TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart manufacturing.
IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for the company and underscores a promising growth outlook.
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leverage advanced process technology and advanced packaging to help customers accelerate innovation in the AI era.
Japan is broadening its semiconductor support strategy by expanding subsidies for domestic production of legacy chips, aiming to strengthen economic security and reduce reliance on overseas suppliers.
Tower Semiconductor reported a strong start to 2026, marked by double-digit revenue growth and a significant jump in net profit. Following a "solid" first quarter, the company issued guidance for the second quarter that would represent the highest revenue in its history. Management highlighted surging growth in silicon photonics and a strategic restructuring of manufacturing in Japan as key drivers of long-term expansion.
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued that the AI revolution is advancing far faster than anticipated and is reshaping the industry from generative AI and AI agents to inference computing.
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
The ongoing Samsung Electronics labor dispute highlights sharply different labor models in South Korea and Taiwan, where firms such as TSMC operate with minimal union presence and rely instead on compensation-driven workforce stability. Industry observers say the Samsung conflict reflects broader tensions over profit sharing during the AI-driven semiconductor upcycle, while Taiwan's tech sector continues to favor high mobility and individual incentives over collective bargaining.
Despite weakness in the personal computer market, surging DDR5 memory prices, and tight CPU supply, ASMedia Technology posted record results in the first quarter of 2026, underscoring early gains from its shift beyond PC connectivity chips into custom silicon, artificial intelligence infrastructure, and automotive electronics.
The memory market is entering a new growth cycle as artificial intelligence demand reshapes supply and pricing, with DRAM prices still rising 10% to 20% a month, according to Nicky Lu, chairman of Etron Technology.
Etron Technology is seeing momentum extend beyond its core memory business, as subsidiaries built over the past several years begin to bear fruit in robotics, edge computing, and privacy-focused applications.
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