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Jun 12
TSMC hit by US patent suit, Taiwan ministry pledges support
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor equipment supplier's first manufacturing site in Malaysia.

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new contracts and revenue rebounds for domestic suppliers, according to executives and industry reporting.

Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lapping the field by multiples, not percentages.

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization and de-Chinaization pressures.

Wus Printed Circuit sees turnaround on high-end PCB demand
Jun 15, 14:25

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.

Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end wafer manufacturing to broaden its capacity sources.
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and image-generation workloads.
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.

Below are the most-read DIGITIMES Asia stories from the week of June 8-14, 2026:

Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.