DIGITIMES Semiconductors news

Sep 10

China's Nvidia rivals raise prices as HBM shortage bites

Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.

TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

Sep 10

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

Sep 10

Apple just put a US$700 premium on hinges — seven supply chain takeaways

Sep 10

Qualcomm's AWS deal raises stakes for MediaTek and Alchip

Sep 10

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IC MANUFACTURINGASE to buy AOI, AVI equipment from Machvision for NT$334M

Sep 11, 17:52

ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection (AVI) systems, from related company Machvision to meet capacity expansion needs. The cumulative pretax transaction value for the past year and future purchases, based on the quotation and negotiation process, came to NT$334 million (US$10.6 million).

MEMORY CHIPSKioxia eyes US listing amid NAND profit rebound

Sep 11, 17:25

Kioxia's planned US listing could broaden the Japanese memory maker's access to global institutional investors as a sharp recovery in NAND profitability coincides with stronger data-center demand and a new round of capacity investment.

IC MANUFACTURINGTaiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment

Sep 11, 17:20

Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the US. Although he did not repeat his previous claim that Taiwan "stole" America's chip industry, Trump said Taiwan's chips should have been subject to heavy tariffs long ago, with tariffs of 100% or even 200%.

IC MANUFACTURINGficonTEC breaks CPO test bottleneck, teams with Hermes Testing

Sep 11, 17:19

German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what it calls the industry's first Insertion 2 automated optical test solution. As demand for photonics-integrated testing rises, the company expects equipment requirements to become more diverse and shipments to top 1,000 systems in the next 18-24 months.

IC MANUFACTURINGChipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Sep 11, 16:59

Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and advanced packaging capacity, according to Futurum Group.

MEMORY CHIPSMemory makers gain the upper hand as Apple's iPhones pay the price

Sep 11, 16:26

Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.

IC DESIGN, DISTRIBUTIONEnflame enters public markets with Nvidia alternatives in its sights

Sep 11, 16:17

Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above the IPO price after raising CNY6.12 billion (US$912 million). The listing gives the Tencent-backed company fresh capital to fund its next generations of AI processors and large-scale computing systems, while sharpening attention on China's effort to build alternatives to Nvidia.

IC MANUFACTURINGAUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging

Sep 11, 16:09

Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and Innolux, the island's two largest panel makers, are accelerating capacity reductions and asset sales while redirecting capital and technology toward higher-growth businesses. For smaller and mid-sized players, however, the path beyond displays remains far less defined.

IC DESIGN, DISTRIBUTIONCPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Sep 11, 15:52

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so far in 2026 to US$650 million. The company says it will use the money to move its CPO products into high-volume manufacturing.

PASSIVE, PCB, OTHER IC COMPONENTSChina's DRAM supply chain clears another materials hurdle

Sep 11, 15:12

China's semiconductor localisation effort has reached another upstream materials milestone. Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products at a domestic DRAM manufacturer capable of large-scale production.

IC MANUFACTURINGCIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

Sep 11, 14:40

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.

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Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications and advanced packaging as AI demand expands.

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