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Jul 24
AMD redraws server chip strategy as AI workloads evolve
AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping its roadmap for a world where AI workloads are spreading from training models to enterprise agents. The shift matters globally because it signals that data centers may need more balanced upgrades to CPU, GPUs, and networking.
South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial intelligence, while a series of technology partnerships involving Nvidia, South Korean companies and US firms were announced alongside the visit, according to The Chosun Daily, Reuters, and Bloomberg.
South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry partners, highlighting South Korea's efforts to strengthen its artificial intelligence ecosystem and expand international collaboration.
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The companies said the initiative aims to support future computing platforms by improving performance, increasing interconnect density, and enhancing power efficiency.

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy beyond high-bandwidth memory and toward on-device AI applications.

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor development, underscoring six years of sustained investment in the approach. Rather than attempting to disrupt the existing semiconductor industry, Ren said the initiative aims to establish a sustainable path for chip evolution amid restrictions on access to leading-edge manufacturing technologies.

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment in advanced chip production.

Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.

Surging AI server demand is reshaping supply and demand across the global memory market. With DRAM prices rising sharply over the past year, the resulting cost pressure is beginning to spill into the automotive industry.

STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings call that the full profitability recovery hinges on a manufacturing overhaul that will not finish before the end of 2027, and that its near-term ceiling is supply rather than demand.

China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.

Wistron's opening of its D1 AI smart factory in Fort Worth, Texas, marks a new milestone for Taiwan's downstream electronics manufacturers. The plant will support the first US mass production of Nvidia GB300 compute boards, a development with far-reaching implications for Taiwan, the US and the global AI industry.