Infineon Technologies is betting on RISC-V scalability with AURIX RC1, its first RISC-V-based microcontroller (MCU) platform, unveiled this week. A single instruction set lets the platform span everything from very small controllers to real-time vehicle computers and robotic motion controllers, so RC1 can serve automotive, robotics, and industrial customers at the same time.

DIGITIMES observes that as large language models (LLMs) and agentic AI development become increasingly widespread, it is driving not only significant growth in data center CPU demand but also a sharp surge in key-value cache (KV cache) storage requirements. As DRAM and HBM capacity face severe supply shortages, demand for data center SSDs is rising rapidly.

As artificial intelligence reshapes global chipmaking, the UK's strength in design, materials and research is being tested by a longstanding challenge: turning technological breakthroughs into scalable commercial products.

Three US lawmakers asked Nvidia CEO Jensen Huang to attend a closed-door meeting to discuss his interactions with former Megaspeed executive Alice Huang. The request followed recent reports alleging that Alice Huang had fed intelligence to the Chinese government and had developed a "close relationship" with Jensen Huang.

China's Yangtze Memory Technologies (YMTC) plans to source as much as 70% of the manufacturing equipment for its fourth NAND flash factory from domestic suppliers, a substantial increase over the share at its existing operations as the company expands into advanced memory for AI and data centers.

Debt held by Taiwan's science park operating funds reached NT$163.54 billion (approx. US$4.97 billion) as of the end of September 2026, while the National Science and Technology Council (NSTC) remains confident that rising operating cash flow will accelerate repayment. The government continues to develop and expand science parks to meet industry demand, including new sites and expansions across Taiwan.

Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center AI accelerators. The company aims to deliver a lower-cost, more energy-efficient alternative to sixth-generation high-bandwidth memory (HBM4) for AI inference workloads requiring high bandwidth and large buffers.

South Korean chip designer LX Semicon posted its first quarterly operating loss since going public in 2010, as weak demand for display chips and pricing pressure from electronics manufacturers weighed on earnings. The company also nominated a new CEO to lead its turnaround efforts.

National Silicon Industry Group (NSIG) expects to complete its expansion to 1.2 million 300mm silicon wafers per month by the end of 2026, positioning the Chinese semiconductor materials supplier to benefit from recovering wafer prices and growing demand for silicon-on-insulator (SOI) substrates used in silicon photonics (SiPh).

Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages are expected to persist through 2028, DealSite reported.

Taiwan and the UK are deepening technology ties as supply-chain restructuring and industrial security reshape semiconductor strategy. A new bilateral arrangement covers semiconductors, space, communications, net zero, and AI standards, while cooperation could link British research strengths with Taiwan's manufacturing and testing capabilities across more of the chip lifecycle.