
Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring new memory architectures after hiring former SK Hynix CEO Lee Seok-Hee.
Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision Mechanics, a unit of Eternal Materials, saying customer orders and inquiries jumped sharply around Christmas 2025 and have continued since. Its Japan plant has been running at full capacity since May this year.
The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years. At the 2026 OCP APAC Summit, however, Ayar Labs CEO Mark Wade shifted the focus from whether CPO works to whether it can scale commercially.
Zhen Ding Tech (ZDT), a major PCB supplier, said at its second-quarter 2026 earnings conference on August 11 that rising investment in AI computing infrastructure is ushering in a new expansion cycle for high-end PCB demand. Chairman Charles Shen said the company expects strong revenue growth in 2026, while increasing contributions from AI-related products should narrow the traditional gap between peak and off-peak seasons. ZDT aims to raise the combined revenue share of servers, optical modules and IC substrates to 45–50% by 2030.
Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support to attract projects backed by India's national chip-making push, according to state officials cited by regional outlets on August 12, 2026.


