Bits + chips
Winbond to roll out in-house developed DRAM technologies
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

Winbond Electronics has been engaged in the development of 3Xnm and 2Xnm DRAM technologies, which will start to bear fruit in the second half of 2017.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.