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Sep 17
CXMT cashes in on the DRAM shortage — and takes aim at HBM
ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium (SiGe) technology at GF's facility in Burlington, Vermont, as demand grows for optical connectivity used in AI and cloud data centers.

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed toward chip manufacturing rather than the energy and industrial-materials projects announced so far — and the clearest sign yet that the two countries that once dominated chipmaking could rebuild some of that capacity jointly.

Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable energy systems, data centers, and advanced computing. The achievement underscores the push for larger, higher-quality wafers that may improve efficiency, reliability, and manufacturing scale.
The multinationals that filled Semicon India 2026 committed to almost every layer of the semiconductor value chain except the one India most wants: nobody announced a new fab. Applied Materials, Lam Research, Micron, ASML, and Infineon instead put money and headcount behind equipment manufacturing, silicon components, assembly and test, research parks, and design centers. That is the supporting industry that the government's Semicon 2.0 framework explicitly targets, and the part of the chain that can be built without waiting for a customer's wafer starts.
Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented in the company's own announcements, leaving most of the tally resting on a list its chief executive read from the stage. For an India Semiconductor Mission trying to show movement from project approvals to commercial production, the distance between the claim and the paperwork is a fair measure of how early this ecosystem still is.
India's government used the opening of Semicon India 2026 to reframe what it is asking the industry to believe: not that fabs will be built, but that they are already shipping. Prime Minister Narendra Modi told the inaugural session that the mission's second phase is funded at US$13.5 billion against roughly US$8 billion for the first, and that the annual conference has moved through policy, projects, and pilot lines to arrive at commercial output — a claim the government is now inviting equipment, materials, and chemicals suppliers to underwrite with their own capital.
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping the country's materials, equipment and engineering ecosystem to strengthen its broader memory, foundry and advanced packaging business.
GaN is winning the AI power argument, not yet the cost battle
Sep 18, 08:31

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage architectures are forcing suppliers to improve efficiency and power density. But despite rapidly expanding orders and falling costs, industry researchers say GaN remains at an early stage of adoption and is unlikely to displace silicon broadly for another two to three years.

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.

Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance of data infrastructure for storing, accessing, managing, and using data at scale.

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit (IC) substrate zone within Phase 1 of the Taoyuan Aerotropolis Industrial Area. Utilizing a phased construction and staggered site handover model to accelerate tenant entry, the city aims to begin joint land preparation with manufacturers in 2028, with options to scale the zone up to nearly 100 hectares based on industry demand.