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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 26 February 2018
North American semi equipment industry posts US$2.36 billion in January billings
North America-based manufacturers of semiconductor equipment posted US$2.36 billion in billings worldwide in January 2018 (three-month average basis), according to SEMI. The billings...
Monday 26 February 2018
Taiwan LCD driver IC makers diversifying product lines
Taiwan LCD driver IC designers are aggressively diversifying their product lines to counter the declining presence of domestic TFT LCD panel makers in the global market, and will...
Monday 26 February 2018
Chip demand for voice assistant devices rising
Chip demand for smart speakers and other voice-assistant devices has been rising, according to sources at Taiwan-based IC design houses.
Friday 23 February 2018
Integrated circuit technology advances continue to amaze, IC Insights finds
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money, according...
Friday 23 February 2018
Samsung breaks ground on new EUV line in Hwaseong
Samsung Electronics has announced that it has broken ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor...
Friday 23 February 2018
Equipment supplier Nova posts record revenues and profits for 2017
Semiconductor and LCD equipment supplier Nova Technology has reported net profits of NT$447 million (US$15.3 million) on consolidated revenues of NT$3.34 billion for 2017. Both results...
Friday 23 February 2018
China smartphone AP shipments – 4Q 2017
Based on surveys Digitimes Research conducted in China in December 2017, shipments of smartphone application processors (AP) to the China market in 2017 were able to maintain positive...
Friday 23 February 2018
Samsung Galaxy S9 devices to feature SLP, dual-lens cameras, Digitimes Research says
Samsung Electronics' forthcoming Galaxy S9 and S9+, which are expected to be unveiled at MWC 2018, are likely to employ substrate-like PCB (SLP) products to enable more space for...
Friday 23 February 2018
Intel, Unigroup Spreadtrum & RDA team up for 5G smartphone chips in China
Unigroup Spreadtrum & RDA has announced it is teaming up with Intel to develop a 5G smartphone platform designed for the China market.
Friday 23 February 2018
MediaTek reportedly shipping 12nm chips to Oppo, Vivo
MediaTek's 12nm Helio P40 series mobile chips have been adopted by Oppo and Vivo for their upcoming smartphone models, according to a report from Taiwan's TechNews.
Friday 23 February 2018
GBM to acquire 70% of Elna Printed Circuits
Global Brands Manufacture (GBM) has disclosed plans to acquire a 70% stake in Japan-based Elna Printed Circuits for a total of JPY3.5 billion (US$32.7 million).
Thursday 22 February 2018
AUO to begin shipping 8K TV panels in 1H18
AU Optronics (AUO) will begin to ship 8K TV panels in sizes ranging from 65- to 85-inch in the first half of 2018, while also ramping up shipments of all-screen displays for handset...
Thursday 22 February 2018
Samsung and Qualcomm expand foundry cooperation on EUV process technology
Samsung Electronics and Qualcomm Technologies have announced their intention to expand their decade-long foundry relationship into EUV (extreme ultra violet) lithography process technology,...
Thursday 22 February 2018
Chip orders from China smartphone sector to pick up in 2Q18
Taiwan-based IC design houses expect orders from China's smartphone industry to pick up in the second quarter of 2018, with customer orders likely to register double-digit sequential...
Thursday 22 February 2018
Seoul Semiconductor sues Mouser in Italy over patent row with Everlight
Korea-based Seoul Semiconductor has filed with a court in Itlay a charge against US-based electronic component distributor Mouser Electronics for selling LED products made by Taiwan-based...