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Jun 11, 15:28
Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating costs, adding that TSMC does not rule out moderate price adjustments. Those comments have drawn close attention across the industry.

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.

Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment. The move highlights how AI demand is influencing chipmakers, equipment suppliers, and global customers, with implications for production capacity, regional innovation hubs, and technology markets worldwide.
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into the stock market and other asset markets. Central bank governor Chin-Long Yang said on June 10 that Taiwan remains far from systemic risk despite concerns over surging market activity.

Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.

Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure aimed at activating assets and focusing on its core business. It is also intended to improve the group's capital allocation efficiency, optimize its balance sheet, and boost earnings per share (EPS).
MicroIP has opened a nearly 300-ping southern R&D center at Kaohsiung's PIER F, with plans to expand smart manufacturing and smart transportation applications. The move signals a deeper push to link AI development with local logistics, industry, and public infrastructure.
AI servers and high-voltage electric vehicles (EVs) are tightening the global supply of high-end multilayer ceramic capacitors (MLCCs), prompting some Taiwan supply chain players to qualify Chinese alternatives such as Chaozhou Three-Circle as lead times lengthen.
CanSemi Technology's planned ChiNext listing has exposed the financial strain behind China's push to build mature-node semiconductor capacity, as the Guangzhou-based foundry seeks fresh capital despite persistent losses, negative gross margins and a long road to profitability.