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Aug 5
AMD says server CPU market to hit US$220B by 2030

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate of more than US$120 billion three months earlier, as the company sees agentic artificial intelligence (AI) creating a new class of CPU-intensive workloads.

Parade said its second-quarter 2026 results were squeezed by a sudden increase in back-end testing and packaging costs, but the high-speed interface chip designer remains confident about demand going forward. For global readers, the takeaway is that rising memory prices are reshaping notebook and PC supply chains, yet AI-driven upgrades could still support growth ahead.

SpaceX's first earnings report since going public showed that second-quarter 2026 revenue surged 92% year-over-year to US$7.81 billion, while the company still posted a net loss of US$541 million.
US polysilicon tariff exposes chip security's solar dependence
Aug 6, 14:00

The Trump administration is preparing to impose a 15% tariff and minimum import prices on polysilicon and selected derivative products, placing an upstream material shared by solar panels and semiconductor chips at the center of efforts to reduce US exposure to Chinese supply.

Elon Musk is accelerating plans to establish a fully integrated US solar manufacturing ecosystem through Tesla and SpaceX, with a combined long-term capacity target of 200 GW. His strategy now extends from solar cells and modules into crystal growth and wafer production, while industry reports suggest the effort could eventually reach upstream polysilicon manufacturing.
Nuvoton Technology is navigating weaker PC-related demand as memory shortages reshape global hardware orders, while cloud, AI, and security products gain momentum. The company said its shift toward server controllers, quantum-safe microcontrollers, and XR components could help offset near-term pressure and support stronger growth from 2027.
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test (OSAT) providers, according to ETNews, which cited semiconductor industry sources.
Taiyo Yuden has lifted its full-year outlook after a stronger first quarter, as demand from AI servers and related IT infrastructure increasingly drives sales of higher-end capacitors. The Japanese passive component maker returned to profit in the quarter ended June 30 and said a weaker yen, higher volumes, and stronger demand for high-reliability products are improving the outlook for the year.
ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing Director and CEO Venkata Simhadri told DIGITIMES.
NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory. The company says the technology is intended to improve AI performance, scalability, and efficiency as models grow larger and more demanding across global markets.

Anthropic is building an in-house team to design custom chips for its Claude AI models, according to Reuters, moving ahead with a plan first reported in April as the startup responds to a shortage of processors needed to run and develop more advanced AI systems.

Nanya Technology's board of directors approved several resolutions on August 5, including a plan to accelerate capacity build-out at its new Fab 5A by raising its 2026 capital expenditure to no more than NT$69.7 billion (approx. US$2.16 billion) from the earlier estimate of NT$52 billion, a roughly 34% increase. The board also approved participation in the bidding process for a testing facility to expand backend packaging and testing capacity.