ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM supplier closer to the core market of domestic rival Yangtze Memory Technologies (YMTC) as enterprise storage becomes a bigger part of the memory growth story.

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip stage at Samsung Foundry, adding a manufacturing dimension to Samsung's recent investment in the two-year-old company.

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that wider adoption of co-packaged optics (CPO) could reduce high-speed transmission requirements for AI server motherboard printed circuit boards (PCBs).

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such as Apple's A20 Pro and MediaTek's Dimensity 9600 Pro are clearly concentrated in the neural processing unit (NPU). Qualcomm also published a technical article on NPU development on September 10, saying its next-generation NPU will expand shared memory capacity to improve access efficiency and speed for model data, helping mobile AI maintain fast response times.

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium (SiGe) technology at GF's facility in Burlington, Vermont, as demand grows for optical connectivity used in AI and cloud data centers.

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed toward chip manufacturing rather than the energy and industrial-materials projects announced so far — and the clearest sign yet that the two countries that once dominated chipmaking could rebuild some of that capacity jointly.