After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...

Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...

Zhen Ding Technology Group (ZDT), the world's largest printed circuit board (PCB) manufacturer, returned to SEMICON Taiwan 2025 to highlight how the AI boom is reshaping PCBs from...

The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...

Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...

Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...

NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...

The global market for ultra-large-sized TVs continues to grow, with leading brands such as Samsung Electronics, TCL, and Hisense all launching massive 115 or 116-inch screens in 2025...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...

Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...

Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...

The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...