Chinese tech website MyDrivers.com posted a picture that supposedly includes telecom giant China Mobile's presentation of its plans for 2016. On the right hand column of the presentation labeled "April or later," one product reads "future Apple iPhone 7C."

The recall itself isn't anything that shareholders should get worked up about; it was a relatively low-volume product and the impact on the company's financials should be minimal. What is interesting, though, is that as a result of this recall, investors can now glean some insight into the financials of Nvidia's device business.

AMD's President and CEO, Lisa Su, revealed at yesterday's earnings call that AMD has already completed its first couple of FinFET designs. She also stressed that FinFET is going to be incredibly important across all markets for the company in 2016.

Greater China, which includes Taiwan and Hong Kong, is now Apple's second-largest market and has become a battleground for the company as it vies with Samsung Electronics Co. and Xiaomi Corp. for smartphone supremacy.

Qualcomm's CEO said his company has the capabilities to build ARM server chips but was careful not to disclose any product plans at the International CES in Las Vegas.

There's absolutely no denying that mobile phone cameras are more than just a check-box item but have actually moved to the forefront of a product's feature set for many customers.

Qualcomm Life, launched two years ago as a division of the San Diego-based telecommunications giant Qualcomm, is building software and protocols that could bring some order to the chaos of health data. Its first product, called the 2Net Platform, is a system for getting wireless data off those devices and onto the Internet servers of clients, like health device makers or hospitals.

Samsung's disclosure comes after people familiar with Apple's plans said last month the company has about 100 product designers working on a wristwatch-like device that may perform similar functions to the iPhone and iPad.

Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011.

There's a hubbub of current speculation which once again claims Apple intends launching the next iteration of its iPhone in or around June: it's important to take claims of a June launch with a pinch of salt as there's been similar speculation in the past and the product didn't actually appear until Q4.

or most of the last two decades personal computers have accounted for a third or more of annual IC sales, but standard PCs are now on the brink of being replaced as the largest end-use product category for ICs.

Spansion has announced what it claims is the industry's first single-die 8Gb NOR flash memory product at 45nm. The 8Gb Spansion GL-T delivers high-quality, fast random access read performance to enable a better user experience with interactive graphics, animation and video in games and industrial applications.

TrendForce believes that, for the A6 and A7 chips, Apple will just as likely turn to Globalfoundries and Intel, which currently provides the Core i processors for Apple's notebooks. The ultimate choice will likely narrow down to whose products fits or performs up to Apple's product standards.

KLA-Tencor has announced two new additions to the company's IC fab-based reticle inspection portfolio: the X5.2 and Teron 611 systems. As the latest offering in the successful 5XX product line, the new X5.2 applies its high performance to capture defects and pattern degradation on masks currently in production, with extended capability for the upcoming 20nm node.

Prior to joining Globalfoundries, Bruce Kleinman served as corporate VP of platform marketing at Xilinx, where he led product marketing, product planning and technical marketing.

Spansion has unveiled what it claims is the industry's first human machine interface (HMI) coprocessor that enables voice-controlled system interfaces. Leveraging Nuance Communications' voice technology, the new product is ideal for voice recognition systems in automotive, gaming and consumer electronics, significantly improving response time and accuracy over conventional voice interfaces by supporting larger acoustic databases.

Texas Instruments (TI) announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products. This milestone underscores TI's confidence in copper as a viable replacement to gold in its semiconductor product roadmaps.

Mobile World Congress attendees hoping to see the first smartphones with quad-core SnapDragon processors on board had better brace for disappointment. There won't be any, said Qualcomm VP of product management Raj Talluri, unless you count the concepts touted by phone vendors and chip suppliers.

"We delivered a solid fourth quarter amid challenging market conditions," said company president and CEO John Kispert. "2011 was a year of transition and intense product development. Spansion is now well-positioned for growth in the future in areas such as automotive, industrial, communications and gaming..."

SpringSoft has announced immediate availability of the Laker Blitz chip-level layout editor, a new software product targeting chip finishing applications and the latest addition to its popular family of Laker custom IC design and layout automation solutions.

Aptina has announced the expansion of its extensive product portfolio with the production ready AR0832E backside illuminated (BSI) sensor. The AR0832E is a 1/3.2" optical format, 8-megapixel sensor with a 1.4-micron BSI pixel that produces stunning images to enable a class of Smartphone cameras capable of delivering the performance of digital still cameras.

Samsung Electronics Co., Ltd has revealed new figures highlighting a staggering 50% month-on-month growth in GCC sales of its Smart TVs since the product's regional launch just six months ago.

When the authorized biography of Steve Jobs goes on sale tomorrow, it will throw more fuel on the rumor that Apple has a TV set in its product pipeline.

TI's authorized semiconductor distributors include Arrow, Avnet, WPG, WT Microelectronics, and so on.

Integrated Device Technology (IDT) and Qualcomm have announced the signing of a definitive agreement to transfer the design team of IDT's Hollywood Quality Video (HQV) and Frame Rate Conversion (FRC) Video Processing product lines and certain related assets to Qualcomm.

Dell plans to release a smartphone shopping application this week, a move that mimics the tactics of competitor Apple as the tech giant ramps up marketing toward consumers ahead of the holiday shopping season. Dell's application, which will run on phones powered by Google's Android operating system, will let customers choose and pay for a computer, as well as customize its features. The app will also include product reviews in order to help tech buyers make their decisions.

Texas Memory Systems, best known for its pricey, yet extremely high-performance NAND flash-based storage arrays, has introduced a new system that it said competes with Tier 1 hard drives on a price-per-gigabyte basis.

A Wall Street analyst has predicted that Intel may acquire Micron Technology as the move would diversify its product offerings.

Seagate has shipped its one millionth solid state hybrid drive for laptop PCs after launching the product - Momentus XT - in spring 2010. Major computer makers including Alienware, ASUS, Dell, Sony and Toshiba now offer laptops powered by the 2.5-inch drive.

SanDisk has implemented the new SATA 繕SSD specification into its SanDisk iSSD product line of postage stamp-sized embedded SSDs.

3M has announced the completion of a major expansion of 3M's development laboratory and cleanroom located at its headquarters in Saint Paul, Minn. The expansion includes a 300mm CMP tool and defect metrology for product and application development.

Fujitsu Semiconductor has announced the release of 113 microcontrollers, including chips from the MB96600 Series of 16-bit microcontrollers and chips from the MB91520 Series of 32-bit microcontrollers.

Disruptions and shortages continue to loom over MCU product suppliers who are already facing severe pressure in the supply chain.

Hynix Semiconductor has developed 2Gb DDR4 DRAM and DDR4 DRAM-based 2GB ECC-SODIMM applying its 30nm-class process technology. Hynix plans to start volume production of this high performance DDR4 product in the second half of 2012.

"I don't envision us using Microsoft. I would never say never but it's not something we're entertaining now," said Christy Wyatt, corporate vice president of software and services product management for Motorola.

"The first iPhone shipped in 2007, and we still don't have a product that is close to their experience. Android came on the scene just over 2 years ago, and this week they took our leadership position in smartphone volumes. Unbelievable," said CEO Steven Elop in an internal email.

"Things have changed quite a bit," says Robert Passaro, a senior product manager for BMW. "We're tapping into where people are living their digital lives now, and that's on the smartphone. It makes sense to leverage that and integrate it into the car."

The Mobile Internet and Digital Home Business Group will be run by Liu Jun, formerly president of Lenovo's Product Group.