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News tagged fab
  • Last update: Monday 29 June 2015 [291 news items]

Powerchip inks pact to built 12-inch JV fab in China

Newswatch - Jun 29, 10:42

Powerchip Technology has announced that it has inked an agreement with Hefei Construction Investment and Holding to set up a 12-inch joint venture fab in Hefei, China.

HKC expects new 8.5G fab to enter production in 1Q17

Jun 26, 11:37

China-based display solution maker HKC recently signed an agreement with the Chongqing government to invest CNY12 billion (US$1.92 billion) in a new 8.5G fab that will go into production...

US fab tool book-to-bill ratio slips below parity

Jun 22, 23:34

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.99 in May 2015 after having stayed above parity for four straight months.

Fab equipment growth continues into 2015, says SEMI

Jun 5, 15:45

Semiconductor fab equipment spending is expected to increase 11% to US$38.7 billion in 2015, and grow another 5% to US$40.7 billion in 2016, according to SEMI.

Commentary: UMC aims to trump investment restriction for producing 28nm chips in China

Jun 4, 11:13

United Microelectronics Corporation (UMC) is mulling to accelerate the development of its 18nm process at its fabs in Taiwan in order to pave the way for its subsidiary in Xiamen,...

TSMC to build 10nm pilot line in June, says report

Newswatch - May 26, 22:07

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to...

CSOT launches new 8.5G fab estimated to bring over US$3 billion a year in revenues

Apr 27, 21:50

TCL subsidiary China Star Optoelectronics Technology's (CSOT) T2 8.5G fab in Shenkeng, China has kicked off production as of April 24, 2015, which is expected to bring in CNY20 billion...

US fab tool book-to-bill ratio rises

Apr 23, 11:13

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in March 2015, having been above parity for three months in a row, according to the...

BOE invests CNY3 billion to construct new 8.5G fab

Apr 21, 15:46

China panel maker BOE has announced it will invest CNY3 billion (US$484 million) to construct a new 8.5G fab in Fuzhou, China.

TSMC to open new fab for 10nm manufacturing in mid-2016, says chairman

Apr 20, 15:42

Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips...

tsmc

TSMC hopes to build wholly-owned 12-inch fab in China

Apr 16, 21:59

TSMC would prefer to set up its own 12-inch wafer fab in China, and management is evaluating the feasibility "aggressively," according to the Taiwan-based contract chipma...

TSMC evaluating plans to set up 12-inch fab in China

Commentary: TSMC to lag UMC, Powerchip to build 12-inch fab in China

Apr 16, 14:22

Taiwan Semiconductor Manufacturing Company (TSMC) may not only lag behind rival United Microelectronics Corporation (UMC) but also Powerchip Technology in the race to build 12-inch...

Powerchip reportedly to set up 12-inch wafer fab in China

Apr 14, 11:32

Powerchip Technology will partner with the Hefei city government to set up a joint-venture fab in the capital city of China's Anhui Province, according to industry sources. The JV...

TSMC to construct Fab 15 Phase 5 facility starting May

Apr 9, 22:04

Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sour...

tsmc

BOE kicks off product shipments on new 8.5G fab

Apr 9, 15:05

China-based panel maker BOE has officially kicked off shipments for new products from its newly established 8.5G fab in Chongqing, China to clients that include Konka, Wistron and...

UMC begins construction of 12-inch fab in Xiamen

Mar 30, 15:57

United Semiconductor (Xiamen) or United Semi, a subsidiary of United Microelectronics Corporation (UMC) in Xiamen, has begun construction of its new 12-inch fab, which is scheduled...

US fab tool book-to-bill ratio stays above parity, says SEMI

Mar 24, 21:02

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.02 in February 2015, staying above parity for the second consecutive month.

Fab equipment spending to rise in 2015, says SEMI

Mar 11, 20:51

Worldwide fab equipment spending, which increased almost 20% in 2014, will rise 15% in 2015, according to SEMI. Growth will slow to only 2-4% in 2016, however, said SEMI.

Micron to expand NAND flash fab in Singapore

Mar 10, 20:34

Micron Technology recently hosted a groundbreaking ceremony to begin the expansion of its NAND flash memory fabrication facility in Singapore, according to the US memory vendor.

US fab tool book-to-bill ratio rises

Feb 24, 10:53

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.03 in January 2015 from 0.99 in the prior month.

HKC to build 8.5G LCD panel fab in China

Jan 8, 14:51

China-based display products maker HKC has signed an agreement with the Chongqing government to invest CNY12 billion (US$1.92 billion) in a new 8.5G fab in the western Chinese city...

UMC allowed to invest in 12-inch foundry in China

Jan 6, 10:45

United Microelectronics' (UMC) application to invest in a 12-inch foundry in Xiamen, China has been approved by Taiwan's investment commission. UMC is allowed to invest a total of...

BOE to invest US$3.53 billion in new 6G fab

Dec 30, 14:30

China panel maker BOE has announced it will invest CNY22 billion (US$3.53 billion) to construct a new 6G fab that will focus on production of LTPS and AMOLED panels for use in high-end...

Globalfoundries reportedly to likely delay 14nm ramp-up

Dec 30, 14:17

Globalfoundries has stopped deliveries of tools for 14nm to its fab, which would delay the foundry's production ramp-up of the process by one to two quarters, according to an industry...

Korea and Taiwan companies control 56% of global 300mm fab capacity, says IC Insights

Dec 24, 10:48

South Korea- and Taiwan-based chip companies are well known for manufacturing prowess when it comes to efficiently fabricating huge amounts of IC wafers. Most of the IC industry's...

US fab tool book-to-bill ratio rises above parity, says SEMI

Dec 23, 15:14

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment rose to 1.02 in November 2014 from 0.93 in the prior month.

HLMC said to invest NT$100 billion to build new fab

Dec 22, 21:36

Shanghai Huali Microelectronics (HLMC) will invest around NT$100 billion (US$3.2 billion) to build a new 12-inch wafer fab in 2015, according to industry sources.

Demand for 8-inch fab equipment rises

Dec 19, 11:09

Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity,...

SMIC Shenzhen 8-inch fab goes into operation

Dec 17, 20:43

Semiconductor Manufacturing International (SMIC) has begun operations at its Shenzhen 200mm (8-inch) wafer fab, according to the China-based IC foundry.

IC foundries gearing up for 8-inch fab expansions

Dec 17, 11:10

China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing...

US fab tool book-to-bill ratio stays below parity, says SEMI

Nov 21, 15:09

The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 0.93 in October 2014, staying below parity for the second consecutive month.

VIS hiking production at 8-inch fab

Oct 20, 11:45

Wafer foundry service provider Vanguard International Semiconductor (VIS) has increased monthly output at its 8-inch Fab 3 to 26,000 wafers since September and will increase to 27,000-28,000...

UMC to build 12-inch fab in Xiamen, keep 28/14nm production in Taiwan

Oct 13, 13:56

Having reached an agreement to invest in a 12-inch fab in Xiamen, China recently, United Microelectronics Corporation (UMC) has insisted that it will keep its advanced manufacturing...

China promoting development of MEMS industry

Sep 16, 14:59

In view of strong demand for MEMS components from China-based smartphone vendors, the China government has been promoting the development of the local MEMS industry by teaming up...

EPA passes initial environmental impact assessment for TSMC planned 18-inch fab

Aug 28, 15:03

A special panel of the Environmental Protection Administration (EPA) has approved the environmental impact assessment for a piece of land designated for construction of an 18-inch...

291 items [1/9]
  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

2015 China IC design market forecast
2015 China smartphone panel trend forecast

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