TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.
Nanya Technology Corporation reported July 2026 revenue of NT$43.868 billion(US$1.353 billion), up 49.27% from June and marking a new monthly record, as stronger DDR4 contract prices lifted memory sales in the third quarter. The Taiwan memory chip maker also said revenue for the first seven months of 2026 reached NT$175.504 billion, up 660.87% from a year earlier.
Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging equipment and systems integration solutions, according to the Southern Taiwan Science Park Bureau. The move is aimed at developing next-generation tools for markets including artificial intelligence, high-performance computing, and panel-level packaging.
South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.
Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second quarter of 2026. Stronger demand for CCL-related products helped lift quarterly revenue to NT$420 million (US$13 million), up 24.2% year-over-year.
