Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the company expands capacity, upgrades processes and pushes further into server memory.
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment supply chain. Its overall business portfolio is also shifting increasingly toward semiconductors, with the company formally reclassified as a semiconductor stock on the Taipei Stock Exchange in 2025.
ASML issued joint statements with Intel Foundry, TSMC and Samsung Electronics on September 8, converging the three leading-edge chipmakers on a transition from the semiconductor industry's decades-old 6-inch photomask to a larger 12-inch format for High NA EUV lithography. Only TSMC attached a schedule to it.
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different challenges across Insertion 1 through Insertion 4.
Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from an earlier 12-high design, as rising memory costs put greater emphasis on bandwidth efficiency and overall system economics.
Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line is likely heading toward end-of-life (EOL) as CEO Lip-Bu Tan reshapes the business to cut low-margin products and lift overall profitability.
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI chip customers. The share is estimated at 50–60% as of August, according to ZDNet Korea.
After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next year, signaling a renewed push into a market where AI and advanced packaging are raising the stakes for equipment suppliers.
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR) is not necessarily the hardest part. The more difficult question comes later: who will shoulder the enormous and recurring cost of keeping advanced semiconductor research infrastructure running?
Huawei's Kirin 9050 Pro is the first commercial test of its Tau Scaling Law, with the company claiming a 55% increase in transistor density at the same process node while cutting NPU, GPU and CPU performance-core power by 66%, 58% and 41%, respectively.
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