Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Naver and Nvidia announced on June 7 that the South Korean internet company will expand its AI infrastructure using Nvidia's DSX platform, starting at 55 megawatts and targeting gigawatt-scale deployment. The expansion begins at Naver's GAK Sejong data center in Sejong, South Korea.
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman Chey Tae-won on this Korea trip. The agreement covers next-generation memory co-development across Nvidia's full product roadmap and extends into semiconductor design, AI factory infrastructure and digital manufacturing.
Nvidia and Doosan Group are widening their collaboration to develop physical AI, robotics, and AI factory infrastructure that could shape industrial automation worldwide. The effort spans robotics, heavy equipment, power systems, and advanced materials, highlighting how global AI growth is increasingly tied to manufacturing, energy, and data center supply chains.
According to Nvidia's press release, SK Telecom plans to build a gigawatt-scale AI cloud in Korea, with the first AI factory set to go online in 2027. The project signals how telecom operators may evolve into global AI infrastructure providers, shaping access to computing capacity, energy use, and industrial AI deployment.
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used worldwide. The partnership targets efficiency, resilience, and faster industrial innovation, with potential implications for factories, power networks, and other critical operations globally.
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global shipping remains highly volatile amid geopolitical tensions and adjustments to energy prices and routes.
Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market demand for power management components is steadily increasing, driving growth in lead frame shipments. Demand for microcontrollers (MCUs) used in PCs, networking equipment, industrial control systems, and electric vehicles has recovered, boosting orders for QFP lead frame products. This has kept CWTC's overall capacity utilization at a high level and contributed to revenue growth.
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