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Apr 21
ASML's memory revenue tops logic in 1Q26, AI-fueled HBM demand surges
ASML revealed during its first quarter 2026 earnings call that revenue from memory systems has, for the first time, exceeded that of logic chips. Against a backdrop of sustained AI infrastructure investment, DRAM manufacturers are aggressively competing for extreme ultraviolet (EUV) equipment capacity, signaling a shift in global semiconductor demand patterns.
Geopolitical risks and rising industrial demand have driven volatile metal prices for gold, silver, and copper, triggering a wave of quarterly price increases in the lead frame industry starting from the fourth quarter of 2025. Supply chain sources indicate that these price adjustments are already taking effect and are beginning to reflect in revenue performance for the first quarter of 2026.
South Korea's Gangwon Province is accelerating the development of a semiconductor cluster centered on Wonju, Chuncheon, and Gangneung, aiming to build a full ecosystem. Global supply chains could gain a new hub built on strengths in smart medical semiconductors, geographic proximity to major fabs, and growing Taiwan partnerships that may diversify sourcing and innovation.
Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year over year, benefiting from the disposal gains related to the sale of its Tongluo fab in Taiwan to Micron Technology. Net profit after tax reached NT$14.23 billion, with earnings per share (EPS) of NT$3.36, ending 10 consecutive quarters of losses.
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory costs soaring and supply tightening, roughly 40% of CXMT's capacity will reportedly be reserved for LPDDR4X, while the remaining 60% is dedicated to advanced DDR5 and LPDDR5 products.
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory (HBM3), according to Korean media reports.
Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial intelligence continues to accelerate.
China's domestic GPU push has gained a new contender in the capital markets race. Xiangdi Xian Computing Technology (Chongqing) Co., also known as XDXCT, has formally launched pre-IPO preparations after signing a financial advisory agreement with CSC Financial Co., marking a strategic shift from survival mode to expansion.
Micron Technology's Sanand assembly, test, marking, and packaging plant has given India something it lacked until recently: a live semiconductor manufacturing operation with global supply-chain relevance.
Tesla's Terafab project is accelerating, with the company targeting substantial in-house chip production to support autonomous driving, robotaxis, humanoid robots, and AI infrastructure. The push is already forcing a split among its potential foundry partners, with divergent responses that could reshape supplier relationships and competitive dynamics across the semiconductor industry.
Niche memory design firm AP Memory announced a 112% year-over-year increase in its self-reported March 2026 revenue to NT$814 million (approx. US$25.9 million). Pre-tax net income rose 53% to NT$457 million, while net profit attributable to the parent company grew 62% to NT$372 million. Earnings per share (EPS) reached NT$2.29. The company is optimistic about sustained growth momentum throughout 2026, with overall operational visibility better than in previous years.
Chinese authorities announced 10 new policies related to Taiwan following the meeting between China's president Xi Jinping and the chairperson of the Kuomintang political party in Taiwan, Cheng Li-Wun.