DIGITIMES Semiconductors news

May 8

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.

TSMC reports record April sales as AI chip demand puts Asia supply in focus

May 8

Analysis: Anthropic's xAI deal puts Musk's GPU efficiency problem in focus

May 8

Sony, TSMC form Japanese joint venture to push image sensors into automotive and robotics

May 8

Inside Nvidia's high-stakes bet on next-generation AI cooling

May 8

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IC MANUFACTURINGWhat's driving the TSMC-Sony AI sensor JV?

May 9, 17:26

TSMC and Sony Semiconductor Solutions signed a non-binding memorandum of understanding on May 8 to establish a joint venture developing and manufacturing next-generation AI image sensors, targeting automotive, robotics and advanced smartphone camera markets. The planned venture will be headquartered at Sony's new facility in Kōshi, Kumamoto Prefecture, with Sony holding a majority stake and operational control.

MEMORY CHIPSSamsung accelerates Pyeongtaek fab expansion as memory supercycle builds

May 9, 09:16

Samsung Electronics is reportedly moving up construction of the final production line at its Pyeongtaek semiconductor campus, accelerating one of its largest capacity-expansion projects as demand for memory chips tied to artificial intelligence continues to exceed expectations.

PASSIVE, PCB, OTHER IC COMPONENTSPower chip shortages deepen as AI server demand and GaN battles escalate

May 9, 09:16

Global power semiconductor suppliers are entering a new upcycle marked by tightening supply, rising prices, and intensifying technology competition, fueled by accelerating investment in AI infrastructure and electric vehicles.

MEMORY CHIPSAdata sees DRAM, NAND prices rise 40% in 2Q26

May 9, 09:15

Adata said DRAM and NAND flash contract prices will each climb more than 40% in the second quarter of 2026, as supply is kept tight by cloud server giants that have already locked up 2027 output from upstream memory suppliers. The memory module maker said its inventory topped NT$40 billion (approx. US$1.3 billion) as of the end of April, and it sees no risk to demand through the end of 2026.

IC MANUFACTURINGGlobal semiconductor market faces shortages as AI demand strains supply chains

May 9, 07:50

Since the second half of 2025, the global semiconductor industry has been squeezed by a rare convergence of forces: surging artificial intelligence (AI) demand, escalating geopolitical fragmentation, and persistent supply chain constraints. The result, industry executives say, is a form of "silicon inflation" and a structural shortage cycle that extends far beyond a typical downturn.

IC DESIGN, DISTRIBUTIONUS president considers inviting Nvidia and other CEOs to China trade talks

May 8

CEOs from Nvidia and other American tech companies are among those that the US government plans to invite to join President Donald Trump's visit to China next week. Along with the trade negotiations, the US leader has also sought to frame the summit as a type of high-level trade delegation, although the White House is reportedly considering inviting only a small number of executives.

IC MANUFACTURINGNovatek raises margin outlook on stronger product mix and early shipments

May 8

Novatek Microelectronics, one of Taiwan's leading display driver IC (DDI) makers, said revenue in the first quarter of 2026 was supported by growth in system-on-chip (SoC) and large-size display driver products, which offset weakness in the smartphone segment.

MEMORY CHIPS2D NAND shortage spirals after Samsung, Micron, and rivals exit market

May 8

Major international NAND manufacturers are gradually exiting the mature-process 2D NAND market, triggering panic buying and a sharp spike in prices. Industry sources suggest the supply shortage may be difficult to resolve. While vendors are seeking alternative solutions, product specifications are expected to become increasingly polarized as scarcity persists.

MEMORY CHIPSBig Tech reportedly offers to fund SK Hynix fabs and EUV tools in escalating AI memory race

May 8

Global technology firms are reportedly offering unprecedented investment proposals to secure memory supply from SK Hynix, including funding new production lines and helping pay for expensive semiconductor equipment — underscoring the growing intensity of the AI-driven memory crunch.

PASSIVE, PCB, OTHER IC COMPONENTSSurging AI demand tightens supply of key PCB material

May 8

Demand for high-performance printed circuit boards (PCBs) used in advanced semiconductors has surged in recent months, tightening supply across the copper clad laminate (CCL) industry and extending lead times more than twofold, according to industry sources.

IC MANUFACTURINGSamsung chiefs address pay talks as strike deadline nears

May 8

Samsung Electronics Vice Chairman and Device Solutions (DS) head Jun Young-Hyun, along with Device eXperience (DX) head Roh Tae-moon, issued a joint statement to all employees on the progress of wage negotiations on May 7, marking their first public remarks on the talks. The move comes as Samsung tries to defuse labor tensions ahead of a union strike deadline.

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