Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.

Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.

Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board (PCB) markets.

South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.

Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.

As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems.

Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performance amid rising demand for storage driven by artificial intelligence.

During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners working together toward shared goals.

SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment.

Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the product appears to have stalled, according to The Elec.