DIGITIMES Semiconductors news

Apr 24

Intel flags price increases and supply shortages as CPU demand strengthens

Intel signaled that industry-wide supply shortages and selective price increases are helping offset weaker PC demand, even as the company works to expand supply capacity across its product lines. Management said constrained output continues to limit revenue upside in parts of the business, while rising prices and improving server CPU demand are supporting overall resilience. The company also pointed to ongoing efforts to increase supply availability, though demand in several segments continues to outpace output.

Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

Apr 24

Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Apr 24

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

Apr 24

Exclusive: Google ramps new TPU servers, Taiwan suppliers gain share

Apr 24

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IC MANUFACTURINGDIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

Apr 27, 16:47

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to DIGITIMES' special report, Accelerating enterprise AI: Hardware advancements and compute architecture transformation, the industry is moving beyond the initial buildout of training capacity and into a stage defined by large-scale deployment—where inference workloads are emerging as the primary driver of compute growth.

MEMORY CHIPSSamsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die

Apr 27, 16:44

Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions to rapidly improve yield.

PASSIVE, PCB, OTHER IC COMPONENTSThailand's PCB industry moves upmarket, local supply gaps persist

Apr 27, 16:32

Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing power accelerates.

IC MANUFACTURINGTSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron

Apr 27, 12:56

A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment giant Tokyo Electron (TEL) NT$150 million (approximately US$4.6 million) for stealing advanced chipmaking secrets — marking the first time a corporation has been penalized under Taiwan's National Security Act.

IC DESIGN, DISTRIBUTIONMeta signs deal for AWS's Graviton CPUs as inferential and agentic AI enter the scene

Apr 27, 12:32

Meta and Amazon announced on April 24 that Meta will use Graviton5 CPUs made by Amazon Web Services (AWS). The deal illustrates the growing importance of CPU chips for increasingly complex compute tasks as AI technology makes the leap from model training to autonomous agents.

IC DESIGN, DISTRIBUTIONBroadcom, Marvell set to benefit as 1.6T optical modules near mass production

Apr 27, 12:30

1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's digital signal processor (DSP) chips and Marvell's fully integrated Light Engine have begun volume production and testing, with revenue contributions expected to grow quarter by quarter this year.

IC MANUFACTURINGHCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility

Apr 27, 12:20

The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor assembly and testing (OSAT) facility in Uttar Pradesh, according to people familiar with the matter cited by The Economic Times. The project marks a further step in India's push to localize semiconductor packaging capacity amid a global supply chain diversification.

IC MANUFACTURINGDenso weighs Rohm bid withdrawal as support stalls

Apr 27, 10:54

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal for chipmaker Rohm, after failing to secure the company's support.

IC MANUFACTURINGASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave

Apr 27, 10:52

Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).

IC MANUFACTURINGTSMC's refusal of ASML's expensive High-NA EUV equipment, explained

Apr 27, 10:50

ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.

IC MANUFACTURINGWeekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea

Apr 27, 10:32

Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:

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