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News tagged 12-inch wafer
  • Last update: Friday 13 October 2017 [101 news items]

Demand for 12-inch silicon wafers to surge in China

Oct 13, 14:23

Demand for blank 12-inch silicon wafers is set to increase to 1.1-1.3 million pieces per month in China in 2018, up from the current 500,000 units, according to local media.

Commentary: Triple-win decision for TSMC to build 3nm wafer fab in Taiwan

Oct 2, 14:48

Taiwan Semiconductor Manufacturing Company (TSMC) has recently decided to set up the world's first 3nm wafer fab in the Southern Taiwan Science Park (STSP) after gaining government...

Winbond to break ground on new 12-inch fab in mid-2018

Sep 27, 14:11

Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...

Beijing, Shanghai IC sectors prospering

Sep 25, 15:30

The flourishing IC industries in Beijing and Shanghai has been pushing forward China's overall IC industry development, enabling the rapid rise of China in the global marketplace...

Globalfoundries Chengdu fab nears completion

Sep 22, 11:47

Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...

Globalfoundries looking to ramp new 12-inch wafer plant in Chengdu in 2018

Supply of 12-inch silicon wafers to stay tight through 2019

Sep 22, 11:11

The global supply of 12-inch silicon wafers will further tighten over the next two years, when new fabs in China are set to come online, according to industry sources.

12-inch wafer supply to remain tight through 2019

DRAM bit growth to reach 19.6% in 2018, says DRAMeXchange

Sep 21, 11:01

Global DRAM bit production will grow just 19.6% in 2018, as major suppliers intend to slow down the pace of their capacity expansions and technology migrations for chip price stability,...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

TSMC starts equipment move-in at Nanjing plant

Sep 13, 14:21

TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.

TSMC chairman Morris Chang at the ceremony to mark the start of equipment move-in at the company's

GigaDevice draws investment from China state-backed fund

Aug 30, 13:25

China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...

ASML opens branch office in Nanjing

Aug 24, 11:51

ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.

ASML opens branch office in Nanjing

Winbond announces equipment purchases

Aug 23, 15:05

Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...

Wafer Works expects wafer prices to continue rising on strong demand

Aug 18, 14:05

Taiwan-based Wafer Works, which makes small- to medium-size semiconductor-grade wafers, expects silicon wafer prices to continue rising on strong demand.

Shanghai Huahong renames fabs

Aug 11, 11:35

Shanghai Huahong Group has renamed all the wafer fabs under the group. The move is to enhance the overall image of the group's IC manufacturing business, and enable its worldwide...

wafer

NVM IP provider eMemory optimistic about 2H17

Aug 11, 10:53

Taiwan-based eMemory, a developer and provider of embedded non-volatile memory (eNVM) technology, expects sales to peak for 2017 in the second half of the year thanks to robust demand...

Commentary: Can Samsung Foundry unseat TSMC?

Aug 3, 21:20

Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...

TSMC is the leader in the pure-play foundry sector

Shanghai Huahong to build 12-inch fab in Wuxi

Aug 2, 21:47

Shanghai Huahong Group on August 2 struck a deal with the national China Integrated Circuit Industry Investment Fund and the city government of Wuxi to set up a new 12-inch wafer...

HHGrace likely to operate a new 12-inch fab in Wuxi

Winbond to spend NT$6.28 billion on equipment

Jul 27, 22:59

Taiwan-based Winbond Electronics, a provider of specialty DRAM and flash memory, has announced plans to budget an additional capex of NT$6.28 billion (US$207.7 million) for buying...

FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha

Jul 19, 10:37

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Globalfoundries CEO

NSIG hires former MEMC CEO

Jul 10, 21:40

China's National Silicon Industry Group (NSIG) has hired Nabeel Gareeb, former CEO of MEMC Electronic Materials, to help it establish a materials eco-system in China.

Globalfoundries 22FDX attracts orders from Shanghai Fudan

Jul 10, 14:23

Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.

Globalfoundries 22FDX obtains orders in China

Powerchip eyeing orders from Illumina

Jun 29, 14:57

Powerchip Technology is looking to become the second foundry partner of Illumina following Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.

Winbond intros 1.2V, 1.5V NOR flash memories for IoT

Jun 28, 13:55

Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin...

New Winbond NOR flash for IoT

GlobalWafers teaming up with Ferrotec to expand 8-inch wafer supply

Jun 20, 15:15

Taiwan-based GlobalWafers is teaming up with Ferrotec to ramp up new 8-inch wafer capacity, according to company chairperson Doris Hsu.

GlobalWafers chairperson Doris Hsu

Winbond to expand 12-inch fab capacity

Jun 14, 20:27

Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...

winbond

Hefei Chang Xin keeps low profile but DRAM ambition remains unchanged

May 24, 16:11

Hefei Chang Xin's ambition to grow its DRAM business has seen some progress though the China-based firm has now chosen to keep a low profile. The company has been quietly renamed...

Winbond planning new 12-inch fab

May 2, 14:16

Specialty DRAM and NOR flash memory maker Winbond Electronics is planning a new 12-inch wafer plant which will be located in Tainan, southern Taiwan or Singapore.

UMC expects flat performance in 2Q17

Apr 27, 11:08

United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2017, when the foundry chipmaker's capacity utilization rate...

UMC Xiamen fab obtains orders from MediaTek, Spreadtrum

Apr 17, 11:40

United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China has obtained 40nm chip orders from MediaTek and Spreadtrum Communications, according to industry...

Winbond mulls opening 12-inch wafer fab in Singapore, says report

Feb 24, 13:51

Winbond Electronics has been approached by the Singapore government to set up a manufacturing site locally, and the Taiwan-based maker of specialty DRAM and flash memory is considering...

Globalfoundries Chengdu fab to start production in 4Q18

Feb 13, 21:21

Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...

Faraday announces 55nm eFlash-based ASIC solution

Dec 16, 10:20

Faraday Technology has announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance, and has already achieved multiple design wins for products such as...

Commentary: Silicon wafer industry headed for consolidation

Dec 13, 12:30

With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.

Prices of 12-inch blank wafers to rise 10-20% in 1Q17

Dec 8, 10:43

Chipmakers including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Micron Technology have been informed by their upstream suppliers that prices...

wafer

Spreadtrum places 40nm chip orders with UMC Xiamen fab

Nov 23, 15:50

Spreadtrum Communications has placed 40nm chip orders with United Microelectronics' (UMC) recently-opened 12-inch wafer fab in Xiamen, China, according to industry sources.

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  • Winbond+SpiStack+memories

    Winbond SpiStack memories

    Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series...

    Photo: Company, Mar 30.

  • Altatech+AltaSight+SL300+inspection+system

    Altatech AltaSight SL300 inspection system

    Altatech Semiconductor has announced silicon wafer maker Siltronic is evaluating its AltaSight SL300 inspection system to verify the tool's capabilities for use in wafer manufacturing...

    Photo: Company, Jun 29.

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