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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 24 August 2020
Highlights of the day: TSMC and Samsung keen on developing packaging technology
TSMC has been devoting a lot of efforts to developing packaging technology in line with its efforts to extend the validity of Moore's Law. The foundry house's packaging...
Monday 24 August 2020
Panel makers developing OLEDoS for AR/VR, says Digitimes Research
The latest development of small- to medium-size panel technology is rapidly shifting toward AMOLED panels and related applications, including OLEDoS (OLEDon-silicon) panels for AR/VR...
Monday 24 August 2020
Taiwan IC designers to see growing pressure from China homegrown competitors
Taiwan's IC designers have benefited the most from China's de-Americanization campaign, but they will have to brace for new competition pressure from Chinese chipmakers aggressively...
Monday 24 August 2020
Semiconductor equipment supplier Trusval swings to profit
Taiwan-based Trusval Technology swung to net profits of NT$45.19 million (US$1.54 million) in the second quarter from losses in the prior quarter, with gross margin climbing 18.76pp...
Monday 24 August 2020
TSMC makes 1 billionth defect-free 7nm chip
TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.
Monday 24 August 2020
Demand for TWS chips warming up
Demand for chips needed for production of true wireless studio (TWS) devices has rebounded recently, fueled by orders from non-AirPods vendors who have seen a pick-up in sales of...
Monday 24 August 2020
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Friday 21 August 2020
Highlights of the day: TSMC to detail chip development at upcoming forum
TSMC is going to disclose more about the development of its sub-3nm manufacturing processes and SoIC at its upcoming technology...
Friday 21 August 2020
North American semi equipment industry billings rise
Monthly billings of North American semiconductor equipment manufacturers registered double-digit increases on both sequential and on-year bases in July 2020.
Friday 21 August 2020
Nan Ya delivers sample SiP substrates for 5nm chips
Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...
Friday 21 August 2020
IntelliEPI to start trial production of GaN epi wafers in September
Intelligent Epitaxy Technology (IntelliEPI), which supplies compound semiconductor epitaxial wafers, will start trial production of GaN epi wafers in September, seeking to tap the...
Friday 21 August 2020
MediaTek conducts public test of 5G satellite IoT data connection with Inmarsat
MediaTek has announced a successful field trial that transfers data through Inmarsat's Alphasat L-band satellite in Geostationary Orbit (GEO) 35,000 kilometers above the equator....
Thursday 20 August 2020
Highlights of the day: Memory chipmakers see headwinds
The US trade sanctions on Huawei are expected to hit consumer confidence further, sending memory chipmakers bracing...
Thursday 20 August 2020
Semiconductor firms say sales goals unchanged despite Huawei ban
Several Taiwan-based IC design houses and power semiconductor device suppliers have said their sales targets for 2020 remain unchanged despite recent reports indicating that Huawei...
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...