2D materials: from memory entry to logic's future
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Samsung's 'Wide Fold' sets up a 4:3 foldable showdown with Apple in 2026
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Taiwan advances 'dream memory' R&D beyond DRAM for AI era
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Moore Threads challenges Nvidia as S5000 targets Hopper-class LLM training
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CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab
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EVs and chips convergence: Taiwan's auto industry shifts south
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ENE Technology warns DDR shortage may hit revenue, eyes drones for growth
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PQC security chips likely to adopt plug-in deployment for data protection
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Quantum reshapes cybersecurity as AI and industrial sectors deploy PQC
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Chinese AI models overtake US rivals in developer adoption
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AI chips run too hot: Engineers race to reinvent cooling
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China's battery and energy storage firms lead amid AI-driven power demand surge
Dec 23, 18:57 in Tomorrow's Headlines
TSMC's Nanjing plant operates steadily amid VEU restrictions
Dec 23, 18:57 in Tomorrow's Headlines
SMIC reportedly raised prices by 10% amid mature process market recovery
Dec 23, 18:57 in Tomorrow's Headlines
US ban on DJI boost Taiwan's drone investment in the US
Dec 23, 18:57 in Tomorrow's Headlines
Samsung poised to fill US advanced chip capacity amid TSMC's N-2 restrictions
Dec 23, 18:57 in Tomorrow's Headlines
Taiwan firms secures low-earth orbit satellite orders, sees stable Taiwan-US demand
Dec 23, 18:57 in Tomorrow's Headlines
