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Sep 14, 09:50
CPO nears mass production — next battle about interfaces, yield and maintenance
Sep 14, 09:22
AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
Sep 14, 09:56
India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
Sep 14, 10:38
iPhone Duo's price opens room for Android rivals
Sep 14, 10:22
Lab self-investigations show AI agents improvising past their own guardrails
LATEST STORIES
7 days news
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
Sep 14, 12:55
ICT
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Sep 14, 12:42
EAST ASIA
Beijing municipality bans civilian drones from mid-November
Sep 14, 12:21
AEROSPACE
Sandisk recruits engineers in Korea as memory talent race heats up
Sep 14, 12:20
EAST ASIA
South Korea broadens espionage law to counter rising tech leaks
Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace
LG Display's AI transformation turns employees into AI builders, yielding 450+ in-house projects
Taiwan taps Amazon Leo for next-generation government satellite network
Z.ai reloads with US$5 billion for China's AI race
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
AI's energy demand ignites global nuclear rush, straining Taiwan's restart
Foldable smartphone panel shipments to grow 23% in 2026
China's OLED expansion narrows South Korea's auto, IT panel lead
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake
US finalizes anti-dumping and anti-subsidy duties on solar imports from India, Indonesia, and Laos
AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
The case for an AI speed limit collapsed in a weekend
AI labs ask to be slowed, Congress stirs, and Nvidia calls the alarm a sales pitch
India's chip show nearly doubles in two years, with suppliers leading the build-out
CoreIntelligence Holdings posts 6% revenue growth in first 8 months as optical ASP soars and energy-saving products grow
Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
Blokcert launches Gefjon AI to help Taiwan charging operators improve profitability as EV demand rebounds
Hiroca revenue jumps 35% as auto summer slowdown fades
Lite-On revenue rises in August on cloud power demand
Aurotek posts record August revenue on semiconductor, robot shipments
Renesas readies second price hike amid stronger power-chip demand
India roundup: India says it cannot build electronics without China
Image Match Design wins exclusive fingerprint module role in African ID project
More news
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Winstar's AI push gains momentum with some orders extending into 2027
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
Semicon Taiwan 2026
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Friday 11 September 2026
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
Friday 11 September 2026
China sets clear limits on payment terms to auto suppliers
Thursday 10 September 2026
TECH
Friday 11 September 2026
Micron Taiwan junior engineers to average NT$3.4 million, production workers up to 68 months’ pay amid memory boom
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Thursday 10 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes
Wednesday 9 September 2026
SEMICON Taiwan 2027 move to August highlights venue pressure, not anniversary tie-in
Monday 7 September 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Friday 11 September 2026
Enflame enters public markets with Nvidia alternatives in its sights
Friday 11 September 2026
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Friday 11 September 2026
OPINIONS
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
Wednesday 9 September 2026
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Wednesday 9 September 2026
TOPICS
SEMICON TAIWAN 2026
GEOWATCH
5G
TSMC UPDATES
SPECIAL REPORTS
Thursday 10 September 2026
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation
DIGITIMES identifies three main directions for memory development in cloud AI accelerators: processing near memory, 3D Stacked SRAM, and high-bandwidth flash.
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
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