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Jul 9
What China's rumored limited reopening to Nvidia's H200 implies for US-China chip contest and Beijing's drive for self-reliance
China's rumored tentative plan to allow a handful of its largest artificial intelligence (AI) companies to purchase a small number of Nvidia H200 chips has implications that extend well beyond a single procurement decision. The plan is possibly, though not only, for the shifting balance between US export leverage and Beijing's push to reduce its dependence on foreign silicon.
China's graduate job market is shifting toward semiconductors, materials, and manufacturing, with global implications for supply chains, AI development, and critical minerals. Fresh salary data show computer science and software engineering losing ground as strategic industries draw more talent, while hard tech majors gain pay advantages across the country.
Global Mixed-mode Technology reported June revenue of NT$743 million (US$23.16 million), down 0.71% from May but up 7.19% from a year earlier. The Taiwanese PMIC maker said second-quarter revenue reached NT$2.238 billion, up 5.99% from the first quarter and down 0.46% year on year, while first-half revenue totaled NT$4.349 billion, a 1.30% decline from a year earlier.

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.

E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.

ADATA Technology's board has approved a public tender offer for Tittot's common shares at NT$24 (US$0.75) per share in cash, a move that could reshape Taiwan's cultural sector and attract attention from global investors watching how technology companies broaden beyond their core hardware businesses. The deal underscores growing cross-industry convergence and could strengthen brand positioning across Asia and beyond.

PCB midplane snags cast doubt on Nvidia's Kyber rack timeline
Jul 10, 08:39

Nvidia has denied reports that its next-generation Kyber AI rack system could be delayed to 2028, saying its product roadmap remains unchanged, after SemiAnalysis pointed to manufacturing challenges in a key PCB midplane as a potential bottleneck for the Rubin Ultra platform.

For years, India's electronics manufacturing has clustered in a handful of states — mobile-phone assembly around Greater Noida in Uttar Pradesh, and a broad electronics and EMS base across Tamil Nadu and Karnataka, where the iPhone was first built in Bengaluru. India's semiconductor push is now redrawing that map, pulling the center of gravity westward to Gujarat.

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.

Kioxia and SanDisk have begun shipping samples of 332-layer BiCS10 NAND, giving the Japanese memory maker a concrete technology milestone as CEO Hiroo Ota works to pull the company back toward the top of the NAND industry.
Realtek Semiconductor reported June 2026 revenue of NT$12.31 billion (approx. US$383.67 million), down 1.7% from the previous month but up 20.6% from a year earlier. Second-quarter 2026 revenue totaled NT$37.55 billion, rising 3.11% sequentially and 17.68% year-over-year, while first-half 2026 revenue reached NT$73.98 billion, up 10.52% from the same period last year. Both second-quarter and first-half 2026 revenue reached record highs.
LG Innotek expands Vietnam footprint with new IC substrate plant
Jul 10, 02:48
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.