India's first large-scale wafer fab will begin production on decades-old 90nm technology rather than the 28nm node the Tata group publicly touted, a step that underscores how far the country still has to travel to build a chip industry from scratch, even as New Delhi commits fresh billions to the push.
SK Group chairman Chey Tae-won has floated a "memory as a service" model for SK Hynix, saying the memory chipmaker needs to build a higher-value business beyond manufacturing and selling chips.
Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add CXMT to its entity list but had not announced it, and that easing US-China tensions, along with reports that Apple had tested CXMT memory and lobbied the US government, had signaled a possible green light and triggered a rush of orders from brands, with shipments reportedly booked through the end of 2027.
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization trends reshape technology supply chains for global customers, investors, and competitors. The company said the forecast is preliminary and unaudited.
TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the company welcomes the added supply-chain flexibility. His comments, made at TSMC's earnings call, suggested that customer growth has already been somewhat constrained by tight back-end packaging capacity.
TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several 2nm and more advanced logic wafer fabs as well as advanced packaging plants to support continued strong demand from major US customers.
Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year US dollar revenue growth forecast to more than 40%. The company also increased its 2026 capital expenditure guidance to US$60-64 billion. However, investors focused more closely on its softer gross margin outlook for the third quarter, the additional US$100 billion investment planned for Arizona, and the company's evolving global manufacturing strategy.
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the US to meet global market demand, while also backing the chipmaker's continued fab expansion in Taiwan.
Micron Technology said it has completed strategic customer agreements with several tier 1 suppliers and ecosystem partners serving the global automotive industry, including Qualcomm, Visteon, Harman, Joynext, Denso, Astemo, and Hyundai Mobis.
Semiconductor suppliers have begun rolling out one to two rounds of price increases and tighter allocations in the first half of 2026 as demand from GenAI, geopolitical tensions and inflation continue to reshape the market. Automakers have been watching closely for signs of a repeat of the pandemic-era auto chip shortage, but supply-chain sources said production has so far remained stable.
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