Taiwan-based PCB maker Zhen Ding Tech has stated that as customers' next-generation product platforms gradually enter mass production starting from the second quarter of 2026, its IC substrate, server, and optical communications businesses are entering a new round of high-speed expansion. The company targets mid-to-high double-digit revenue growth for the full year of 2026 and is optimistic that shipment momentum will follow a quarter-on-quarter growth trend.

Growing pressure from capacity expansion in China, price competition, and compressed profit margins for traditional display applications has prompted Taiwan-based polarizer manufacturers to accelerate their transformation. Companies including BenQ Materials, Cheng Mei Materials Technology (CMMT), and Optimax Technology are diversifying their roles across medical, semiconductor materials, and automotive applications. Their objective is to mitigate industry risk and obtain a second growth curve.

Taiwanese printed circuit board (PCB) giant Zhen Ding Technology Group held a groundbreaking ceremony for the HD Campus of the "Zhen Ding Technology Group Huai'an Tech City" in Huai'an, China, on April 22. The new park plans to build facilities for high-density interconnect (HDI), modified semi-additive process (mSAP), and high-layer count (HLC) PCBs. Upon completion, the group's total number of factories across four major local parks will reach 23, further strengthening its manufacturing scale in the advanced PCB sector.

SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performance.

IndieSemiC, an Indian semiconductor and chip design company, has partnered with Nordic Semiconductor to design and commercialize wireless modules for connected devices, as Indian firms seek to capture more value in the semiconductor chain through design, RF integration, certification, and module-level manufacturing.

SK Hynix reported its strongest quarterly results on record in the first quarter of 2026, with revenue of 52.58 trillion won (approximately US$37.9 billion), operating profit of 37.61 trillion won (approximately US$27.1 billion), and net profit of 40.35 trillion won (approximately US$29.1 billion).

Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook. PSMC president Martin Chu stated that DRAM foundry prices had significantly increased in March. However, due to the impact of the tape-out cycle on pricing, the price hike is expected to contribute to revenue starting in June.

Leading materials engineering in the semiconductor industry, Applied Materials, announced today that Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied's Equipment and Process Innovation and Commercialization (EPIC) platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.

Starting in the second half of 2026, all flagship smartphone SoCs will transition to the 2nm process node. While this promises enhanced performance for flagship devices, it also triggers a rapid rise in production costs.

Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product line and halts plans for mass production of its next-generation 1d DRAM due to insufficient yields.