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Dec 12
Huawei–SMIC chip hits milestone, still lags TSMC’s 5nm

China is accelerating its semiconductor capabilities through technical gains at Huawei and Semiconductor Manufacturing International Corp.(SMIC) while simultaneously mandating the use of domestic processors across state sectors to circumvent US export controls.

Analysts believe that the performance outlook for 2026 from Taiwan Semiconductor Manufacturing Company (TSMC) and Broadcom offers a glimpse into the expected performance of South Korea's two semiconductor leaders, Samsung Electronics and SK Hynix.
These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
As India intensifies its efforts to become a global semiconductor hub, Intel CEO Lip-Bu Tan has expressed support for the country's strategy of pursuing incremental progress, focusing initially on legacy node fabrication for automotive and industrial applications.
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To address the strong demand for advanced packaging capacity from AI GPU and ASIC vendors, and as IC design houses increasingly introduce second suppliers to enhance supply chain resilience, TSMC is expected to begin expanding the release of Chip-on-Wafer (CoW) packaging process orders to OSAT providers starting in 2026-2027.
The Shenzhen 8K UHD Video Industry Cooperation Alliance (SUCA) said China's domestically developed General-Purpose Multimedia Interface (GPMI) standard is set for formal release.
The US government is rethinking the impact of Washington's decision to clear Nvidia's H200 exports to China after a Financial Times report suggested Beijing is prioritizing domestically developed AI chips.
Bloomberg, citing unnamed sources, reported that Intel Corp. is in advanced discussions to acquire artificial intelligence chip startup SambaNova Systems Inc. for about US$1.6 billion including debt, a move that could significantly bolster Intel's AI product portfolio while reigniting scrutiny over governance and potential conflicts of interest linked to its chief executive.

NetApp Taiwan general manager Peter Chu said the transition from early AI experimentation to agentic AI running mission-critical workloads is creating unprecedented demands on data complexity, scale, and security, while presenting significant opportunities for NetApp. He remains optimistic about the company's 2026 trajectory and noted that global memory shortages have not affected its operations.

Global growth is poised to lose momentum. IMF forecasts show global GDP easing from 3.3% in 2024 to 3.2% in 2025 and 3.1% in 2026. China's growth is expected to slow from 5% to 4.8% and then to 4.2%, while India may dip from 6.6% to 6.2%. Taiwan remains an outlier, supported by strong AI and semiconductor investment and exports, with GDP projected at 7.37% in 2025. Continued strength in AI server exports could also lift its 2026 forecast of 3.54%.

Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA).
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output. This is fueling continued growth in outsourced packaging and testing (OSAT) and underpinning an unusually strong fourth quarter of 2025, with visibility now stretching well into the second half of 2026.