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Thursday 20 July 2017
Zhonghuan Semiconductor lowers prices for mono-Si solar wafers
The second largest China-based solar-grade monocrystalline silicon wafer maker Zhonghuan Semiconductor has decreased quotes for a wafer with 190-micron) thickness to CNY5.90 (US$0.87)...
Thursday 20 July 2017
Qualcomm net profits fall 40% in fiscal 3Q17 amid Apple dispute
Qualcomm has announced revenues for its fiscal third quarter ended June 25, 2017 decreased 11% on year to US$5.4 billion, while net profits fell 40% from a year ago to US$900 million...
Thursday 20 July 2017
Powerchip, Zentel to appeal patent ruling favoring Toshiba
Powerchip Technology and Zentel Electronics will file an appeal against a Taiwan IP court patent dispute ruling in favor of Toshiba, according to the Taiwan-based companies.
Thursday 20 July 2017
STMicro extends lead time for 32-bit MCUs
STMicroelectronics has extended delivery lead times for 32-bit MCUs due to strong demand, according to industry sources. The MCU vendor has also informed its customers that it plans...
Thursday 20 July 2017
Digitimes Research: UFS-based NAND flash solutions to become mainstream storage technology for mobile devices
While today's mobile devices use either UFS (Universal Flash Storage) or eMMC (embedded multi-media card)-based NAND flash solutions to store information, eMMC5.1 chips are becoming...
Thursday 20 July 2017
TSMC InFO packaging brings more competitiveness to its 7nm process technology
Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...
Thursday 20 July 2017
IDM model no longer viable for Japan semiconductor industry: Q&A with Socionext CEO Yasuo Nishiguchi
Though still a global bellwether in many areas of semiconductor technologies, Japan's semiconductor industry is significantly losing ground in world markets, as most Japanese players,...
Wednesday 19 July 2017
Upcoming Meizu Pro 7 series reportedly to utilize MediaTek chips
Meizu is scheduled to introduce its new Pro 7 and Pro 7 Plus smartphone series on July 26. The Pro 7 model is expected to feature MediaTek's 16nm Helio P25 SoC chip while the Pro...
Wednesday 19 July 2017
Chipbond reportedly to sell partial stake in China subsidiary to BOE
Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...
Wednesday 19 July 2017
Chipbond, ChipMOS seeing robust gold bumping demand
Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...
Wednesday 19 July 2017
Digitimes Research: Panel makers pushing 10.5G lines to enrich product mix
Panel makers have been aggressively making investments in 10.5G or 11G LCD production lines anticipating that demand for 65-inch and above applications and 8K displays will surge...
Wednesday 19 July 2017
IC vendors ramping up solutions for voice assistants
A number of China- and Taiwan-based IC design houses are ramping up their production of speaker solutions, MEMS microphones and other chips to meet increasing demand for voice assistant...
Wednesday 19 July 2017
FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Tuesday 18 July 2017
Installed 8-inch fab capacity to rise through 2020, says SEMI
Installed 8-inch (200mm) fab capacity has increased since 2009, and will reach close to 5.4 million wafers per month (wpm) by the end of 2017, according to SEMI. By 2020, 200mm capacity...