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As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer ceramic capacitor (MLCC) embedded semiconductor substrates at its Vietnam facility to strengthen its position in the AI semiconductor supply chain.
Silicon Motion's president, Wallace Kou, said the memory industry is undergoing an irreversible structural shift driven by AI infrastructure growth. Since August 2025, NAND flash prices have surged 4–10x, and module makers' profits are expected to grow 2–3x in 2026 as this becomes the new normal.

Samsung Electronics is nearing a technical milestone for its 2nm process, but yields are reportedly still below the level required for stable mass production, raising questions about its ability to secure major foundry customers for the next-generation node.

China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy vehicles and vehicle intelligence. As cars become more software-defined, semiconductor content and system complexity are rising, while electronic architectures shift from distributed systems toward centralized, platform-based designs.

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth, the industry is shifting its focus toward mass production timelines and yield stability, according to industry sources and reports by ChosunBiz.
Silicon Motion Technology held a groundbreaking ceremony on April 13 for its new corporate headquarters in Taipei, marking a key step toward expanding its operational footprint. The company plans to connect its two major sites — in Taipei and Zhubei, a major tech hub in northern Taiwan — through the new Taipei facility, which is expected to open by 2030.
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres, and high-performance computing.
Passive component demand splits in 2026; AI and autos hold firm
Apr 14, 09:41

The passive components sector is emerging from its inventory slump, with Yageo and Walsin Technology flagging a pickup in both commodity and high-end components, driven by AI servers and automotive electronics.

Nanya Technology reported strong financial results for the first quarter of 2026, driven by a significant rise in DRAM prices and artificial intelligence (AI)-fueled demand across key market segments.
As global companies unveil plans for space AI data centers, South Korean firms are prioritizing space-related technology as a new growth driver. Samsung Electronics' foundry division is reportedly actively developing space semiconductors and related foundry technologies.
Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing company King Yuan Electronics (KYEC) reported a strong first quarter of 2026 despite the typical seasonal slowdown.