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Monday 30 March 2026
China's semiconductor capacity share to reach 32% by 2030
The global semiconductor industry is undergoing a structural transformation. SEMI estimates that in 2025, capital expenditures (CapEx) by the four largest US cloud service providers...
Monday 30 March 2026
Arm pushes beyond licensing with a new AI CPU platform
Since Arm formally launched its Arm AGI CPU platform and upended its long-standing business model, industry observers have been eager to understand both the mechanics behind the move...
Monday 30 March 2026
AI-driven memory market set to top US$600 billion on rising storage demand
The global semiconductor memory market is expected to surpass US$600 billion by 2026, as artificial intelligence accelerates a shift toward high-performance storage, according to industry...
Monday 30 March 2026
Sumco shifts wafer strategy to equipment upgrades over new plant
Sumco has revised its semiconductor wafer supply plan to prioritize upgrading existing fabrication equipment over building new capacity, following approval from Japan's Ministry of...
Monday 30 March 2026
Analysis: Terafab's scale raises market doubts; is Elon Musk aiming to dominate chip supply chain?
Elon Musk recently announced the launch of the "Terafab" project, aiming to expand compute production capacity to 1 TW per year, which is about 50 times the current global compute...
Monday 30 March 2026
AI optical boom forces FICG into overdrive expansion
Demand for optical communication modules driven by artificial intelligence is exceeding supply, prompting FIC Global (FICG) to accelerate capacity expansion in Malaysia and China,...
Monday 30 March 2026
SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward
Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.
Monday 30 March 2026
China launches probe into US green product trade barriers
China's Ministry of Commerce has launched an investigation into what it describes as US trade barriers affecting green products, citing domestic trade law provisions that allow authorities...
Monday 30 March 2026
Thermoplastic composites see growing applications in EVs and humanoid robots
Thermoplastic composites have emerged as key materials in manufacturing worldwide, as production trends toward lightweighting and automation. With competition in the field now intensifying,...
Monday 30 March 2026
NeurIPS rule barring OFAC-listed institutions raises global collaboration concerns
NeurIPS' new rule barring institutions on the US Treasury Department's OFAC entity list from submitting papers, reviewing, or editing risks fracturing global AI collaboration, excluding...
Monday 30 March 2026
AI compression won't ease memory crunch, NAND shortage set to persist
AI-driven demand is tightening global memory supply, pushing NAND flash and server DRAM into shortages, price hikes, and capacity constraints. Server memory demand is expected to grow...
Monday 30 March 2026
2026 Global Helium Supply Crisis: Strategic Implications for Semiconductor and Storage Supply Chains

The global helium market is currently facing an unprecedented supply shock, driven by geopolitical instability in the Middle East. As of March 2026, disruptions at Qatar's...

Monday 30 March 2026
China foundry SMIC moves to capture growth beyond AI-led supply squeeze

SMIC on March 26 outlined an action plan to strengthen core operations and identify new growth drivers in 2026, targeting revenue growth...

Monday 30 March 2026
SMIC accused of supplying chipmaking tools to Iran military, US officials say
SMIC, China's largest chipmaker, is accused by senior Trump administration officials of supplying chipmaking equipment to Iran's military, escalating tensions linked to the ongoing...
Sunday 29 March 2026
Innodisk says AI success depends on software-hardware integration, signaling shifts for edge and industry deployments
Innodisk told attendees at the 2026 AI EXPO that effective AI deployment requires more than raw computing power; it depends on tight integration between software and hardware, and...