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Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory (HBM) technology without authorization. The case arrives as AI applications are driving soaring demand for next-generation memory chips, and it is brought forward by a company with a track record of winning patent verdicts against memory makers.
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.
AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These companies are extending their reach into emerging areas such as advanced packaging and optical communications, seeking to leverage core technologies such as glass substrates and Micro LED.
Murata Manufacturing has started mass production of its LLD series, a new class of ultra-compact capacitors that could help device makers worldwide fit more power management into smaller electronics. The move underscores how component miniaturization is shaping smartphones, wearables, and other connected devices used by consumers across global markets.

Nvidia founder and CEO Jensen Huang and AMD chair and CEO Lisa Su have joined the advisory board of Tsinghua University's School of Economics and Management (SEM), putting two of the global AI chip industry's most prominent executives on the Beijing-based body.

NSIG chair exit brings leadership succession into focus
Sep 30, 14:34
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin a leadership transition.
Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion as demand for high-performance passive components continues to rise.
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge that has shaped nearly half a century of semiconductor development.
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
DeepSeek is bringing more of the software used to develop its AI models to Huawei Technologies' Ascend 950 processors, deepening cooperation as Chinese technology companies seek to reduce reliance on Nvidia's hardware and CUDA software ecosystem.
VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in Tampines, Singapore, on September 28.