TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than 98% yield — sometimes 99% — on multiple AI customer products already in high-volume manufacturing. By Jun He's account, that is finally almost enough.
South Korean sensor IC designer Haechitech is moving beyond smartphone compass chips into enterprise solid-state drive temperature sensors, with supply to a major South Korean memory maker set to begin in 2026. The shift would end a single-supplier setup previously dominated by Texas Instruments and give Haechitech a foothold in the data center and memory markets.
Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications continue to grow, with lead times for some products stretching to 36 weeks. The company said manufacturers are shifting capacity toward high-end applications, crowding out standard-spec products.
AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device performance and into overall reliability and validation at the packaging, board, system, and even rack levels. Speaking at the 2026 OCP APAC Summit keynote on August 11, 2026, TSMC Vice President of Advanced Packaging Technology and Service Jun He said AI systems now demand far higher quality, reliability and development speed, making traditional component-only qualification insufficient and forcing 3DIC verification methods and development flows to be redefined from the system level.
Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin County, Taiwan, amid surging global demand for artificial intelligence (AI) and high-performance computing (HPC). The plant will cover an area of approximately six hectares and is expected to introduce chip-on-wafer-on-substrate (CoWoS) advanced packaging technology, with a total investment of about NT$100 billion (approx. US$3.1 billion). The first phase is scheduled to begin operations in 2028.
South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion and the government increases financial support for suppliers.
Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after fiscal fourth-quarter revenue surged 109% year-over-year to US$1.01 billion, with the company now guiding to hit its long-stated US$1.25 billion quarterly revenue target more than a quarter ahead of schedule.
Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for computing costs, energy use, and bandwidth worldwide. At the 2026 OCP APAC Summit, ASE said next-generation packaging, optics, and power delivery will be critical to scaling AI systems for global markets.
Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a sharp improvement since mass production began and strengthening its ability to compete with SK Hynix on volume and cost.
TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much of the partnership has been shaped by a customer neither company controls: Apple. At a two-day meeting that concluded August 11, directors approved a subscription of up to JPY282 billion(US$1.77 billion) for shares in the new joint venture with Sony Semiconductor Solutions Corp.
