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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 18 October 2018
CIS demand from handset, automotive sectors set to boom in 2019
CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...
Thursday 18 October 2018
Communications rise to represent largest portion of foundry sales
With tremendous growth of smartphones over the past decade, foundry sales to the communications market have soared and are now forecast to account for about 3x more than IC foundry...
Thursday 18 October 2018
Chipbond enters Huawei smartphone supply chain
Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.
Thursday 18 October 2018
Xilinx promoting acceleration solutions for datacenter servers in China
At its recent forum in Beijing, Xilinx introduced its FPGA-based acceleration solutions designed for artificial intelligence (AI) and data center applications. Dubbed Alveo, the acceleration...
Thursday 18 October 2018
Qualcomm extends Wi-Fi to 5G with 60GHz 802.11ay solutions
Qualcomm Technologies has announced a family of 60GHz Wi-Fi chipsets, the QCA64x8 and QCA64x1, delivering 10+ gigabit-per-second (Gbps) network speeds and wire-equivalent latency.
Thursday 18 October 2018
Samsung starts production of 7LPP with EUV
Samsung Electronics has started wafer production of its 7nm LPP with extreme ultraviolet (EUV) lithography technology, according to the company.
Thursday 18 October 2018
Wafer shipments forecast to set new highs through 2021, says SEMI
Worldwide shipments of polished and epitaxial silicon wafers are forecast to total 12.445 billion square inches in 2018, exceeding the market high set in 2017, according to SEMI....
Wednesday 17 October 2018
MediaTek to roll out 12nm Helio P70 mobile chip in October
MediaTek is expected to roll out its new Helio P70 mobile SoC built using a 12nm process technology later in October, aiming to maintain the shipment momentum of its mobile chips,...
Wednesday 17 October 2018
Flexium, Unimicron fined for environmental violations in China
Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.
Wednesday 17 October 2018
CEATEC Japan 2018 opens
CEATEC Japan 2018 opened on October 16, with the four-day event showcasing the country's growth strategies and Society 5.0, its vision of a super-smart community of the future in...
Wednesday 17 October 2018
China recruiting engineering talent in Taiwan IC design industry
Senior engineers and executives at Taiwan-based IC design houses are being targeted by China-based firms looking to enhance their homegrown technology capability, according to industry...
Tuesday 16 October 2018
Innolux names new vice chairman, president
Innolux has appointed its president Robert Hsiao as vice chairmanship and also promoted its vice president James Yang to president, effective immediately, according to an announcement...
Tuesday 16 October 2018
NextDrive and partners jointly release IoT gateway-based smart lock
Taiwan startup NextDrive has recently announced the latest application of its cube devices, a smart IoT gateway, to remote-control smart locking system developed in cooperation with...
Monday 15 October 2018
PMOLED panel maker WiseChp reports decreased revenues for September
PMOLED panel maker WiseChip Semiconductor has reported revenues of NT$140.61 million (US$4.54 million) for September, down 2.78% on month and 29.11% on year.
Monday 15 October 2018
Advantech to acquire 15% stake in touch panel maker Mildex
Advantech has announced it will spend NT$200 million (US$6.41 million) acquiring a 15% stake in touch panel maker Mildex Optical, an equivalent to 15.71 million shares, from Panjit...