Apple quietly launched new MacBook, iPad, and Vision Pro products equipped with its latest M5 chip on the evening of October 15, 2025, in Taiwan, generating considerable public attention over the major M5 chip upgrades.
Micron reportedly plans to stop supplying server chips to data centers in China, according to a Reuters report citing sources familiar with the decision. The move comes two years after Beijing imposed a ban on Micron's products for use in "critical infrastructure," a decision widely interpreted as retaliation for US export restrictions on advanced chips and AI technologies.
China's Wingtech is grappling with an unprecedented crisis after the Dutch government seized control of its subsidiary Nexperia. In a stunning triple blow, Nexperia's Chinese CEO, Xuezheng Zhang, has been suspended, Dutch authorities have taken over the company's management, and all 30 of its global business entities have been frozen for one year.
As the generative AI (GenAI) boom becomes a central focus in tech development, high-performance computing (HPC) opportunities continue to expand, recently causing supply-demand gaps in the memory market that have triggered a surge of urgent orders. Coupled with the arrival of the consumer peak season and the first wave of new device shipments in September 2025, these three key drivers have pushed Taiwan's printed circuit board (PCB) industry to exceed revenue expectations in the third quarter of 2025.
Airoha Technology has continued to secure new collaboration opportunities in the international telecom market in 2025, with some of its previously developed markets now entering mass production and shipment phases, driving steady growth in its overall revenue. The company has also integrated MediaTek's Wi-Fi chips into its solutions.
Samsung Electronics revealed it is developing its seventh-generation high-bandwidth memory (HBM4E), with a target bandwidth of over 3TB per second. The announcement comes as Nvidia continues to pressure suppliers to increase the bandwidth of sixth-generation high-bandwidth memory (HBM4), signaling that the HBM speed race will intensify.
As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, frequency, and speed. In response, the testing interface industry has been pushed into a new wave of product upgrades.
AI inference chip startup Rebellions announced on October 15 that it has joined Arm's Total Design ecosystem. The announcement, made at the OCP Global Summit 2025, positions the company to accelerate the development of customized, high-efficiency chips for next-generation AI data centers.
Tesla is reportedly expanding its semiconductor operations in South Korea with a new organization in Hwaseong, Gyeonggi Province, the same city that houses Samsung's wafer fabrication hub. The US EV maker has started hiring semiconductor engineers, stirring industry attention as it strengthens collaboration with Samsung after inking a US$16.5 billion foundry deal for its upcoming AI6 chip.
Acer chairman and CEO Jason Chen once described the "dulling effect" of US President Donald Trump's tariffs, a phenomenon now increasingly reflected in ASML's earnings and guidance. Despite these pressures, the Dutch firm reported steady third-quarter earnings, buoyed by a surge in demand from the artificial intelligence (AI) sector and a last-minute scramble by Chinese firms to acquire advanced chipmaking equipment.
TSMC will build two advanced packaging plants in Arizona, part of a sweeping expansion to support soaring demand for AI chips and solidify its strategic presence in the US, Chairman and CEO C.C. Wei announced during the company's latest earnings call.
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