TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than 98% yield — sometimes 99% — on multiple AI customer products already in high-volume manufacturing. By Jun He's account, that is finally almost enough.
Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin County, Taiwan, amid surging global demand for artificial intelligence (AI) and high-performance computing (HPC). The plant will cover an area of approximately six hectares and is expected to introduce chip-on-wafer-on-substrate (CoWoS) advanced packaging technology, with a total investment of about NT$100 billion (approx. US$3.1 billion). The first phase is scheduled to begin operations in 2028.
South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion and the government increases financial support for suppliers.
Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after fiscal fourth-quarter revenue surged 109% year-over-year to US$1.01 billion, with the company now guiding to hit its long-stated US$1.25 billion quarterly revenue target more than a quarter ahead of schedule.
Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for computing costs, energy use, and bandwidth worldwide. At the 2026 OCP APAC Summit, ASE said next-generation packaging, optics, and power delivery will be critical to scaling AI systems for global markets.
Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a sharp improvement since mass production began and strengthening its ability to compete with SK Hynix on volume and cost.
TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much of the partnership has been shaped by a customer neither company controls: Apple. At a two-day meeting that concluded August 11, directors approved a subscription of up to JPY282 billion(US$1.77 billion) for shares in the new joint venture with Sony Semiconductor Solutions Corp.
TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead in image sensors from eroding. The two companies said Tuesday they will form a joint venture, Advanced Vision Semiconductor Manufacturing Corp, to develop and mass-produce next-generation CMOS image sensors in Kumamoto, Japan, with volume production targeted for 2029.
Tsang Yow said its semiconductor equipment components business had become a major growth driver in July, as the Taiwan transmission-system maker reported stronger profitability in the second quarter and the first seven months of 2026. The improvement came alongside a higher-margin product mix, tighter cost control, and gains from foreign-currency movements.
