Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment purchases over the next three years. The expansion will be located at its Plant 6 facility in Yangmei, Taoyuan, with monthly output expected to increase by about 25% by 2027.

As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with SMIC chairman Liu Xunfeng attending the unveiling ceremony, marking a new stage in the company's advanced packaging research and development efforts.

Apple reported strong results for its fiscal first quarter of 2026, but the company's supply chain did not share in the enthusiasm. The key reason is that Apple is feeling the impact of rising prices for critical components while striving to maintain a certain gross margin range. This means increased pricing pressure on suppliers.

Wuhan Jingce Electronic Group forecasts net profit of CNY80 million to CNY90 million (approx. US$11.5 million to US$13 million) for 2025, representing year-over-year growth of 181.97% to 192.21%. Net profit excluding non-recurring items is expected to reach CNY21.66 million to CNY31.66 million, up 113.66% to 119.97%, reversing losses from the previous year.

Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines, with about 8,000 workers running operations 24 hours a day. The Tianjin site is Semco's largest global manufacturing base, focused primarily on automotive MLCCs while also supplying consumer electronics and server markets.

Kioxia Holdings sees an opportunity to expand its presence in high-density storage for AI data centers as rivals direct resources to other segments. The company's incoming president said demand tied to artificial intelligence continues to grow and Kioxia will keep capital spending disciplined.

ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern, central, and southern Taiwan, as well as in China and Malaysia. The company estimates that capital expenditure could reach US$6 billion in 2026, reflecting continued investment in equipment and facilities.

As demand for AI infrastructure continues to grow steadily, major networking and server PCB suppliers such as Gold Circuit Electronics (GCE), First Hi-tec (FHt), and Allied Circuit (ACCL) have benefited from a significant uptick in shipments of high-end boards, pushing full-year 2025 revenue to record highs.

Msscorps held its year-end gathering on February 1, 2026, during which chairman Chi-Lun Liu highlighted the company's two decades of deep expertise in semiconductor testing and analysis. Having established a global footprint across 12 facilities in Taiwan, China, the US, and Japan's key semiconductor hubs, Msscorps has seen monthly revenues hit record highs since the second half of 2025, signaling the start of a new growth phase.

China's drive to localize its semiconductor supply chain is reshaping the global chipmaking equipment industry, with three domestic suppliers now ranking among the world's top 20 for the first time — a shift fueled by heavy investment and tighter US export controls.

TSMC chairman C.C. Wei recently confirmed that AI demand is real and the trend will remain unchanged in the coming years. AI accelerators accounted for a "high double-digit" percentage of TSMC's total revenue in 2025.