TSMC chairman and CEO C.C. Wei said on October 15 that the chipmaker sees no ceiling on its profitability as demand for AI accelerators continues to outpace supply. Wei also said AI-related growth could exceed the company's long-term forecast and outlined plans to adopt high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography in 2030.
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new US factory, Reuters reported on October 15, citing two people familiar with the matter.
Six Taiwanese server and networking contract manufacturers booked combined revenue of NT$2.18 trillion (US$67.3 billion) in September 2026, up 55.9% year-over-year and 4.9% month-over-month, as demand for AI servers stayed strong. Nine-month revenue of NT$15.5 trillion already exceeds the group's full-year 2025 total of NT$14.3 trillion.
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to Dalal Street Investment Journal.
TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of talks between the two sides.
TSMC expects fourth-quarter 2026 revenue to reach US$52.3 billion to US$54.3 billion, potentially rising as much as 61% year-over-year, with sustained demand for advanced semiconductor manufacturing and accelerating 2nm production supporting its year-end outlook.
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition, advanced packaging, inspection and other semiconductor manufacturing processes.
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin Memory Technologies (CXMT) prepares to introduce server memory using the architecture by the end of 2026. The competing timelines have raised questions about whether China's memory industry is closing the technology gap with South Korean manufacturers.
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference systems. The South Korean chipmaker is also exploring ways to stack DRAM directly on AI processors to improve performance and energy efficiency.
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6 billion), exceeding market expectations on sustained demand for advanced semiconductors used in artificial intelligence (AI).
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.
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