CONNECT WITH US
Jul 29
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints and shifting customer buying patterns. The South Korean chipmaker said it is expanding long-term agreements with major customers to lock in demand and support investment planning. The company also expects HBM and DRAM to remain key growth drivers into the second half of 2026.

Rising prices for memory and other key components are weighing on smartphone demand in Taiwan, but the overall market value is still expected to grow in 2026, according to Samsung Electronics Taiwan.
AI infrastructure competition is intensifying, but the market is no longer focusing only on GPU performance and is instead re-evaluating the entire computing system. For AMD, the chance to turn software improvements into market share is now emerging, but two hurdles remain: whether ROCm can run stably in large clusters and whether Helios can enter mass production and ship on time.

Japan and South Korea's MLCC suppliers are again raising prices, signaling tighter supply conditions that could affect electronics makers worldwide. The moves, led by major passive component manufacturers, suggest AI-related demand is reshaping a market previously softened by weaker consumer and automotive orders.

Greatek's latest investment and capacity plans signal how AI-driven semiconductor demand is rippling beyond Taiwan, with implications for global device makers, automakers, and industrial customers. The PowerTech Technology unit said orders remain strong, its bumping lines are full, and it is preparing new overseas capacity to support supply chain diversification.
Amkor Technology reported record second-quarter results for 2026, characterized by broad-based revenue growth and significant strategic shifts in its global manufacturing footprint. During the subsequent Q&A session, President and CEO Kevin Engel and CFO Megan Faust detailed the company's performance across ten key areas, ranging from volatile smartphone demand to the long-term financial implications of its new US manufacturing facility.

Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in wafer fabrication, memory, and advanced packaging. Taipower projected that the industry's power use would reach 52 billion kWh in 2026, underscoring how the island's chip ambitions are reshaping its energy system.

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility systems at its JASM wafer fab are operating normally, equipment inspection and calibration are in progress, and construction at the site of its second Kumamoto fab has resumed.

Coretronic said its first-half 2026 performance turned negative as margin pressure and weaker profitability offset a second-quarter revenue recovery. The Taiwanese electronics maker said it would respond cautiously to market changes while focusing on its core businesses, product mix, market position, and technology development.
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the industrialisation of glass core substrates.

Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official attention in Washington after the release of the powerful Kimi K3 model from Chinese startup Moonshot AI. His comments added another voice to the ongoing debate over closed-source versus open-source approaches as the US considers restrictions on Chinese AI.

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience, national security, and global access to advanced chips. The work, tied to Intel 18A technology, aims to expand trusted domestic manufacturing and could shape how allied governments approach secure chip production.