AI chipmaker SambaNova could raise between US$800 million and US$1 billion in a new funding round, according to its executive chairman and Intel CEO Lip-Bu Tan. This would raise SambaNova's value to US$10 billion as increasing inferential AI workloads spur a search for alternatives to Nvidia's expensive GPUs.

ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company had built over the past few years was absorbed almost immediately.

ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit from expanding AI infrastructure, supporting industrial policy, and strengthening regional cooperation. The company sees Thailand as a possible hub for future growth and technology investment.

Optical lens manufacturer Calin Technology stated at its shareholders' meeting on June 24 that global market growth has been weakened by economic volatility and US tariff policies. It reported consolidated revenue of NT$1.02 billion (approx. US$32 million) in 2025 and a net loss after tax of NT$261 million. Although profitability fell short of expectations due to production volumes remaining below economies of scale, Calin has demonstrated a strong commitment to transformation in recent years by actively developing higher-value products and gradually optimizing its product mix, laying a critical foundation for long-term growth.

Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.

Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing capacity, while unveiling a new long-term supply model backed by strategic customer agreements.

The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to diversify supply-chain risk make deeper global investment inevitable.

Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the global AI race is rapidly expanding beyond GPU compute, with optical interconnects, silicon photonics, and CPO emerging as the next major battleground.

JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.

As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.