India is now an important market for Apple in two ways. It is a growth market where the company set an all-time revenue record in the September quarter, even as overall smartphone shipments fell to a decade low. It is also a production base that, according to industry estimates, assembles roughly one in four iPhones.

Chunghwa Telecom is expanding its Google partnership by bringing the latest Google AI services to consumers, with the aim of achieving 200,000 subscribers in the first year, according to Chunghwa Telecom Consumer Business Group president Hsueh-hai Hu. The focus will be on converting existing Google One users to higher-tier plans by combining cloud storage with AI features.

Largan Technology reported October revenue of NT$5.846 billion (US$178.1 million) on November 5, down 7.0% year-over-year, while moving to consolidate its camera actuator subsidiary and advance co-packaged optics (CPO) products. Revenue for the first 10 months of 2026 reached NT$50.705 billion, an increase of approximately 1% from the same period a year earlier, as the smartphone camera lens market entered its seasonal slowdown.

Coherent is positioning itself as the optics supplier with no stake in the chip wars, two days after Marvell Technology agreed to acquire one of its closest rivals.

Chunghwa Telecom (CHT) reported consolidated revenue of NT$675.9 billion (US$2.06 billion) for the third quarter of 2026, up 16.7% year over year, with revenue, operating profit, net income attributable to shareholders, and earnings per share all exceeding the high end of its financial forecast.

US chipmaker Qualcomm will present its latest developments in 6G and AI agent-powered devices at the ninth China International Import Expo (CIIE), held from November 5 to 10 at the National Exhibition and Convention Center in Shanghai. The exhibition will mark the first public display of what Qualcomm describes as the world's first 6G terminal prototype conforming to the latest 3GPP definition.

AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical upstream materials. Indium phosphide (InP), a key substrate for high-speed optical lasers and optoelectronic devices, is increasingly sought after as 800G and 1.6T transceivers gain traction. With capacity expansion requiring time and product qualification presenting technical hurdles, securing InP wafer supplies has become a strategic priority for optical communications companies.

Apple's memory requirements for its new Apple Intelligence features have sparked debate after the launch of iOS 27 and iPadOS 27, with some older or lower-spec devices excluded from on-device AI functions and local models consuming substantial storage. The 2024 entry-level M4 iPad Pro, priced at nearly US$1,000 and equipped with only 8GB of memory, cannot run some of the latest on-device Siri AI features, while the later-released iPad Air can.

Qualcomm has secured a role in SpaceX's planned US terrestrial mobile network, turning Starlink Mobile's ambitions for integrated satellite and ground-based connectivity into a named infrastructure deployment. Announced November 4, the multi-year agreement calls for rollout to begin in 2027, with tens of thousands of sites planned over the life of the deal.

Qualcomm's fiscal fourth quarter showed a company whose growth now comes almost entirely from outside the smartphone, but not yet at a scale that can offset a shrinking handset business. Revenue fell 8% from a year earlier to US$10.3 billion for the three months ended September 27, according to the company's November 4 earnings release, as a memory-driven downturn in phone demand weighed on its largest product line while automotive chips grew sharply.

Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging, 5G and 6G communications, AI data center connectivity, and quantum computing. The agreements were unveiled during PIC Summit Europe as both sides sought to deepen semiconductor cooperation and strengthen supply chain resilience despite having no formal diplomatic relations.