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Sep 8, 07:50
Taiwan and Saxony start building the talent pipeline behind TSMC's German fab
TSMC's investment in a fab in Germany's Free State of Saxony has drawn close attention from across Europe. Eva Ins Obergfell, Rector of Leipzig University, one of Germany's leading universities, recently visited Taiwan and toured National Taiwan University and National Tsing Hua University, among others, to explore ideas for research cooperation. Experts said Taiwan and Germany had opportunities to build long-term partnerships in quantum sensing technology, semiconductor materials processes and cross-border biomedical research.
MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month. Revenue for the first eight months reached NT$4.196 billion, up 17.66% from the same period in 2025.
South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions facing Samsung Electronics and SK Hynix.
PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile communications products, combined revenue from servers, optical modules, and IC substrates more than tripled from a year earlier, with growth accelerating further and lifting August revenue above NT$20 billion (≈US$634 million).
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's era of pervasive digital connectivity, from smart glasses to cars to phones, this event is expected to give us a glimpse into the hardware supply chain behind these devices, and increasingly behind the global AI infrastructure build-out.

A US push for additional Korean semiconductor manufacturing investment has entered bilateral negotiations just as the first project under South Korea's US$200 billion strategic-investment mechanism approaches selection.

Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according to The Elec. The effort is aimed at completing wafer-level testing for photonic integrated circuits, or PICs, by 2026 and preparing for silicon photonics foundry services planned for 2027.
Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the company expands capacity, upgrades processes and pushes further into server memory.
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment supply chain. Its overall business portfolio is also shifting increasingly toward semiconductors, with the company formally reclassified as a semiconductor stock on the Taipei Stock Exchange in 2025.
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different challenges across Insertion 1 through Insertion 4.
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI chip customers. The share is estimated at 50–60% as of August, according to ZDNet Korea.