Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial intelligence (AI), high-performance computing (HPC), and custom ASIC developments, both sectors demonstrated substantial year-over-year revenue gains as of September 2026.

ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects on October 16, focusing on advanced packaging integration and the development of critical processes and materials.

US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional rendering, challenging Nvidia and AMD in markets beyond AI acceleration.

Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its first facility prepares to begin operations by the end of the year.

Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory (HBM) directly above graphics processors and SK Hynix advancing high-bandwidth flash (HBF) to expand memory capacity for AI inference.

Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman Lee Jae-yong was visiting Japan, bringing together the company's three executive directors and key corporate decision-makers as it expands cooperation with Japanese semiconductor suppliers.

Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and intelligent control, edge AI computing, and general-purpose applications.

As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind in the AI race.

The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However, only 68% of those inputs are actually manufactured or assembled in those regions, exposing geographic dependencies that supplier headquarters data can obscure, according to an October 9 report from the Semiconductor Industry Association (SIA).

As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand for silicon interposers, through-silicon vias (TSVs), and embedded deep trench capacitors (eDTCs) in advanced packaging is creating a sizable blue-ocean market for mature-node capacity.

Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core substrates, producing 24-layer samples measuring more than 100 × 100mm. The samples have been delivered to customers and passed multiple reliability tests, with further validation underway.