SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the amount he said the group is already putting into the country—though he did not disclose the plan's size, timing or components.
Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new orders becoming increasingly hard to absorb.
German automotive supplier and chipmaker Bosch has begun sample production at its first US semiconductor factory after finalizing an agreement for up to US$225 million in federal funding. Commercial production of silicon carbide chips at the Roseville, California, site is expected to begin in 2026.
US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on his goal of raising the US share of the global chip market to 50% before the end of his term. TSMC declined to comment on the report, but investors may press the company on the issue at its second-quarter 2026 earnings call.
Taiwan's silicon foundry industry posted a strong performance in June 2026, with aggregate revenue reaching US$15,131.2 million, up 5.9% from May and 54.0% from a year earlier — underscoring the sector's continued ride on AI and advanced-node chip demand.
Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneously bets on AI compute and storage.
The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects through higher costs, delayed capacity, and uneven access to advanced processors. As demand for CPUs, GPUs, and ASICs rises, ABF substrate supply is tightening, and the squeeze is expected to last for years.
The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.
Taiwan's IC design companies are stepping up investment in AI imaging solutions, with both industry leaders and smaller players accelerating development to capture emerging opportunities in the fast-growing market.
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
