China's Yangtze Memory Technologies (YMTC) plans to source as much as 70% of the manufacturing equipment for its fourth NAND flash factory from domestic suppliers, a substantial increase over the share at its existing operations as the company expands into advanced memory for AI and data centers.
South Korea's JNTC has joined Nvidia's purchasing supplier list and is supplying paid samples of through-glass via (TGV) substrates, including 2mm-thick glass cores, The Elec reported on November 6.
Debt held by Taiwan's science park operating funds reached NT$163.54 billion (approx. US$4.97 billion) as of the end of September 2026, while the National Science and Technology Council (NSTC) remains confident that rising operating cash flow will accelerate repayment. The government continues to develop and expand science parks to meet industry demand, including new sites and expansions across Taiwan.
Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center AI accelerators. The company aims to deliver a lower-cost, more energy-efficient alternative to sixth-generation high-bandwidth memory (HBM4) for AI inference workloads requiring high bandwidth and large buffers.
South Korean chip designer LX Semicon posted its first quarterly operating loss since going public in 2010, as weak demand for display chips and pricing pressure from electronics manufacturers weighed on earnings. The company also nominated a new CEO to lead its turnaround efforts.
National Silicon Industry Group (NSIG) expects to complete its expansion to 1.2 million 300mm silicon wafers per month by the end of 2026, positioning the Chinese semiconductor materials supplier to benefit from recovering wafer prices and growing demand for silicon-on-insulator (SOI) substrates used in silicon photonics (SiPh).
Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic manufacturing tools. The expansion is benefiting suppliers across etching, thin-film deposition, cleaning and electroplating, although component delivery constraints could delay the conversion of orders into revenue.
Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages are expected to persist through 2028, DealSite reported.
Taiwan and the UK are deepening technology ties as supply-chain restructuring and industrial security reshape semiconductor strategy. A new bilateral arrangement covers semiconductors, space, communications, net zero, and AI standards, while cooperation could link British research strengths with Taiwan's manufacturing and testing capabilities across more of the chip lifecycle.
YMTC's parent company, CCSH Corporation, had planned to raise CNY33 billion (approx. US$4.93 billion) through an IPO on Shanghai's STAR Market to finance production-line upgrades and next-generation memory research. However, the strategic placement process, originally expected to begin between late October and early November 2026, has reportedly slowed.
SK Hynix's US-based artificial intelligence (AI) investment arm, HYAICO Corporation, has acquired a stake in AI infrastructure provider Penguin Solutions from an SK Telecom affiliate for US$377.16 million, according to filings with the US Securities and Exchange Commission (SEC).
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