AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.

Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China, Hong Kong, and Macau, launching a second round of raids targeting Supermicro's Taiwan branch and two listed Taiwanese technology companies.

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.