DIGITIMES Semiconductors news

Mar 20, 15:58

Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity

Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity to internal production, according to Hankyung and industry sources. The move underscores the South Korean chipmaker's drive to meet surging demand for artificial intelligence (AI) components as orders from major customers — including Nvidia and Advanced Micro Devices (AMD) — continue to accelerate.

Malaysia chipmakers monitor helium supply risks as Middle East tensions weigh Qatar output

Mar 20, 15:45

Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials

Mar 20, 15:33

MediaTek on cruise control as chipmakers scramble for next-gen silicon photonics standards

Mar 20, 11:23

Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting

Mar 20, 10:31

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IC DESIGN, DISTRIBUTIONLumotive makes optical breakthrough, targets 10,000-port data centers

Mar 20, 16:28

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world's first programmable 2D optical beamforming chip.

IC MANUFACTURINGAnalog Devices activates Thailand plant to boost global manufacturing resilience

Mar 20, 16:05

Analog Devices has officially launched its advanced manufacturing facility in Thailand, aiming to enhance the company's advanced manufacturing and testing capabilities while promoting a more resilient and sustainable semiconductor production footprint across the Asia-Pacific region.

MEMORY CHIPSMemory price surge drives Transcend's 15x profit growth in January 2026

Mar 20, 15:19

Memory module maker Transcend reported a remarkable profit increase for January 2026, with net income reaching NT$2.786 billion (approx. US$87.2 million), up 1578% year-over-year. Its earnings per share (EPS) hit NT$6.49, also rising 1578%, already achieving 50% of its full-year 2025 EPS of NT$12.98.

MEMORY CHIPSSamsung plans over KRW110 trillion investment in AI semiconductor facilities and R&D for 2026

Mar 20, 15:12

Samsung Electronics announced it will invest more than KRW110 trillion (approx. US$73.4 billion) in facilities and R&D by 2026 to secure a leading position in the AI semiconductor era. This marks the first time its annual investment surpasses the "KRW100 trillion" threshold.

IC DESIGN, DISTRIBUTIONNvidia and AWS strike massive GPU supply deal through 2027

Mar 20, 14:52

On March 19, senior executives at Nvidia said the company has reached an agreement with the cloud computing division of Amazon to supply large-scale GPU infrastructure through 2027.

IC MANUFACTURINGSamsung foundry shows signs of stabilization as Nvidia, Tesla orders underscore AI chip capabilities

Mar 20, 14:40

Samsung Electronics' foundry business is showing signs of stabilization after a sustained period of market share decline, as new orders from Nvidia and Tesla underscore its ability to manufacture high-value artificial intelligence (AI) semiconductors, according to Maeil Business News Korea and EBN.

PASSIVE, PCB, OTHER IC COMPONENTSHiSilicon unveils self-developed CIS chip, shaking global sensor supply chain

Mar 20, 14:33

The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera "Xiaotu S7PRO MAX" equipped with its proprietary sensor.

IC MANUFACTURINGWhen secrets walk out the door: TSMC's cross-border IP battle tests Taiwan's legal reach

Mar 20, 11:59

TSMC built its dominance not just on cutting-edge fabs, but on closely guarded know-how that rivals cannot easily replicate. Now, that edge is at the center of a high-stakes legal fight. Former senior vice president Wei-jen Lo stands accused of walking out with the crown jewels — key parameters and trade secrets tied to the chipmaker's most advanced processes — before crossing the Pacific to join rival Intel. The case has landed in Taiwan's Intellectual Property and Commercial Court, and the outcome could set a precedent for how the island defends its most valuable technological assets.

MEMORY CHIPSAs NAND makers move on, MLC memory nears the end of the line

Mar 20, 11:05

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance and edging toward obsolescence.

IC MANUFACTURINGUK-Taiwan R&D ties scale up with Foxconn, Turing Space, NSYSU

Mar 20, 08:07

Taiwan has long leveraged its manufacturing strengths to carve out a place in the global supply chain. Now, it is going further. With research and development reach expanding overseas, the country is shifting from contract manufacturing to joint innovation. The UK-Taiwan Innovative Industries Programme (I2P), run under the British Office Taipei and ITRI, has hit a record scale in 2026, with 17 research and development teams taking part in bilateral exchanges.

PASSIVE, PCB, OTHER IC COMPONENTSAI tailwinds and global reach put Topco on track for double-digit growth in 2026

Mar 20, 08:07

Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC) has announced plans to focus on high-growth sectors such as AI, automotive, and data centers in 2026, targeting sustained double-digit growth.

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