SKU per product instead of separate ones for each ecosystem, thereby reducing costs, shortening development and production time, and simplifying the entire supply chain.With Matter, consumers have the power to choose how they want to control their homes and with what devices – not limited to certain ecosystems. Consumers can have peace of mind when using their devices as privacy and security are central to Matter, with built-in encryption, over the air updates, and standardization to keep data safe. Another benefit for consumers is simplified setup for new IoT devices in their homes. Matter uses a simple and secure onboarding process to connect new devices and is as easy as scanning a QR code to add a new Matter device. Lastly, Matter is compatible with existing devices – non-Matter-certified devices – using Matter bridges so that consumers can continue to use the devices they already have.Matter 1.0: Certification Now Open In 2022, the CSA launched Matter 1.0., eight authorized test labs for product certification, the test tools needed to certify devices, and the open-source reference design software development kit (SDK) to develop Matter devices.Consumers started to see the first ever Matter-certified devices. The Matter 1.0 release supported a variety of common smart home products, such as lighting and electrical, HVAC controls, window coverings and shades, safety and security sensors, door locks, media devices including TVs, controllers as both devices and applications, and bridges.In addition to new devices, Matter 1.0 allowed companies to upgrade existing, already deployed devices, to Matter-certified devices via over the air updates.Matter 1.1: Enhancements for Developers and Devices Six months later in May 2023, Matter 1.1 was released. This update enhanced support for many smart home products in the Intermittently Connected Devices (ICDs) category, as known as "sleepy devices." ICDs are usually battery-powered devices like sensors, door locks, and switches that are connected via wireless networks and need to conserve power for optimal operation and lifespan. While ICDs aren't constantly connected, they "wake up" and connect periodically, drawing power and making energy efficiency vital. Matter 1.1 allows ICDs to sleep for longer periods of time before checking in with parent devices without having to reconnect to the network. Fewer check-ins means power conservation and longer battery life.Matter 1.1 fixed many of the bugs from the initial launch of Matter, especially from the developer side. Given the code is publicly available and relies on open source SDK, it is important that these tools are easy to work with. In this update, the CSA gathered feedback from developers throughout the process to make clarifications on how to make the tools better to work with, helping developers to work with Matter.The CSA also launched a testing center in Portland offering interoperability testing services to alliance members developing Matter products for certification. Silicon Labs also launched its Connectivity Lab, which simulates a modern Smart Home, with a range of IoT devices, applications, ecosystems, and networks. Customers are able to test their Matter prototypes operating within real-world scenarios across a variety of protocols and device brands.Matter 1.2: More Device TypesFast forward another six months, Matter 1.2 introduces new device types and brings other improvements that enhance interoperability and user experience. This release expands device types to washing machines, refrigerators, dishwasher, room air conditioners, robotic vacuums, air quality sensors, air purifiers, smoke/CO alarms, and fans. Matter 1.2 also adds key foundational elements that will enable more device types, such as operational modes, that are important to adding more appliances in the future.This is exciting as many of these devices tend to be Wi-Fi-enabled but often have limited ecosystem support and require proprietary app control. Matter 1.2 allows manufacturers to simplify the user experience – including commissioning – while enabling integration into key smart home ecosystems.Matter 1.2 also includes new features that improve the user experience for commissioning to better identify the product and its description. For example, to help the user verify which device is the one they are interacting with, the color of the device is listed in the Matter controller's user interface, or a light with multiple bulbs can describe the location or position in a controller user interface to indicate which bulb is bound to a smart switch.Final Thought: Matter 1.3 and Beyond Only Gets Bigger Support for Matter will only continue to get bigger. In fact, Amazon has already added Matter to more than 100 million Echo and eero devices. The CSA has already indicated that it hopes to share new Matter updates every six months, so we can continue to expect more Matter device types, specifically cameras and energy management devices to further unify smart home ecosystems, as well as more updates that helps widespread adoption across the smart home.Author: Rob Alexander, Principal Product Manager

iCatch Technology, a leading AI image processing IC design company, announced today a collaboration with Valens Semiconductor, a world leader in high-performance connectivity solutions, on an innovative AI-enhanced multi-channel surround view monitoring system based on Valens Semiconductor's MIPI A-PHY high-speed and long-range sensor connectivity technology. The live demonstration of this system will be featured at Automotive World Tokyo 2024 Booth E42-20 from January 24 to 26.Invitation to Automotive World Tokyo 2024 by iCatch Technology Photo: iCatch TechnologyThe multi-channel surround view monitoring system is designed to transmit four camera streams over extended distances, leveraging the capabilities of Valens Semiconductor's VA7000 chipset family which provides flexibility on a wide range of standardized cables to deliver a high bandwidth, zero latency, and cost-efficient connectivity solution for future automobiles. The four independent video streams are then received by iCatch Technology's CR3 Automotive AI Imaging SoC for image and Advanced Driver Assistance Systems (ADAS) processing to enable Blind Spot Detection (BSD) and Rear Collision Warning (RCW) features.Moreover, iCatch Technology will also unveil a wide range of Smart Cabin solutions at Automotive World Tokyo 2024, covering Euro NCAP compliant Driver Monitoring Systems (DMS) and Occupant Monitoring Systems (OMS), along with Camera Monitoring System (CMS). These solutions are designed to revolutionize the automotive industry by enhancing safety, comfort, and the overall driving experience.Weber Hsu, General Manager of iCatch Technology, expressed enthusiasm for the event, stating, "Our collaboration with Valens Semiconductor on the MIPI A-PHY Automotive SerDes Solution signifies a substantial step forward in reshaping the automotive connectivity landscape. Automotive World Tokyo provides us with a great opportunity to showcase the latest innovations in automotive AI imaging. Our recent acquisition of certifications in the ISO26262 FuSa and ISO21434 Cybersecurity design flow, emphasizes our dedication to penetrate the automotive OEM market, whether through existing SoC or Solution SoC."Gideon Kedem, Head of Automotive Business at Valens Semiconductor, said: "The superiority of MIPI A-PHY technology continues to attract interest from around the automotive market. A-PHY is the best way to deliver raw sensor data to centralized ECUs, where iCatch's AI algorithms can turn that data into unparalleled perception for ADAS systems. Because of these synergies between our companies, we are strong believers in our long-standing collaboration with iCatch."iCatch Technology invites all potential customers and business partners to explore our booth, engage with our experts, and experience pioneering innovations that are shaping the future of the automotive industry.For more information about our participation in Automotive World Tokyo 2024, visit us at Booth E42-20 or contact us at [request@icatchtek.com].

CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance. CXL, built upon PCIe interfaces, supports memory expansion beyond DIMM slots, overcoming the latency gap between main memory and SSD storage. It is crucial for AI applications, offering increased memory capacity and bandwidth, and contributing to high-performance computing.Recently, BIWIN successfully launched CXL 2.0 DRAM memory modules. BIWIN's CXL 2.0 DRAM adopts the EDSFF (E3.S) form factor with a memory capacity of up to 96 GB. It also supports a PCIe 5.0 × 8 interface, achieving a theoretical bandwidth of up to 32 GB/s. These modules can be directly connected to backplanes and server motherboards supporting the CXL specification and the E3.S interface, expanding server memory capacity and bandwidth. Additionally, BIWIN can provide CXL AIC adapter cards for server backplanes without E3.S.Features and Advantages:*Equipped with a high-performance memory expansion controller, compliant with CXL 2.0 Type 3 standards, supporting PCIe 5.0 x 8 interface with a theoretical bandwidth of up to 32 GB/s.*Premium DDR5 ICs and capacities of up to 96 GB.*Supports On-Die ECC, Side-Band ECC, SDDC, SECDED.*Allows up to 16 hosts to simultaneously access different sections of memory, and also supports pooling and sharing.*Simultaneously releases an open-source CXL DRAM software toolkit to ensure seamless deployment of CXL extended memory for users. Toolkit features: provides CXL display, implicit API, and allows customers to use it based on different application scenarios; offers application-level CXL NUMA tool usage methods to establish an intuitive understanding at the application level of the benefits of CXL.In terms of latency performance, during actual testing, the BIWIN CXL 2.0 DRAM, mounted on Node 2, exhibits a latency of 247.1 ns for CPU access compared to Node 0. With a bandwidth exceeding 21 GB/s, it demonstrates excellent latency performance, empowering high-speed data processing.Artificial Intelligence (AI) and Machine Learning (ML) continue to drive the growing demand for high-speed data processing. BIWIN CXL 2.0 DRAM combines features such as support for memory capacity and bandwidth expansion, memory pooling and sharing, high bandwidth, low latency, and high reliability, empowering AI high-performance computing. Currently, BIWIN offers functional prototypes of 32 GB to 96 GB CXL 2.0 DRAM for joint evaluation and testing by customers and partners. In the future, BIWIN will remain focused on CXL technology to meet the demands of high-performance computing.AIC Adapter CardFor server backplanes without E3.S, BIWIN provides Adapter-In-Card (AIC) adapter cards, enabling CXL RDIMM memory expansion for servers.BIWIN Launches CXL 2.0 DRAM to Empower Cutting-edge ComputingPremium DDR5 ICs and capacities of up to 96 GBLatency performance, empowering high-speed data processingCXL 2.0 DRAM, achieving a theoretical bandwidth of up to 32 GB/sFor server backplanes without E3.S, BIWIN provides Adapter-In-Card (AIC) adapter cards, enabling CXL RDIMM memory expansion for servers