Around the web
26 Jul 200525 Jul 2005
The Japan Times
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Nikkei Electronics Asia
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Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standardAs chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung,...
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Singapore's chip progressSingapore's semiconductor sector took a major step this week with the launch of its first 12-inch wafer fab in Tampines on September 28.
The...
AI demand reshapes capital allocation and operating models in telecom sector
Although the global 5G mobile communications market is still growing in 2025, higher 5G user penetration has not necessarily...
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued...
Winning the AI glasses race: Why myopia users and optical retailers hold key to mass adoption
AI glasses are emerging as a key gateway to AI; the market is projected to grow rapidly between 2026 and 2030, with a compound...
