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Sep 7
Exclusive: Infineon COO says chip shortage recovery will take longer
Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.
ChenFull Precision has expanded rapidly in recent years from traditional precision manufacturing operations such as welding and surface treatment into the semiconductor process equipment supply chain. Its overall business portfolio is also shifting increasingly toward semiconductors, with the company formally reclassified as a semiconductor stock on the Taipei Stock Exchange in 2025.
TSMC and ASML have formed an industry-wide initiative to move extreme ultraviolet lithography from 6-inch photomasks to 12-inch formats, with a pilot mask line targeted for 2031 and 12-inch High NA systems entering advanced-node production by 2033.
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different challenges across Insertion 1 through Insertion 4.

Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from an earlier 12-high design, as rising memory costs put greater emphasis on bandwidth efficiency and overall system economics.

Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line is likely heading toward end-of-life (EOL) as CEO Lip-Bu Tan reshapes the business to cut low-margin products and lift overall profitability.
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI chip customers. The share is estimated at 50–60% as of August, according to ZDNet Korea.
After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next year, signaling a renewed push into a market where AI and advanced packaging are raising the stakes for equipment suppliers.
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR) is not necessarily the hardest part. The more difficult question comes later: who will shoulder the enormous and recurring cost of keeping advanced semiconductor research infrastructure running?
Huawei's Kirin 9050 Pro is the first commercial test of its Tau Scaling Law, with the company claiming a 55% increase in transistor density at the same process node while cutting NPU, GPU and CPU performance-core power by 66%, 58% and 41%, respectively.
Memory manufacturers Macronix International, Etron Technology, and Winbond Electronics all reported surging revenue for the first eight months of 2026. As the memory upcycle continues, all three companies posted strong August revenue growth, with executives noting that demand remains tight.