China-based foundry Grace Semiconductor Manufacturing has announced the successful development of its 0.13-micron embedded flash process.

Toshiba has said it aimed to expand its energy, healthcare and environment-related businesses as it targets a strong recovery in earnings within the next three years.

Toshiba has begun volume shipments of solid-state drives ranging up to 512GB in size. The drives are built on a 43nm manufacturing process using multi-level cell (MLC) technology.

Microsoft's newest operating system for PCs will launch in late October, but it won't boost PC sales enough to help the global DRAM memory chip market until the second quarter of 2010.

LG Chem has consolidated its position as a global power in car batteries, in a deal with carmaker General Motors for its eco-friendly vehicle, Volt. Samsung SDI is following up with its own major deal with BMW, a German premier carmaker. But Japanese battery makers currently capture 95% of the nickel-metal hybrid batteries market.

The Central Weather Bureau forecast the storm to make landfall in northeastern Taiwan ton the evening of August 7.

Initially expected to be ready by the end of 2009, the PCI Express 3.0 specification has been officially delayed and will not see the light of day until second-quarter 2010, according to PCI-SIG.