DIGITIMES Semiconductors news

May 22

AMD's Lisa Su says memory is becoming another pressure point for AI chips

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.

Anthropic reportedly eyes Microsoft Maia chips to cut Nvidia reliance

May 22

EverDisplay appoints former Hua Hong executive as chairman in board overhaul

May 22

Amkor expands Arizona semiconductor packaging campus with additional 67 acres

May 22

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

May 22

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IC DESIGN, DISTRIBUTIONNvidia's reporting pivot and AMD's US$10B Taiwan bet signal a new frontier in AI chip war

May 25, 13:50

Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments reflect a shared urgency to expand beyond traditional hyperscale clouds into the booming, highly lucrative global enterprise, industrial, and sovereign AI factory frontiers.

IC MANUFACTURINGLam Research CEO: New fabs alone will not solve chip bottlenecks

May 25, 13:36

Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.

MEMORY CHIPSNvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix

May 25, 13:03

Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain.

IC MANUFACTURINGAI servers drive order growth; Weltrend's fan motor driver IC visibility strong

May 25, 13:00

At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the full year. Meanwhile, AI servers are becoming increasingly diversified, with demand across GPUs, ASICs, and CPUs growing almost simultaneously, underpinning a highly promising operating outlook.

IC MANUFACTURINGNan Pao joint venture nears full capacity as semiconductor demand rises

May 25, 12:52

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.

IC DESIGN, DISTRIBUTIONAnthropic-Microsoft deal could broaden ASIC demand across cloud supply chains

May 25, 11:50

Anthropic has reportedly approached Microsoft about renting AI computing power running on Microsoft's in-house chips to expand support for its Claude model business. The move is a positive sign for Microsoft and could generate momentum for the mass production of its recently unveiled Maia 200 chip, while ASIC players such as Global Unichip and Ethernet chip suppliers Marvell Technology and Broadcom also stand to benefit.

PASSIVE, PCB, OTHER IC COMPONENTSAI data centers spark 800V HVDC rush for Taiwan lead frame suppliers

May 25, 11:45

The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.

PASSIVE, PCB, OTHER IC COMPONENTSAmple Electronic says AI demand is boosting MLCC-related passive components

May 25, 11:42

Ample Electronic said rising demand from artificial intelligence end customers has driven a stronger market for multilayer ceramic capacitors and related passive components, lifting orders, driving inventory builds, and prompting a shift toward longer-term material lock-in agreements. The conductive paste supplier reported a positive outlook for the second half of 2026 and said customers who initially carried low inventories were replenishing stock and, in some cases, signing extended supply arrangements.

MEMORY CHIPSHuawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

May 25, 11:42

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.

IC DESIGN, DISTRIBUTIONAnalysis: Lisa Su moves on China — and Nvidia's CUDA moat

May 25, 11:01

For AMD CEO Lisa Su, the current moment presents an opening that Nvidia does not have. Nvidia's high-end chips have repeatedly faced scrutiny and export restrictions in China, and Nvidia CEO Jensen Huang only recently confirmed in May that Nvidia once held as much as 95% market share there. That dominance has since been reset, with the bulk of that share ceding to domestic rival Huawei.

IC MANUFACTURINGWeekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment

May 25, 10:45

Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:

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