MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position. At a recent earnings call, MediaTek also raised its 2027 ASIC market share target to 15% to 20%, and industry watchers largely credit that goal to the breadth of MediaTek's ASIC services.

The intensifying US-China technology rivalry is moving beyond export controls and semiconductor restrictions. What comes next could matter more: the formation of competing international AI ecosystems.

As SpaceX accelerates its push into space-based AI data centers and NVIDIA brings Jetson GPUs into lunar exploration missions, the race to build computing infrastructure beyond Earth is moving from proof-of-concept experiments toward actual deployment.

Taiwan Mobile has raised its full-year 2026 operating profit growth outlook to 7% to 9%, excluding the impact of its planned Systex acquisition, as AI applications continue to drive demand for data center computing power and spur the company's AI data center (AIDC) expansion.

Printed circuit board (PCB) drill bit manufacturer Topoint Technology stated during its second-quarter 2026 earnings call that strong demand for artificial intelligence (AI) servers and high-performance computing (HPC) has significantly improved its product structure. High-end coated drill bit products accounted for 56% of product share in the first half of the year, already exceeding the company's original full-year target of 55%.

India's electronics and AI infrastructure ambitions are accelerating, but mounting environmental opposition, tighter Chinese visa curbs, and intensifying competition for semiconductor investment are exposing new challenges. As Google advances a US$15 billion AI data center, Larsen & Toubro (L&T) restructures its cloud business, and Dixon Technologies expands its smartphone OEM business, states are sweetening incentives to strengthen India's position in global technology supply chains.

China is accelerating construction of its national computing network, and a growing share of new capacity is likely to use supernodes. With domestic AI accelerators still trailing leading global chips in single-card performance, Chinese vendors are increasingly relying on larger card counts, high-speed interconnects and system-level optimisation to close the gap.

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called it "lousy" at a recent AI summit in Paris. SK Hynix, the market leader in this type of memory, also said it is not the final answer to AI memory bottlenecks, underscoring the industry's push to find a next-generation memory architecture beyond HBM.

Connector maker Lotes is deepening its server business, with its server quick disconnect (QD) line set to enter mass production in July, and expansion is expected to accelerate at the same time. A new-generation server platform is expected to begin small-volume shipments in the fourth quarter of 2026, followed by a larger-scale ramp-up in early 2027, making both key growth drivers to watch in the coming quarters.

Alibaba Cloud's Lingjun Zhenwu M890 supernode has officially gone live, with its initial commercial deployment in Ulanqab, Inner Mongolia—the same super data center launched six years ago. The site is now hosting next-generation AI supernode compute capabilities, bringing Alibaba Cloud's "Five Super Data Centers" back into the spotlight as the company positions itself for the AI era.

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove more heat.