Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elec and Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
AI-driven memory price spikes are presenting a challenge for Samsung's smartphone business, with rising component prices eroding the affordability of its budget phones. At the same time, Samsung is seeking to use its new AI features to encourage new device purchases as memory prices dampen smartphone sales globally.
Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion (approx. US$495.3 million) over the next five years to expand production of advanced ceramic materials used in chip manufacturing. According to a Nikkei Asia report, the company aims to support future-generation semiconductor processes in the 1nm range, extending a business that has become a major profit driver amid the AI boom.
According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been added to its internal product roadmap and is expected to launch in the first quarter of 2028, potentially making its public debut at CES 2028.
Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from four companies, led by MSScorps, which will invest NT$1.5 billion (US$47.4 million) and is filing for the third time. The company plans to add production lines and adopt AI technology at its Hsinchu, Tai Yuen Hi-Tech Industrial Park, and Southern Taiwan Science Park (STSP) facilities.
Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC design house. The company was established by three founders with extensive experience in the IC design industry: Meng Thai Ng, Hun Wah Cheah, and Chun Chiat Tan. Headquartered in Bayan Lepas, Penang, Oppstar opened an office in Kuala Lumpur, Malaysia, in 2022. From its inception, the company positioned itself as a one-stop IC design service provider, initially focusing on 16nm design nodes.
