AMD CEO Lisa Su kicked off the CES 2026 keynote sessions by establishing a singular, dominant theme: Artificial Intelligence. Taking the stage, Su emphasized that AI adoption is outpacing the rise of the internet, driving a hundredfold surge in global compute demand in just three years.
SK Hynix Inc. said it will showcase its next-generation AI memory solutions at CES 2026, where it plans to operate a customer exhibition booth at the Venetian Expo in Las Vegas from January 6 to 9, 2026. Under the theme "Innovative AI, Sustainable Tomorrow," the company aims to highlight products optimized for AI workloads and deepen engagement with key customers as demand for AI infrastructure continues to accelerate.
Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series processor for advanced industrial autonomous mobile robots and full-size humanoids. The comprehensive stack integrates hardware, software, and AI to enable scalable, energy-efficient, real-world deployment of intelligent robots across retail, logistics, and manufacturing.
Chunghwa Precision Test Tech (CHPT) said that although revenue in December 2025 and the fourth quarter both declined compared with the same period in 2024, overall full-year performance in 2025 still exceeded the company's original expectations. As AI continues to drive transformation and growth across the semiconductor industry, CHPT is positive that market demand will continue to expand, with 2026 revenue expected to set another new record.
Field-programmable gate array (FPGA) designer DCC Technology recently held a shareholders' meeting and approved a company name change. After completing administrative procedures, the company officially announced its new name as Nexora. The name combines tech themes like "Next" and "Aurora" to signify "the next dawn," symbolizing a commitment to innovation built on a solid technical foundation while looking toward long-term industry development.
At CES 2026, Nvidia unveiled a suite of AI innovations spanning data center, enterprise, robotics, and autonomous vehicles. Highlights include the Rubin six-chip AI platform, DGX Spark and DGX Station deskside supercomputers, BlueField-accelerated Enterprise AI Factory, Inference Context Memory Storage, Alpamayo autonomy models, and expanded DRIVE Hyperion and robotics frameworks.
Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs. The new processor targets modern professionals, content creators, and everyday users seeking high performance, integrated AI capabilities, and extended battery life in thin and lightweight devices. Qualcomm said select systems from major OEM partners are expected to reach the market in the first half of 2026.
On January 5, Nvidia CEO Jensen Huang opened the company's CES keynote in Las Vegas by welcoming the live and global audience, wishing attendees a Happy New Year, and setting expectations for a wide-ranging presentation. With thousands in the auditorium and millions watching worldwide, Huang positioned the talk as both a technology roadmap and a statement about how quickly AI is reshaping computing.
China's semiconductor sector is entering a new phase of domestic consolidation, as leading foundries Hua Hong Semiconductor and SMIC move to tighten control over key manufacturing assets. The deals reflect Beijing's drive to localise chip production, strengthen mature-node capacity, and curb reliance on external supply chains amid sustained US-China technology tensions.
At the start of 2026, Taiwan's electronic components and AI server industries continue to post strong export momentum, driven by surging demand for artificial intelligence (AI), high-performance computing (HPC), and cloud services. Production indices are expected to register double-digit year-over-year growth, with key indicators like demand, raw material inputs, and pricing all trending upward.
China's drive to localize high-value sensor manufacturing gained momentum this week, as China Mobile and China National Building Material (CNBM) Group became core shareholders of Anhui Huaxin Micro-Nano Integrated Circuit Co., an emerging domestic MEMS foundry specializing in 8-inch wafers.
More coverage
