OCP APAC Summit 2026

The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.

The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei. The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world and feature talks from experts who are researching, designing, building, and running the next generation of hyperscale data center facilities and infrastructure.

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IN THE NEWS

Tuesday 11 August 2026

TSMC nears AI packaging demand after years of doubling capacity:'CoWoS guy' Jun He

TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than...

Tuesday 11 August 2026

Interview: Nvidia says networking is the core of AI computing as AI factories scale

Global AI computing is rapidly moving beyond single-GPU systems toward AI Factory architectures, where agentic AI and inference workloads...

Monday 10 August 2026

Interview: Nvidia sees Taiwan as more than an assembler — an engineering partner

Taiwan's role in the global AI supply chain is shifting from manufacturing toward engineering, Nvidia networking senior vice president...

Saturday 8 August 2026

Interview: Lightmatter maps CPO future with Nvidia NVLink, Taiwan supply chain

The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's...

Friday 7 August 2026

Interview: Nvidia exec on progress of CPO production and pluggable optics

Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments...

Thursday 6 August 2026

Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029

The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...

Wednesday 5 August 2026

From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era

Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...

Saturday 1 August 2026

At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...