DIGITIMES Semiconductors news

Sep 17

CXMT cashes in on the DRAM shortage — and takes aim at HBM

ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.

20 of China's OSATs push into advanced packaging amid EUV curbs

Sep 17

SK Hynix weighs US memory options as buyers lock in 2027 supply

Sep 17

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

Sep 17

Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

Sep 17

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MEMORY CHIPSWinbond's Infineon buyout puts GigaDevice under pressure

Sep 18, 00:08

Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.

IC DESIGN, DISTRIBUTIONAMD pivots to China developer ecosystems as Nvidia retreats

Sep 17

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.

MEMORY CHIPSSK Hynix looks beyond HBM as inference workloads diversify

Sep 17

SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context applications.

IC MANUFACTURINGTrumpf eyes glass as AI demand drives packaging innovation

Sep 17

At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser solutions to advanced chip packaging, specifically for drilling holes in glass substrates.

MEMORY CHIPSSamsung bets on zHBM as 2.5D memory nears its limits

Sep 17

Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.

IC MANUFACTURINGTSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership

Sep 17

TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology Council (NSTC) has not yet approved the related 2027 budget. NSTC Minister Cheng-Wen Wu said the partnership with Taiwan Semiconductor Research Institute (TSRI) and ITRI EOSL remains unchanged, although the location has shifted.

MEMORY CHIPSMemory LTAs lock up 50-70% of capacity

Sep 17

The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from three to five years, with many in the industry expecting 2027 to be the tightest year yet. Supply chain sources said Kioxia has about 50% of its LTA capacity tied up, while South Korea's two major vendors reserve about 70% of capacity for LTAs. Micron also has around 60% of its capacity locked into such agreements.

IC MANUFACTURINGArdentec, Sigurd race into silicon photonics TIA testing as US client books capacity

Sep 17

The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance amplifier (TIA) testing as AI data-center networks shift toward faster optical interconnects. Ardentec and Sigurd are among the firms benefiting as a major US customer rushes to reserve capacity.

IC DESIGN, DISTRIBUTIONSamsung expands SRAM, IP to speed chip development

Sep 17

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster AI chip refresh cycles push customers to demand stronger process competitiveness, faster development, and better-prepared infrastructure including IP. Samsung is responding by expanding memory design options, IP, and development tools through its Samsung Advanced Foundry Ecosystem (SAFE) program.

MEMORY CHIPSAI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Sep 17

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.

IC MANUFACTURINGSamsung reportedly starts Tesla chip trial production at Taylor fab

Sep 17

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving the US fab into 2nm wafer production and yield verification ahead of full-scale operations.

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