Wingtech has launched a lawsuit in China against Nexperia's Dutch entities and related parties, intensifying a dispute that could affect semiconductor supply chains, corporate governance, and cross-border investment rules for customers and investors worldwide. The case adds another layer to a legal battle already spanning China and the Netherlands.
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Naver and Nvidia announced on June 7 that the South Korean internet company will expand its AI infrastructure using Nvidia's DSX platform, starting at 55 megawatts and targeting gigawatt-scale deployment. The expansion begins at Naver's GAK Sejong data center in Sejong, South Korea.
Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman Chey Tae-won on this Korea trip. The agreement covers next-generation memory co-development across Nvidia's full product roadmap and extends into semiconductor design, AI factory infrastructure and digital manufacturing.
Nvidia and Doosan Group are widening their collaboration to develop physical AI, robotics, and AI factory infrastructure that could shape industrial automation worldwide. The effort spans robotics, heavy equipment, power systems, and advanced materials, highlighting how global AI growth is increasingly tied to manufacturing, energy, and data center supply chains.
According to Nvidia's press release, SK Telecom plans to build a gigawatt-scale AI cloud in Korea, with the first AI factory set to go online in 2027. The project signals how telecom operators may evolve into global AI infrastructure providers, shaping access to computing capacity, energy use, and industrial AI deployment.
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used worldwide. The partnership targets efficiency, resilience, and faster industrial innovation, with potential implications for factories, power networks, and other critical operations globally.
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the business into a key growth engine and generate more than KRW3 trillion (approx. US$1.9 billion) in annual revenue by 2030.
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging as critical constraints. Industry analysts expect AI rack power requirements to exceed 1 MW per rack in the coming years.
More coverage
