The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.

The MIPI Alliance held this year's MIPI Demo Day Taipei at the Grand Hyatt Taipei this week, where 16 member companies demonstrated working products to more than 200 developers and engineers. Founded in 2003 to standardize camera and display interfaces for smartphones, the alliance now serves automotive, IoT, industrial, medical, and PC applications, with AI driving its next expansion into AR glasses and humanoid robots.

Infineon Technologies is expanding its work with Nvidia on 800-volt direct current power architectures for AI data centers, with a focus on gallium nitride (GaN) chips in the intermediate bus converter (IBC), the company said on October 21.

As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology is expanding its role in Arizona, from core facility systems and equipment hook-up to materials supply. Chi Yi Hsin Technology said its backlog reached NT$4.476 billion (US$137.5 million) as of the end of September 2026, with projects scheduled for execution through around 2028 and overall order visibility extending to 2030.

Texas Instruments reported strong revenue growth in its third-quarter earnings call due to strong demand across its industrial, automotive, and data center businesses. The company said it is facing a tight supply environment for its chips, but brought up its ramping of production and testing capacity, including through its new Malaysia back-end facility.

Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development, bringing researchers and production teams closer together while addressing concerns over incentives and talent retention.

Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions cover process materials, piping and valves, wastewater recycling equipment, and semiconductor testing components, raising questions about whether Taiwan's semiconductor supply chain will benefit from the massive expansion.

Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors and gaming for near-term investment, while physical AI and hydrogen are positioned as the next growth drivers.

BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip design with packaging and vehicle testing. ChosunBiz and ZDNet Korea reported the collaboration on October 20.

Intel is accelerating work on its long-delayed US semiconductor manufacturing projects, with equipment installation underway at its Fab 62 facility in Arizona and construction progressing at its Ohio site. The developments come as stronger demand for AI data center processors supports the chipmaker's efforts to expand capacity and strengthen its foundry business.

PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry faces obstacles in securing affordable renewable power, validating low-carbon materials, and measuring emissions across its supply chain. Industry output is expected to exceed NT$1.13 trillion (US$34.63 billion) in 2026, putting pressure on the industry to balance growth with its sustainability goals.