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Oct 27
DRAM price gains fall short as supply shrinks up to 50%
DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect DRAM supply from leading manufacturers to shrink by 30% to 50% for the next two to three quarters, widening the supply gap in 2027.
Volkswagen Group and NXP Semiconductors have agreed on a strategic partnership under which NXP's S32K5 microcontrollers (MCUs) are intended to serve as a building block of the carmaker's future software-defined vehicle architecture.
United Microelectronics Corporation (UMC) expects wafer foundry pricing to continue rising in 2027, with CEO Jason Wang projecting approximately 10% year-over-year growth in the company's full-year average selling price (ASP).
ChangXin Memory Technologies (CXMT), China's leading producer of DRAM memory, is reportedly planning to begin production of HBM3E, despite yields so far only reaching 20% to 30%. This reflects the memory shortage faced by China's market as it seeks to expand its domestic capacity while facing restrictions on critical equipment imports.
SpaceX's Starship super-heavy rocket completed its 14th test flight on September 28, successfully reaching Earth orbit and deploying 26 next-generation Starlink V3 satellites. A 15th test flight is expected within weeks.
Samsung Electronics and SK Hynix are undertaking their largest-ever equipment investments in 2026, but the memory supply increase is not expected to materialize until 2028. By then, however, new South Korean plants and expanded capacity at China's ChangXin Memory Technologies (CXMT) are expected to come online simultaneously, potentially triggering price competition in commodity DRAM.
Samsung Electronics Chairman Lee Jae-yong marked his fourth anniversary as chairman on October 27, 2026, by visiting a robotics research center, where he reviewed humanoid robot technology and preparations for commercialization, instead of holding a commemorative event. As Samsung integrates its research organizations and plans manufacturing-floor applications, robotics is emerging as a key pillar of its physical AI strategy.
Nvidia is reportedly adjusting the fourth-generation high-bandwidth memory (HBM4) specification for its Vera Rubin NVL72 platform, cutting bandwidth per GPU from the previously announced 22TB/s to 19.2TB/s, a reduction of about 13%. South Korean industry observers said the move could increase supply flexibility and help balance performance with mass-production delivery, although the reason for the change and its actual impact on supplier orders remain unconfirmed.
Google is now supplying its tensor processing units (TPUs) to companies it competes with, including Anthropic and Apple. On Alphabet's third-quarter earnings call, management gave two reasons: outside customers keep the chips competitive, and outside volume lowers the cost of every chip Google uses itself. However, it would not say how much money the business makes.
Soaring memory prices have pushed some IC design firms to develop and manufacture their own SRAM as a substitute for DRAM, while electronics assemblers and brand manufacturers that still need DRAM face challenges in passing on higher costs and securing supply through long-term contracts.
Samsung Electronics' next-generation semiconductor process data was allegedly removed without authorization by a university-industry research partner in South Korea, raising concerns over security vulnerabilities in industry-academia collaborations. The researcher, who reportedly retained Samsung employee access while working on the project, was indicted after allegedly transferring extreme ultraviolet (EUV) lithography information to a personal cloud account for use in the collaboration.
Taiwan's AI and semiconductor stocks have delivered substantial gains for foreign investors, who have recently taken profits, converted the proceeds into US dollars, and repatriated them, driving the New Taiwan dollar lower.