Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has matured and its scope of application has gradually expanded beyond vehicle-mounted applications. It has become a critical packaging process for next-generation RFIC used for low earth orbit satellites. Robert Lin, General Manager of Manz Taiwan, stated that the FOPLP market demand will quickly expand as the number of success stories increases. Manz Taiwan has worked on these solutions for years. It has developed several innovative technologies and established comprehensive service mechanisms and professional teams to facilitate joint development with IDM OSAT (outsourced semiconductor assembly and test), Display panel, and IC substrate manufacturers to reduce the minimum requirements for production and commence mass production.Manz Taiwan has strong roots in automation and has focused on the development of production equipment for displays, high-end IC substrates, and other high-tech electronics since its establishment. It has also developed FOPLP technologies in the last 10 years. Since 2015, the company has helped renowned companies in the domestic and foreign semiconductor industries with the production of the next-generation packaging process and accumulated strong innovation capabilities, particularly the equipment and plating processes for the FOPLP RDL wet fabrication process. It also introduced high-precision inkjet printing technologies and gained a leading position in the industry.Robert Lin stated that the evenness of the coating in FOPLP RDL is critical for the performance of semiconductor components. Manz Taiwan optimized the FOPLP RDL plating process and increased the overall copper plating uniformity to 92%. It can also meet the requirements of certain categories of customers such as power semiconductor companies to increase the thickness of the coating to 100μm and increase the current used for plating to 5 ASD instead of the existing 1-2 ASD. It significantly increased the copper plating speed and doubled monthly output. Manz AG developed exclusive high-precision inkjet printing technologies and Manz Taiwan used them in the FOPLP process. The technology can be used for direct printing on functional conductor or intermediary materials to streamline the production process and enhance production efficiency.Manz Taiwan offers customers the best support with comprehensive service mechanismsIn addition to innovative technologies, Manz Taiwan also provides comprehensive service mechanisms for technology validation and introduction. First, Manz Taiwan integrated partners and technologies to create one-stop process equipment solutions and ensure that customers can quickly commence mass production after the delivery of the equipment. The advantages of automation increase the synergy and performance of the entire process. Second, Manz Taiwan provides solutions and services for different FOPLP substrate materials including stainless, glass, and epoxy molding compounds (EMC) for customers to choose the most appropriate process solution based on their expertise.Third, Manz Taiwan set up the RDL laboratory in Taiwan equipped with comprehensive advanced equipment for customers to conduct tests and validation during the technology development phase before verifying the feasibility of projects and transferring them to the actual production line. The laboratory thus reduces the minimum requirements for production and helps customers commence mass production.After the laboratory was established, domestic and foreign customers have used it for tests and validation of FOPLP process technologies. During the tests, the team at Manz Taiwan also provides technical services to help customers reduce the development time.With regard to FOPLP development, Robert Lin believes that the technology has underwent concept communication, validation, and trial production and has entered the practical application phase. Applications have also expanded from vehicles to satellite communication, which verified its commercial value. Robert Lin stated that the demand for future FOPLP applications has risen faster than expected. Manz Taiwan has prepared robust technical capacities and comprehensive service mechanisms to help different customers adopt next-generation packaging technologies and win the next wave of market opportunities.Robert Lin, General Manager of Manz Taiwan, stated that Manz Taiwan has worked on FOPLP solutions for years. It has developed several innovative technologies and established comprehensive service mechanisms and professional teams to help customers adopt new process technologies and win new business opportunities in the market.

Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC's 5nm process technology. The platform was demonstrated at the Partner Pavilion of the TSMC 2023 North America Technology Symposium. It contains a fully functional HBM3 Controller and PHY IP and vendor's HBM3 memory using TSMC's industry leading CoWoS® technology.HBM memory vendors keep aggressive roadmap increasing throughput and memory size from HBM3 to HBM3E/P and further doubling data bus width at HBM4. But fundamental DRAM timing parameters don't change and HBM Controller is getting more and more sophisticated to enable full bus utilization. GUC's HBM3 Controller achieves above 90% bus utilization at random access while keeping low latency. GUC's HBM3 PHYs are silicon proven at TSMC's 5nm technology and were taped out at the TSMC 3nm early this year, and ready to support the fastest planned HBM3E/P memories. The PHYs are verified with angle routing of HBM bus on both CoWoS-S and CoWoS-R interposers enabling offsetting HBM PHY vs. HBM memory for ASIC floorplaning flexibility. GUC's HBM Controller and PHY IPs are used in customers' HPC ASICs for production since 2020.Explosion in amount of computation required from Level4 Autonomous Driving computer leads to adoption of 2.5D chiplet-based architectures and HBM3 memories by car processors. Harsh car environment and high reliability requirement make continuous monitoring of 2.5D interconnect and replacement of failing lanes necessary. GUC integrates proteanTecs' health and performance monitoring solutions into all its HBM and die-to-die interface test chips. proteanTecs' technology is now silicon proven in GUC's 5nm HBM3 PHY, up to 8.4 Gbps. During data transfer in mission mode, I/O signal quality is continuously monitored, without any re-training or interruptions. Each signal lane is individually monitored, allowing for the identification and repair of bump and trace defects before they cause system operational failures and therefore extending the chip's lifetime. "We are proud to demonstrate the world's first HBM3 controller and PHY at 8.4 Gbps," said Dr. Sean Tai, president of GUC. "We established a complete 2.5D/3D chiplet IP portfolio at TSMC's 7nm, 5nm and 3nm technologies. Together with design expertise on the TSMC 3DFabric™ technologies including CoWoS, InFO, and TSMC-SoIC, we provide our customers robust and comprehensive solution of their AI/HPC/xPU/Networking/ADAS products.""Based on high-volume manufacturing experience of our 2.5D chiplet products we defined the strictest qualification cycle and covered our IPs with comprehensive set of diagnostics, it allows our IPs to pass the toughest quality criteria of the world's leading car manufacturers." said Igor Elkanovich, CTO of GUC. "Convergence of 2.5D and 3D packaging using HBM3, GLink-2.5D/UCIe and GLink-3D interfaces enables highly modular, chiplet-based, much- bigger-than-reticle-size processors of the future."GUC HBM Controller and PHY IPTSMC Process NodesSpeedReadiness7nm HBM37.2 GbpsV (6nm compatible)5nm HBM38.4 GbpsV (4nm compatible)3nm HBM38.6 GbpsVGUC D2D (GLink-2.5D & UCIe) IPTSMC Process NodesBandwidth (full duplex)Readiness7nm GLink 1.00.7 Tbps/mmV (6nm compatible)5nm GLink 2.3LL2.5 Tbps/mmV (4nm compatible)3nm GLink 2.3LL2.5 Tbps/mmV3nm UCIe 1.05.1 Tbps/mm4Q23To learn more about GUC's HBM3, GLink-2.5D/3D and UCIe IP portfolio and InFO/CoWoS/SoIC total solution, please contact your GUC sales representative directly or send email to IP-FAE-AM@guc-asic.com.Please visit https://www.guc-asic.com

The semiconductor manufacturing industry, which constantly pursues ultimate performance, small form factors, and minimal power consumption, has been continuously refining various technologies in recent years. Apart from the two major trends of advanced processes and compound semiconductors, advanced packaging technology for heterogeneous integration has also become a recent market focal point in conjunction with the AI popularity. However, all three of the aforementioned technologies must be accompanied by material analysis (MA) and failure analysis (FA) to ensure product quality and reliability. With ample professional experience in semiconductor analysis, Integrated Service Technology Inc. (iST) provides a variety of solutions that cater to the diverse needs of customers in this field.Creating new technologies with professional experience to overcome analytical challenges in new production processesTurning the attention to advanced processes, over the past two years, AI development has picked up the pace gradually. Various electronic devices and field systems have shown an increasing demand for more computing power in ICs. To meet these market demands, semiconductor manufacturers have been investing heavily in the research and development of advanced processes. Due to these efforts, the mass production of 3-nanometer chips began in the end of 2022, while the mass production of 2-nanometer chips is expected to commence in 2025. Miniaturization processes and high-density components have brought various challenges to failure analysis(FA) and material analysis(MA) in semiconductor production. Shih-Hsorng Shen, the Director of Failure Analysis Engineering Division at iST, pointed out that as component sizes decrease, internal structures become more refined. As a result, failure points will also become proportionally smaller. Analyses thus require techniques and approaches that are different from the past to address these challenges.Demands for new analytical techniques brought forth by new processes are also created in the fields of heterogeneous integration and compound semiconductors. Shen explained that advanced processes, advanced packaging for heterogeneous integration, and compound semiconductors all give rise to fault patterns that are different from traditional processes. In traditional processes, faults typically involve issues like open circuits, short circuits, or leakage. However, new processes exhibit different faults. For example, in advanced packaging processes for heterogeneous integration that require stacking of different materials, variations in the coefficient of thermal expansion among different materials can lead to mechanical stress, impacting the overall operation of ICs. Due to diverse materials used and the intricate 3D IC architecture of heterogeneous integration, compared with inspecting a single layer in traditional 2D ICs to detect problems, diagnosing faults in 3D ICs of heterogeneous integration requires a thorough understanding of material properties, mechanical stress during fabrication, thermal effects, and layer-by-layer examination of the 3D structure to identify defect points. As a result, the difficulty level is fairly high.To overcome these challenges, laboratories with complete testing instruments, and extensive professional analysis experience are required. Taking thermal effects, which often lead to component failures, as an example, a thermal imager is typically used for identifying heat concentration points within the structure. If the issue still cannot be pinpointed, transmission electron microscopy (TEM) must be conducted for an in-depth microscopic material analysis. However, in the verification and analysis service industry, precision instruments only constitute the basic requirements. Kim Hsu, Assistant Vice President of Material Analysis Engineering Division at iST, pointed out that to obtain accurate results, extensive analysis experience is also essential.Hsu further said that generally, more comprehensive information will make analysis results with higher precision. However, due to the sensitive nature of information in the semiconductor industry, clients are often less willing to provide detailed information compared with other fields. To deliver analysis results that meet client expectation despite these circumstances, different professional approaches are required.Regarding the mechanism of semiconductor verification and analysis services, Shen used the medical field and its processes as an analogy. When a person feels unwell, he or she would usually see a family physician first. The family physician would conduct preliminary examinations such as auscultation, inspection, or use various instruments to identify the cause of illness. Once the cause is established, the patient is then referred to the appropriate specialized department, where a specialist physician would provide the corresponding treatment. iST's verification and analysis services follow a similar approach. Shen explained that when a product fails, customers often struggle to identify the point of defect. As such, iST will first assign a single contact window to handle the case. Preliminary diagnosis will be conducted before the case is transferred to the corresponding laboratory. This practice resolves the inefficiency of past procedures, where trial and error was repeated in various analysis processes to determine the cause of defect. As a result, the time required for product analysis is significantly reduced.Additionally, much like in hospitals, where X-rays or ultrasound scans are performed for maintaining as much integrity of a patient's body as possible, and preventing the equipment from affecting the area under examination, verification and analysis services operate under similar principles. However, as semiconductor processes become increasingly miniaturized, the difficulty of conducting non-destructive testing has increased. iST's unique techniques and methods often start with a pinpoint analysis for a broad area, and an elimination process layer by layer to identify the issue. Subsequently, limited-destructive or non-destructive analysis will be carried out where appropriate. The majority of the analysis work is conducted with this approach, which leads to precise results.Consolidating years of analysis expertise to provide one-stop integrated solutionsIn addition to aiding customers in swiftly identifying causes of product defects, Hsu pointed out that a product comprises an integrated structure. Therefore, failure analysis(FA) and material analysis(MA) not only have to fulfill their respective roles, but also closely interact and connect with each other to effectively ascertain the reasons for failure. During the analysis process, FA primarily focuses on identifying root causes of issues from a higher level such as mechanical and electrical causes. On the other hand, MA delves deeper into analyzing material properties to ensure that the quality and performance of materials or components align with the requirements.Hsu continued to explain that the ability of iST in providing comprehensive solutions is underpinned by a high degree of professional expertise. He cited TEM as an example. TEM can penetrate materials to reveal their internal structures at a microscopic level. However, the results are inherently microscale. At this point, it is necessary to cross-examine and verify the microscopic results against macroscopic findings. Hence, MA and FA need to go hand in hand to identify the causes of failures.To provide customers with the best integrated solutions, iST adopts several approaches to strengthen the capabilities of its team. Firstly, iST continues to invest in its hardware and equipment to establish a comprehensive analytical environment. Secondly, the company works to enhance the quality and quantity of its talents. Employees are encouraged to proactively participate in academic conferences, and engage in exchanges and collaborations with research institutions. Meanwhile, industry experts are also recruited into the team.Aside from investing in hardware and cultivating talents, Shen mentioned that another important aspect is the utilization of data science in iST. He said that with the increasing data volume nowadays, data analysis and processing have become ever more important. iST uses AI-automated measurement technology to effectively reduce human error. By integrating automated measurement technology with TEM, not only can the precise dimensions, shapes, and distribution of grains and nanometer-sized particles be accurately measured, the thickness and width of thin-film layers can also be measured. Through this integration, a continuous stream of data on nanoscale components can be generated, ultimately enhancing process yield and creating new business opportunities.In addition to advanced processes, advanced packaging for heterogeneous integration, and compound semiconductors, more new technologies will emerge in the future. In this regard, Shen said that iST will work to establish a comprehensive hardware environment, nurture cross-disciplinary talents, and develop analytical technologies. In response to the rapidly changing semiconductor industry, iST aims to become the strongest force through professional analysis services, supporting customers to emerge a winner from market competition.iST's Assistant Vice President of Material Analysis Engineering Division, Kim Hsu (left), and Director of Failure Analysis Engineering Division, Shih-Hsorngg Shen (right), pointed out that new semiconductor technologies must be complemented by sophisticated analytical technologies to ensure product quality and reliability.Photo: DIGITIMES

In the midst of semiconductor, automation equipment, and material companies at SEMICON TAIWAN, iCometrue stands out with its unique business model.iCometrue was founded by Dr. M. S. Lin, who is an inventor and the current chairman of the company. He is currently also a member of Harvard University's Global Advisory Council as well as a member of Dean's Advisory Cabinet under the School of Engineering and Applied Sciences. He has four decades of experience in the semiconductor industry. Lin said that primary objective of participating in SEMICON TAIWAN 2023 is to find partners for co-development to lead to production of Logic Drive, a disruptive device invented by iCometrue. Alternatively, the company is looking for opportunity for patent licensing, finding possible manufacturers that may be interested in developing and producing Logic Drive.The Logic Drive Aims to Create a Public Innovation Platform for IC Designers Using Technology Nodes More Advanced Than 10 NanometersLogic Drive is an innovative term to many people in the industry. Lin said that as the technology of the semiconductor IC chip continues to advance, the cost of developing a chip below the 5nm technology node would easily surpass hundreds of millions of dollars. The cost presents a huge barrier to chip innovation. If this barrier could not be surmounted, chip designers would only flock to large semiconductor companies, thus, missing public talent pools and making revolutionary breakthroughs of the overall semiconductor industry even more difficult.Lin also pointed out that with the 10nm technology node, Field Programmable Gate Array (FPGA) performance in some applications will be able to complement or even contend against the popular GPU — especially in networking and AI inference. With the inherent programmability of FPGA, developers will have flexibility to develop a variety of applications by modifying the configuration, which then alters the circuitry of FPGA chip, an impossibility for existing ASIC and CPU/GPU chips.Lin even likens FPGAs to a modern Leonardo da Vinci, a Renaissance man who made great contributions as a painter and musician, an anatomist and physiologist; a geometer and a civil engineer; a skilled astronomer, meteorologist, geologist, optical scientist, mechanic, and a biologist familiar with animals and plants.Inspired by the potential of FPGAs, Lin proposed a totally new idea: Logic Drive: Standardize the FPGA chip manufactured by the technology more advanced than 10nm technology node, pair it with a non-volatile memory (NVM) chip to store the FPGA configuration, and then package them together using multi-chip packaging technology. The result is a product similar to a Solid-State Drive or Solid-State Disk (SSD), with the only difference being that SSD is for storing data memory, while Logic Drive is for storing computing logic. An innovative IC designer may implement his innovations cost-effectively by programming his innovation into Logic Drive, put his own logo on a Logic Drive, and sell it as an ASIC chip.What does standardizing FPGA chip mean? It means that only the programmable circuits of the FPGA is retained, while the I/O circuits and control circuits are removed from the FPGA chip to form the I/O chips and control chip in the Logic Drive. That way, the standardized FPGA chip becomes a commodity product and is easier and much less costly to mass-produce.Lin further mentioned that adopting one or even multiple FPGA chips in a multi-chip package is a quite flexible method. In other words, the Logic Drive can be customized with different quantities of standardized FPGA chip, all depending on computing demand.A Public Innovation Platform for Conquering Present ChallengesLin hopes to use the realization of Logic Drive to create a public innovation platform. So that, through Logic Drive, the 99% of the common public can also participate in cutting-edge technology available to the wealthy 1%. Moreover, Logic Drive is a re-useable product, contributing to environmental sustainability. Based on Lin's observations over the past few years, iCometrue has gradually been able to search out market demand, and he also believes that such a model has a great chance of success. That is why the company hopes to seek partners at SEMICON TAIWAN. In last seven years, iCometrue has intensively detailed the roadmap to Logic Drive, proposing methods to standardize the FPGA chiplets for cost reduction and inventing advanced multi-chip packaging technology for packaging Logic Drive. As now, iCometrue has been awarded 36 US patents, with many more pending.Realizing the concept of Logic Drive still presents some difficulties, such as the willingness of FPGA manufacturers to invest in this field so that FPGAs can be standardized and mass-produced. Another difficulty, in terms of development tools, is whether there is a more friendly development interface (such as NVIDIA's CUDA) that the market can use. But Lin also revealed that there are already methods to overcome these obstacles and realize Logic Drive, all without much difficulty. iCometrue will use multiple channels and business models to promote Logic Drive, and continue to develop multi-chip packaging technology patents for Logic Drive.A New Moore's Law: The Result of Multi-Chip Packaging TechnologyLin has years of research and observation of multi-chip packaging technology, and he proposes: "Moore's Law of Chip Package." Moore's Law of chip states that the number of transistors per unit area doubles every 18–24 months. While the chip packaging technology was once considered as "non-Moore's Law", Dr. Lin proposes that the chip packaging technology will also start to undergo a similar trend of size miniaturization, following the well-known Moore's Law of chip. This implies that every 18-24 months, the number of transistors within a unit volume of chip package will double. When combining with Moore's Law of chip, the number of transistors in the multi-chip package will double sooner in every 9–12 months. The Moore's Law of chip now faces challenges related to physical limitations and escalating costs, and gradually slows down. As a result, the miniaturization journey is turning towards the chip packaging technology. In the future, the chip packaging technology is anticipated to progressively take the lead and continue the Moore's Law.Finally, it is worth mentioning that Lin has over 40 years of industry experience, having worked at IBM, AT&T Bell Laboratories, and TSMC, and founded Megic Technologies (which became part of Chipbond) and Megica (which was acquired by a leading US semiconductor company). He has more than 300 US patents to his name. Encouraged by several top scientists, he distilled his forty years of experience into a book, Moore's Journey. The book was published at the end of August, and covers core concepts of science and engineering intermingled with personal stories and observations. Lin eloquently shares his deep understanding of physics and philosophy in this exploration of the past and present of semiconductors. The book, to be exhibited at SEMICON TAIWAN this year, also contains a more fleshed-out explanation of Logic Drive and Moore's Law of Chip Package. Anyone interested is welcome to come and browse.Logic Drives store computing logic, just like solid state drives store data memory Photo: iCometrueIn a standardized FPGA chip, most of its area is occupied by regular logic block arrays, just like memory block arrays in the DRAM chipPhoto: iCometrueDr. Lin proposed Moore's Law for chip packaging based on his decades of research and observation of multi-chip packaging technologyPhoto: iCometrue

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced that it significantly expanded its portfolio in the first two quarters of 2023 by adding 300 new suppliers across their core business, DigiKey Marketplace and Fulfilled by DigiKey program."DigiKey is focused on adding the newest and most innovative technologies to carry the widest selection for the engineering community," said Mike Slater, vice president, global business development for DigiKey. "In addition, we are continuously analyzing our supplier mix to fill technology gaps and provide the global engineering community with technologies that are in compliance with regulations in their respective locations."Some of the key suppliers added to the DigiKey portfolio so far in 2023 include Alps Alpine, Amphenol LTW, Ambiq Micro, HELUKABEL and Zettler Magnetics. Long term suppliers also continue to expand their offerings by adding new products from different divisions. DigiKey is rapidly expanding in the industrial space, controls, sensors, motors and advanced products in industrial automation.DigiKey is an authorized distributor of electronic components for more than 2,400 industry-leading suppliers, ensuring that the products engineers, designers, procurement professionals and makers order are authentic and come to DigiKey directly from the manufacturer.The company also continues to expand the diversity of its products and suppliers in new product categories with its DigiKey Marketplace, a single source for all aspects of technology innovation, including bare PCB boards, industrial automation, test and measurement, IoT solutions and virtually all things related and adjacent to technology innovation, all through a singular shopping experience.By using DigiKey's state-of-the-art warehouse and logistics center, the Fulfilled by DigiKey program brings the capabilities of a 3PL warehouse along with a longstanding, global customer base and world-class on-demand fulfillment and transaction website to market, sell, pick, pack, and ship a supplier's products globally.For more information about the suppliers in the DigiKey portfolio, please visit the DigiKey website.

Today DTS, Inc., which creates extraordinary experiences, announced the official launch of immersive audio support for DTS Play-Fi Home Theater, the only whole-home wireless solution to support 12 channels of discrete sound, for a higher-fidelity listening experience. Originally launched in 2021 with support for 5.1 surround sound, this latest update enables playback of immersive sound formats like DTS:X, Dolby Atmos and IMAX Enhanced from DTS Play-Fi compatible TVs to discrete speaker layouts, up to 7.2.4. DTS Play-Fi Home Theater eliminates the need for unsightly wiring, TV dongles, and AV receivers by re-using the Wi-Fi radio built into every smart TV.DTS, Inc. is a wholly owned subsidiary of entertainment technology company Xperi Inc. (NYSE: XPER)"Whether for movies or music, everyday consumers have had to settle for less than what today's latest immersive audio formats fully have to offer, limited by the impracticality of wires, bulky electronics, and inconvenient speaker placement," said Dannie Lau, general manager, DTS Play-Fi. "DTS Play-Fi Home Theater brings high-fidelity immersive sound to the masses featuring wireless convenience, flexible speaker layouts, a range of in-market products, and enveloping sound with 12 discrete channels of audio. Play-Fi is the new benchmark for truly immersive wireless sound."DTS Play-Fi Home Theater recreates an incredible immersive listening experience, today with up to 12 discrete channels of audio, all over standard Wi-Fi. Key features include:Customizable home theater configurations from the simple, like a wireless soundbar connection, to the truly immersive with discrete speakers, surrounds, and subwoofers, supporting layouts up to 7.2.4 Option to use the TV's internal speakers as part of a DTS Play-Fi Home Theater system Support for all immersive and surround sound formats including DTS:X, Dolby Atmos and IMAX Enhanced Works with all TV video sources including wired inputs (e.g. HDMI), on-board streaming apps, and wireless streaming protocols like AirPlay and Chromecast Capability to mix-and-match DTS Play-Fi compatible soundbars, speakers, subwoofers, and amplifiers, regardless of brand Technology-agnostic streaming solution that works across various TV operating systems and leading TV system-on-chip solutions Utilizes the same Wi-Fi radio already built into the smart TV; no additional hardware is requiredTPV will be the first partner to launch the latest DTS Play-Fi Home Theater enhancements on select 2023 Philips TVs, which are expected to be released in the coming year. All DTS Play-Fi compatible TVs offer an extensive array of whole-home capabilities including multi-room music and TV playback, portable and private listening, and compatibility with top music services from around the world via the DTS Play-Fi mobile app."Every great home theater system combines two things: the best possible picture quality and true-to-life sound," said Diederik Houtman, head of product management at TPV Europe. "DTS Play-Fi's industry-leading technology lets consumers do just that by wirelessly connecting Philips award-winning TVs with DTS Play-Fi compatible soundbars, speakers, and subwoofers to deliver the ultimate immersive home cinema experience."Learn more about DTS Play-Fi and its award-winning wireless audio technology at IFA 2023 in Berlin and at play-fi.com.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the market's first MEMS water/liquid-proof absolute pressure sensor with a declared 10-year longevity program for the industrial market."With the spread of the Industrial Internet of Things, companies are seeking to gather data from throughout their operations, often in challenging environments both indoors and outdoors," said Simone Ferri, General Manager, AMS MEMS Sub-Group, STMicroelectronics. "Our latest waterproof MEMS pressure sensors provide the environmental robustness needed to power digital transformation everywhere, with the long-term availability needed to protect customers' designs."ST's new ILPS28QSW sensor comes in a sealed, cylindrical, surface-mountable package. It features a ceramic substrate that provides high resistance to liquid permeability and a robust potting gel, proven in automotive applications, to protect the internal circuitry. The lid, made from high-grade surgical steel, is sealed with an o-ring and secured with epoxy adhesive. This unique package design ensures an ingress-protection rating of IP58 to withstand immersion in over one meter of water, certified according to IEC 60529 and ISO 20653. In addition, the sensor can sustain up to 10Bar over-pressure.The ILPS28QSW provides absolute pressure readings, accurate to within 0.5hPa, with selectable full-scale range of 260-1260hPa and 260-4060hPa, and has a wide operating-temperature range, from negative 40- to positive 105-degree Celsius. Its high accuracy and superior environmental robustness are suitable for applications such as gas and water metering equipment, weather monitors, air-conditioning smart filters, and home appliances.Also featuring ST's unique Qvar electrostatic-charge sensing channel, the ILPS28QSW lets developers create additional value in their applications through features such as liquid leakage detection. Qvar combined with the pressure signal enables monitoring of both liquid level and even the tiniest of leaks in home appliances and industrial processes.With operating current as low as 1.7µA allowing use in power-conscious applications, the ILPS28QSW integrates digital features that simplify system design and management. Temperature compensation, FIFO memory, and an I2C/MIPI-I3C digital communication interface are all built-in and the output data rate is selectable from 1Hz to 200Hz.The ILPS28QSW is in production now.For further information please go to www.st.com/industrial-pressure-sensor.STMicroelectronics ILPS28QSW sensor is designed by IPCs

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed a new FlightSense multi-zone distance sensor with a 90-degree field of view – the industry's best and 33% larger than the previous generation. The optical sensors bring lifelike situational awareness to applications like home automation, domestic appliances, computers, robots, and smart equipment used in stores, factories, and more."Our FlightSense technology inside Time-of-Flight multi-zone sensors enables sophisticated scene understanding with low demands on system power and processing," said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging sub-group within ST's Analog, MEMS and Sensors Group. "Extending the field of view now gives users even greater flexibility while maintaining accuracy, resolution, and simplicity."Unlike camera sensors, which are sometimes positioned for these tasks, Time-of-Flight (ToF) sensors like ST's new VL53L7CX announced today do not capture images and thus ensure full privacy for users. The VL53L7CX extends the field of view to an unprecedented 90-degree (diagonal) for enhanced peripheral sensing, almost equivalent to that of a camera. This enhances the performance of presence detection and system activation, such as activating a screen or waking an appliance like an oven or coffee machine.ST's FlightSense multi-zone sensors have powerful capabilities including 3D scene mapping and simultaneously measuring distance to multiple objects in multiple zones. The multi-zone capability and the motion indicator allow use in applications like people detection and tracking, over-shoulder warning, occupancy detection, and storage/parking management.The new sensor also enhances the performance of applications like smart waste-management for tracking full and empty bins. It can also improve floor sensing, cliff prediction, obstacle avoidance, and small-object detection for robots. Further applications include keystone correction in projectors and extended hand tracking for gesture recognition using the STGesture software pack.Further technical informationThe new VL53L7CX has native 64-zone (8 x 8) sensing and can measure distance to multiple objects in each zone, up to 350cm. ST-patented histogram algorithms allow multi-target detection and measurement within the field of view, as well as smudge immunity above 60cm. The linearity is consistent when measuring distance to objects as close as 2cm.In low-power mode, the sensor consumes just 5.4mW. In addition, the VL53L7CX can operate in autonomous mode that allows the host system to power down and wake only when a threshold value is reached. Thresholds include distance to nearest object, signal rate, and detection of motion. The new sensor is pin-to-pin and driver compatible with the previous-generation device, VL53L5CX.ST provides extensive design-in support to help users accomplish the maximum with these sensors and enjoy a fast time to market with low design risk. These include the VL53L7CX Expansion board (X-NUCLEO-53L7A1) and a development pack that includes the VL53L7CX board with an additional STM32F401 Nucleo board. The SATEL-VL53L7CX, a small-outline PCB for easy integration and fast prototyping, is also available.A full set of software is available to make user development easier, including the Ultra Lite Driver, Linux driver, and STGesture code examples. The X-CUBE-TOF1 software pack for fast STM32 microcontroller programming contains application code examples and is compatible with the STM32CubeMX tools.The VL53L7CX is in production now and available in a 6.4mm x 3.0mm x 1.6mm miniature optical LGA16 package.A webinar dedicated to Time-of-Flight sensing is available, which describes the VL53L7CX, its features, opportunities for product innovation, and resources to assist hardware and software development.STMicroelectronics FlightSense multi-zone distance sensor

As a result of technological innovation, the audio and visual have been not only be applied on entertainment but also be applied to the situation room, hybrid working space and distance learning to provide valid information in real time.Across the various vertical markets served by professional audio and visual products, certain installation environments possess unique and challenging conditions that cannot be adequately addressed by standard product specifications. In these special applications, product reliability is just as important as the product's features and functions. To fulfil this vital requirement, CYP has launched its M.A.R.S. product line, which has been tested long-term in the field and laboratory to achieve the most stringent of reliability standards.The M.A.R.S. series currently includes products specifically tailored for wide temperature applications, maritime and naval purposes, as well as rugged applications, with all products field-tested for over a year to meet this tough standard.The CYP M.A.R.S. standard stands for:Military Grade: Product quality and reliability standard meeting, or exceeding, military standard certification (MIL-STD) and suitable for deployment in harsh environments.All Weather: Products that can operate seamlessly across a wide range of temperatures.Rugged: Products designed to be robust and durable, boasting an extremely long MTBF (Mean Time Between Failures).Shock Resistance: Products that can withstand vibrations and external impact forces.Wide Temperature Applications – Compliance with IEC 60068-2-1/2-2The wide temperature product series has the capability to transmit 4K video and audio signals stably at a working temperature range of -20 ~ 70�J, which is suitable for low and high-temperature work environments, even when in constant use. In addition, the flexibility of the configuration when used with the central management system delivers the most efficient audio and video performance.Maritime and Naval Applications (NAV series) - EN-60945 certifiedIn response to the increased digitisation of ship instrumentation, audio and video products need to integrate data from various sensors and devices, all with different interfaces, to be displayed in real-time on the screens within the ship's bridge. Electronic devices on ships must also be able to withstand the impact of waves as well as resist drastic changes in temperature and humidity, so ensuring reliability, durability, a long lifespan, and meeting the relevant safety certifications is essential. CYP's NAV series products are specifically designed for audio visual data transmission as experienced within these harsh environments, whilst combining built-in software interfaces to provide crew members with a simple and reliable means of carrying out various critical tasks.Rugged Applications (MIL series) - MIL-STD-810G certifiedMonitoring and control systems in extreme environments heavily rely on audio and video streaming or real-time video transmission technologies. These monitoring and control systems are able to help organisations make decisions quickly, whilst ensuring staff safety when working within high-risk conditions. The CYP's MIL series, certified to meet the MIL-STD-810G standard (US Defence Standard), exhibits outstanding reliability and can operate stably across a range of extreme environments. In addition, CYP provides customisation services, such as M12 waterproof connectors, to ensure that the MIL series meets the user's needs in any harsh environment.The M.A.R.S. product range from CYP combines great reliability, a long life span and is maintenance free, making it the perfect product range where harsh conditions might be encountered. With AV used more and more across a wide-range of control applications, the ability to bring it all together and control it by ultra-reliable devices is essential for when it is called into action. CYP will be adding to the range, so no matter how harsh the environment, CYP will have an AV device that will simplify the complicated digital workflow through AV/IT technology.The Big Step in Pro AV Industry - CYP launched M.A.R.S. product line which specially designed for mission critical

The world leader in gaming, content creation, business & productivity and AIoT solutions, MSI announced today its participation in IFA 2023 on September 1st. Established in 1924, the IFA Berlin International Consumer Electronics Exhibition stands as a beacon with an impressive history spanning nearly a century. IFA remains one of the trade fairs that profoundly impacts global PC buyers, wholesalers and retailers by providing a platform that offers comprehensive solutions for the industry.At IFA 2023, MSI will showcase its full lineup of cutting-edge products. This highly anticipated range encompasses laptops, desktops, monitors, graphics cards, motherboards, peripherals and components. These products symbolize MSI's pursuit of innovation and its commitment to delivering high-quality experiences for global consumers.MSI's Vice President of Marketing, Sam Chern commented, "MSI is thrilled to be part of IFA 2023 event again, it's a fantastic chance to present our achievements. Our MSI team is all about bringing the latest technology to users around the world, making their lives more convenient and joyful. We invite everyone to visit MSI booth and explore our exciting products and innovations!"Join MSI at IFA 2023 in Berlin! You're invited!MSI looks forward to seeing friends and partners from the media and industry at IFA 2023. Expert staff will be on hand to answer your questions and demonstrate a huge range of new products and technologies. No matter what your interest, from business to gaming, from productivity to the home, MSI will be excited to show you the latest technology, unique innovations, and products that will change your world. See you in Berlin!MSI Stealth 16 Mercedes-AMG Motorsport LaptopStealth 16 Mercedes-AMG Motorsport is now in the market! The epic crossover between MSI and Mercedes-AMG. Sporting the latest 13th Gen Intel Core i9 processor with NVIDIA GeForce RTX 40 Series Laptop GPUs, this limited edition also garners an upgrade on the panel to 4K OLED. Various bundle items are included in the exclusive Premium Bundle Pack, namely mouse, mousepad, USB drive and pouch, to epitomize the kindred spirit of luxurious experience shared by both MSI and Mercedes-AMG Motorsport.MSI Stealth 16 Mercedes - AMG Motorsport bundleMSI Commercial 14 H LaptopThe new MSI Commercial 14 H is heightened by tailor-made solutions to enterprises through surgical precision on security measures. There are two optional features to choose from, NFC (Near-field communication) and a built-in Smart Card Reader. Both provide one more layer of identity authentication. Moreover, laptop configuration can be customized as needed. Aside from its outstanding features in the business territory, Commercial 14 H also brings to the table MSI's contribution to environmental protection. The keyboard deck is made of a recycled material PCR (Post-Consumer Recycled Resin), and over 90% of the packaging consists of recycled paper.MSI GAMING SLIM Family Graphics CardMSI GAMING SLIM series is a thinner variant of GAMING series while maintaining elevated performance and aggressive looks. Its lightened form factor for gaming rig building with space constrains and airflow vent design on the backplate for better heat dissipation make GAMING SLIM series an appearing option.MSI Gaming SLIM Family Graphics CardMSI MEG Trident X2 13th Desktop & MEG 342CDE QD-OLED MonitorTo deliver the ultimate gaming experience, MSI is proud to showcase the MEG Trident X2 13th, a top-notch gaming desktop powered by the 13th Gen Intel Core i9 processor and GeForce RTX 4090 graphics card. Designed with MSI's exclusive Silent Storm Cooling 3 thermal technology and the unique HMI 2.0 touch panel, the MEG Trident X2 13th works perfectly with MSI's newest QD-OLED display, the MEG 342C QD-OLED, offering players gaming experiences of the highest caliber. In addition, to cater to diverse gaming needs, MSI is also unveiling, at IFA 2023, the all-new 4K Gaming series, featuring the Rapid IPS technology in the MAG 274UPF/MAG 323UPF models while offering up to 160Hz refresh rates for ultimate picture quality and fluidity. Furthermore, the new Rapid VA series curved displays will also make their debut, with the MAG 325CQRXF featuring a 1000R curvature and Rapid VA panel technology to deliver unparalleled immersion and lightning-fast response time that gamers crave.MSI Modern MD271ULDE MonitorThe Modern MD271ULDE is a 27-inch 4K monitor that offers an immersive visual experience with its wide color gamut and advanced EyesErgo eye-care technology. It boasts a 27-inch 4K display with a wide color gamut with 95% of Adobe RGB, 99% of DCI-P3, and 139% of sRGB, ensuring accurate and lifelike color reproduction for an enhanced viewing experience. The TÜV-certified Anti-Flicker and Less Blue Light technologies both make the Modern MD271ULDE a perfect solution for people with excessive screen time at work. In addition, the Eye-Q check system enables users to perform self-checks on their eyes to ensure optimal eye health. In terms of design, the Modern MD271ULDE features a sleek and modern look with a 90° easy cable connection & management design, providing a clean and clutter-free setup. Its impressive specifications and innovative features make it well-deserving of the Red Dot Award 2023 for outstanding design and innovation.MSI B650M PROJECT ZERO Back-connect MotherboardThe B650M PROJECT ZERO back-connect motherboard is coming to the market. This motherboard has moved the power connectors, fan connectors, and other pin headers to the back of the motherboard, provides a cleaner and neater front view and significantly reduces the difficulty of cable management, allowing the motherboard, liquid cooler, and graphics card aesthetic design to be fully displayed. Besides its unique back-connect design, B650M PROJECT ZERO also equips plenty of features and specifications such as 2 PCIe Gen 4 x4 M.2 slots with M.2 Shield Frozr, USB 3.2 Gen 2 x2 Type-C port, 2.5G LAN and Wi-Fi 6E.MSI MPG GUNGNIR 300 Series CaseThe new MPG GUNGNIR 300 series is born to fulfill the compatibility needs of mid-level system configurations for gamers. Its front panel is made of a one-piece mesh design, supporting dual 360mm radiators of AIO liquid cooler or up to 12 x 120mm fans, providing exceptional cooling performance. The case also featured several patented designs, including a sliding HDD cage mount, horizontal/vertical push latches PCIE bracket, and a tool-free omnidirectional graphics card stand that can rotate 90 degrees to accommodate NVIDIA GeForce RTX 40 series graphics cards. Gamers can adjust and select their preferred support position based on the graphics card's size, shape, and outlet position.MSI MAG CORELIQUID E Series Liquid CoolerThe MAG CORELIQUID E Series, inspired by the shape of a solar eclipse, is an innovative product that combines advanced cooling technology with a striking visual design. By enlarging the contact area between the water channel and the copper base of the water block, the MAG CORELIQUID E Series maximizes heat dissipation from the CPU and improves thermal performance. Meanwhile, enhancing micro-channel height improves the water cooling system's efficiency. The 270-degree rotating water block cap design ensures the logo remains horizontal regardless of the mounting orientation. Users can integrate the MSI CORELIQUID E series with the MSI motherboard and adjust the cooling fan speed and pump through the MSI CENTER software, providing easy-to-use controls to fine-tune their hardware and achieve optimal computer performance.MSI SPATIUM M570 PRO PCIe 5.0 NVMe M.2 FROZR SSDThe SPATIUM M570 PRO PCIe 5.0 NVMe M.2 FROZR, with lightning-fast read/write speeds of up to 12400/11800 MB/s, blends MSI's passive thermal cooling design with well-pathed Core Pipes that transfer heat along a surfaced heatsink for efficient airflow passthrough, unleashing phenomenal transfer rates in 1TB, 2TB, and 4TB capacities.MSI VIGOR GK41 Gaming KeyboardThe VIGOR GK41 utilizes Kailh Red Switches for linear and precise feedback. It offers six fixed LED lighting zones with 10 modes that can be toggled to change the lighting effects. The keyboard is customizable, allowing you to store up to 3 profiles, including settings and Macro Keys, through MSI Center.MSI IMMERSE GH50 WIRELESS Gaming HeadsetThe IMMERSE GH50 WIRELESS is MSI's first wireless gaming headset broadcasting at a low-latency 2.4GHz with extended hours of immersive audio experience, featuring bass-enhancing audio drivers, an omnidirectional microphone, and advanced software applications. Its cross-platform compatibility brings the gameplay from PC to consoles in a foldable and durable lightweight package.MSI Smart EV ChargerMSI AC Smart EV Charger - EV Life, EV Premium, EV AI is compliant with Type 1 and Type 2 charging interfaces, and with certification standards including CNS 15511, UL 2594, and IEC 61851, offering charging power up to 14.4 kW through 60A. It supports mobile application, charging pay, RFID sensing, AI-based license plate recognition and remote management via ethernet and wireless connections, which is perfect for home and business.MSI Smart EV ChargerMSI AI DVRThe AI DVR could realize the driver behavior detections including driver's fatigue detection, distraction behaviors, and facial recognition for driver's ID info. This helps fleet operators to monitor their drivers' status at any time. Moreover, it also could develop functions like object detection to remind drivers of vehicles on the road, and automatic license-plate recognition as additional features to enhance drivers' driving experience & safety.MSI MS-C903 Intel Tiger Lake-UP3 Compact-Size AI Ready Box PCShowcasing smart 360° remote real-time patrolling solution by using MS-C903 with Intel OpenVINO AI development toolkit which can help you deploy solutions faster than ever, satisfying different applications that require high-performance and low-power computing kernel, such as image processing technology. The AI Box PC is offering the flexibility for machine builder and system integrators to build systems which can be widely adopted in smart factory, smart city and AIoT gateway applications.For further information, please contact: https://www.msi.comSubscribe to MSI RSS Feeds via https://www.msi.com/rss for real-time news and more product info.