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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Tuesday 30 March 2021
Highlights of the day: TSMC fast advancing manufacturing processes
TSMC is fast advancing its manufacturing processes. The foundry house's N4 - an extension of its 5nm process family...
Tuesday 30 March 2021
TSMC to volume produce 4nm chips ahead of schedule
TSMC will move N4 (namely 4nm process) to volume production in the fourth quarter of 2021, ahead of the 2022 timeframe set previously, according to sources at fab toolmakers.
Tuesday 30 March 2021
Chipmaking equipment and materials suppliers looking to beef up operations in Taiwan
Japan-based semiconductor equipment vendor Tokyo Electron is reportedly eyeing the acquisition of a 6-inch wafer fab in Taiwan that has been put up on sale, while fellow companies...
Monday 29 March 2021
VisEra may offer wafer-level optical films for new iPhones
TSMC subsidiary VisEra Technology, which offers image sensor foundry, wafer-level testing and wafer-level optical film services, is expected to land orders for customized wafer-level...
Friday 26 March 2021
MediaTek likely to see March revenue hit record high
Sufficient foundry support will boost MediaTek's March revenue to a record high, according to market sources.
Thursday 25 March 2021
Highlights of the day: TSMC to continue making chips for Intel
Third-party foundries will continue to play an important role in Intel's freshly unveiled IDM 2.0 strategy. TSMC is...
Thursday 25 March 2021
TSMC to remain major foundry partner of Intel
TSMC has been a major foundry partner of Intel and will remain so in the foreseeable future, despite the ambitious foundry plan that the US chip vendor has just unveiled, according...
Wednesday 24 March 2021
Wire-bonding capacity to sustain full utilization throughout 2021
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Tuesday 23 March 2021
Chip vendors volunteering higher prices for foundry support to become new normal
It will become a new normal for chip vendors to offer higher prices to win more capacity support from foundry partners, now that global shortages of automotive chips are further compounded...
Tuesday 23 March 2021
PTI to offer Renesas additional backend capacity support
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Monday 22 March 2021
TSMC to issue NT$21.1 billion in bonds
TSMC will issue a total of NT$21.1 billion (US$743.2 million) in unsecured bonds to finance new facility establishment and equipment purchases, according to a resolution approved...
Monday 22 March 2021
Pure-play foundries mulling floating price contracts for 2022
Taiwan-based pure-play foundries are already in talks with clients about contracts for 2022, and intend to implement a floating pricing policy amid tight capacity, according to industry...
Friday 19 March 2021
AP Memory develops versatile heterogeneous memory
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has developed a new heterogeneous integrated technology named VHM...
Friday 19 March 2021
IC designers may hike quotes to reflect further foundry cost increases
Taiwan's IC design houses will have no other choice but to directly pass increased costs to downstream clients if their foundry partners raise quotes again in the second half of the...
Thursday 18 March 2021
Samsung, TSMC to see combined capex account for 43% of global semi industry spending in 2021
Samsung Electronics and TSMC will see their combined capex account for as high as 43% of the worldwide semiconductor industry capital spending this year, according to IC Insights'...