Taiwan Semiconductor Manufacturing Co. (TSMC) confirmed that its personnel are safe and facility safety systems are functioning normally following a powerful magnitude 7.0 earthquake that struck off the eastern coast of Taiwan late Saturday night.
Market attention in the modern AI computing power competitive landscape has mainly focused on semiconductor chip upgrades. But according to Chih-Ming Lin, chairman of Tatun Electric, the real challenge lies elsewhere. The company, with more than 70 years of industry experience, believes AI will not turn into a bubble—provided power transmission issues are effectively resolved.
South Korea's drive to build a domestic artificial intelligence semiconductor industry is hitting a key constraint. Despite gains in power efficiency and pricing, industry executives say the lack of large-scale validation environments is slowing commercial adoption and limiting the ability of local chips to compete beyond pilot deployments.
Google is advancing its TorchTPU initiative to optimize PyTorch performance on its proprietary TPU chips, as reported by Reuters. This effort, undertaken in collaboration with Meta Platforms Inc., aims to reduce developers' switching costs and disrupt Nvidia Corporation's leading position in AI infrastructure.
With panel industry demand remaining weak, display driver IC testing and packaging specialist Chipbond is pursuing a second growth engine and has formally entered the silicon photonics (SiPh) packaging market.
Taiwan's automotive printed circuit board suppliers are facing mounting shipment pressure as global vehicle demand remains weak into early 2025, with consumers and automakers hesitating over the pace of the shift from gasoline-powered cars to electric models, according to industry sources.
Japan is preparing a major expansion of state support for advanced semiconductors and artificial intelligence, with the Ministry of Economy, Trade and Industry (METI) set to nearly quadruple related funding from fiscal year 2026, starting in April 2026.
Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease, DDR4 will officially become Winbond's main product in the first half of 2026. The company's new 8Gb DDR4 products manufactured on its in-house 16nm process have recently passed customer qualification smoothly and are expected to enter mass production and shipment in the first to second quarters of 2026.
MediaTek and DENSO said they have entered into a joint development effort to create a custom automotive system-on-chip (SoC) for advanced driver-assistance systems (ADAS) and in-vehicle cockpit applications, reflecting growing demand for higher-performance and safety-compliant computing platforms in next-generation vehicles.
Egis Technology Group recently held an investor briefing to present its operational outlook for 2026, focusing on a dual approach to cloud AI and edge AI development. The group aims to deliver tangible outcomes by 2026 and 2027 through leveraging the strengths of its subsidiaries in various AI-related technologies.
The US government has decided not to impose additional semiconductor tariffs on China for the next 18 months, despite concluding that Beijing's state-led chip industry policies involve unfair subsidies and market distortion. DIGITIMES analyst Luke Lin stressed in a recent podcast that this should not be misinterpreted as a softening stance toward China.
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