Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other conventional memory products while maintaining high-bandwidth memory (HBM) volumes already committed to customers.
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products expected with the DDR6 generation.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
US President Donald Trump has signed a proclamation creating a new incentive program that would cut import tariffs on primary aluminum for companies that invest in expanding domestic smelting capacity, marking the latest effort by the administration to boost US metals production.
Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed Compute Express Link (CXL) controller chips, shifting more controller work to specialist fabless suppliers while continuing to develop CXL-based memory products.
Chinese AI developer Z.ai has completed a giant data center running exclusively on domestically made chips, a milestone in Beijing's drive to replace restricted Nvidia silicon for future AI development.
As the AI boom keeps memory shortages running hot, steep price hikes for smartphones in the second half of 2026 are coming into view. Global market researchers have issued increasingly bleak forecasts, warning that "chipflation" could last through 2027 and that surging memory prices are already lifting the cost of consumer devices.
