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Aug 19
SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle

SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its own shares, the largest share buyback and cancellation ever undertaken by a company listed in South Korea.

China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery times for Taiwanese aerospace and optical suppliers and, in some cases, costing them orders.
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating its shift from an etch specialist into a broader semiconductor equipment supplier.
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing only Nvidia's 75% gross margin in the fiscal first quarter of 2027 (which ended in April 2026), TSMC posted a record quarterly gross margin of 67.72% in the second quarter, with its first-half margin also reaching 67%. Related suppliers have joined the club as well.

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting how the industry's migration to larger wafers is beginning to reshape SiC economics across electric vehicles and AI power infrastructure.

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea, after the project cleared a provincial urban-planning review. The move advances a broader capacity buildout to meet growing AI memory demand.
Kenmec subsidiaries target SiC, AIDC growth
Aug 20, 10:50

Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic Materials focusing on silicon carbide (SiC), a third-generation semiconductor material, and Kentec targeting the AI data center (AIDC) market. Both companies are expected to list on Taiwan's Emerging Stock Board in October 2026.

Marvell Technology has issued Google a warrant to purchase up to 58,970,907 shares of its common stock at US$206.58 per share, according to a Form 8-K signed on August 19, 2026, by Mark Casper, the company's executive vice president, chief legal officer, and secretary. The filing does more than register a financing detail. It puts a company signature under a set of supply-chain reports that have circulated since the spring, and it attaches a dollar meter to how far the relationship is expected to run.

Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment gains, while tightening global FPGA supply is creating fresh opportunities for Chinese suppliers.