As robots and autonomous systems move from factory floors into hospitals, warehouses, and public spaces, NXP Semiconductors CEO Rafael Sotomayor used his Computex 2026 keynote to argue that the defining challenge of physical AI is not raw intelligence, but the ability to act in milliseconds without waiting for instructions from the cloud.
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea's memory equipment industry.
Intel's effort to rebuild confidence in its manufacturing technology is facing an early test, as PC makers struggle to secure laptop processors built on the company's 18A process.
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary, combining two processor IP portfolios into a single offering that spans RISC-V processor IP, software tools, custom silicon design, and semiconductor manufacturing.
xMEMS Labs is preparing to move its MEMS-based µCooling technology toward commercial production in 2027, with AI glasses and data-center SSDs expected to be among the first applications as sustained AI workloads push thermal constraints beyond GPUs.
At the opening day of Computex 2026, Lite-On Technology hosted an AI industry summit under the theme "Powering the AI-driven Future," where DIGITIMES chairman Colley Hwang moderated a cross-industry panel with Nvidia, Infineon Technologies, and Gigabyte subsidiary Giga Computing at the exhibition venue.
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy remains focused on TSMC. The clarification came after a Goldman Sachs research note, and media coverage suggested MediaTek had set tape-out and mass-production dates for a project using Intel EMIB-T packaging.
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal.
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion, surpassing OpenAI and making Anthropic the world's most valuable AI startup.
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and rising NAND prices, according to Counterpoint Research.
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart.
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