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Jul 15
ASML raises 2026 sales outlook as AI-fueled logic and memory demand accelerates
Dutch lithography giant ASML reported total net sales of EUR9.3 billion for the second quarter of 2026, exceeding its own guidance, as customers accelerated capacity expansion plans amid continued AI-driven demand for advanced logic and memory chips.
Reports of lengthening semiconductor lead times have become increasingly common in recent months, highlighting that the imbalance between chip supply and demand has not eased but is instead spreading across a broader range of end markets. Taiwanese IC design companies believe that while booming cloud AI investment remains the primary driver behind today's capacity constraints across semiconductors and electronic components, resilient demand outside the cloud AI sector has also played an equally important role in keeping the market tight.

A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding the AI data center boom, handing a small California patent holder a border lever that runs parallel to President Donald Trump's campaign to force chip production back onto US soil.

TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations, underscoring sustained demand for AI and high-performance computing (HPC) chips.

As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese companies may find an opportunity to break into the market by addressing the widening supply gap.
The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry it is entering, including detailed profiles of the three incumbents it must eventually displace, and a frank accounting of how far behind it still sits.

A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations in calling for the European Commission to impose interim measures while it processes an antitrust case against Broadcom. The case concerns recent licensing changes made by the chip designer on the virtualization platform VMware.

Microcontrollers (MCUs), widely used across industrial automation, medical devices, and consumer electronics, are experiencing longer delivery times as both wafer fabrication and semiconductor packaging lead times continue to extend. Industry suppliers said customers accelerated orders and pulled in shipments during the first half of 2026 amid rising prices across the supply chain, with urgent orders also on the rise.

Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design.
Shenzhen Baiwei Storage Technology said its first-half 2026 revenue and profit are likely to rise sharply, highlighting how the global AI boom is reshaping demand for memory chips and related equipment. The company's preliminary figures suggest stronger orders, improved product mix, and a recovering storage market that could matter for investors worldwide.
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically in high-bandwidth memory, or HBM.
India approved two large incentive packages on July 15 that together recast how New Delhi subsidizes electronics manufacturing: learner-per-project chip subsidies spread across a much broader slice of the value chain, paired with a new smartphone scheme designed to reward domestic components and homegrown brands rather than assembly alone. The twin moves signal a shift from simply attracting fabs and iPhone assembly toward deepening local value addition, as India tries to pull more of the global electronics supply chain away from China.