DIGITIMES Semiconductors news

Feb 4

AMD delivered the numbers—just not the surprise the AI market wanted

Advanced Micro Devices (AMD) announced financial results for the fourth quarter and full year of 2025, reporting its highest annual revenue to date. While the company met or exceeded several financial targets, its share price decreased following the report, indicating that the results may not have met the heightened expectations currently set for companies in the artificial intelligence (AI) and semiconductor sectors.

TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand

Feb 4

China's memory makers abandon low-price strategy: DRAM, NAND near Korean levels

Feb 4

CXMT, YMTC scale up DRAM and HBM output keenly in largest expansion push yet

Feb 4

Intel and SoftBank's SAIMEMORY target 2029 commercialization of Z-angle AI memory

Feb 4

MORE NEWS

PASSIVE, PCB, OTHER IC COMPONENTSGoogle AI platform win elevates Innoscience's 8-inch GaN manufacturing clout

Feb 5, 16:59

Driven by expanding AI servers, data centers, and new energy applications, third-generation semiconductor gallium nitride (GaN) is moving from niche technology toward mainstream power device solutions.

IC MANUFACTURINGCommentary: How TSMC's C.C. Wei solidifies global alliances from Washington to Tokyo

Feb 5, 16:36

In the high-stakes theater of global chipmaking, TSMC Chairman C.C. Wei has mastered a rare skill: the art of the well-timed strategic masterstroke.

IC MANUFACTURINGSkytech delivers self-made PLP equipment, eyes record 2026 growth

Feb 5, 16:07

As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation chip-on-panel-on-substrate (CoPoS) advanced packaging, the company has completed delivery of the world's first 310mm by 310mm panel-level packaging physical vapor deposition (PLP PVD) equipment. The equipment has been successfully introduced into the production line of a major semiconductor packaging and testing plant in Kaohsiung, Taiwan.

MEMORY CHIPSAdata sees January revenue nearly triple, as memory prices hold in 2026

Feb 5, 16:03

The ongoing tight supply of memory chips globally has driven contract price surges for DRAM and NAND flash. As a result, memory module maker Adata Technology once again reported explosive growth in January 2026, with consolidated revenue for the month soaring to NT$8.41 billion (US$266.23 million), up 198.92% year over year and 44.78% sequentially. This marks the company's second consecutive month of record-breaking single-month revenue following December 2025.

IC MANUFACTURINGSiemens expands EDA stack with AI metrology acquisition of Canopus AI

Feb 5, 15:34

Siemens has acquired French startup Canopus AI, adding AI-based metrology and inspection software to its electronic design automation (EDA) portfolio as it expands deeper into semiconductor manufacturing workflows.

IC MANUFACTURINGTSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse

Feb 5, 12:48

TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of this initiative, with estimated equipment investment reaching US$17 billion.

IC MANUFACTURINGQualcomm reports record 1QFY26 results, flags memory constraints in near-term outlook

Feb 5, 12:33

Qualcomm reported record financial results for its fiscal first quarter of 2026, while guiding lower for the current quarter as memory supply constraints begin to weigh on handset production.

IC DESIGN, DISTRIBUTIONAlphabet's US$185 billion hardware mandate: Breaking the AI supply bottleneck

Feb 5, 12:21

Alphabet has signaled a transformative shift in its industrial strategy, unveiling a massive, sustained hardware build-out designed to break a persistent supply-side bottleneck.

IC MANUFACTURINGTexas Instruments to reshore Silicon Labs production in US$7.5 billion wireless play

Feb 5, 11:46

Texas Instruments (TI) has announced that it has reached an agreement to acquire chip designer Silicon Laboratories for approximately US$7.5 billion, marking the largest deal for TI since its US$6.5 billion purchase of National Semiconductor in 2011. The acquisition underscores TI's strategy to strengthen its presence in wireless connectivity chips for industrial, consumer, and smart-device applications.

IC DESIGN, DISTRIBUTIONMediaTek projects strong growth in cloud ASIC market, aims for US$1 billion revenue by 2026

Feb 5, 11:42

At its February 4 earnings call, MediaTek outlined a robust outlook for its application-specific integrated circuit (ASIC) business, with CEO Rick Tsai Lixing projecting the cloud ASIC market to reach US$70 billion by 2028. The company aims for a 10–15% market share and expects ASIC revenue to constitute around 20% of total sales by 2025.

IC MANUFACTURINGSingapore highlights photonics drive for chip innovation at APE 2026

Feb 5, 11:41

Dr. Patrick Lo, Senior Fellow, Technology Development at GlobalFoundries (former Chief Technology Officer, AMF), outlined how photonic technologies are shaping the next phase of semiconductor innovation during a presentation at the third Asia Photonics Expo (APE 2026). His talk, titled "Integrated Photonics: A New Engine for Singapore's Semiconductor Innovation," focused on the role of optoelectronics in computing and communications.

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