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Jun 9
Nvidia-SK Hynix pact sharpens memory race with Samsung, Micron
Nvidia's multiyear technology partnership with SK Hynix could reinforce the South Korean chipmaker's role in the AI memory supply chain, raising pressure on Samsung Electronics and Micron Technology as the memory market enters one of its strongest upcycles in years.
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management. The shift signals firmer supply-chain conditions, rising leadframe demand, and broader pressure on packaging capacity across Asia — factors with direct implications for global electronics buyers and investors.
Taiwan is considering significantly tougher restrictions on exports of advanced AI chips to China, a move that would bring the island's regulations closer to those of the US and strengthen efforts to combat semiconductor smuggling, according to Bloomberg.
WinWay revenue rises on AI and HPC demand
Jun 10, 10:40
WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to NT$1.073 billion (US$33.9 million) in May 2026, the company's second-highest monthly total on record. For global readers tracking the semiconductor supply chain, the results signal how AI infrastructure demand is reshaping testing capacity and equipment needs worldwide.
YMTC and CXMT have returned to Washington's Chinese Military Companies list, placing China's two leading memory chipmakers back at the center of US scrutiny over semiconductors, military-civil fusion, and China's technology supply chain.
HVLP4 copper foil battle heats up as Nvidia courts Co-Tech
Jun 10, 09:45
Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and a structural supply bottleneck looms in 2026. Chairman Frank Lee said the market could face a 15–25% supply shortfall in 2026, setting up a two-to-three year upcycle in prices.
The Taiwanese government has launched an AI infrastructure initiative aiming to further strengthen its semiconductor industry prowess by leveraging silicon photonics (SiPh) to form a new moat, as AI-driven demand for high-speed data transfer accelerates.
Largan targets CPO multilayer stacking with first FAU pilot line
Jun 10, 09:26
Lens maker Largan Precision held its shareholders' meeting on June 9, where chairman Adam Lin, long known for his terse public remarks, appeared relaxed and offered unusually detailed views on the industry, technology, and Largan's own operations. His comments showed clear optimism toward the company's development of fiber array units (FAUs).
Malaysia's electronics sector is expected to keep expanding into 2026, even as tariffs, geopolitical tensions, and rising input costs weigh on manufacturers. Industry leaders say the country's neutral position in the US-China contest, along with a deepening semiconductor ecosystem, should help sustain export growth for global supply chains.
QBit Semiconductor said it will buy a 60% stake in Singapore-based Sinchip Technology, a move that gives it control of the company and expands its reach across major chip markets. The deal could affect global demand for customized semiconductors used in AI, computing, communications, and vehicles.
GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density increased, and described the result as evidence of strong long-term momentum for its materials transformation strategy.
At COMPUTEX 2026, held under the theme "AI Together," a clear shift was visible across the exhibition floor: the focus has moved beyond individual chips and server specifications toward a far more practical challenge — how to rapidly deploy full-scale computing infrastructure under tight constraints of power, time, and construction capacity.