Taiwan-based IC design houses see mixed shipment momentum for different segments in the second half of the year, with PC peripheral chips to sustain strong demand, handset chips to...
Taiwan's tech firms have intensified coronavirus-prevention measures after COVID-19 hit some local semiconductors plants, with KYEC bearing the brunt of the impacts, raising concerns...
Globalfoundries has announced that the foundry and silicon wafer supplier GlobalWafers have struck a US$800 million agreement to add 300mm silicon-on-insulator (SOI) wafer manufacturing...
Nan Ya PCB and Kinsus Interconnect Technology continued to see their May sales driven by robust shipments of IC substrates, and are both poised to enjoy a strong 2021, according to...
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Technology Group, has announced suspension of its fab operations in Taiwan for two days...
Taiwan-based PCB equipment maker Taliang Technology has reported revenues for May 2021 of NT$438 million (US$15.8 million), up 2.3% sequentially and a robust 174.8% on year, and a...
MediaTek, a major customer of OSAT King Yuan Electronics (KYEC) which halted its chip production for two days due to a cluster of COVID-19 infections at its factory site in northern...
Taiwan's PCB makers are accelerating their deployments in the miniLED backlighting boards as more non-Apple notebook vendors continue to roll out new miniLED-backlit gaming and creator...
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Samsung Electronics is expected to see sales of its non-memory business particularly the system LSI segment boom this year, buoyed by strong demand for handset application processors,...
Brand PC vendors, such as HP, have moved to skip usual practice by placing orders directly with IC design houses that usually land orders from ODMs, according to industry sources.
Automotive PCB makers have seen overbooking at clients ease a little, but order visibility still continues to lengthen as clients remain eager to secure longer-term capacity supply,...
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
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