Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's United Microelectronics Corporation (UMC), South Korea's Dealsite reported on November 12, citing industry sources.

Qualcomm has started laying off employees in India, its largest engineering base outside the US, as the chipmaker carries out a performance-focused global workforce reduction amid a fall in smartphone chip sales.

The controversy surrounding Nvidia CEO Jensen Huang has grown from a personal dispute into a broader question about corporate governance, succession planning, and the shifting power structure of the global AI supply chain. With Huang's formal resignation, the AI industry faces a new period of uncertainty, and Taiwan's supply chain must reassess its partnerships, order allocations, and industry interests.

Nvidia co-founder Jensen Huang resigned as president, CEO and board member on November 12, effective immediately, the company's board said. He had led the company for 33 years, since its founding.

Micron Technology has responded to an open letter from the Taoyuan Union, a labor group in Taiwan, about its ongoing contract talks. Taoyuan is a city in northern Taiwan where Micron has a large factory, and the dispute centers on a new employee bonus program that the union has been pressing the company to discuss.

Foxconn reported third-quarter 2026 revenue of more than NT$3 trillion (US$91 billion) and raised its full-year outlook, while taking a "cautiously optimistic" view of 2027 and forecasting high-double-digit growth in AI rack shipments. The company expects to gain market share through diversified AI solutions and an expanding customer base, but warned that component supplies, geopolitical and economic conditions, inflation, and monetary policy will shape its 2027 operations.

Tata Electronics is lining up fresh debt at a moment when nearly every leg of its expansion has run into friction: a flagship chip fab whose production start has moved from the end of 2026 to mid-2028 and will launch on an older process, losses that widened even as revenue doubled, and a run of incidents at its iPhone component plant in Tamil Nadu.

With Chinese and US leaders expected to meet on October 18 during the APEC Economic Leaders' Meeting, allegations involving Nvidia CEO Jensen Huang's extramarital affair and supposed links to Chinese espionage continue to escalate. China's state-run Global Times questioned whether the closely timed media reports and congressional actions reflect political maneuvering behind US technology policy toward China.

Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising demand for AI server memory.

DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have also become increasingly pronounced, prompting industry players to invest in the development of different core-layer materials. Glass, which offers excellent flatness and an adjustable coefficient of thermal expansion (CTE) that can be brought closer to that of silicon, can help reduce warpage. As a result, it has emerged as a closely watched core-layer solution and a key focus of future technology development.

Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded. South Korea has also become Taiwan’s largest trade deficit partner, with Taiwan’s deficit reaching US$59.37 billion in the first 10 months of 2026, more than double its US$25.39 billion deficit with Japan.