CONNECT WITH US

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second major expansion announcement this year, Seoul Economic Daily reported, citing a regulatory filing with South Korea's Financial Supervisory Service.

SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands its ability to serve US customers.
Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global data centers, cloud providers, and AI developers manage surging data demand while easing energy and cooling pressures across infrastructure markets.
Airoha sees faster growth ahead as AI infrastructure, optical networking, and wireless edge products expand across global supply chains. The chip designer said its 2026 product mix is shifting structurally, with addressable markets broadening in wired and wireless businesses. Revenue momentum is being driven by demand from cloud providers, telecom operators, and enterprise customers.
AMD says server CPU market to hit US$220B by 2030
Aug 5, 14:23

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate of more than US$120 billion three months earlier, as the company sees agentic artificial intelligence (AI) creating a new class of CPU-intensive workloads.

Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese factories, Reuters reported on August 5, citing three people familiar with the matter.

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture, faster data movement and tighter coordination between chips, software and AI models.

Macroblock's return to profitability in the second quarter points to a steadier recovery in the LED display supply chain, with implications for customers and competitors across Asia, Europe, and North America. The Taiwanese chip designer said improving product mix, new validations, and a planned cost-competitive product line could help second-half results outperform the first half.
After a brief recovery in 2025, the PC supply chain had hoped the market would return to sustained growth. Instead, AI server demand has squeezed memory production capacity, driving sharp increases in DRAM and NAND prices while also tightening CPU supply, causing overall PC demand to weaken once again.
AI chip demand is tightening supply of IC substrates, prompting Nvidia, AMD, and hyperscalers to lock in Ajinomoto Build-up Film (ABF) capacity through 2028 and press suppliers to begin planning additional expansion for 2029 and 2030.

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung Electronics, SK Hynix and Micron that once spanned years.