US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a plan to rethink how high-density memory is manufactured.

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators as external memory tiers create new options for storing key-value (KV) cache, according to Astera Labs.

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the US, positioning the company to tap renewed investor demand for semiconductor and AI-related businesses.

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and Answers for the AI Era" forum on September 15. Students asked how TSMC determines whether a technology is worth long-term investment when information is incomplete and the technological direction remains unclear, as well as how people can develop the ability to judge whether answers generated by artificial intelligence (AI) are true or false in the AI era.

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory. Within weeks, SK Hynix has been reported to be weighing Intel alongside TSMC, Samsung Electronics has been reported to be pairing its own foundry with TSMC, and Micron has confirmed that TSMC will manufacture its next-generation base die. What began as a single-vendor arrangement is turning into a multi-front sourcing contest — and the assumption that a second source automatically means a cheaper one is already being challenged.