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Aug 17
TSMC overseas fabs see profit flip in 1H26

Since 2020, when TSMC began its overseas manufacturing buildout, the company has tracked financial results at its foreign subsidiaries across the first half of 2025, full-year 2025, and the first half of 2026. The Arizona fab, long seen as difficult to make profitable, has expanded sharply, while Japan's JASM has turned from loss to profit, China operations have remained stable, and Germany's ESMC is still in the red as it remains under construction.

Humanoid robots are moving from demonstrations toward mass production, changing the priorities of chip design. Instead of simply chasing higher AI compute and TOPS, or trillions of operations per second, the industry is increasingly focused on how efficiently perception, computing, decision-making, and control can work together within tight power, cost, and latency constraints.

A new joint venture between South Korean and Indian chemical firms is betting that semiconductor materials can be made without touching China at any stage, positioning itself as an alternative supply route just as the US-China conflict pushes chipmakers to rethink where their raw materials come from.
MediaTek widens ASIC services as market share surges
Aug 18, 07:53

MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position. At a recent earnings call, MediaTek also raised its 2027 ASIC market share target to 15% to 20%, and industry watchers largely credit that goal to the breadth of MediaTek's ASIC services.

AI server demand pushes high-end MLCC lead times toward 40 weeks
Aug 18, 07:50
Multilayer ceramic capacitor (MLCC) supply is increasingly diverging by product specification, with mainstream components remaining relatively stable while lead times for some high-capacitance, high-specification parts used in AI servers stretch toward 40 weeks.

SK keyfoundry has approved KRW90 billion (approx. US$64 million) in capital spending to expand its 8-inch foundry capacity, a rare move for a company that has long prioritized maintaining existing production lines.

Phison Electronics CEO Pua Khein-Seng said the company is seizing a once-in-a-lifetime chance to transform into a high-growth business as AI agents drive massive demand, keeping NAND Flash supply tight for many years. He said 2027 capacity constraints will be even more severe than in 2026, leaving room for further price gains, though the pace of increases will gradually narrow.
Samsung Electronics' sales to China and the US surged in the first half of 2026 as an AI-driven memory upcycle boosted its semiconductor business, while Nvidia did not rank among the company's five largest customers despite growing ties between the two companies in high-bandwidth memory (HBM).

Less than a week after LG Group and Nvidia signed a strategic memorandum of understanding (MOU), Madison Huang, Nvidia's senior director of product marketing for Omniverse and robotics, is reportedly preparing to visit South Korea and head directly to one of LG's key robotics R&D sites.

Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing base in Changzhou, expanding beyond VCSELs into high-end indium phosphide, or InP, laser chips for AI optical interconnects.

Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung into a foundry send-fab, a shift that would add advanced-node capacity as demand for AI memory strains leading-edge capacity.

Samsung Electro-Mechanics (SEMCO) and LG Innotek pushed their semiconductor package substrate operations close to full capacity in the first half of 2026 as shipments of high-value substrates for AI accelerators, server CPUs, memory and data center networking climbed, company filings and earnings materials show.