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Jan 21
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked through 2027. Deutsche Bank analysts suggest that the crunch may provide a strategic opening for Samsung Electronics to capture orders from major technology firms.

The US has confirmed that under a new set of stringent regulations, Nvidia's H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand. However, the Chinese government has shown no intention of granting approval, causing supply chain plans that were originally preparing to ship to be put on hold. Currently, the main obstacle to entering the Chinese market is the mindset of the Chinese authorities. From the Chinese government's perspective, since domestic AI chips are already usable, there is no need to further allow China's AI development to rely more heavily on the US and Nvidia.
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates high-performance computing (HPC) with quantum computing (QC). Based in southern Taiwan, the system is intended to accelerate real-world applications through international cooperation, leveraging the country's strong semiconductor manufacturing expertise.

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update on its latest operational plans.

2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

As generative AI technologies scale up, the semiconductor industry is poised for a significant transition from copper-based interconnects to optical solutions to meet the stringent requirements of AI data centers. Nvidia has targeted 2026 as the initial commercial launch window for silicon photonics (SiPh) technology, signaling a strategic shift that will reverberate throughout global semiconductor supply chains. Taiwanese packaging and testing firms, among others, are positioning themselves to capitalize on the burgeoning market for ultra-high-bandwidth, energy-efficient AI infrastructure.
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agreement.
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust DRAM market into 2026. Customers are overbooking and seeking long-term agreements (LTAs), eyeing to secure sufficient supply.

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts to build domestic production capacity—even as Japanese firms continue to dominate the global photoresist market.

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market moves into a new upcycle. That spending now faces fresh pressure from the US semiconductor tariff policy, complicating long-term investment planning at the two companies.

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.