Bits + chips
Winbond to expand 12-inch fab capacity
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly capacity will grow further to 53,000 units in 2018.

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