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Apr 8
Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season in releasing industry outlooks. This time, ASML will hold its earnings call for the first quarter of 2026 a day earlier on April 15, and is expected to outline how memory manufacturers and new large-scale logic foundries will reshape the semiconductor manufacturing landscape.
Global memory markets are entering a new restructuring cycle driven by AI demand, with China's YMTC and CXMT scaling capacity and state-backed investment to gain share in a sector long led by US, South Korean, and Japanese suppliers.
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.
Memory module maker Transcend reported a new monthly revenue high in March 2026 of NT$5.7 billion (approx. US$178.8 million), up 78.6% month-over-month and 3.8 times year-over-year. The company's consolidated revenue for the first quarter of 2026 reached NT$13.6 billion, marking the highest quarterly revenue in its history.
Apple's US online store is currently showing extreme shipping delays of 4-5 months for several upgraded RAM configurations of the Mac mini and Mac Studio, highlighting a severe supply bottleneck in its high-end desktop lineup.
The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds in Taiwan and China.
China-based automotive semiconductor wafer foundry Zensemi has announced a new management team led by chairman Xiaofei Chen, appointing two internationally experienced executives: KC Ang as general manager and Marco Maria Monti as co-general manager. This leadership restructuring signals Zensemi's ambition to expand its presence in the automotive and specialty process wafer markets by integrating global expertise.

Shanghai state-backed foundry GTA Semiconductor has partnered with Infineon Technologies to introduce SONOS-based embedded non-volatile memory (eNVM) into production, positioning itself more firmly in automotive and industrial chip supply chains.

As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously, supply constraints across upstream materials — including glass fiber cloth, copper foil, and drill bits — are creating bottlenecks that are gradually tilting capacity toward a supply shortfall and extending forward visibility across the IC substrate sector.
Silicon Motion said AI-driven NAND supply constraints are causing structural shifts in the memory industry and warned the imbalance will worsen in 2027 as cloud service provider demand outpaces capacity. The company expects growth across product lines in 2026 despite weakening mobile and consumer shipments.
Memory module giants Adata Technology and Team Group both reported record-high revenue for March 2026. Adata's monthly revenue surpassed NT$10.54 billion (approx. US$330.19 million), a rise of 47.09% from February and 181.48% year over year. Meanwhile, Team Group reported NT$4.92 billion in March revenue, surging 326.68% sequentially and 120.49% from a year earlier, setting new records for both monthly and first-quarter sales.
Memory shortages are pushing prices sharply higher, forcing a reshuffle across the consumer electronics market. Chinese authorities have intervened for a second time, convening domestic memory leaders CXMT and YMTC to provide "strategic support" aimed at stabilizing prices and containing supply chain costs for local brands. Yet with a wide supply-demand gap in DRAM and NAND flash, near-term price stabilization remains unlikely.