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Sep 24
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.

South Korean electronics component suppliers are under growing pressure as rising memory prices drive chip inflation deeper into the supply chain. Finished-goods makers are asking for price cuts of 10% to 20% starting in the third quarter of 2026, while Chinese rivals have been offering bids that are 20% to 30% lower, according to Chosun Biz.

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used in consumer appliances have dropped sharply. The split in the market has opened more room for Chinese suppliers in midrange and general-purpose categories as major manufacturers shift capacity toward higher-value products.

Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need for AI. The investment gives the Korean group a stake in a builder that could become a buyer of its chips, cooling equipment, batteries and construction services.
AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the startup's model expertise to shape its future hardware, software and systems.

AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting demand for substrates, high-layer-count boards, and HDI products. Tight supplies of advanced materials and rising raw-material costs also pushed PCB prices higher quarter by quarter.

As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.
Nvidia's board has approved an extra US$150 billion for the company's share repurchase program. That raises the total still available for buybacks to US$235 billion. The company said on September 28 that it is the largest increase to a buyback authorization in history, and it expects to spend the full amount by the end of fiscal 2028.
NXP Semiconductors CEO Rafael Sotomayor said the Singapore fab NXP built with Vanguard International Semiconductor (VIS) is NXP's largest investment since it acquired Freescale in 2015. The 12-inch fab, run by the joint venture VisionPower Semiconductor Manufacturing Company (VSMC), opened in Tampines, Singapore on September 28. It is now in trial production, and volume production is scheduled for the first quarter of 2027.

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value data show that the chips going to Taiwan and Malaysia are worth several times more per kilogram than those shipped to Hong Kong, China, or Vietnam. That points to a two-tier trade, with premium stacked memory heading to advanced packaging lines and cheaper multichip parts going to transit hubs and lower-unit-value destinations.

China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory, DRAM and NAND shortages, HBM reallocation and rising Chinese capacity are reshaping pricing and share gains for CXMT and YMTC. Taiwan and Singapore are extending into glass packaging, photonics and advanced packaging, while Chinese auto ambitions are stirring US backlash ahead of Xi's visit.

China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown barcode designed for chips and other components too small for conventional labels.