DIGITIMES Semiconductors news

Apr 16, 16:46

TSMC enters 2nm mass production, scales 3nm capacity

TSMC laid out its capacity expansion plans and advanced node progress at its first quarter 2026 earnings call. Chairman C.C. Wei reaffirmed Taiwan as the primary base for leading-edge production, citing close coordination with its research and development teams.

TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last

Apr 16, 17:21

TSMC guides over 15% 2Q26 revenue growth, N3 margins set to top average

Apr 16, 16:31

Taiwan analog IC firms show varied 1Q26 revenue; motor control and DDR5 PMIC drive growth

Apr 16, 16:28

TSMC lifts full-year outlook above 30% as AI demand powers another record quarter

Apr 16, 15:22

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PASSIVE, PCB, OTHER IC COMPONENTSYageo posts 40% YoY profit rise in 1Q26, driven by AI demand, price hikes

Apr 16, 16:34

Passive component manufacturer Yageo held its first-quarter 2026 online earnings call on April 15, reporting strong financial results. Company CEO David Wang said that robust demand from applications related to artificial intelligence (AI) boosted sales of both standard and specialty products. Combined with the gradual impact of price increases, this drove significant growth in revenue and profits for the quarter, exceeding previous projections.

IC DESIGN, DISTRIBUTIONMCU demand pull-in lifts first-quarter sales, inflation risk clouds outlook

Apr 16, 16:18

The traditional off-season for consumer electronics showed unexpected strength in the first quarter of 2026, with microcontroller (MCU) suppliers reporting a wave of early orders. Customers, facing rising costs and sharp increases in memory prices, have accelerated procurement due to concerns over future supply shortages. This front-loading of demand has effectively brought forward the peak season. Still, industry players caution that inflationary pressure linked to ongoing Middle East conflicts could weigh on end-market demand.

IC MANUFACTURINGEZconn posts 200% profit surge in March as high-fiber count shipments boost growth

Apr 16, 16:12

Optical communication manufacturer EZconn announced a net profit after tax of NT$312 million (US$9.9 million) for March 2026, marking a 200% increase year on year and earnings per share (EPS) of NT$4.02. Including the previously reported January and February EPS of NT$2.3, the cumulative EPS for the first quarter of 2026 has reached NT$6.32.

PASSIVE, PCB, OTHER IC COMPONENTSChina tightens rules against foreign supply chain decoupling

Apr 16, 16:02

The Chinese government has introduced sweeping regulations that authorize investigations and penalties against foreign companies that decouple from China's supply chain. The new rules arrive as global supply chains face mounting geopolitical pressure and China's export surplus continues to grow.

MEMORY CHIPSSamsung pushes HBM4 yields as advanced testing and cutting technologies emerge

Apr 16, 15:50

Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According to Chosun Biz, yields for Samsung's latest 10nm-class 1c DRAM have surpassed the industry's "mature yield" threshold of around 80%, indicating meaningful progress at the wafer level.

IC MANUFACTURINGTSMC 1Q26 earnings: AI demand sends profit up 58%, gross margin to all-time high

Apr 16, 14:46

Taiwan Semiconductor Manufacturing Company (TSMC) reported a first-quarter 2026 revenue of US$35.90 billion, a 40.6% jump from a year earlier, as insatiable demand for artificial intelligence (AI) processors pushed the world's largest contract chipmaker to its highest-ever gross margin.

IC DESIGN, DISTRIBUTIONChina's homegrown GPU startups gain ground in global AI chip race

Apr 16, 12:30

China's domestic GPU industry is entering a new phase of rapid commercialization, as leading startups post strong revenue growth while intensifying investment in research, patents, and ecosystem development.

IC DESIGN, DISTRIBUTIONTesla AI5 tape-out signals dual sourcing with Samsung, TSMC

Apr 16, 12:17

Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon Musk confirmed the tape-out in a post on X, saying the design has been sent to foundry partners for fabrication. Musk also said Tesla is developing follow-on processors, including AI6 and Dojo3.

IC DESIGN, DISTRIBUTIONCadence, Nvidia deepen AI partnership to reshape chip design and robotics

Apr 16, 12:11

Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure, the companies said at CadenceLIVE Silicon Valley 2026. The collaboration aims to combine Cadence's electronic design automation (EDA) software with Nvidia's accelerated computing and AI platforms to improve engineering productivity and reduce development cycles.

IC DESIGN, DISTRIBUTIONSamsung System LSI talent exits raise risks for Exynos and image sensors

Apr 16, 12:02

A wave of departures among core engineers at Samsung Electronics' System LSI division is raising concerns over a potential leadership gap at its non-memory chip unit, particularly in areas tied to Exynos processors and ISOCELL image sensors.

MEMORY CHIPSMemory suppliers post record 1Q26 revenue as AI demand defies seasonal slowdown

Apr 16, 11:57

The global memory industry delivered its strongest first-quarter performance on record in 2026, defying the traditional seasonal slowdown as strong AI demand drove supply shortages and accelerated an upcycle. Revenue across the supply chain rose sharply year over year, with many upstream and downstream players reporting growth that doubled or more.

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