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India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating its China ties. IndieSemiC and Kaynes target local chip gaps despite uncertain demand, and Cyient's Kinetic deal boosts power IC capabilities. Meanwhile, security-driven supplier shifts and new export opportunities highlight India's evolving strategic and industrial positioning.

The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES analyst Luke Lin.
SAS Group's strategic shift into renewable energy, AI-related semiconductor materials, and automotive components signals growing resilience for global energy and tech supply chains, offering long-term recurring revenue through integrated hardware and service platforms and enhanced worldwide positioning for geopolitical robustness.
Nan Pao Resins Chemical Group reported a historic revenue high for March, reaching NT$2.4 billion (approx. US$75.3 million), up 17.4% year-over-year, fueled by raw material price fluctuations and customers' proactive stockpiling ahead of expected product price hikes. The company also achieved a record first-quarter revenue of NT$5.8 billion in the first quarter of 2026, supported by ongoing new product development and successful expansion into new customer segments.
The Chip-based Industrial Innovation Program (Taiwan CBI), a decade-long, NT$300 billion (US$9.4 billion) initiative launched by the Executive Yuan to support academic and research institutions in acquiring costly semiconductor equipment, has begun to achieve initial results. According to a report from the National Science and Technology Council (NSTC), over 200 key semiconductor-related devices are now available to provide regular fabrication and implementation services, becoming a major boost for training advanced IC design talent.

US lawmakers from both parties have recently introduced a new bill aimed at further restricting China's access to advanced semiconductor manufacturing equipment. The move seeks to strengthen efforts to curb China's ambitions in semiconductor development and to achieve closer alignment with allies such as the Netherlands and Japan on export controls.

Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment, a critical process step in advanced chip manufacturing.

Taiwan's ASIC design service providers delivered sharply divergent results in the first quarter of 2026, underscoring how exposure to artificial intelligence (AI) demand does not translate uniformly into financial performance.
Samsung's next-generation mobile processor, the Exynos 2700, has appeared in early benchmark tests, offering one of the first real-world signals of how its second-generation 2nm process may perform ahead of mass production.
Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE collaborated with WinWay and Horng Terng Automation (HTA) to jointly invest in building a high-end semiconductor testing service industrial park that will provide wafer and chip testing services.
Samsung Electro-Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 language processing unit (LPU), a next-generation inference chip integrated into Nvidia's upcoming Vera Rubin AI platform.