Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.

Canon Inc. said on November 10, 2026, that it will launch the FPA-6400ES6a, a krypton fluoride (KrF) scanner for manufacturing memory and logic semiconductors, in early December 2026. The company's release gave no exact launch date, price, or shipment volume.

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.

PCB maker Dynamic Holding reported October 2026 consolidated revenue of NT$10.637 billion (approx. US$323.6 million), down slightly from NT$10.648 billion in September as extended holidays reduced working days, but up 70.3% from NT$6.245 billion a year earlier and the company's second-highest monthly figure on record.

Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said recently. If the separation becomes permanent, Wingtech's ownership should entitle it to fair compensation.

Infineon Technologies told analysts that demand is no longer what limits its growth. On a November 10 call to discuss its fiscal 2026 results, the German chipmaker said orders for its data center power products already exceed the close to EUR4 billion (approx. US$4.46 billion) of revenue it forecasts for fiscal 2027, and that how much of that it can book will depend on how fast its factories and outsourcing partners can ramp.

Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell 8.59% month-over-month and 18.37% year-over-year to approximately NT$130 million as shipments of specialty gases to Japan, South Korea, and domestic customers declined slightly.

Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model inference and enterprise high-performance orchestration workloads. The company outlined new GPU D-series technology at the 2026 Open Compute Project (OCP) Global Summit as it pursues server CPU upgrade opportunities driven by agentic AI.

Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request. TSMC declined to comment on market speculation and stressed that it remains focused on its core foundry business.

Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic components distributor Smith.

Nichidenbo Corporation said successive AI server generations, designed for higher power consumption and voltages, are increasing demand for high-end capacitors offering high capacitance and resistance to heat and voltage. AI-related products now account for 55–60% of its revenue, up from about 40% in the first quarter, and could exceed 60% in 2027.