DIGITIMES Semiconductors news

Jun 12

TSMC hit by US patent suit, Taiwan ministry pledges support

TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.

Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Jun 12

Google weighs Samsung's role in next AI chip as TSMC capacity tightens

Jun 12

SuperAI 2026: From turbine backlogs to copper limits, AMD maps infrastructure walls closing in on AI

Jun 12

CXMT IPO rides HBM shift to shake DRAM order, but Koreans seen holding ground

Jun 12

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IC DESIGN, DISTRIBUTIONGoogle's TPU diversification challenges MediaTek and other ASIC partners

Jun 15, 12:49

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end wafer manufacturing to broaden its capacity sources.

IC DESIGN, DISTRIBUTIONSamsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks

Jun 15, 12:40

Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and image-generation workloads.

IC MANUFACTURINGAI server tracker: Taiwan's AI supply chain posts triple-digit gains in May as server makers and memory chips surge

Jun 15, 12:33

Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.

MEMORY CHIPSSK Hynix readies HBM4 packaging push as Nvidia demand grows

Jun 15, 12:10

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.

IC MANUFACTURINGWeekly news roundup: Samsung foundry profit rebound may come in 3Q26; Nvidia unveils AI PC vision

Jun 15, 11:11

Below are the most-read DIGITIMES Asia stories from the week of June 8-14, 2026:

IC MANUFACTURINGTaiwan's UBright broadens beyond optical films with push into semiconductors, passives and smart acoustics

Jun 15, 11:07

Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.

IC MANUFACTURINGChina eases InP substrate exports, lifting compound semiconductor supply

Jun 15, 11:00

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS) are expected to benefit in the second half of 2026.

IC MANUFACTURINGThe great chip bazaar: India's fragmented fight to build a tech empire

Jun 15, 10:45

Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology from Taiwan's PSMC, has also drawn a strategic partnership with Dutch lithography equipment supplier ASML.

PASSIVE, PCB, OTHER IC COMPONENTSLG Innotek's Vietnam substrate investment plan comes as FC-BGA demand broadens

Jun 15, 07:12

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.

IC MANUFACTURINGIndia roundup: Meta-Reliance AI data centers, Anthropic-TCS tie-up, EV expansion, Starlink delay and supply chain shifts

Jun 15, 07:11

India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.

IC MANUFACTURINGTsang Yow plans Malaysia plant as semiconductor demand shifts to Southeast Asia

Jun 15, 07:11

Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.

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