DIGITIMES Semiconductors news

Apr 27

TSMC's refusal of ASML's expensive High-NA EUV equipment, explained

ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.

TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron

Apr 27

HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility

Apr 27

DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?

Apr 27

Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress

Apr 27

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IC MANUFACTURINGAnalysis: Why Tokyo Electron's China problem goes deeper than a data breach

Apr 28, 12:26

Amid growing geopolitical tensions over the global semiconductor supply chain, what initially appeared to be an internal personnel matter is evolving into a broader case study of the operational risks that foreign equipment vendors face in China.

MEMORY CHIPSSamsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scale

Apr 28, 12:22

Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4, into full operation by the end of 2026 as the AI server boom reshapes demand for high-bandwidth memory (HBM) and advanced DRAM.

IC DESIGN, DISTRIBUTIONChinese GPU maker Lisuan secures Microsoft WHQL certification for 6nm chip

Apr 28, 12:12

China-based GPU designer Lisuan Tech has secured Windows Hardware Quality Labs (WHQL) certification from Microsoft, becoming the first Chinese company and the fourth globally to receive official GPU compatibility endorsement.

IC DESIGN, DISTRIBUTIONNvidia says GPU allocation follows first-come, first-served principle, not highest bidder

Apr 28, 12:02

Nvidia CEO Jensen Huang clarified in an April 2026 interview with Silicon Valley podcast host Dwarkesh Patel that the company allocates GPUs based on a first-come, first-served principle rather than a highest bidder wins approach.

IC MANUFACTURINGUS chip packaging capacity to hit 10% by 2032

Apr 28, 12:02

The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing capacities stateside, strengthening local OSAT capabilities is seen as the "last mile" in building a domestic supply chain.

IC DESIGN, DISTRIBUTIONIntel prioritizes Xeon; CPU shortage opens door for AMD and MediaTek

Apr 28, 11:37

Generative AI has driven a surge in GPU demand and accelerated a structural reshaping of the semiconductor industry. At the same time, CPUs are re-emerging after years of being sidelined, with demand rising sharply and pushing Intel into a rare supply shortage. Intel executives said demand is far exceeding supply, with capacity constraints costing billions of dollars in lost revenue.

MEMORY CHIPSWuhan unveils US$38 billion plan; YMTC and XMC lead memory expansion

Apr 28, 10:51

China's central tech hub Wuhan has unveiled its 2026 major project plan, targeting 355 city-level projects with total investment exceeding CNY260 billion (approx. US$38.1 billion).

IC DESIGN, DISTRIBUTIONCadence signals strong start to 2026 as AI drives growth across EDA and IP

Apr 28, 10:20

Cadence Design Systems reported a robust first quarter for 2026, underscoring how accelerating demand for AI is reshaping semiconductor design and expanding the role of electronic design automation (EDA) tools.

IC MANUFACTURINGStrong demand and advanced packaging execution drive Amkor's upbeat quarter

Apr 28, 09:40

Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packaging.

IC DESIGN, DISTRIBUTIONAI-driven demand and record backlog fuel Cadence's strong start to 2026

Apr 28, 09:32

Cadence Design Systems reported a solid first quarter for 2026, with growth driven by accelerating AI demand and sustained customer investment in chip and system design tools.

IC MANUFACTURINGTSMC 2nm leak case results in NT$150M fine for TEL; company says no confidential data was leaked and discussions are underway

Apr 28, 07:33

In the trade secret leak case involving TSMC's 2nm process, the Intellectual Property and Commercial Court ruled on April 27, 2026, that Tokyo Electron (TEL), the equipment supplier involved, must pay a fine of NT$150 million (US$4.8 million), marking the first penalty imposed on a legal entity under the National Security Act.

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