Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.
Apple's memory requirements for its new Apple Intelligence features have sparked debate after the launch of iOS 27 and iPadOS 27, with some older or lower-spec devices excluded from on-device AI functions and local models consuming substantial storage. The 2024 entry-level M4 iPad Pro, priced at nearly US$1,000 and equipped with only 8GB of memory, cannot run some of the latest on-device Siri AI features, while the later-released iPad Air can.
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production efficiency, allowing the company to expand server DRAM supply even as it concentrates capacity on HBM, a trend also reflected in the growth of its DRAM capacity disclosed in its financial results for the third quarter of 2026.
Arm delivered a record-breaking second quarter for fiscal year 2027, reporting total revenue of US$1.44 billion, up 27% year-over-year. This milestone marks the company's fifth straight quarter of growth exceeding 20%, driven by massive acceleration in its licensing business and strong demand for its artificial intelligence (AI) infrastructure.
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares to select 10 strategic customers for long-term agreements that would reserve production capacity from 2029 through 2032.
German quantum-sensing startup QuantumDiamonds has tested its technology on high-bandwidth memory (HBM) devices, including cases involving individual through-silicon via (TSV) failures, as it works to bring its chip defect detection technology into semiconductor production lines. The company, however, does not yet have a high-throughput wafer inspection system.
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory (HBM) and advanced DRAM, the tightening supply of mainstream DRAM is allowing CXMT to capitalise on domestic demand and capacity expansion.
Anthropic has reportedly told investors that its chip design team, comprising just 15 people, is using its Claude models to design custom chips. It and another frontier lab, OpenAI, are beginning to probe the AI-assisted chip design market as a new business area, even as they seek to produce their own silicon.
Mitsui Chemicals is planning to acquire semiconductor materials maker JSR from state-backed Japan Investment (JIC) in a deal potentially worth more than JPY1.3 trillion (US$8.2 billion), which would rank as the largest acquisition in Japan's chemicals sector, according to reports by Nikkei Asia and Reuters on November 4, 2026.
GlobalFoundries is gaining traction in custom silicon, processor intellectual property (IP) and physical AI applications, as the chipmaker seeks to expand its role beyond wafer manufacturing and capture more value from customer chip development. The company secured custom silicon design wins representing nearly US$1 billion in lifetime revenue during the third quarter, CEO Tim Breen said on its November 4, 2026, earnings call.
Qualcomm has secured a role in SpaceX's planned US terrestrial mobile network, turning Starlink Mobile's ambitions for integrated satellite and ground-based connectivity into a named infrastructure deployment. Announced November 4, the multi-year agreement calls for rollout to begin in 2027, with tens of thousands of sites planned over the life of the deal.
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