DIGITIMES Semiconductors news

Sep 16

Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and Answers for the AI Era" forum on September 15. Students asked how TSMC determines whether a technology is worth long-term investment when information is incomplete and the technological direction remains unclear, as well as how people can develop the ability to judge whether answers generated by artificial intelligence (AI) are true or false in the AI era.

Taiwan, South Korea should stop comparing, says DIGITIMES chairman

Sep 16

SK Hynix, Intel in talks on US production to ease memory crunch

Sep 16

Samsung reportedly weighs Micron's newest memory for Galaxy S27

Sep 16

A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors

Sep 16

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MEMORY CHIPSSamsung looks to outside suppliers as HBM boom shifts priorities

Sep 17, 01:54

Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and packaging. However, recent sourcing moves suggest those internal links are becoming more selective as individual businesses pursue their own customers, margins and capacity priorities.

IC MANUFACTURINGTSMC's C.C. Wei says to solve problems, put customers first

Sep 17, 00:40

TSMC chairman C.C. Wei and co-COO Y.J. Mii joined a forum on September 15, 2026, where Wei shared lessons from school, R&D and corporate management with National Taiwan University students via video, while Mii led a deeper discussion on advanced process technology and AI tools.

IC DESIGN, DISTRIBUTIONJensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Sep 17, 00:39

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.

IC DESIGN, DISTRIBUTIONCharts: Memory chip designers carry Taiwan's IC design rebound

Sep 17, 00:36

Taiwan's IC design sector is growing fast, but the gains are concentrated in memory. Combined January–August 2026 revenue at the 105 listed chip designers tracked by DIGITIMES reached NT$1.15 trillion, up 29.6% from a year earlier. Five memory-related companies added two-thirds of the NT$261.8 billion increase.

IC DESIGN, DISTRIBUTIONHuawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Sep 17, 00:10

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.

MEMORY CHIPSInfineon exits NOR Flash with US$1.12 billion sale to Winbond, reviving Spansion name

Sep 16

Winbond Electronics will buy Infineon Technologies' NOR Flash and F-RAM business for US$1.12 billion in cash and rename it Spansion, the name of the US memory pioneer whose NOR Flash line forms the core of the business.

MEMORY CHIPSSamsung advances jump 70% amid shift to long-term memory deals

Sep 16

Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers increasingly turn to multi-year agreements to secure supply and improve demand visibility.

IC MANUFACTURINGIndia's Eastern state clears SiCSem's SiC unit in SEZ

Sep 16

The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar, a project with an investment of INR34.06 billion (US$355 million) and expected to employ about 1,270 people directly.

IC DESIGN, DISTRIBUTIONNvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage

Sep 16

US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a turbulent economic period marked by an April 2025 tariff surge where both nations raised levies above 100% before reaching a temporary stalemate. Alongside traditional trade discussions and potential climate change or pandemic prevention talks, technology leadership, export controls, and regulatory frameworks are set to dominate the agenda.

IC MANUFACTURINGSamsung and Qualcomm jointly developing organic bridges for 2.1D packaging

Sep 16

Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser, and higher-performing, bolstering the value of the advanced packaging end of the chip process.

MEMORY CHIPSSK Hynix union approves revised pay deal after 25-vote rejection

Sep 16

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.

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