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The rapid development of AI and high-performance computing (HPC) chips is providing long-term demand support for the semiconductor advanced testing interface supply chain, driving growth in the global probe card market. Technologically, as signal contact density and probe pin counts continue to rise, the requirements for guide plate hole counts and structural precision in a single probe card are also increasing accordingly.
OpenAI agreement boosts Cerebras’ renewed IPO push
Feb 24, 12:11
Cerebras Systems has confidentially filed for a US initial public offering for a second time, as the AI chip designer seeks to capitalize on surging demand for high-performance computing infrastructure and a landmark supply agreement with OpenAI.
Samsung Electronics and SK Hynix have in recent years received repeated invitations from Japan's central and local governments to build semiconductor fabs, but neither has advanced the proposals, citing South Korea's domestic political environment and public sentiment.
Following the US Supreme Court ruling that global tariffs under the International Emergency Economic Powers Act (IEEPA) were unlawful, President Donald Trump announced a comprehensive tariff increase of 15%, a move Taiwanese officials say is less damaging than the alternative previously anticipated.
In an interview with Germany's Handelsblatt, Infineon CEO Jochen Hanebeck said the emerging robotics market is expected to generate significant revenue growth and help support the company's stable performance amid margin pressures.
Nvidia and Meta recently announced a multi-year strategic partnership under which Meta will procure and deploy millions of Nvidia chips. The deal covers not only the current Blackwell architecture and next-generation Rubin GPUs, but also marks the first time Meta will deploy Nvidia's Grace CPU and Vera CPU at large scale as standalone products. Nvidia has also now begun supplying CPUs independently, signaling that the shift toward Arm architecture in data centers is accelerating; bad news for Intel.

Artificial intelligence infrastructure spending is tightening global memory supply and reshaping the semiconductor cycle. Speaking at the 2026 Trans-Pacific Dialogue in Washington, SK Group Chairman Chey Tae-won said demand for AI memory is distorting supply chains and pledged to expand production of what he described as "monster chips."

ASML has unveiled an extreme ultraviolet (EUV) upgrade that could raise chip output per scanner by up to 50% by 2030, without expanding cleanroom space or adding new tools.

The US Supreme Court on February 20 struck down the Trump administration's use of the International Emergency Economic Powers Act (IEEPA) to impose "reciprocal tariffs," prompting the administration to switch to Section 122 of the Trade Act of 1974 and impose a temporary additional 15% tariff on global goods. The change has immediate implications for previously negotiated exemptions and for Taiwan's export sectors.
Memory supply shortages and rising prices for electronics components are expected to weigh on smartphone and notebook shipments in 2026, industry sources say. Mid- to low-end smartphone vendors face pressure to cut specs or raise prices amid thin margins and price-sensitive consumers.
Just ahead of the launch of Nvidia's next-generation GPU Vera Rubin, market sources indicate that the company will differentiate high-bandwidth memory (HBM) suppliers based on product performance tiers. Analysts suggest that Samsung Electronics may exclusively supply the sixth-generation HBM4 used in the highest-end products.