DIGITIMES Semiconductors news

Apr 16

TSMC enters 2nm mass production, scales 3nm capacity

TSMC laid out its capacity expansion plans and advanced node progress at its first quarter 2026 earnings call. Chairman C.C. Wei reaffirmed Taiwan as the primary base for leading-edge production, citing close coordination with its research and development teams.

TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last

Apr 16

TSMC guides over 15% 2Q26 revenue growth, N3 margins set to top average

Apr 16

Taiwan analog IC firms show varied 1Q26 revenue; motor control and DDR5 PMIC drive growth

Apr 16

TSMC lifts full-year outlook above 30% as AI demand powers another record quarter

Apr 16

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IC DESIGN, DISTRIBUTIONInterview: Semidynamics expands from SoC to rack-level solutions, targeting memory-intensive AI inference

Apr 17, 07:45

Spain-based AI chip startup Semidynamics has recently seen a wave of positive developments. Its first chip, fabricated on TSMC's 3nm process, has successfully completed tape-out, and just weeks ago, the company secured an investment commitment from SK Hynix. Both significantly enhance its operational credibility and global visibility. CEO Roger Espasa stated that the company's proprietary Gazzillion technology is a specialized memory subsystem designed to address one of AI's most pressing challenges today: inefficient memory utilization, which has led to persistent supply constraints.

IC DESIGN, DISTRIBUTIONSK Hynix invests in RISC-V chip designer Semidynamics

Apr 17, 07:44

SK Hynix has invested in Semidynamics, a Spanish fabless chip designer, as part of a push to expand its presence in the artificial intelligence (AI) semiconductor ecosystem.

IC MANUFACTURINGMusk's foundry push forces chipmakers to rethink customer relationships

Apr 17, 07:44

Elon Musk has said that the computing demands of Tesla, xAI, and SpaceX will far exceed current semiconductor supply capacity, arguing that existing production can meet only a fraction of future needs.

IC MANUFACTURINGTaiwan's TPK profit jumps more than 20-fold on investment gains and chip exposure

Apr 17, 07:43

TPK Holding reported a sharp rebound in profitability for the first quarter of 2026, driven by new semiconductor investments and favorable one-off gains.

IC MANUFACTURINGWith chip limits near, focus shifts to packaging and integration

Apr 17, 07:42

As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental constraint: the slowing of Moore's Law. Increasingly, engineers are turning their attention not just to chip design, but to system integration and advanced packaging, areas now seen as critical to sustaining performance gains.

IC DESIGN, DISTRIBUTIONEU Chips Act 2.0 expected by late May, with stronger domestic focus

Apr 17, 07:41

Since early 2025, the European Union (EU) has been actively shaping its next-generation semiconductor strategy. Recent reports indicate that the EU Chips Act 2.0 is set to be officially announced on May 27. During the drafting process, the Catalonia regional government in Spain, along with industry stakeholders, has contributed several recommendations.

PASSIVE, PCB, OTHER IC COMPONENTSYageo posts 40% YoY profit rise in 1Q26, driven by AI demand, price hikes

Apr 16

Passive component manufacturer Yageo held its first-quarter 2026 online earnings call on April 15, reporting strong financial results. Company CEO David Wang said that robust demand from applications related to artificial intelligence (AI) boosted sales of both standard and specialty products. Combined with the gradual impact of price increases, this drove significant growth in revenue and profits for the quarter, exceeding previous projections.

IC DESIGN, DISTRIBUTIONMCU demand pull-in lifts first-quarter sales, inflation risk clouds outlook

Apr 16

The traditional off-season for consumer electronics showed unexpected strength in the first quarter of 2026, with microcontroller (MCU) suppliers reporting a wave of early orders. Customers, facing rising costs and sharp increases in memory prices, have accelerated procurement due to concerns over future supply shortages. This front-loading of demand has effectively brought forward the peak season. Still, industry players caution that inflationary pressure linked to ongoing Middle East conflicts could weigh on end-market demand.

IC MANUFACTURINGEZconn posts 200% profit surge in March as high-fiber count shipments boost growth

Apr 16

Optical communication manufacturer EZconn announced a net profit after tax of NT$312 million (US$9.9 million) for March 2026, marking a 200% increase year on year and earnings per share (EPS) of NT$4.02. Including the previously reported January and February EPS of NT$2.3, the cumulative EPS for the first quarter of 2026 has reached NT$6.32.

PASSIVE, PCB, OTHER IC COMPONENTSChina tightens rules against foreign supply chain decoupling

Apr 16

The Chinese government has introduced sweeping regulations that authorize investigations and penalties against foreign companies that decouple from China's supply chain. The new rules arrive as global supply chains face mounting geopolitical pressure and China's export surplus continues to grow.

MEMORY CHIPSSamsung pushes HBM4 yields as advanced testing and cutting technologies emerge

Apr 16

Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According to Chosun Biz, yields for Samsung's latest 10nm-class 1c DRAM have surpassed the industry's "mature yield" threshold of around 80%, indicating meaningful progress at the wafer level.

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