SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES that it had not discussed commissioning eSSD controller design work.

As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to biological neuroscience to build an entirely new class of energy-efficient microelectronics. Their objective is straightforward but radical: reverse-engineer the human brain to solve the semiconductor industry's looming power and thermal bottlenecks.

The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging design.

Four major US technology companies have committed a combined US$2 billion to investments across South Korea's semiconductor materials, equipment, and clean energy sectors. The move is expected to reinforce critical supply chain resilience between the US and South Korea while providing momentum for the South Korean government's three strategic "Mega Projects."

Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise SSDs, according to a Sept. 7 report from KB Securities.

Huawei has unveiled the Kirin 9050 Pro in its new Mate XT 2 tri-fold smartphone, marking the commercial debut of the LogicFolding architecture behind its Tau Scaling Law and Huawei's first new high-performance Kirin chip introduced at a flagship launch in six years.

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions, boosted by AI tools and a single virtual fab strategy. He said the facility could reach full capacity in two to three years as demand from the market and from AI takes off.

India's most senior semiconductor policymakers came to Taipei with an argument aimed squarely at the Taiwanese supply chain: the country's chip program is meant to add redundancy to an over-concentrated global industry, not to substitute imports behind a wall. For Taiwanese materials, gas, equipment and packaging firms, that reframes India from a distant end market into a second production base their own customers are already asking them to staff.

SEMICON Taiwan, one of Taiwan's key semiconductor industry events, will move its 2027 edition forward by nearly a month to August 18-20, departing from its traditional early-to-mid-September schedule. The rapidly expanding exhibition, whose agenda increasingly centers on TSMC's strategy and technology roadmap, has grown substantially in recent years, but the new timing has raised concerns among some international supply-chain companies over summer holidays, Taiwan's heat, and peak typhoon season.

Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US, Japan, Singapore, and Europe. Demand is rising for facility engineering services, including hookup and equipment installation, and semiconductor engineering services provider Yaho System Technology (Yaho) is moving fast to capture this market.

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.