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Feb 5
TSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse
TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of this initiative, with estimated equipment investment reaching US$17 billion.

South Korean President Lee Jae-myung recently convened a meeting at the Blue House titled the "Corporate Roundtable on Youth Employment and Expanded Regional Investment," bringing together leaders from the country's 10 largest conglomerates, including Samsung Electronics, Hyundai Motor and LG Group, along with representatives from the financial sector. Lee urged companies to work with the government to promote youth employment, entrepreneurship and more balanced regional development.

AMD's next-generation MI450 AI accelerator remains on schedule for launch and volume production in the second half of 2026, with CEO Lisa Su signaling confidence that supply capacity will not constrain deliveries as the company steps up its push in high-end AI chips.

MetaOptics drives heat-resistant metalenses into CPUs
Feb 6, 16:46

At the Asia Photonics Expo (APE 2026) in Singapore, DIGITIMES interviewed MetaOptics, the first planar lens company listed on the Singapore Exchange's Catalist board. Aloysius Chua, the company's deputy CEO, outlined MetaOptics' latest technological advances and global footprint, with a particular focus on its progress in co-packaged optics (CPO).

India's Union Budget for fiscal year 2026–27, unveiled on February 1, 2026, emphasizes manufacturing, semiconductors, and AI-linked infrastructure as central pillars of economic growth. The measures aim to strengthen supply chains, reduce import dependence, and institutionalize compliance frameworks for both domestic and foreign investors.
Memory module maker Transcend Information reported a record high monthly consolidated revenue of NT$4.76 billion (US$150.4 million) in January 2026, driven by soaring demand for AI servers, large-scale industrial control shipments, and steadily rising memory prices.
Samsung Electronics' foundry business is reportedly preparing price increases for certain process technologies, including 4nm and 8nm nodes, with hikes reportedly around 10%. Despite the adjustment, Samsung is expected to maintain a pricing advantage over TSMC as TSMC continues to raise its own wafer prices.
To meet the surging demand driven by AI, TSMC is upgrading its second wafer fab under construction in Kumamoto, Japan, to use more advanced 3nm process technology. This development was personally conveyed by TSMC chairman C.C. Wei to Japanese Prime Minister Sanae Takaichi.
The global competition for advanced wafer foundry processes is intensifying, with Samsung Electronics recently announcing that its 2nm process will focus on artificial intelligence (AI) chips. The company projects a more than 130% increase in 2nm order volume in 2026 compared to 2025, signaling an aggressive push to catch up with TSMC.
Global DRAM supply remains tight, pushing major PC makers, including HP, Dell, Acer, and Asus, to consider sourcing memory chips for the first time from Chinese suppliers such as ChangXin Memory Technologies (CXMT) to offset price surges driven by booming AI demand.
TSMC is doubling down on Japan. By upgrading its second Kumamoto facility to 3-nanometer production, the chipmaking giant has turned what was once a secondary supply-chain hedge into a cornerstone of its global strategy to dominate advanced AI silicon.
China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving into the cleanroom. Construction, tool setup, and system commissioning are progressing simultaneously, targeting facility completion and production ramp-up in the second half of 2026.