Taiwanese machinery component maker Hiwin has officially opened its new headquarters in Agrate Brianza for its Italian subsidiary, saying the site will serve as a key hub connecting Europe with global markets and strengthening its international service network. Chairman Eddie Chuo said that Hiwin Italy is not only an operating base, but also a critical bridge for broader regional integration.

SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to a press release.

The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.

Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and stability have become baseline requirements for hardware suppliers.

Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.

SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.

Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness.

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.

Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600 million (approx. US$19.10 million) at its shareholders' meeting on May 26. The company also welcomed Unimicron Technology, Gold Circuit Electronics (GCE), and Zhen Ding Technology Group (ZDT) as strategic investors.

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to address employees in person over the growing backlash surrounding reports that the company will cut employee bonuses by 15%.

Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account for more than half of revenue. Despite continued uncertainty in the global environment, Peng remains cautiously optimistic about the second half of 2026 and expects the company to maintain relatively strong performance.