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News tagged manufacturing
  • Last update: Monday 16 October 2017 [820 news items]

Toshiba discloses further investment in 3D NAND flash facility

Oct 16, 15:37

Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).

KYEC obtains key backend orders from MediaTek

Oct 16, 13:24

Testing house King Yuan Electronics (KYEC) has obtained orders for MediaTek's major products for 2018, including 12nm mobile SoCs, and chips solutions for voice assistant devices...

Demand for 12-inch silicon wafers to surge in China

Oct 13, 14:23

Demand for blank 12-inch silicon wafers is set to increase to 1.1-1.3 million pieces per month in China in 2018, up from the current 500,000 units, according to local media.

ON Semi looking to fully own Fujitsu fab

Oct 13, 10:58

Fujitsu Semiconductor and ON Semiconductor have announced an agreement that ON Semi will purchase a 30% incremental share of Fujitsu's 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting...

ACTT complete IoT solutions available on SMIC 55nm eFlash platform

Oct 13, 10:54

Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...

Mobile DRAM prices to rise 10-15% in 4Q17, says DRAMeXchange

Oct 13, 10:49

Average prices for mobile (LPDDR) DRAM products are expected to rise 10-15% sequentially in the fourth quarter of 2017, according to DRAMeXchange. Major suppliers have intentionally...

Pure-play foundries boosting presence in China

Oct 12, 10:58

With the rise of fabless IC companies in China, demand for foundry services in the country has also increased. In total, pure-play foundry sales in China are expected to increase...

Compeq Manufacturing reports increased revenues for September

Oct 6, 15:59

Compeq Manufacturing has reported consolidated revenues of NT$5.519 billion (US$181.77 million) for September 2017, representing a 11.23% increase on month and 18.11% increase on...

Digitimes Research: Panel makers stepping up 10.5G development

Oct 5, 15:17

With competition in the TV panel market gradually mounting in the above 55-inch segment, some makers have been aggressively establishing new 10.5G production lines, including: China's...

Toshiba seals JPY2 trillion deal with Bain group

Sep 29, 11:50

Toshiba announced on September 28 the company had signed a deal to sell its memory-chip business - Toshiba Memory - to a group led by Bain Capital for about JPY2 trillion (US$18 bi...

Diode maker Eris looks to revenue and profit growth in 2018

Sep 29, 11:40

Taiwan-based Eris Technology, which specializes in the manufacture of rectifier diodes, expects to enjoy another year of revenue and profit growth in 2018, driven by robust orders...

Eris chairman

SMIC, Sanechips announce NB-IoT solution

Sep 29, 10:48

Semiconductor Manufacturing International (SMIC) and Sanechips Technology (formerly ZTE Microelectronics Technology) have announced the launch of RoseFinch7100, which the companies...

NAND flash to reach supply-demand balance in 2018, says DRAMeXchange

Sep 28, 10:39

The global NAND flash market will shift away from undersupply and reach a supply-demand balance in 2018, when supply bit growth is forecast to reach 42.9%, according to DRAMeXchang...

DRAM transition to EUV for sub-10nm node remains a financial challenge

Sep 27, 15:59

Major DRAM chipmakers will continue to use multiple patterning exposure techniques for their 1x/1y nodes, but a question mark is still hanging over the prospect of their switch to...

Winbond to break ground on new 12-inch fab in mid-2018

Sep 27, 14:11

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...

MEMS sensor demand for smartphones, automotive surging

Sep 26, 15:42

MEMS sensor demand for smartphones and automotive applications has been surging, according to sources at Taiwan-based IC backend houses, which have enjoyed a ramp-up of orders placed...

Foxconn chairman to visit Wisconsin in early October

Sep 26, 12:38

Foxconn Electronics (Hon Hai Precision Industry) chairman Terry Gou is expected to visit Wisconsin, the US in early October to sign agreements with the local government for the subsidy...

Foxconn chairman Terry Gou

SMIC to build new plant in Ningbo

Sep 26, 11:07

Semiconductor Manufacturing International (SMIC) plans to set up a new plant in Ningbo, China where the pure-play foundry will install its specialty process technology R&D and...

SMIC

Beijing, Shanghai IC sectors prospering

Sep 25, 15:30

The flourishing IC industries in Beijing and Shanghai has been pushing forward China's overall IC industry development, enabling the rapid rise of China in the global marketplace...

Taiwan IC backend firms to enjoy strong 4Q17

Sep 25, 11:57

A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...

Taiwan August manufacturing production index up

Sep 25, 10:22

Taiwan recorded manufacturing production index (2011 as base year) of 117.21 for August 2017, increasing 3.62% sequentially and 4.03% on year, according to the Ministry of Economic...

Infineon to sell Newport manufacturing site to Neptune 6

Sep 22, 14:52

Infineon Technologies and a private company trading under the name Neptune 6 have announced that they have signed a definitive agreement under which Neptune 6 will acquire IR Newport,...

North American semi equipment industry billings fall to 4-month low in August

Sep 22, 12:36

North America-based manufacturers of semiconductor equipment posted a 3.9% sequential decrease in billings worldwide in August reaching a four-month low of US$2.18 billion, according...

Globalfoundries Chengdu fab nears completion

Sep 22, 11:47

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries looking to ramp new 12-inch wafer plant in Chengdu in 2018

Globalfoundries to roll out 12nm FinFET technology for high-performance devices

Sep 22, 10:30

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...

KYEC grabs testing orders for analog, PA chips from Murata

Sep 21, 15:18

King Yuan Electronics (KYEC) has recently obtained testing orders for analog chips and power amplifiers (PA) from Murata Manufacturing, according to industry sources.

TSMC to hold over 70% of PWM IC orders from Qualcomm

Sep 21, 14:11

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to grab 70-80% of the total orders for Qualcomm's new-generation power management ICs (PWM IC), according to industry...

qualcomm

Toshiba agrees to sell memory-chip unit to Bain Capital-led consortium

Sep 21, 10:33

Toshiba has agreed to sell its memory-chip business to KK Pangea, a special purpose acquisition company formed by a Bain Capital Private Equity-led consortium. The decision was made...

Intel provides 10nm updates, plan for 10nm FPGA

Sep 20, 10:49

Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...

SMIC, Brite and Synopsys team up for IoT platform

Sep 19, 11:40

Semiconductor Manufacturing International (SMIC), Brite Semiconductor and Synopsys have teamed up to develop a platform that enables designers, system integrators and OEMs to accelerate...

GigaDevice signs wafer supply contract with SMIC

Sep 19, 10:36

China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...

Digitimes Research: Top-5 notebook vendors see on-year shipment declines in August

Sep 18, 11:16

Worldwide top-5 notebook brand vendors' combined shipments grew on month, but decline on year in August. With the consumer notebook sector continuing to lack new innovations to stimulate...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

Marketech seeing orders swell, says report

Sep 15, 12:22

Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$13.6 billion (US$452 million), according to a recent Chinese-language Economic Daily News...

IC packager ASE reportedly enters Amazon supply chain

Sep 15, 11:04

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

820 items [1/24]
Realtime news
  • China-based Konka group to invest NT$200-300 billion in AMobile

    Before Going to Press | 8h 10min ago

  • Xintec to swing to profit in 4Q17, says report

    Before Going to Press | 8h 14min ago

  • SMIC names new executives

    Before Going to Press | 8h 43min ago

  • TSEC to establish new PV module plant with 2,000MWp capacity in Taiwan

    Before Going to Press | 8h 44min ago

  • NSP looking to wholly own GES

    Before Going to Press | 8h 46min ago

  • Components for iPhone X see improving yield

    Before Going to Press | 8h 49min ago

  • Xiaomi aims to ship 90 million smartphones in 2017

    Before Going to Press | 8h 51min ago

  • Asustek, Gigabyte reorganization efforts to bear fruit in 1Q18

    Before Going to Press | 8h 57min ago

  • Samsung striving for OLED panel orders from China smartphone vendors

    Before Going to Press | 9h 6min ago

  • IC material supplier Wahlee cuts into supply chain of China panel makers

    Before Going to Press | 9h 19min ago

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  • Samsung+12Gb+LPDDR4+DRAM

    Samsung 12Gb LPDDR4 DRAM

    Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is...

    Photo: Company, Sep 18.

  • Intel+sixth%2Dgeneration+Core+processor

    Intel sixth-generation Core processor

    Intel has introduced the sixth-generation Core processor family for a range of device designs - from the ultra-mobile compute stick, to 2-in-1s and high-definition all-in-one desktops,...

    Photo: Company, Sep 3.

  • 3D+NAND+die+with+M%2E2+SSD

    3D NAND die with M.2 SSD

    Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage...

    Photo: Company, Apr 7.

  • Samsung+3D+V%2DNAND+SSD

    Samsung 3D V-NAND SSD

    Samsung Electronics has introduced a solid state drive (SSD) based on its 3D V-NAND technology. The new SSD, unveiled during a keynote at the Flash Memory Summit 2013 in California,...

    Photo: Company, Aug 19.

  • Applied+SEMVision+G6+defect+analysis+system+

    Applied SEMVision G6 defect analysis system

    Applied Materials has announced a suite of new defect review and classification technologies for its SEMVision family of products to accelerate time to yield for leading-edge chip...

    Photo: Company, Jul 15.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

16-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.