CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 21 November 2017
Samsung to unseat Intel as top semiconductor supplier in 2017, says IC Insights
For the first time since 1993, the semiconductor industry is expected to witness a new number 1 supplier, according to IC Insights.
Tuesday 21 November 2017
ASE to expand WLCSP capacity at Singapore plant, sources say
In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand...
Tuesday 21 November 2017
Balazs expands advanced analytical services footprint in Taiwan for semiconductor and high technology industries in Asia
Balazs, the leader of Air Liquide analytical service offerings for its electronics customers, expands its activities in Asia and introduces new laboratory and services capabilities...
Friday 17 November 2017
Automotive electronics to see strongest growth through 2021, says IC Insights
Automotive electronic system sales are forecast to rise by a compound annual growth rate (CAGR) of 5.4% from 2016 through 2021, which is the highest among six major end-use system...
Friday 17 November 2017
China IC design revenues to surge 28% to CNY194 billion in 2017
The annual revenues of China's IC design industry are estimated to surge 28.15% on year to CNY194.598 billion (US$29.26 billion) in 2017, accounting for more than one third of the...
Friday 17 November 2017
SMIC founder to set up new CIDM in China
Richard Chang, founder and former CEO of China-based pure-play foundry Semiconductor Manufacturing International (SMIC), has orchestrated the establishment of a new foundry house...
Friday 17 November 2017
Austria chipmaker ams partners with China firm to develop 3D sensing camera solutions
Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...
Friday 17 November 2017
More Android smartphone vendors to adopt 3D sensing for new models
Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...
Friday 17 November 2017
Anpec expects fan motor drivers to drive 2018 revenue growth
Analog IC firm Anpec Electronics expects growing sales of its fan motor driver ICs to be a major revenue growth driver for the company in 2018.
Friday 17 November 2017
Samsung to continue adopting heat pipes for smartphones in 2018
Despite the recent market rumors indicating that Samsung Electronics may stop using heat pipes for its new smartphones in 2018, sources from upstream supply chain players have pointed...
Thursday 16 November 2017
AI to bring opportunities, challenges for Taiwan semiconductor industry
Artificial intelligence (AI) will bring huge business opportunities and challenges for Taiwan's semiconductor industry, and the industry will face fierce competition from China, where...
Thursday 16 November 2017
SMIC to start volume production of 14nm FinFET process in 2019
Semiconductor Manufacturing International Corp (SMIC), China's largest foundry, will kick off volume production of 14nm FinFET process technology in 2019 and launch its second-generation...
Thursday 16 November 2017
MediaTek touts Helio P in China amid Qualcomm speculation
MediaTek is aggressively persuading China smartphone vendors to adopt its Helio P processors to reduce risks of heavy reliance on Qualcomm, whose operations might be affected by Broadcom's...
Thursday 16 November 2017
Next-gen iPad Pro to feature 7nm A11X chip, says report
Speculation circulated recently in the chipmaking industry that Taiwan Semiconductor Manufacturing Company (TSMC) is gearing up for 7nm chip production for Apple's in-house designed...
Thursday 16 November 2017
Global Unichip tapes out 16nm TCAM compiler
Taiwan-based IC design service company Global Unichip has announced a successful TCAM compiler tape-out based on TSMC's 16FFC process technology.