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News tagged wafer
  • Last update: Friday 20 October 2017 [762 news items]

Taiwan foundries seeing brisk demand from fabless firms

Oct 20, 15:46

Taiwan-based IC foundries including 8-inch ones have seen orders from their local fabless clients grow, which would indicate a particularly strong fourth quarter for Taiwan's IC industry,...

IC makers maximize 300mm, 200mm wafer capacity, says IC Insights

Oct 20, 10:19

With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The...

TSMC 3Q17 profits slip

Oct 19, 15:27

Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$89.93 billion (US$2.97 billion) on consolidated revenues of NT$252.11 billion for the third quarter...

TSMC saw profits drop on year in 3Q17

Nanya ramping 20nm process output

Oct 18, 14:15

Nanya Technology has started volume shipments of 20nm 4Gb DDR3 chips, and is scheduled to enter mass production of 20nm 8Gb DDR4 chips in the fourth quarter of 2017, according to...

Pei-Ing Lee, president for Nanya

SEMI forecasts record silicon wafer shipments

Oct 17, 15:01

Worldwide shipments of polished and epitaxial silicon wafers are forecast to total 11.448 billion square inches in 2017, exceeding the market high set in 2016, according to SEMI.

Demand for 12-inch silicon wafers to surge in China

Oct 13, 14:23

Demand for blank 12-inch silicon wafers is set to increase to 1.1-1.3 million pieces per month in China in 2018, up from the current 500,000 units, according to local media.

Pure-play foundries boosting presence in China

Oct 12, 10:58

With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...

Service-oriented corporate culture counts most in foundry sector, says Morris Chang

Oct 11, 14:43

Once describing Intel and Samsung Electronics as "700-pound gorillas" when commenting on his company's two major competitors, Taiwan Semiconductor Manufacturing Company (TSMC) chairman...

Morris Chang, chairman of TSMC

TSMC 3nm fab plan to create huge biz opportunities for supply chains

Oct 5, 14:06

The decision made by Taiwan Semiconductor Manufacturing (TSMC) to build its 3nm wafer fab in the Southern Taiwan Science Park has won acclaims from both member firms of the TSMC Grand...

Commentary: Triple-win decision for TSMC to build 3nm wafer fab in Taiwan

Oct 2, 14:48

Taiwan Semiconductor Manufacturing Company (TSMC) has recently decided to set up the world's first 3nm wafer fab in the Southern Taiwan Science Park (STSP) after gaining government...

Staying focused on profitability: Q&A with UMC co-president SC Chien

Oct 2, 11:45

United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...

UMC co-president SC Chien

China makers setting up solar poly-Si wafer plants

Sep 29, 13:02

China-based Shunfeng International Clean Energy, CETC Shanxi New Energy Technology and Tongwei Group are constructing solar poly-Si wafer plants with annual production capacities...

Moore's Law has come to its end, says Nvidia CEO Jensen Huang

Sep 27, 14:57

Nvidia founder and CEO Jensen Huang has said that with the emergence of GPU computing following the decline of the CPU era, Moore's Law has come to an end, stressing that his company's...

Jensen Huang, CEO of Nvidia

Winbond to break ground on new 12-inch fab in mid-2018

Sep 27, 14:11

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...

Globalfoundries Chengdu fab nears completion

Sep 22, 11:47

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries looking to ramp new 12-inch wafer plant in Chengdu in 2018

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

TSMC to hold over 70% of PWM IC orders from Qualcomm

Sep 21, 14:11

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...

qualcomm

Leading-edge paves way for pure-play foundry growth, says IC Insights

Sep 20, 13:55

In 2017, the 7% increase in the total pure-play foundry market is forecast to be almost entirely due to an 18% jump in sub-40nm feature size device sales, according to IC Insights.

GigaDevice signs wafer supply contract with SMIC

Sep 19, 10:36

China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

IC Insights finds continued adversarial relationship between DRAM buyers and suppliers

Sep 15, 12:27

The DRAM market has been historically the most volatile of the major IC product segments, according to IC Insights, adding that the average selling price (ASP) for DRAM has more than...

ITRI joins TSMC supply chain with new liquid nanoparticle monitor

Sep 15, 11:08

Taiwan's Industrial Technology Research Institute (ITRI) has tapped into the supply chain of Taiwan Semiconductor Manufacturing Company (TSMC) with a new generation liquid nanoparticle...

ITRI displays new liquid nanoparticle monitor at SEMICON Taiwan 2017

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

TSMC starts equipment move-in at Nanjing plant

Sep 13, 14:21

TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.

TSMC chairman Morris Chang at the ceremony to mark the start of equipment move-in at the company's

Most of 2017 capital spending will go to foundry and flash memory, says IC Insights

Sep 1, 11:28

Following a substantial increase in semiconductor capital expenditures during the first half of 2017, IC Insights raised its annual semiconductor capex forecast to a record high of...

Probe card demand for memory chips, high-end APs remains strong

Aug 31, 13:58

Semiconductor probe card demand for the manufacture of memory chips and high-end application processors (APs) has been strong, whereas that for the production of LCD driver ICs and...

Probe card demand rising for memory chips and high-end mobile APs

IC material supplier Wahlee obtains dry-film photoresist orders

Aug 31, 12:24

Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Samsung seeking long-term supply contracts with wafer firms

Aug 30, 13:34

Samsung Electronics is striving to sign long-term supply contracts with multiple wafer makers to ensure sufficient silicon wafer supplies for the manufacture of memory chips and logic...

A new Samsung fab in Pyeongtaek to focus on 64-layer 3D NAND flash production

Samsung to expand NAND chip capacity in China

Aug 29, 13:57

Samsung Electronics has disclosed plans to expand production capacity at its NAND flash memory wafer fab in Xian, northwest China for a total of US$7 billion over the next three ye...

ASML opens branch office in Nanjing

Aug 24, 11:51

ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.

ASML opens branch office in Nanjing

Winbond announces equipment purchases

Aug 23, 15:05

Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...

Taiwan reliance on diamond wire-sliced solar wafers to surge in 4Q17

Aug 22, 12:00

As China-based poly-Si wafer makers are fast replacing slurry slicing with diamond wire slicing to reduce production cost, Taiwan-based solar cell makers have been compelled to adopt...

solar

Global DRAM revenues increase 17% in 2Q17, says DRAMeXchange

Aug 21, 11:34

Sales in the global DRAM market surged 16.9% sequentially to US$16.51 billion in the second quarter of 2017, when PC DRAM contract prices rose over 10%, according to DRAMeXchange...

Wafer Works expects wafer prices to continue rising on strong demand

Aug 18, 14:05

Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.

762 items [1/22]
  • Winbond+SpiStack+memories

    Winbond SpiStack memories

    Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series...

    Photo: Company, Mar 30.

  • Micron+16nm+flash+die

    Micron 16nm flash die

    Micron Technology has announced the sampling of its 16nm, 128Gb MLC NAND flash memory devices, designed for applications like SSDs, USB drives and flash memory cards, tablets, ultra-thin...

    Photo: Company, Jul 23.

  • KLA%2DTencor+2910+series+optical+inspection+system+and+eDR%2D7100+e%2Dbeam+review+tool

    KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool

    KLA-Tencor has announced the new 2910 series optical wafer defect inspection platform with NanoPoint technology and the new eDR-7100 electron-beam wafer defect review system. Meeting...

    Photo: Company, Jul 18.

  • KLA%2DTencor+Surfscan+SP3

    KLA-Tencor Surfscan SP3

    KLA-Tencor has announced a new generation in the Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection...

    Photo: Company, Jul 18.

  • Canon+202x205mm+image+sensor

    Canon 202x205mm image sensor

    Canon has developed what it claims is the world's largest CMOS image sensor, with a chip size measuring 202x205mm. The newly-developed CMOS sensor is among the largest chips that...

    Photo: Company, Sep 10.

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

20-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.