Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed by AUO and Radiant Opto-Electronics (ROEC) on July 30 and BenQ Materials (BMC) on July 31.

AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT, accelerates capacity expansion after a record IPO.

Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.

Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook to 19%, citing broad demand for its AI-driven chip design tools and a landmark new agreement with Intel that executives described as a historic shift in the two companies' relationship.

Anthropic has asked SK Hynix to help supply chips for its own in-house AI chip production, SK Group chairman Chey Tae-won said. He made the remarks at a recent AI summit in San Francisco, where he also disclosed that South Korea's three new investment plans in semiconductor expansion, AI data centers and physical AI would total more than US$3 trillion.