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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Tuesday 9 May 2023
Neo Semiconductor develops 3D NAND-like DRAM
Neo Semiconductor has announced the release of 3D X-DRAM, the world's first 3D NAND-like DRAM, which the company believes would eliminate DRAM's capacity issue and replace the entire...
Tuesday 9 May 2023
Samsung eyes AI for semiconductor production efficiency
Samsung Electronics has been suffering from the memory industry slump. Investment in equipment is expensive and increasingly a burden to the company. Sources from South Korean memory...
Tuesday 9 May 2023
VIA Labs uncertain about 2H23 demand prospects
VIA Labs, a subsidiary of VIA Technologies specializing in high-speed transmission chips, has expressed uncertainty regarding the demand outlook for the second half of this year.
Tuesday 9 May 2023
Zhen Ding cautious about 1H23 business prospects
PCB and IC substrate manufacturer Zhen Ding Technology has expressed caution about its business prospects for the first half of this year, citing ongoing inventory adjustments throughout...
Tuesday 9 May 2023
Nuvoton warns of limited long-term order visibility
MCU specialist Nuvoton Technology has warned of limited long-term order visibility, claiming the market recovery is not proceeding as fast as expected and the industry's inventory...
Tuesday 9 May 2023
Canadian AI startup Astrus on the way to revolutionize analog chip design
Astrus, a Canada-based startup focusing on analog IC design automation, is aspiring to revolutionize the global chip design industry by leveraging recent breakthroughs in artificial...
Tuesday 9 May 2023
3D chip stacking tech competition intensifying
TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.
Tuesday 9 May 2023
Taiwan PMIC suppliers see increased competition from IDMs
Taiwan-based power management IC (PMIC) producers had previously expressed fear that Europe- and US-based IDMs would return to the consumer PMIC segment, and this appears to be the...
Monday 8 May 2023
Nvidia's new mid-end gaming series to be mild boost to peripheral IC packaging & testing
The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...
Monday 8 May 2023
Mobile peripheral chips expect weak recovery with lack of optimism from both MediaTek and Qualcomm
After MediaTek issued a negative outlook regarding the 2023 mobile phone market, Qualcomm, MediaTek's top rival, also admitted during its latest earnings call that the weak demand...
Monday 8 May 2023
BenQ Materials expects robust demand for consumer medical products in China in 2Q23
BenQ Materials has continued to shift its business focus toward medical-related products, away from polarizers, which have gradually seen a reduced revenue contribution and expects...
Monday 8 May 2023
Qualcomm to acquire Autotalks
Qualcomm has entered into a definitive agreement to acquire Autotalks, a fabless semiconductor company dedicated to vehicle-to-everything (V2X) communications. The transaction is...
Monday 8 May 2023
Nan Ya sees 1Q23 profit fall to 8-quarter low
Nan Ya PCB, among Taiwan's major ABF substrate suppliers, saw its net profits hit an eight-quarter low of NT$2.325 billion (US$75.8 million) in the first quarter of 2023. EPS for...
Monday 8 May 2023
China reportedly pours CNY12.1 billion into local chipmaking sector
In 2022, the Chinese government allocated CNY12.1 billion (US$1.75 billion) in subsidies to 190 listed semiconductor companies to fill the gap left by US restrictions on advanced...
Monday 8 May 2023
DDI firm Fitipower cautious about 2H23 market prospects
Fitipower Integrated Technology, a Foxconn Group affiliate specializing in display driver ICs (DDI), has expressed caution about its market prospects for the second half of 2023.