Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components. US optical communications leaders Coherent and Lumentum are actively developing 6-inch indium phosphide (InP) wafer production technology. Industry sources said 4-inch wafers remain the mainstream format, but fast-growing demand in optical communications is accelerating the shift toward 6-inch substrates. Supply constraints, however, persist, with substrate technology maturity and supply availability cited as the main bottlenecks.

Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case targeting a Taiwanese vendor. Sercomm recently disclosed that its German subsidiary, Sercomm Deutschland GmbH, had received a lawsuit from Huawei over certain Wi-Fi 6 products sold in Germany and other markets.

AI glasses are gaining momentum as Meta, Rokid, RayNeo, Xreal, Viture, HTC, and other vendors step up their efforts, with Google and Samsung Electronics expected to enter the market in the second half of 2026. The category is widely seen as a potential essential mobile device after the smartphone.

China has launched a probe into a Beidou high-precision smart monitoring project in Shandong, after reports of severe construction defects at the base sparked public concern over the quality of new infrastructure projects. The project, with a total investment of nearly CNY300 million (US$44.4 million), has drawn scrutiny after its base structures were described as "easy to tear apart by hand."

Backed by Google, researchers at the University of California, San Diego, are repurposing retired Pixel phones into a computing cluster that could lower costs and cut e-waste. The project matters far beyond one campus, as it points to a possible model for affordable, local cloud infrastructure that could interest schools and smaller organizations worldwide.