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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 29 July 2019
Apple revving up in-house IC design capability; TSMC to benefit most
Apple has clinched a deal to acquire Intel's smartphone baseband (modem) chip business unit, and the US vendor is also expected to roll out MacBook models featuring its own ARM-based...
Monday 29 July 2019
Huawei gearing up 5G deployments via 3-pronged approach
Despite suffering hiccups in obtaining advanced 5G base stations chips from US suppliers, Huawei is still aggressively taking a three-pronged approach in carrying out its 5G deployments,...
Monday 29 July 2019
Global TV panel shipments edge up in 1H19
Global shipments of TV panels totaled 140 million units in the first half of 2019, up 3.6% from a year earlier, driven mostly by capacity ramps by China's plat panel makers, according...
Friday 26 July 2019
AUO looking to diversified operations
Despite incurring a loss of NT$2.68 billion (US$86.23 million) in the second quarter of 2019, AU Optronics (AUO) will continue to implement its value-creating policy by further diversifying...
Friday 26 July 2019
Highlights of the day: AUO pushing diversification
AUO expects its sales to remain flat sequentially in the third quarter despite the period being the traditional strong...
Friday 26 July 2019
UMC, TeraSillC jointly roll out 24GHz CMOS radar transceiver chips
UnitedDS Semiconductor (UDS), a China-based IC design affiliate of United Microelectronics (UMC), and Taiwan's mmWave chip designer TeraSillC have jointly rolled out 24GHz radar transceiver...
Friday 26 July 2019
Huawei sharply boosts adoption ratio of in-house mobile SoCs
Huawei is expected to have 60% of its phones powered by Hisilicon's APs in the second half of 2019, compared with 45% in the first half of the year and less than 40% in the second...
Friday 26 July 2019
Taiwan chipmakers expect rising orders for Nintendo Switch
With Nintendo set to launch its Switch game console in China next month, related chip and component suppliers are expected to see orders for the device ramp up significantly starting...
Friday 26 July 2019
Taiwan PCB firms see pull in of Huawei smartphone orders
Taiwan-based PCB manufacturers have seen orders for Huawei's smartphones pull in rapidly, particularly those for high-end models, according to industry sources.
Friday 26 July 2019
AUO gives flat outlook for 3Q19
AU Optronics (AUO) expects its sales for the third quarter of 2019 to remain at the same levels as a quarter earlier because there is uncertainty about demand in the traditional high...
Friday 26 July 2019
Intel reports 2Q19 financial results
Intel has reported second-quarter 2019 financial results, generating approximately US$7.6 billion in cash from operations, paid dividends of US$1.4 billion and used US$3 billion to...
Friday 26 July 2019
Semiconductor equipment billings stay above US$2 billion in June
Billings among North American manufacturers of semiconductor production equipment dropped on both sequential and on-year bases in June 2019 but stayed above US$2 billion, according...
Friday 26 July 2019
Apple to acquire the majority of Intel's smartphone modem business
Apple and Intel have signed an agreement for Apple to acquire the majority of Intel's smartphone modem business. Approximately 2,200 Intel employees will join Apple, along with intellectual...
Thursday 25 July 2019
IC backend firms expanding capacities on strong demand from Huawei
Taiwan IC backend service firms are moving to carry out capacity expansions to meet increased shipment demand from Huawei and its chipmaking arm HiSilicon, which, coupled with growing...
Thursday 25 July 2019
Apple supply chain cautious about orders for new iPhones
Judging from the order visibility from Apple for the third quarter of 2019, the build-up of components for the production of new iPhone devices to be released later in the year could...