Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
Simon Lin, Chairman of Wistron Corporation, offered a candid look at the tech giant's bumpy journey into venture capital during a keynote speech at Taiwan's Venture Capital Summit...
TSMC will exit the gallium nitride wafer foundry business within two years, a move that has prompted US chipmaker Navitas Semiconductor to redirect its orders to Powerchip Semiconductor...
The 2025 World Robot Conference kicked off in Beijing, China, on August 8, running for five days and showcasing more than 50 humanoid robot manufacturers. The event features the largest...
AI servers are expected to lead the electronics industry demand momentum in the second half of 2025, with Chenbro Micom and Sunon highlighting them as key drivers of operational gr...
During its earnings call on August 7, 2025, high-speed interface provider Parade stated that its second-quarter revenue grew steadily, and gross margin improved, mainly due to a better...
Connector and electronic component manufacturer CviLux has recently launched a diversified product portfolio and adjusted its global production strategy, with server and networking...
Tesla is reportedly disbanding its internal development team responsible for the Dojo supercomputer, with key personnel set to depart. This news has drawn attention from Taiwan's...
IC distribution giant WT Microelectronics' chairman Eric Cheng stated at the August 6, 2025, investor conference that strong AI demand will become the core growth driver for WT in...
The accelerating demands of artificial intelligence are redrawing the blueprint of data center infrastructure, driving server design into an era defined by rack-scale integration,...
With the rapid development of the global AI industry, demand for high-performance computing and GPU resources continues to rise, and the global AI data center market is expanding...
The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...
