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Mar 25
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet.
Nvidia and Emerald AI said on Tuesday that they are joining forces with a group of major US power producers — including AES Corporation, Constellation Energy, Invenergy, NextEra Energy, Nscale Energy & Power, and Vistra — to develop a new generation of "AI factories" designed to come online faster and operate as active participants in the power grid.
US Senators Jim Banks and Elizabeth Warren, in a joint letter dated March 23, called on US Commerce Secretary Howard Lutnick to suspend Nvidia's export licenses for advanced AI chips destined for China and intermediary Southeast Asian countries, including Singapore and Vietnam.
Four reasons that Aspeed dominates the BMC chip market
Mar 26, 08:19
As Taiwan-based IC design firms face declining global market share due to China, Taiwan's Aspeed stands out by dominating the baseboard management controller (BMC) chip sector.
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions.
Lelon Electronics expects shipments to rise in 2026, driven by automotive electronics and AI servers, with wider supply-chain and pricing implications for global electronics manufacturers and suppliers as inventory buildups and pull-in deliveries reshape component flows and capacity planning worldwide.
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling accelerated progress toward higher-speed optical links, with implications for global data center scalability, AI deployments, and supply-chain dynamics as the industry awaits volume production and wider market adoption over the coming years.
Phison Electronics is partnering with AIC, InWin, and other platform, server, and PC solution providers to deploy Pascari PCIe Gen5 SSDs across the EU, targeting storage bottlenecks for AI and data-center workloads. The move carries wider implications for global supply, energy efficiency, data sovereignty, and operational resilience.
Yesiang, a global leader in advanced process micro-contamination control filters, is set to enter a double-digit revenue growth trajectory by 2026 through its innovative regenerative chemical filters and Clean Air as a Service (CaaS) subscription model. Chairman and CEO James Chuang highlighted that with major wafer foundries aggressively expanding sub-2nm advanced processes, Yesiang's new regenerative filter product, slated for mass production in April, will strengthen the company's industry moat and drive significant revenue gains.
Over 1,000 employees at ASML's headquarters in Veldhoven, the Netherlands, staged a lunchtime walkout on March 24, 2026, to protest the company's plan to cut 1,700 jobs as part of an organizational restructuring. The layoffs represent about 3.8% of ASML's total workforce.
Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a takeover. This move appears to show Denso's intention to strengthen its position in the automotive semiconductor and power control sectors.
Samsung Electronics has reportedly raised the yield of its 2nm wafer foundry process above 60%, a significant jump from around 20% in the second half of 2025. Industry analysts say this improvement not only cuts manufacturing costs but also boosts Samsung's chances of securing new orders.