Acer is set to elect new board members at its 2026 shareholders' meeting, with Taiwan Semiconductor Manufacturing Company (TSMC) senior vice president Lora Ho included in the list of nominees for the new board. Industry observers expect her nomination to be approved at Acer's shareholder meeting on May 29.

SK Hynix said it has confidentially submitted a registration statement to the US Securities and Exchange Commission for a potential listing of American depositary shares, as part of a broader push to tap global capital markets.

Arm has officially launched the Arm AGI CPU, a new class of mass-production-ready processor built on its Neoverse platform and designed to power next-generation AI infrastructure. Mohamed Awad, executive vice president of Arm's cloud AI business, also outlined the company's latest strategic roadmap alongside the announcement.

Arm on March 24, 2026, announced the Arm AGI CPU, its first mass-produced chip product, designed specifically for AI data centers and built on TSMC's 3nm process. The company presented the chip as a response to accelerating demand for processors capable of handling agentic AI workloads at scale.

Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial core business growth in the second half of 2026. Despite headwinds from geopolitical tensions and competition from China, TMC is cautiously optimistic about full-year operations, backed by product line expansions and advanced process deployments, with current capacity utilization exceeding 90%.

According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above 20%. This follows a downturn in 2023 and reflects a strong AI-driven recovery. The data processing segment, led by companies such as Nvidia, recorded the fastest expansion, while all major end markets — including automotive, industrial, and consumer — returned to growth, pointing to a broad-based recovery rather than the uneven rebound seen in 2024.

SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production capacity for advanced memory products such as high-bandwidth memory (HBM), further cementing its leadership in the global AI semiconductor sector.

Every advanced chip leaves behind a chemical trail. The solvents, acids, and sludge generated in semiconductor fabrication are growing faster than the fabs themselves — and for most of the world, they remain an expensive, hazardous liability. In Taiwan, one company has turned that problem into a business.

SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI architectures, according to Nikkei and PC Watch.

Memory module maker Team Group reported a record-high monthly profit for January 2026, with earnings soaring over 50 times year-over-year. Although shipments declined in February due to the Lunar New Year holidays, the company expects a full recovery of shipment momentum over March. Annual procurement strategies and specification adjustments among system integrator (SI), edge computing, and OEM customers for high-end memory products are anticipated to drive sales in the second quarter of 2026.

Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet.