DIGITIMES Semiconductors news

May 8

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.

TSMC reports record April sales as AI chip demand puts Asia supply in focus

May 8

Analysis: Anthropic's xAI deal puts Musk's GPU efficiency problem in focus

May 8

Sony, TSMC form Japanese joint venture to push image sensors into automotive and robotics

May 8

Inside Nvidia's high-stakes bet on next-generation AI cooling

May 8

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MEMORY CHIPSMemory bottlenecks threaten data-center GPU efficiency as AI inference scales, says Micron SVP

May 11, 12:35

Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can sharply cut GPU utilization while faster, larger memory can theoretically multiply the compute extracted from GPUs. The remarks underscore how storage and memory design could limit AI deployment.

IC MANUFACTURINGSamsung strike talks resumed with US$29 billion on the line

May 11, 12:31

Samsung Electronics' labor and management have returned to the negotiating table under South Korean government mediation, as the company faces a planned general strike and a widening dispute over how profits from its semiconductor rebound should be shared.

IC MANUFACTURINGAMD's 2nm defection to Samsung dents TSMC's AI grip

May 11, 12:18

The AI semiconductor supply chain is showing unexpected signs of a shift, with TSMC's long-held dominance in the foundry market beginning to loosen. US chipmakers are increasingly engaging with Samsung Electronics and Intel as alternative suppliers, and AMD has already handed its 2nm order to Samsung.

IC MANUFACTURINGDIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

May 11, 12:14

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.

MEMORY CHIPSPhison targets AI storage and edge computing growth through Phison 3.0 strategy

May 11, 11:41

Phison Electronics Corp. reported record revenue and profit for the first quarter of 2026, while Chief Executive Khein-Seng Pua warned that a severe imbalance in the global NAND market would push average selling prices higher and sustain tight supply conditions into the second half of the year. He said the company is accelerating a strategic shift into AI storage infrastructure and edge AI computing as part of its transition, which it calls Phison 3.0.

PASSIVE, PCB, OTHER IC COMPONENTSTesla AI5 ignites Samsung-LG race for ABF substrates, robot parts

May 11, 11:33

LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's AI4 chips, intensifying its competition with Samsung Electro-Mechanics (Semco) across both autonomous driving and humanoid robotics hardware.

MEMORY CHIPSAI inference boom fuels memory race, with Samsung in pursuit

May 11, 11:31

AI-driven demand and new product cycles are accelerating competition among major memory makers, creating pressure across storage and component supply chains. Production is running near full capacity, margins on some DDR5 products have improved, and next-generation HBM will be a focal point of contention through 2027 and beyond.

IC MANUFACTURINGChinese semiconductor suppliers expand SEA presence at SEMICON SEA 2026

May 11, 10:47

At SEMICON Southeast Asia 2026 in Kuala Lumpur, China's semiconductor equipment makers are steadily "infiltrating" the Southeast Asian market, extending from back-end packaging and testing into front-end processes while setting up subsidiaries in Singapore and Malaysia and using localized branding to break through. The shift is reshaping the competitive landscape at the region's annual semiconductor showcase.

IC MANUFACTURINGASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029

May 11, 10:43

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler moves to expand capacity ahead of surging AI-driven demand. The plant, to be located in the Kaohsiung Nanzih Technology Industrial Park, is scheduled to open in September 2029.

IC MANUFACTURINGAI boom drives Taiwan's semiconductor testing industry into record expansion

May 11, 10:33

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test (OSAT) industry is entering what executives and analysts describe as an unprecedented expansion cycle. Industry observers estimate that combined capital expenditures by Taiwanese OSAT providers could surge to a record NT$400 billion (approx. US$12.7 billion) in 2026, driven by an aggressive race to expand high-end production capacity.

IC MANUFACTURINGWeekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals

May 11, 10:06

Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:

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