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Sep 10
China's Nvidia rivals raise prices as HBM shortage bites
Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding another cost constraint to China's push for domestic computing hardware.
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity and technology development.

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND core design, VLSI design, and mask design while listing experience in HBM, LPDDR, and GDDR among key qualifications.

South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent organization, as South Korea strengthens protection of semiconductors and other strategic technologies.
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a share of Qualcomm's flagship processor business.
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.
A worldwide nuclear comeback, fueled by artificial intelligence data centers and semiconductor demand, is tightening supply chains and labor markets just as Taiwan considers restarting idle reactors.

Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years, with in-house silicon recovering its costs in half that time. This translates to a payback period of less than one year for servers using Google's in-house silicon, including its tensor processing units (TPUs). Industry observers note this rapid capital return gives application-specific integrated circuit (ASIC) design service partners, such as MediaTek and Broadcom, substantial room for upward revenue revisions as Google doubles down on its TPU strategy.

India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures arrive days before SEMICON India 2026, the country's flagship semiconductor conference, opens in New Delhi on September 17.

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC), strengthening the company's position in China's semiconductor foundry market.

As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO). But large-scale deployment will depend on more than optical-engine performance. Precision alignment, serviceability, manufacturing yield, and whether the supply chains for light sources, packaging, testing, and materials can advance in step are becoming equally critical.
Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon cycle.