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Jul 15
ASML raises 2026 sales outlook as AI-fueled logic and memory demand accelerates
Dutch lithography giant ASML reported total net sales of EUR9.3 billion for the second quarter of 2026, exceeding its own guidance, as customers accelerated capacity expansion plans amid continued AI-driven demand for advanced logic and memory chips.

Microcontrollers (MCUs), widely used across industrial automation, medical devices, and consumer electronics, are experiencing longer delivery times as both wafer fabrication and semiconductor packaging lead times continue to extend. Industry suppliers said customers accelerated orders and pulled in shipments during the first half of 2026 amid rising prices across the supply chain, with urgent orders also on the rise.

Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design.
Shenzhen Baiwei Storage Technology said its first-half 2026 revenue and profit are likely to rise sharply, highlighting how the global AI boom is reshaping demand for memory chips and related equipment. The company's preliminary figures suggest stronger orders, improved product mix, and a recovering storage market that could matter for investors worldwide.
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically in high-bandwidth memory, or HBM.
India approved two large incentive packages on July 15 that together recast how New Delhi subsidizes electronics manufacturing: learner-per-project chip subsidies spread across a much broader slice of the value chain, paired with a new smartphone scheme designed to reward domestic components and homegrown brands rather than assembly alone. The twin moves signal a shift from simply attracting fabs and iPhone assembly toward deepening local value addition, as India tries to pull more of the global electronics supply chain away from China.

Across almost every competitive metric disclosed in its STAR Market IPO prospectus, Changxin Memory Technologies (CXMT) trails the established leaders of the global DRAM industry. There is one conspicuous exception: the share of revenue the company devotes to research and development has exceeded every peer in the comparison group for three consecutive years — and by a wide margin.

Generative AI applications are expanding rapidly, making computing costs a growing bottleneck to commercial AI deployment. The AI accelerator market, long dominated by graphics processing units (GPUs), has increasingly explored specialised architectures in recent years. Tensor Processing Units (TPUs), optimised for the matrix operations used by AI models, have again drawn industry attention.

Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported 10th-generation tensor processing unit, as growing demand for Samsung's 2nm foundry process reportedly stretches its internal engineering resources.

The IPO prospectus of Changxin Memory Technologies (CXMT), filed ahead of a planned listing on Shanghai's STAR Market, lays bare the international talent base the company has assembled to compete against the established leaders of the global DRAM industry — and raises a subtler question about the residency arrangements of its founder.

South Korean prosecutors have opened a criminal front in a widening international investigation into alleged price-fixing of the small but critical chips that link AI processors to high-speed memory, raiding the local operations of three global suppliers on July 15.

Nvidia co-founder and chief executive Jensen Huang used a developer event in Tokyo on July 15 to reject reports that manufacturing problems could delay its next-generation AI accelerator systems, telling reporters the claims were "not true" and that "Vera Rubin is already in production. Giant amounts of production incoming."