Norelsys (Tianjin) Co., Ltd. has begun IPO counseling after filing registration for listing guidance with the Tianjin branch of the China Securities Regulatory Commission, according to regulatory disclosures.
China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer interfaces (BCIs) and fourth-generation semiconductors among its priority future industries, signaling early preparation for a new materials era beyond third-generation semiconductors.
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid ongoing memory shortages and rising demand for advanced packaging, Powertech aims to become the top partner outside the TSMC ecosystem, expecting a significant revenue surge in 2027-2028 as FOPLP capacity reaches full utilization, contributing NT$3 billion (US$95 million) monthly.
Ample Electronic Technology, a major upstream manufacturer of conductive pastes for passive components, said that the sharp decline in silver has revived downstream customers' ordering momentum. Despite seasonal factors affecting February, the company remains optimistic about strong shipment demand in the first quarter of 2026, likely matching the fourth quarter of 2025 and supporting steady quarterly growth for the full year.
SK Hynix has reportedly made significant progress in the quality testing of Nvidia's sixth-generation high-bandwidth memory (HBM4) products, boosting the likelihood that it will become a stable supplier of HBM4 for Nvidia's latest Rubin GPUs.
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750 square feet) production site in Nantun, Taichung, Taiwan. The expansion is intended to support the development of next-generation process equipment for artificial intelligence (AI) advanced packaging without disrupting existing plant operations in Taichung.
NXP Semiconductors reported a sequential recovery across most end markets in its fourth-quarter results, yet its core automotive business grew more slowly than anticipated. This performance highlights an uneven semiconductor rebound, where strength in the mobile and industrial sectors must offset persistent instability in the vital automotive segment.
OpenAI has been exploring alternatives to some of Nvidia's latest artificial intelligence chips, particularly for AI inference workloads. This exemplifies the intensifying competition in the inference segment of the AI chip market and has raised investor concerns about Nvidia's long-term dominance, even as both companies publicly stress the strength of their partnership.
Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor supply chain and affecting multiple global carmakers. To meet customer demand for a "non-China supply chain," the company is reportedly planning to expand its packaging and testing capacity in Malaysia. The move aims to reduce reliance on its current "European wafer, China packaging" model and prevent future shipment interruptions.
Alchip, Global Unichip (GUC), and Faraday each hold unique strengths as leading ASIC design service providers. Benefiting from major US cloud service providers' (CSPs) push for in-house chip development, their long-term operations are highly anticipated. Among them, Alchip focuses on high-end AI and sub-5nm advanced processes for US customers; GUC primarily serves TSMC-related projects; while Faraday targets mature to advanced process nodes in artificial intelligence of things (AIoT) and industrial control sectors.
Competition in the smart glasses market is heating up, with startups launching new products in rapid succession and major consumer electronics brands preparing to enter the space.
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