PCB maker Dynamic Holding reported October 2026 consolidated revenue of NT$10.637 billion (approx. US$323.6 million), down slightly from NT$10.648 billion in September as extended holidays reduced working days, but up 70.3% from NT$6.245 billion a year earlier and the company's second-highest monthly figure on record.

Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said recently. If the separation becomes permanent, Wingtech's ownership should entitle it to fair compensation.

Infineon Technologies told analysts that demand is no longer what limits its growth. On a November 10 call to discuss its fiscal 2026 results, the German chipmaker said orders for its data center power products already exceed the close to EUR4 billion (approx. US$4.46 billion) of revenue it forecasts for fiscal 2027, and that how much of that it can book will depend on how fast its factories and outsourcing partners can ramp.

Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell 8.59% month-over-month and 18.37% year-over-year to approximately NT$130 million as shipments of specialty gases to Japan, South Korea, and domestic customers declined slightly.

Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model inference and enterprise high-performance orchestration workloads. The company outlined new GPU D-series technology at the 2026 Open Compute Project (OCP) Global Summit as it pursues server CPU upgrade opportunities driven by agentic AI.

Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request. TSMC declined to comment on market speculation and stressed that it remains focused on its core foundry business.

Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic components distributor Smith.

Nichidenbo Corporation said successive AI server generations, designed for higher power consumption and voltages, are increasing demand for high-end capacitors offering high capacitance and resistance to heat and voltage. AI-related products now account for 55–60% of its revenue, up from about 40% in the first quarter, and could exceed 60% in 2027.

Infineon Technologies ended fiscal 2026 with its strongest quarter ever, and the shape of the result says more than its size: profitability rose much faster than sales, and the German chipmaker now plans for a year in which power supplies for data centers become one of its largest single businesses.

Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking business as China's AI ecosystem seeks to reduce its reliance on US semiconductors through domestic alternatives.

Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit samples for AI customer validation, targeting advanced semiconductor and AI applications.