SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather than weakening demand.
United Microelectronics (UMC) saw operating momentum strengthen in the third quarter of 2026, as demand for artificial intelligence (AI), high-performance computing (HPC), communications, and automotive chips continued to drive the mature and specialty process markets.
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan Semiconductor Manufacturing Company (TSMC). In his new book, Find the Solutions, Hu argues that this funding does not achieve the same multiplier effect as investment in universities.
Oracle has signed partnerships with Cerebras and other chipmakers to host their chips in its cloud infrastructure. The Cerebras deal gives the chipmaker a new large customer to anchor its post-IPO trajectory, while allowing Oracle to reduce its reliance on Nvidia's expensive chips, even though Oracle also announced a purchase of Vera Rubin platforms for its data centers.
Chunghwa Precision Test Tech (CHPT), a major semiconductor test interface supplier, posted record revenue and profit in the third quarter of 2026 as consolidated net profit reached NT$551 million (US$16.97 million), up 11.5% quarter on quarter and double the figure from a year earlier. The company has earned more than one times its paid-in capital for three consecutive quarters, with earnings per share reaching NT$16.75.
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional (3D) DRAM on its technology roadmap as China's ChangXin Memory Technologies (CXMT) prepares to unveil a product based on a smaller cell design.
Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at Vikram Udyogapuri in Ujjain, Madhya Pradesh, with a total proposed investment of about INR28 billion (US$294.14 million), according to ETElectronicsWorld. The company works in GaN, RF, and power semiconductor design.
AMD is backing one of its largest AI customers with capital and chips. Alongside an update on its hardware work with Meta, the chipmaker said on October 27 that it will invest US$1 billion in Meta's equity offering, joining Nvidia in buying into the social media company's fundraising for AI infrastructure. Critics describe this pattern as circular financing.
Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant, Bloomberg reported, citing people familiar with the discussions.
SK Hynix is looking beyond its position as a leading supplier of high-bandwidth memory (HBM), using venture investments to gain a greater say in how next-generation AI infrastructure is designed.
SK Hynix is reassessing how to finance the US manufacturing expansion of its NAND flash subsidiary Solidigm after shelving a potential initial public offering (IPO), as the South Korean memory maker prepares for higher capital spending in 2027 while committing approximately KRW100 trillion to shareholder returns this year.
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