Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage architectures are forcing suppliers to improve efficiency and power density. But despite rapidly expanding orders and falling costs, industry researchers say GaN remains at an early stage of adoption and is unlikely to displace silicon broadly for another two to three years.

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit (IC) substrate zone within Phase 1 of the Taoyuan Aerotropolis Industrial Area. Utilizing a phased construction and staggered site handover model to accelerate tenant entry, the city aims to begin joint land preparation with manufacturers in 2028, with options to scale the zone up to nearly 100 hectares based on industry demand.

Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.