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Jul 29, 10:05
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints and shifting customer buying patterns. The South Korean chipmaker said it is expanding long-term agreements with major customers to lock in demand and support investment planning. The company also expects HBM and DRAM to remain key growth drivers into the second half of 2026.

Coretronic said its first-half 2026 performance turned negative as margin pressure and weaker profitability offset a second-quarter revenue recovery. The Taiwanese electronics maker said it would respond cautiously to market changes while focusing on its core businesses, product mix, market position, and technology development.
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the industrialisation of glass core substrates.

Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official attention in Washington after the release of the powerful Kimi K3 model from Chinese startup Moonshot AI. His comments added another voice to the ongoing debate over closed-source versus open-source approaches as the US considers restrictions on Chinese AI.

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience, national security, and global access to advanced chips. The work, tied to Intel 18A technology, aims to expand trusted domestic manufacturing and could shape how allied governments approach secure chip production.

SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the US or Japan. The company said future overseas expansion decisions will depend on business feasibility, infrastructure availability, semiconductor ecosystems, and customer needs as it builds a flexible global manufacturing footprint.
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards limited commercial deployment.

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond traditional optical fiber and into silicon photonics (SiPh) and co-packaged optics (CPO) for next-generation AI data centers.

Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget handset market, according to Asia Time.

On July 28, ASM International raised its revenue outlook for 2027 and issued third-quarter guidance above market expectations after reporting higher second-quarter revenue and profit, supported by continued investment in artificial intelligence infrastructure and advanced semiconductor manufacturing.

Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion (approx. US$490 million) in capex to expand 12-inch wafer capacity.

On July 28, Seagate Technology reported sharply higher revenue and profit for its fiscal fourth quarter, driven by continued demand from cloud data center customers and higher-capacity storage products tied to artificial intelligence infrastructure. The company also issued first-quarter fiscal 2027 guidance above its prior quarter's revenue level, reflecting expectations that demand momentum will continue.