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Sep 3
Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner said, committing Intel to equipping fabs in Ireland, Arizona, and Oregon before 14A reaches high-volume manufacturing in 2028. At Deutsche Bank's 2026 Technology Conference on August 27, he put numbers on the advanced packaging business, a data center CPU cycle Intel expects to undersupply into 2028, and a gross margin now "comfortably in the 40s."
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners to dismantle organizational silos or face crippling inefficiencies, top industry executives said at SEMICON Taiwan 2026.
Kioxia's plan to push NAND flash into work that DRAM currently does is less a product launch than an answer to a structural problem. Alone among the leading memory makers, it does not produce DRAM, and in the one market where it does compete, it is being squeezed from both above and below — by a resurgent Micron and by China's Yangtze Memory Technologies (YMTC), which has closed much of the gap in a single year.
Nvidia used IFA 2026 to argue that serious AI work can run locally as well as in the cloud, pairing an October launch date for its RTX Spark Windows PCs with free software that distributes independent inference requests across compatible machines already on a local network.
Nvidia's agreement to buy Hugging Face for roughly US$13 billion is being framed by analysts less as a move into software than as insurance against three ways its core business could deteriorate: cheaper open-weight models eroding the frontier labs that buy its chips, those same labs diversifying their silicon, and enterprises pulling workloads out of hyperscaler bundles. On each of those paths, owning the industry's main model repository pays off.
The mechanics of Nvidia's US$12.93 billion purchase of Hugging Face say as much about the deal's purpose as the strategic case does: a tenth of the consideration is set aside to stop the team from walking, part of the payout goes to Intel and AMD, and the whole transaction is framed against an open-weight model market in which the fastest-moving suppliers are Chinese.
Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models — a position that gives it early sight of demand shifts, a structural hedge against customers designing their own accelerators, and a neutrality problem it has already had to answer for in writing.
China's domestic GPU industry crossed a commercial threshold in the first half of 2026, but the interim filings of its six listed players show that revenue growth and earnings power have not yet converged. Three of the six reported positive attributable net profit. Only one of those earned it primarily by selling chips. For an industry whose customers are now committing capital on multi-year horizons, that distinction matters more than the headline growth rates.
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027. Premier Jung-tai Cho said the government is already seeing strong demand from companies looking to build more plants in Taiwan, including semiconductor, packaging and testing, memory, substrate, and equipment makers, as well as foreign investors such as Nvidia and Micron Technology.
Memory chip makers continue to post sequential revenue gains, with Nanya Technology and Elite Semiconductor Microelectronics Technology (ESMT) both reporting record consolidated revenue for August 2026. Nanya's revenue rose 1.88% month-over-month, while ESMT's climbed 16.51%, as higher contract prices in the third quarter drove strong revenue growth.

Foxconn chairman Young Liu on September 2 called on Taiwan's supply chain to shift from "Made in Taiwan" to "Made with Taiwan," saying the island should become a partner that exports technology and know-how across the global industrial chain. He made the remarks at the closing fireside chat of the SEMICON Taiwan 2026 Masters Forum, alongside MediaTek CEO Rick Tsai, Advanced Semiconductor Engineering (ASE) CEO Tien Wu, and Xinxing chairman C.C. Hsien.

Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly Chemical to offer advanced packaging customers a more complete, faster, and more efficient integrated service.