DIGITIMES Semiconductors news

Sep 22

India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout

Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September 17, alongside CDIL Semiconductor's assembly, testing, marking, and packaging unit in Mohali, Punjab. The two facilities take the number of semiconductor projects in commercial production in India to five, according to The New Indian Express, joining Micron, Kaynes Semicon, and CG Semi at Sanand in Gujarat.

Anthropic, OpenAI expected to start buying memory directly in 2027

Sep 22

DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

Sep 22

Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

Sep 22

Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

Sep 22

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PASSIVE, PCB, OTHER IC COMPONENTSNvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

Sep 23, 13:07

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density and energy consumption. Nvidia's transition toward an 800V high-voltage direct current (HVDC) power architecture is driving hardware upgrades across sidecar power cabinets and battery backup units (BBUs), while spurring demand for customized high-voltage NP0 (C0G) multilayer ceramic capacitors (MLCCs).

IC MANUFACTURINGNexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Sep 23, 12:35

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply chain spanning design, wafer production, packaging, and testing.

IC MANUFACTURINGEpisil says AI demand marks structural shift in semiconductor epitaxy

Sep 23, 11:55

Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is expanding in silicon, GaN, SiC, and GeSi to serve AI servers, optical communications, and mature-node power components worldwide.

MEMORY CHIPSSK hynix's venture arm moves beyond memory into optical interconnect and system software

Sep 23, 11:50

SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing, data centers, system software and optical interconnect — areas that sit beside and above its own products rather than inside them.

IC MANUFACTURINGTaiwan's August export orders top US$100 billion as overseas production edges up

Sep 23, 09:27

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month, according to statistics released by Taiwan's Ministry of Economic Affairs (MOEA) on September 22. Export orders for September are forecast to be between US$106 billion and US$109.1 billion, representing year-over-year growth of 50.7% to 55.1%.

IC MANUFACTURINGTaiwan courts Indian IIT chief in bid to boost chip talent ties

Sep 23, 09:05

Taiwan is stepping up outreach to India's engineering sector as global competition for chip and artificial intelligence talent intensifies. The planned cooperation could affect supply chains, university links, and where skilled graduates build careers, with implications for chipmaking hubs in Asia and beyond.

IC MANUFACTURINGWin Semiconductors expands optical communications capacity with DUV tools

Sep 23, 08:13

Optical communications capacity is in short supply as surging computing demand from AI data centers turns transmission into a bottleneck for AI infrastructure. The market is shifting toward combined optical-and-copper solutions, while optical communications rapidly advances toward 800G and 1.6T, prompting compound semiconductor foundry Win Semiconductors to expand its photodiode (PD) and laser diode (LD) capacity and co-develop 200G components with customers.

IC DESIGN, DISTRIBUTIONAscend 950 clears higher security bar in China's latest chip assessment: who else qualified?

Sep 23, 08:12

China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's M100 at Level I among AI training and inference chips. The same assessment also gave the highest Level III rating to several general-purpose CPUs, including Loongson and HiSilicon Kunpeng products, signalling that certification is becoming a more structured gatekeeper for China's locally developed compute infrastructure.

IC DESIGN, DISTRIBUTIONLightmatter launches an optical module that cuts AI cluster fiber in half

Sep 23, 08:12

US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect GPUs in large AI clusters.

IC DESIGN, DISTRIBUTIONSiPearl delivers first homegrown server chips for Europe's exascale supercomputer

Sep 22

SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the European-designed processor from bring-up and validation into customer system integration while benchmarking continues.

IC DESIGN, DISTRIBUTIONMeta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion

Sep 22

Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up chip stocks by focusing attention on the importance of CPUs for agentic AI.

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Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.

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