DIGITIMES Semiconductors news

Aug 4

Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.

Samsung Foundry nears full utilization, but 2nm yields remain a hurdle

Aug 4

China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands

Aug 4

2027 memory capacity reportedly sold out as buyers quietly lock in supply

Aug 4

Onsemi expects AI data-center revenue to more than double in 2026 as cyclical recovery takes hold

Aug 4

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IC DESIGN, DISTRIBUTIONAMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips

Aug 5, 07:53

AMD used its second-quarter 2026 results to reinforce a broader argument: that it can replicate in AI accelerators the market-share gains it has already made in server central processing units (CPUs), according to the latest results released on August 4.

IC MANUFACTURINGSamsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026

Aug 5, 07:02

Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models — zHBM and zNAND-O — and disclosing a 400-plus-layer NAND built on wafer bonding for the first time.

IC MANUFACTURINGCloud AI chipmakers race to secure capacity with long-term deals

Aug 5, 06:20

Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no longer enough; the ability to secure stable, sufficient capacity has become a key factor in supplier selection.

MEMORY CHIPSResearch Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply

Aug 5, 06:20

Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said its review of the call points to three takeaways: AI is broadening high-end memory demand into a wider product mix, supply tightness will last through 2028, and long-term agreements (LTAs) are reshaping supply and operations.

IC MANUFACTURINGHanwha Semitech expands packaging tools as TCB turns profitable

Aug 5, 06:20

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.

PASSIVE, PCB, OTHER IC COMPONENTSAurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aug 5, 06:19

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second quarter of 2026. Stronger demand for CCL-related products helped lift quarterly revenue to NT$420 million (US$13 million), up 24.2% year-over-year.

IC MANUFACTURINGPowerchip says family succession plan remains unchanged

Aug 5, 06:18

Powerchip Semiconductor Manufacturing Corporation said on August 4, 2026, that the death of chairman Frank Huang has not changed the group's ownership structure, management team, or overall strategy. The company said Huang's personal and family shareholdings will be handled under the law, while the Huang family will continue supporting the existing management team.

IC MANUFACTURINGSouth Korea's KRW500B SiC push stalls as low returns deter major companies

Aug 5, 06:16

South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors is struggling to move beyond the planning stage because the government has not secured a major anchor company to drive demand and support commercialization, according to ETNews.

IC MANUFACTURINGFrom chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era

Aug 5, 06:16

Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global standards leadership. He also warns that proprietary management interfaces are delaying AI infrastructure deployment and leaving a meaningful share of large GPU fleets in a degraded state.

MEMORY CHIPSSK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth

Aug 4

SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and bandwidth of up to 3TB/s.

IC MANUFACTURINGPSMC sees stronger 2H, says strategy unchanged after chair's death

Aug 4

Powerchip Semiconductor Manufacturing Corp. (PSMC) will maintain its existing strategy following the sudden death of Chairman Frank Huang and expects business to improve quarter by quarter in the second half of 2026, Acting Chairman Brian Shieh said on August 4th.

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