Marvell Technology's agreement to buy Lumentum Holdings would give the custom chip designer its own supply of indium phosphide (InP) lasers, one of the scarcest components in AI data center networking, and make it one of the few suppliers spanning both the electrical and optical sides of the link. The deal positions Marvell more directly against Broadcom as connections inside AI clusters move from copper toward optics packaged alongside processors and switches.
SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform, while shortages of copper-clad laminate (CCL) and other materials are pushing up substrate prices, South Korea's Dealsite reported on October 30.
Samsung Electro-Mechanics (Semco) has begun mass production of a miniature, ultra-high-capacitance multilayer ceramic capacitor (MLCC) for advanced driver assistance systems (ADAS), as increasingly powerful automotive processors drive demand for smaller components capable of maintaining stable power supplies.
As edge AI applications and AI agents move toward real-world deployment, industrial control and embedded processors are undergoing a structural upgrade in computing capabilities.
Taiwan is aggressively pursuing a core strategy of "Team Taiwan to Team Global," according to Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC). Wu noted that when AI chips are manufactured in Taiwan, local tech companies are the first to understand their application scenarios and strengths—giving domestic industries a head start in integrating advanced AI into their own manufacturing processes.
Murata Manufacturing announced plans to invest around JPY1 trillion (US$6.3 billion) in expanding multilayer ceramic capacitor (MLCC) capacity by 2030. Booming demand from data centers and AI applications has pushed up orders for MLCC makers. MLCCs are a crucial component in managing power demand.
Tokyo Electron (TEL) forecasts nearly 90% annual operating-profit growth as chipmakers accelerate capital spending to meet demand for AI hardware, despite mounting concerns over an AI bubble. The company also announced a JPY150 billion share buyback program.
Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor materials, and image sensors, during an earnings call on October 30.
Memory chipmaker Macronix International Co. has become Taiwan's first semiconductor company to receive an IEEE Milestone, in recognition of its pioneering sNOVA engineering data analysis system and its contribution to semiconductor manufacturing automation.
Chinese AI chipmaker Iluvatar CoreX has released benchmarks showing its next-generation Tiangai 300 general-purpose GPU outperforming Nvidia's H200 in selected large language model (LLM) inference, long-context processing and multimodal generation workloads.
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to strengthen its advanced packaging capabilities for AI processors.
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