IBM and Arm announced a collaboration to build dual‑architecture hardware aimed at running AI and data‑intensive workloads with more flexibility, reliability, and security, potentially affecting enterprise infrastructure worldwide by expanding software choice, easing workload portability, and influencing how organizations deploy mission‑critical applications across cloud and on‑premises environments in the near term.
Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply, significantly raising raw material costs. At the same time, the inventory reduction cycle within the mature process semiconductor market is nearing completion, prompting customers to ramp up orders.
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET News.
Samsung Electronics has supplied its Exynos modem chipset to Chinese wireless module maker Fibocom, marking a notable expansion of its system semiconductor business into external clients, according to inews24 and Greened.
South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East conflict disrupted logistics and energy flows. According to the Ministry of Trade, Industry and Energy (MOTIE), the figure was up 48.3% year on year, extending a 10-month run of record monthly exports and lifting the country's trade surplus to US$25.7 billion — its 14th straight month in the black.
Intel plans to invest a further US$15 million in AI chip startup SambaNova Systems, lifting its stake to about 9% pending regulatory approval, according to Reuters. The move follows a US$35 million investment in February that raised Intel's ownership to 8.2% from 6.8% a year earlier and formalised a strategic collaboration between the two.
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities.
Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning from construction to operational setup for 2nm production. More than 3,000 engineers from Samsung and global equipment suppliers have begun gathering at the site, according to ET News, signaling the start of large-scale ramp-up activities.
As the US-Iran conflict enters its second month, concerns are mounting over potential disruptions to global energy supplies and petrochemical feedstocks. Against this backdrop, Jeffery C.L. Pan, chairman of Taiwan's Topco Scientific, stated that the company's operations remain stable, with shipments unaffected to date and upstream cost pressures largely contained.
UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor interlayer insulating material. This material is marketed under the name Ajinomoto Build-up Film (ABF).
On March 31, Nvidia announced a US$2 billion investment in Marvell and plans to further integrate its NVLink Fusion technology with Marvell's XPU services for customer use. Although Nvidia revealed partnerships with several ASIC service providers around NVLink Fusion technology earlier in 2025, this direct investment signals a closer collaboration between Nvidia and Marvell. The move raises questions about how the two companies will expand their presence in the cloud AI market and whether ASIC customers will embrace this integrated solution.
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