NAND flash pices may stablize in 2022, but supply is likely to turn tight in the second half of next year, according to Silicon Motion's president. Meanwhile, Chinese memory maker YMTC is ready to volume produce 128-layer QLC NAND flash, initially targeting consumer SSDs. And in a recent interview by DIGITIMES, Harish Krishnaswamy, CTO and co-founder of MixComm, and Marzieh Veyseh, CTO/CPO and co-founder of SiTune, talked about their views on the development of mmWave market, latest chip crunch, and the Satcom market opportunities.
Suppliers said demand from Chinese handset vendors is getting opaque in September, portending possible deferral of peak demand and possible decline in suppliers' revenue for the second half of 2021.
For the sixth straight quarter, the global smartphone applications processor (AP) market clocked a double-digit on-year revenue increase in the second quarter of 2021, according to Strategy Analytics.
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according to industry sources.
Following in the footsteps of International IDMs and automakers to promote their SiC components for EVs, China auto and semiconductors makers are also preparing their homegrown SiC chips and modules for EV applications. After the announcement to develop SiC components a few weeks ago, Foxconn continues its investment in EV business with PPT in Thailand to expand its EV supply chains to Southeast Asia. In addition to EV manufacturing, its maintenance service recently has aroused many discussions from different sides, due to the eight-year warrants of early Tesla Model S and Model X being expired soon.
Taiwan-based chipmaker MediaTek announced its plans to recruit more innovation staff in India to support local manufacturing, according to PTI, although the actual number of new employees they are looking for is not disclosed.
Mirle Automation, dedicated to supplying automated logistics systems and flat panel display (FPD) transporting equipment, has seen its backlog of orders exceed NT$10 billion (US$360.6 million), which is over 20% above the level a year earlier, according to the company.
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
MediaTek has expanded its recruitment scale in Taiwan, looking to hire an additional over 2,000 design engineers to support its business expansion goals.
Taiwan's suppliers of high-speed transmission chips, which have obtained commitments from foundries to provide sufficient capacity support next year, are gearing up for a boom in their output value, according to industry sources.