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News tagged fab
  • Last update: Tuesday 21 November 2017 [487 news items]

SPIL to build new factory in China

Nov 21, 12:52

Packaging and testing company Siliconware Precision Industries (SPIL) has gained land use rights for a 147,097-square meter industrial site located at the Fujian (Jinjiang) IC Industrial...

Samsung huge chip capex for 2017 shows move to defend its memory dominance

Nov 16, 11:20

After spending US$11.3 billion in semiconductor capex last year, Samsung announced that its 2017 outlays for the semiconductor group are expected to more than double to US$26 billion...

Innolux to take up Foxconn 6G LTPS line

Nov 15, 15:52

Innolux will take up Foxconn Electronics' 6G LTPS LCD fab in Luzhu, southern Taiwan for NT$31.4 billion (US$1.041 billion), a move which will ramp up its global LTPS panel market...

Innolux president Robert Hsiao

TSMC board passes US$4.29 billion budget for capacity expansion

Nov 15, 14:18

The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved a budget of about US$4.29 billion mainly to construct new fab facilities and expand production...

SMIC 3Q17 profits fall

Nov 15, 14:11

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has announced revenues of US$769.7 million in the third quarter of 2017, up 2.5% sequentially but down...

Global 3Q17 DRAM revenues climb 16.2%. says DRAMeXchange

Nov 14, 10:43

Sales in the global DRAM market surged 16.2% sequentially to a record US$19.18 billion in the third quarter of 2017, when contract prices of various DRAM products rose by about 5%...

Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion

Nov 14, 09:31

Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...

Taiwan IC designers vying for 8-inch foundry supply

Nov 10, 16:14

Taiwan fabless IC firms are aggresively vying to secure capacity at 8-inch foundries to meet increasing orders in 2018, particularly for MCU and MOSFET chips needed to support a variety...

wafer

Strong demand prompts VIS to mull new fab plan

Nov 8, 14:08

Specialty IC foundry Vanguard International Semiconductor (VIS) is evaluating the feasibility of establishing a new fab or buying an existing one to ramp up capacity to meet increasing...

VIS chairman Fang Leuh

TSMC 3nm fab construction to kick off in 2020, chairman says

Nov 6, 13:47

Taiwan Semiconductor Manufacturing Company (TSMC) founder and chairman Morris Chang said at a recent company event that the pure-play foundry will start constructing its advanced...

TSMC chairman Morris Chang

SK Hynix to expand DRAM production capacity in China

Nov 2, 11:20

SK Hynix recently struck a deal with China's city government of Wuxi to expand its DRAM production capacity locally with total investment estimated at US$8.6 billion, according to...

DRAMeXchange predicts higher DRAM bit growth in 2018

Nov 2, 11:14

With Samsung looking to expand production capacity, the global bit growth of DRAM in 2018 is projected to reach 22.5% compared with 19.5% in 2017, according to DRAMeXchange.

Samsung capex to reach KRW46.2 trillion in 2017

Nov 1, 22:17

Samsung expects capital expenditure (capex) for 2017 to be approximately KRW46.2 trillion (US$41.5 billion), a significant increase from 2016. Capex for the semiconductor and display...

UMC profits hit 9-quarter high

Oct 26, 11:40

Pure-play foundry United Microelectronics (UMC) has reported net profits of NT$3.47 billion (US$114.9 million) for the third quarter of 2017, up 65.5% sequentially and hitting a nine-quarter...

Globalfoundries to adopt EUV for 7nm FinFET

Oct 25, 14:05

Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...

Taiwan foundries seeing brisk demand from fabless firms

Oct 20, 15:46

Taiwan-based IC foundries including 8-inch ones have seen orders from their local fabless clients grow, which would indicate a particularly strong fourth quarter for Taiwan's IC industry,...

ASML 3Q17 sales exceed guidance on extra EUV deliveries

Oct 20, 13:29

ASML has announced net sales of EUR 2.45 billion (US$2.89 billion) for the third quarter of 2017, up 16.5% from EUR2.1 billion in the prior quarter. The Dutch fab tool vendor now...

IC makers maximize 300mm, 200mm wafer capacity, says IC Insights

Oct 20, 10:19

With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The...

Toshiba discloses further investment in 3D NAND flash facility

Oct 16, 15:37

Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).

ON Semi looking to fully own Fujitsu fab

Oct 13, 10:58

Fujitsu Semiconductor and ON Semiconductor have announced an agreement that ON Semi will purchase a 30% incremental share of Fujitsu's 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting...

Pure-play foundries boosting presence in China

Oct 12, 10:58

With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...

TSMC 3nm fab plan to create huge biz opportunities for supply chains

Oct 5, 14:06

The decision made by Taiwan Semiconductor Manufacturing (TSMC) to build its 3nm wafer fab in the Southern Taiwan Science Park has won acclaims from both member firms of the TSMC Grand...

Commentary: Triple-win decision for TSMC to build 3nm wafer fab in Taiwan

Oct 2, 14:48

Taiwan Semiconductor Manufacturing Company (TSMC) has recently decided to set up the world's first 3nm wafer fab in the Southern Taiwan Science Park (STSP) after gaining government...

Staying focused on profitability: Q&A with UMC co-president SC Chien

Oct 2, 11:45

United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...

UMC co-president SC Chien

TSMC announces plan to build 3nm fab in Taiwan

Sep 29, 17:10

Taiwan Semiconductor Manufacturing Company (TSMC) today announced that following careful evaluation, the company's planned advanced 3nm fab will be located in the Tainan Science Park...

NAND flash to reach supply-demand balance in 2018, says DRAMeXchange

Sep 28, 10:39

The global NAND flash market will shift away from undersupply and reach a supply-demand balance in 2018, when supply bit growth is forecast to reach 42.9%, according to DRAMeXchang...

Winbond to break ground on new 12-inch fab in mid-2018

Sep 27, 14:11

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...

Beijing, Shanghai IC sectors prospering

Sep 25, 15:30

The flourishing IC industries in Beijing and Shanghai has been pushing forward China's overall IC industry development, enabling the rapid rise of China in the global marketplace...

Globalfoundries Chengdu fab nears completion

Sep 22, 11:47

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries looking to ramp new 12-inch wafer plant in Chengdu in 2018

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

Sep 22, 10:32

Etching equipment demand for the manufacture of 3D NAND flash memory and FinFET chips is expected to grow in 2018 and 2019, according to Tokyo Electron, which expects its share of...

Tokyo Electron eyeing larger share of global etching equipment market

Globalfoundries to roll out 12nm FinFET technology for high-performance devices

Sep 22, 10:30

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...

TSMC to hold over 70% of PWM IC orders from Qualcomm

Sep 21, 14:11

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...

qualcomm

DRAM bit growth to reach 19.6% in 2018, says DRAMeXchange

Sep 21, 11:01

Global DRAM bit production will grow just 19.6% in 2018, as major suppliers intend to slow down the pace of their capacity expansions and technology migrations for chip price stability,...

Toshiba agrees to sell memory-chip unit to Bain Capital-led consortium

Sep 21, 10:33

Toshiba has agreed to sell its memory-chip business to KK Pangea, a special purpose acquisition company formed by a Bain Capital Private Equity-led consortium. The decision was made...

487 items [1/14]
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  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Archer+300+LCM+metrology+system

    KLA-Tencor Archer 300 LCM metrology system

    KLA-Tencor has introduced the Archer 300 LCM Metrology system, which offers precision and measurement speed significantly better than that of its predecessor - the Archer 200, and...

    Photo: Company, Jun 25.

  • Applied+iSYS+

    Applied iSYS

    Applied Materials has unveiled what it claims is the industry's first fully-integrated abatement and vacuum pumping solution for controlling emissions in the semiconductor fab. ...

    Photo: Company, Dec 2.

Innodisk
China AMOLED panel capacity expansion forecast, 2016-2020

22-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.