SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy beyond high-bandwidth memory and toward on-device AI applications.

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor development, underscoring six years of sustained investment in the approach. Rather than attempting to disrupt the existing semiconductor industry, Ren said the initiative aims to establish a sustainable path for chip evolution amid restrictions on access to leading-edge manufacturing technologies.

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment in advanced chip production.

Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis and advanced packaging capabilities alongside a front-end pilot line for 2nm logic chips.

Surging AI server demand is reshaping supply and demand across the global memory market. With DRAM prices rising sharply over the past year, the resulting cost pressure is beginning to spill into the automotive industry.

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.