Arm Holdings executives highlighted a growing focus on integrated compute subsystems during the company's latest earnings call, as rising chip design complexity reshapes customer requirements across multiple end markets.
As global competition in the semiconductor industry intensifies, the focus is no longer limited to technology and production capacity. Protection of data, intellectual property, and supply chains has become an equally critical battleground.
Arm Holdings reported fiscal third-quarter revenue growth of 26% from a year earlier, supported by gains in licensing and royalties, while memory supply constraints in the smartphone market continued to weigh on expectations for mobile-related royalty income.
Renesas Electronics forecast a sharp improvement in profitability for the January to March quarter as growth in data center and other industrial infrastructure demand offsets weakness in automotive, after the Japanese chipmaker swung to its first annual net loss since fiscal 2019.
In a moment that blurred the lines between corporate diplomacy and fan-like devotion, TSMC CEO C.C. Wei turned a high-stakes semiconductor summit into a personal tribute on February 5, 2026.
The third edition of the Asia Photonics Expo (APE) opened on February 4, 2026, at the Sands Expo and Convention Centre, bringing together the global photonics and semiconductor ecosystem for three days of networking, conferences, and industry collaboration through February 6, 2026.
SiTime said it will acquire assets related to Renesas Electronics' timing business in a transaction valued at about US$3 billion, as the Japanese chipmaker narrows its focus on embedded computing while retaining an equity stake in the US precision timing company.
In the high-stakes theater of global chipmaking, TSMC Chairman C.C. Wei has mastered a rare skill: the art of the well-timed strategic masterstroke.
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation chip-on-panel-on-substrate (CoPoS) advanced packaging, the company has completed delivery of the world's first 310mm by 310mm panel-level packaging physical vapor deposition (PLP PVD) equipment. The equipment has been successfully introduced into the production line of a major semiconductor packaging and testing plant in Kaohsiung, Taiwan.
The ongoing tight supply of memory chips globally has driven contract price surges for DRAM and NAND flash. As a result, memory module maker Adata Technology once again reported explosive growth in January 2026, with consolidated revenue for the month soaring to NT$8.41 billion (US$266.23 million), up 198.92% year over year and 44.78% sequentially. This marks the company's second consecutive month of record-breaking single-month revenue following December 2025.
Siemens has acquired French startup Canopus AI, adding AI-based metrology and inspection software to its electronic design automation (EDA) portfolio as it expands deeper into semiconductor manufacturing workflows.
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