Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands larger template formats and higher throughput.

The US Department of Justice has opened a probe into Nvidia's deal with AI chip startup Groq, according to reports from The New York Times and Reuters. Regulators are examining whether the transaction was structured to avoid antitrust review, with potential fines possible if wrongdoing is found.

ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor packaging and testing.

Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter and 21.1% year-over-year. The semiconductor equipment maker said second-half operations should outperform the first half as its Thailand plant ramps following a July production increase and product mix improves.

AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.

Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose headline improvement is a wider memory interface, without saying how much memory sits behind it.

Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles and smart glasses. The company said edge AI demand is rising even as AI data centers absorb semiconductor capacity and supply-chain resources.

As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates are steadily shifting from technology validation to mass production. Spirox chairman Peter Chin said the company has entered advanced packaging inspection with nonlinear optical technology, with TGV aperture sizes now at 4μm and 3μm still under validation, while materials, foundry, memory and packaging companies in Taiwan, Japan, the US and South Korea have already sent samples for testing.

Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment engineering services and customized products. The wafer-testing solutions provider also said its in-house Membrane Probe Card has begun contributing revenue as it moves into customer applications, while the company expands into next-gen test applications for high-speed data transmission, silicon photonics and co-packaged optics (CPO).

AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the global semiconductor equipment market and opening higher-value opportunities for Taiwan's industrial PC (IPC) suppliers.