Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process may perform ahead of mass production.
Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE collaborated with WinWay and Horng Terng Automation (HTA) to jointly invest in building a high-end semiconductor testing service industrial park that will provide wafer and chip testing services.
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation inference chip integrated into Nvidia's upcoming Vera Rubin AI platform.
Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the world's thinnest GaN chiplet as part of its broader push to position itself as a "systems foundry" for the artificial intelligence era.
Taiwan's listed AI hardware companies collectively generated $69.7 billion in March 2026 revenue across 13 supply-chain segments — up 63% year-over-year — offering the most comprehensive single-month snapshot yet of where global AI infrastructure spending is actually flowing. The table below covers 49 companies from TSMC's silicon foundry all the way down to the rail kits that slide servers into racks. Read together, the numbers tell a story that goes well beyond any single company's earnings call.
Taiwan's listed companies powering the global AI server supply chain delivered exceptional March 2026 revenues across virtually every segment, with TSMC posting its strongest single-month revenue on record and server ODMs surging on the back of relentless hyperscaler demand for AI infrastructure. The results, amplified by a seasonal rebound from February's Lunar New Year-compressed working days, confirm that the AI hardware buildout is accelerating rather than plateauing.
Taiwan's two largest semiconductor distributors, WT Microelectronics and WPG Holdings, reported record-breaking quarterly results, underscoring how surging demand for artificial intelligence infrastructure is rippling through the global chip supply chain.
Despite revenue growth in March 2026, Catcher Technology is maintaining a prudent outlook for 2026, citing supply chain bottlenecks, cost pressures, and uncertain end-market demand.
BenQ Materials is expanding into semiconductor materials, with president Ray Liu saying the company has entered CMP cleaning brush rollers and begun shipments to wafer fabs. It is also developing wafer grinding tapes and UV debonding tapes, which are currently under customer validation and could begin shipping as early as the end of 2026.
South Korean IC design firm AD Technology transitioned from the TSMC Value Chain Alliance (VCA) to become one of Samsung's Design Solution Partners (DSPs) in 2019. After overcoming initial challenges, the company has returned to profitability and now aims to surpass KRW1 trillion (US$673.2 million) in revenue by 2029 or 2030 through its self-developed 2nm server platform, ADP620.
High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures will significantly increase starting in 2026. The company expects related production capacity to remain fully utilized through the end of the year, targeting double-digit revenue growth for the full year.
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