Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.
Intel's decision to walk away from its September 2023 agreement for Fab 11X in New Mexico has prompted Tower Semiconductor to revamp its manufacturing roadmap, scrap the facility from its 2028 model, and redirect customers — marking a strategic reset for the specialty foundry partner.
Geopolitical tensions stemming from the US-China trade war and global tariff barriers are driving major changes across the printed circuit board (PCB) industry, prompting structural shifts in Taiwan–US import-export dynamics and the accelerated diversification of manufacturing networks.
Applied Materials, a Santa Clara-based semiconductor equipment maker, has reached a US$252.5 million settlement with the US Department of Commerce's Bureau of Industry and Security (BIS) to resolve allegations of illegal exports to China. The penalty represents the second-highest civil fine ever imposed by the BIS and the maximum amount permitted by statute — equal to twice the value of the illegal transactions.
Win Semiconductors (Winsemi), a GaAs wafer foundry, held its earnings conference on February 11. Its fourth-quarter 2025 consolidated revenue reached NT$4.79 billion (approx. US$152.65 million), up 7% quarter-over-quarter and 29% year-over-year, slightly above expectations. Full-year 2025 revenue totaled NT$16.64 billion, down 5% year-over-year.
Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026, a global printed circuit board (PCB) trade event held in Southern California. This initiative aims to help Taiwanese companies seize opportunities arising from supply chain restructuring and to accelerate Taiwan-US business collaborations.
Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising memory prices make PC and smartphone end-demand unpredictable. The company disclosed its operational outlook and market observations during an investor briefing on February 10, 2026.
Worldwide silicon wafer shipments increased 5.8% in 2025 to 12,973 million square inches (MSI), while wafer revenue declined 1.2% to US$11.4 billion, according to the year-end analysis released by the SEMI Silicon Manufacturers Group (SMG).
The Enterprise Chamber of the Amsterdam Court of Appeal in the Netherlands has ordered a formal investigation into Dutch chipmaker Nexperia BV, deepening a legal dispute that has curtailed the control of its Chinese parent, Wingtech Technology Co.
Samsung is reportedly evaluating a potential European semiconductor expansion alongside its South Korea and US manufacturing base, as the region tightens local production requirements and Germany seeks a replacement for a cancelled flagship chip investment.
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by a sharp increase in testing service revenue. However, high-margin optical diffractive element (DOE) packaging orders continued to decline after a 3D sensing customer adjusted its supplier strategy, putting pressure on overall gross margin and profitability.
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