TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for signs that AI demand, flagship smartphone launches, and broader wafer orders can offset inflation, materials shortages, and mounting manufacturing complexity. The market is watching for another upgrade to revenue, spending, and margin targets.
France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges, cooperation is now showing up in steel, silicon, and server racks. Foxconn, SiPearl, and a growing list of AI data center projects are turning bilateral goodwill into industrial output.
Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated for Nvidia's next-generation Vera Rubin platform, expanding the company's AI memory strategy beyond HBM into high-performance server storage.
AI servers are tightening Taiwan's power component supply chain, lifting demand for MOSFETs, PMICs, cooling motors and power management products even as weak PC demand limits suppliers' ability to pass on higher costs.
A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path for real-time brain modeling, brain-computer interfaces, and brain disease diagnosis.
