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Vietnam has officially begun construction of its first homegrown semiconductor chip manufacturing facility, marking a significant step in the country's plans to develop a domestic semiconductor ecosystem.
Intel has poached Eric Demers, a veteran GPU architect, known for developing Qualcomm's proprietary Adreno GPU architecture. Demers will become Intel's senior vice president of GPU engineering. This suggests that even though Intel has long been unable to compete with Nvidia and AMD in the GPU market, it still hopes to strengthen its own GPU capabilities.
Thailand's Board of Investment (BOI) recently approved a major investment plan led by Zhen Ding Tech (ZDT), the world's largest printed circuit board (PCB) manufacturer, in partnership with local firm Saha Pathana Inter-Holding (SPI). The project involves approximately THB65 billion (US$2.1 billion) to establish advanced PCB production capacity, aiming to position Thailand as a key PCB manufacturing center in Southeast Asia.

Apple is losing the preferential access it held for more than a decade at TSMC as surging demand for AI chips shifts the balance of power toward Nvidia and other high-performance computing customers. The change highlights how AI workloads are reshaping capacity allocation at the world's largest contract chipmaker, reducing Apple's ability to secure priority production at the most advanced nodes.

US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported that Chinese companies have begun investing heavily in equipment localization. For example, ChangXin Memory Technologies (CXMT) is moving towards mass production of more advanced HBM in 2026, and other related equipment vendors are making all-out efforts to build an HBM equipment ecosystem.
As geopolitical tensions escalate, China's AI industry development is shifting from the application layer to underlying computing power and core chip technologies, with GPU- and AI chip-related companies becoming key focal points for both capital and policy resources. The Hurun Research Institute recently released the Hurun Global Unicorns Index 2025.
US secretary of commerce Howard Lutnick recently announced that memory manufacturers not producing in the US could face tariffs of up to 100%. In addition to naming major South Korean players, foreign media reports said that Taiwanese players Nanya Technology and Winbond could also be among the companies potentially affected.
South Korea said it will seek negotiations with the US after Washington imposed a 25% tariff on selected semiconductor products, a move that has placed the country's leading chipmakers, Samsung Electronics and SK Hynix, on heightened alert over potential knock-on effects.
China's semiconductor supply chain is accelerating plans to bring sixth-generation low-power DRAM, known as LPDDR6, into commercial use in 2026, seeking to close a long-standing technology gap with global memory leaders as edge AI raises demand for higher bandwidth and lower power consumption.
Following the conclusion of tariff negotiations between Taiwan and the US, both sides have presented differing interpretations: Taiwan's Executive Yuan has expressed satisfaction with securing its four major goals, while US Commerce Secretary Howard Lutnick described the combined US$500 billion investment as a "down payment," and stressed plans to shift about 40% of Taiwan's supply chain and production capacity to the US before Trump's current term ends.
Taiwan's AI server supply chain delivered broad-based growth in 2025, fueled by surging generative AI and cloud data center spending, but the biggest gains clustered around two areas: system-level integration led by original design manufacturer (ODM)/electronics manufacturing services (EMS) manufacturers, and a set of high-power, AI-specific components—especially thermal solutions, rack hardware, and high-speed optical interconnect.