China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory dies, chips, modules, 2U trays, and racks.

The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its NVHBM architecture, the fight is shifting toward who gets to define the base die — now emerging as the control center of next-generation HBM.

As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international cooperation, and capital. On August 31, the Taiwan Association of Quantum Computing and Information Technology (TAQCIT), SEMI, and the Taiwan Institute of Economic Research invited representatives from eight countries based in Taiwan to share details of the upcoming "2026 Taiwan Quantum Forum" and discuss whether Taiwan can become such a hub.

Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete further expansion in the second half of 2027 and gradually enter mass production, while the company has begun using an existing leased facility in the US for basic processing and manufacturing preparations.

Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.

Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic semiconductor equipment supply chain.

Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages closer cooperation between suppliers and manufacturers.

Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond IC design firms to include model developers and cloud service providers as AI reshapes how computing systems are built and connected. Vandenameele said Imec is well positioned because what is happening in AI aligns with the organization's core mission, but its role has also changed significantly.

AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology CEO and SEMI Global Board Executive Committee Chair Tien Wu said. He made the remarks at a pre-show conference on August 31 ahead of SEMICON Taiwan 2026, which runs from September 2 to 4.

Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the AI data center era has shifted firmly to power consumption. He noted that the acceleration of co-packaged optics (CPO) adoption is primarily driven by two critical bottlenecks: power and unit density.

Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5% of the company's most recent annual revenue.