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Jan 29, 11:16
Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck globally. According to supply chain sources, TSMC will add a P2 fab at its Southern Taiwan Science Park AP8 site, with both fabs focusing on CoWoS technology. Meanwhile, the Chiayi AP7 facility, originally planned for WMCM, SoIC, and CoPoS packaging, will switch from SoIC to CoWoS. This means that over the next two years, TSMC will significantly ramp up CoWoS capacity, prompting Taiwanese equipment and materials suppliers within the CoWoS ecosystem to accelerate expansions amid full order books, according to sources from the upstream supply chain.
The epicenter of the AI supercycle converged on Taipei this Thursday as President Lai Ching-te welcomed Micron CEO Sanjay Mehrotra to the Presidential Office, just hours after NVIDIA CEO Jensen Huang touched down on the island.
Samsung Electronics and SK Hynix both delivered record fourth-quarter 2025 results, underscoring the sharp rise in memory prices and profits as supply across the market tightens.

US President Donald Trump has threatened to restore 25% tariffs on South Korean goods, escalating trade tensions by citing delays in Seoul's passage of legislation linked to a bilateral trade agreement reached last year.

Nvidia CEO Jensen Huang arrived in Taiwan at noon on January 28 following a visit to China for a subsidiary's year-end event, where he outlined the latest status of H200 export approvals and detailed Nvidia's foundry strategy.
Chinese customers who had planned to use Samsung Electronics' foundry services abandoned a number of projects in 2025 as US regulatory pressure on China intensified and uncertainty peaked ahead of mass production, according to Korean industry sources. Market participants say conditions may look different in 2026.
Alibaba has unveiled its in-house high-end AI processor, Zhenwu 810E, advancing its strategy to vertically integrate AI chips, cloud infrastructure, and large language models. Developed by T-Head Semiconductor, the processor appeared on Alibaba's website on January 29, 2026, following an earlier mention on CCTV News, highlighting Alibaba's vertically integrated AI supercomputing framework that combines in-house chips, Alibaba Cloud's computing platform, and the open-source Qwen large language models from Tongyi Lab.
China's microcontroller (MCU) vendors have started raising prices, led by Cmsemicon's increases across MCU and related products, marking the first upward move in a market that has been depressed for years.

The Covid-19 pandemic once sparked a wave of upgrades for personal computers and smartphones, fueling strong demand for semiconductors. However, it also exposed vulnerabilities in supply chains, leaving companies like TSMC entangled in the global automotive chip crunch and prompting the US and Europe to invite TSMC to build factories on their soil.

SK Hynix is moving to lock out competitors in the high-stakes battle for AI memory, deploying a "one-team" operational strategy that integrates the chipmaker directly into its customers' design processes just as it confirms the mass production of its next-generation HBM4.
As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh) technologies. UMC co-president Jason Wang highlighted that although these segments currently generate modest revenues, a surge in project activity is anticipated to drive "significant growth" beginning in 2027, marking a strategic focus on emerging markets tied to AI and related fields.
Samsung Electronics posted record quarterly revenue and operating profit in the fourth quarter of 2025, underscoring how AI-driven demand for advanced memory has become the company's main earnings engine, even as smartphones, TVs, and home appliances faced seasonal slowdowns and margin pressure.