Infineon Technologies officially inaugurated a new backend manufacturing site in Samut Prakan, south of Bangkok, on October 1, expanding the German chipmaker's production network in Southeast Asia starting with an initial investment of over EUR100 million (US$113.1 million).

Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six Taiwanese universities as it works to advance smart outsourced semiconductor assembly and test (OSAT) and digital manufacturing. The projects were designed to support semiconductor factory efficiency, quality control, resilience, and climate adaptation.

Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new core production hub dedicated to high-end semiconductor packaging, addressing surging global demand for AI accelerators and data center applications.

DB HiTek has raised foundry prices by as much as 30%, with Chinese customers facing the steepest increases as rising orders push the South Korean foundry's 8-inch capacity close to full utilization, according to The Elec.

Huawei rotating chairman Eric Xu said the company's Ascend AI accelerators have surpassed Nvidia in both sales and market share in China, highlighting how US export controls on advanced AI chips are accelerating the shift of China's data center and AI industries toward domestic suppliers.

Meta's rapid rollout of its Muse AI agent is emerging as an early test of how agentic AI could reshape server infrastructure demand, with CPU suppliers already seeing longer lead times and AMD's latest EPYC processors reportedly booked deep into 2027.

As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format. The tight alignment strongly suggests that Taiwan Semiconductor Manufacturing Co. (TSMC) is eyeing this exact specification for its post-2030 glass substrate platform.

Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and support the development of more complex AI-powered products and cloud infrastructure.

ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries while AI-related capacity investment and localization continue to support demand.

China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.

MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers (CSPs) battle for semiconductor output in Taiwan's Hsinchu Science Park. MediaTek has also denied market rumors that its TPU orders have slipped.