DIGITIMES Semiconductors news

Aug 20

SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders

SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.

Nvidia, TSMC, chip gear makers ride AI boom into high-margin club

Aug 20

Marvell issues Google warrant worth $12.2bn at exercise — custom chip work spans five TPU-related categories

Aug 20

CXMT planned to use Samsung process data to develop DRAM, ex-engineer says

Aug 20

Intel Malaysia packaging expansion draws HBM flows from Taiwan

Aug 20

MORE NEWS

IC DESIGN, DISTRIBUTIONCharts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up

Aug 21, 06:17

Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.

IC MANUFACTURINGJCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

Aug 21, 06:16

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities towards denser 2.5D and 3D integration.

IC MANUFACTURINGCharts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers

Aug 21, 06:16

Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring across company filings.

MEMORY CHIPSNitto Denko to expand HDD baseboard capacity for AI data center demand

Aug 21, 06:14

Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by 40% from fiscal 2025 levels. The move is aimed at meeting demand driven by AI-related data center growth.

PASSIVE, PCB, OTHER IC COMPONENTSChina silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump

Aug 21, 06:14

National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued R&D spending, currency movements and inventory impairments widened its net loss.

IC MANUFACTURINGSamsung holds off on High-NA EUV until 1nm production

Aug 21, 06:13

Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier hoped to introduce the technology at the 2nm and 1.4nm nodes.

IC MANUFACTURINGDIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

Aug 21, 06:10

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.

IC MANUFACTURINGColumn: Is 800V really 'high voltage'? —AI data centers revive an old power debate

Aug 21, 06:09

High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO Jensen Huang has described as the industry's "five-layer cake," but also a concrete manifestation of the idea that computing power ultimately depends on electrical power.

IC MANUFACTURINGKenmec surges on AI, advanced packaging to record orders, revenue

Aug 21, 06:09

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec Mechanical Engineering, a subsidiary of Kenmec Group, has seen its order backlog surge to nearly NT$6.661 billion (approx. US$209.1 million). Driven by this momentum, both the subsidiary and the group overall are on track to hit historic highs in revenue and order intake in 2026.

IC MANUFACTURINGSamsung gains foundry pricing power as 4nm capacity stays tight through 2027

Aug 20

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.

PASSIVE, PCB, OTHER IC COMPONENTSChina reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers

Aug 20

China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery times for Taiwanese aerospace and optical suppliers and, in some cases, costing them orders.

More coverage

TOPICS

TSMC UPDATES

INDIA'S SEMICONDUCTOR MISSION

INTERVIEWS