TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards and generating patent licensing revenue by focusing on customer challenges in high-current connectors, high-density integration and foolproof connector design, according to Bellwether Electronic chairwoman Hsu Jui-ying, speaking at the Taiwan Venture Capital and Private Equity Annual Conference on July 7.
Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from Intel and AMD pushed back the broader PCIe 6.0 ecosystem, highlighting how AI infrastructure adoption increasingly depends on platform readiness rather than individual components.
Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker's three-decade relationship with Sega, revisiting a partnership that helped Nvidia survive its difficult early years as semiconductor competition expands from data centers to personal computers.
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
