Qualcomm on Tuesday unveiled its latest AI accelerator cards, the AI200 and AI250, along with corresponding rack-level system designs, signaling a major expansion of the company's ambitions in cloud-based AI computing. The two products are slated for commercial release in 2026 and 2027, respectively, and Qualcomm pledged to launch new AI accelerator models every year going forward.
Hon Hai Technology Group (Foxconn) used this week's GTC event in Washington to highlight two fronts of collaboration with Nvidia: expanding US-based AI server manufacturing and joining a new alliance with Stellantis and Uber to develop level-4 robotaxis.
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers.

