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Jul 23
In-depth: Alibaba builds three-layer AI empire across chips, memory and models
Competition in China's AI industry is moving beyond large language models into chips, memory and computing infrastructure. CXMT's planned IPO on Shanghai's STAR Market has put renewed attention on Alibaba, the Chinese DRAM maker's largest industry investor.

Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.

India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components, according to analysts.
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout has entered a new phase after five years of construction, with the company's first 4nm fab now ramping production and contributing to profits. The second fab is set to enter equipment move-in in the fourth quarter of 2026, the third fab is scheduled for move-in in September 2027, and the fourth has already begun site preparation.

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis and advanced packaging capabilities alongside a front-end pilot line for 2nm logic chips.

Surging AI server demand is reshaping supply and demand across the global memory market. With DRAM prices rising sharply over the past year, the resulting cost pressure is beginning to spill into the automotive industry.

STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings call that the full profitability recovery hinges on a manufacturing overhaul that will not finish before the end of 2027, and that its near-term ceiling is supply rather than demand.

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.

AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping its roadmap for a world where AI workloads are spreading from training models to enterprise agents. The shift matters globally because it signals that data centers may need more balanced upgrades to CPU, GPUs, and networking.

Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the South Korean memory maker formally denied pursuing an acquisition of the site.

Wistron's opening of its D1 AI smart factory in Fort Worth, Texas, marks a new milestone for Taiwan's downstream electronics manufacturers. The plant will support the first US mass production of Nvidia GB300 compute boards, a development with far-reaching implications for Taiwan, the US and the global AI industry.
Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts it will raise capital spending, push its 18A and 14A process nodes forward, and expand a fast-growing custom-silicon business — even as it warned it will still be short of chips through the fourth quarter.