Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong public offering. The company is also asking investors to commit to buying its chips as a condition of participation, according to The Information, underscoring the competitive dynamics shaping chip makers as Beijing moves to strengthen its domestic AI supply chain.

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's push to extend vertical integration from electrification into intelligent driving.

Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.

Samsung Electronics chairman Lee Jae-yong said Gwangju is being considered as a candidate site for Samsung's next semiconductor complex, lending corporate backing to South Korea's plan to build a second chip production base in Gwangju and the broader Jeolla region in the country's southwest.

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project for ultra-wide-bandgap semiconductor materials set to be built in Zhengzhou. The project aims to strengthen domestic capabilities in diamond-based semiconductor materials for AI chips, advanced communications and electric vehicles, while expanding China's presence beyond silicon carbide (SiC) and gallium nitride (GaN).

Apple has abruptly raised prices for Mac computers, iPads, and Vision Pro in the US, underscoring how the AI infrastructure boom is spilling from data centers into consumer electronics.