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Global server markets may shift as DIGITIMES analyst Luke Lin says Intel's revenue gains stem largely from price rises while AMD posts stronger shipment-led growth. TSMC plans another price increase as customers prioritize capacity over cost, developments that could affect cloud providers, vendors, and data center economics worldwide.
Tata Electronics has signed a memorandum of understanding with ASML to support the establishment and ramp-up of its upcoming 300mm semiconductor fab in Dholera, Gujarat, marking a significant step in India's effort to build a domestic chip manufacturing ecosystem.
Below are the most-read DIGITIMES Asia stories from the week of May 11-17, 2026:

Nan Ya PCB, one of Taiwan's leading IC substrate manufacturers, said it expects capital spending to rebound sharply in 2026, potentially reaching a record high, as demand from advanced chip packaging customers accelerates alongside the rapid growth of artificial intelligence (AI) computing.

Team Group Chairman Dann-Ning Hsia said memory prices are likely to remain elevated as AI-related demand continues to strain supply, with the company prioritizing shipments to long-term customers in industrial, automotive and gaming markets.

The Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) is moving ahead with its global science park strategy, and Mexico's Sonora has emerged as the leading candidate for an early launch, TEEMA chairman Young Liu said before the group's 27th general assembly on May 15, 2026. Liu said Sonora has the strongest chance of becoming the first site because talks began earliest there and field inspections have already been carried out three times, putting it well ahead of other candidate locations.

India's semiconductor and electronics sectors are accelerating across multiple fronts, from AI-driven power-chip development and domestic EV battery technology to smartphone manufacturing and semiconductor supply-chain expansion. Industry executives and analysts say the shift reflects India's broader effort to move beyond assembly into higher-value chip design, power electronics, and localized technology ecosystems.

Samsung Electronics' labor dispute entered a new phase on May 15 after the company's top executives issued a rare public apology and proposed resuming talks without conditions, only for the union to maintain its plan for an 18-day strike from May 21 to June 7.

Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI and agentic AI to physical AI, driven by the power efficiency and performance of advanced semiconductor technology.
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology is now rippling into legacy memory, packaging, and testing.
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.