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Aug 6
DRAM price surge lifts Samsung and Micron as SK Hynix loses share
Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed the expansion of its traditional DRAM business despite its leadership in HBM.

LG Electronics plans to develop premium, midrange and entry-level on-device AI chips for products ranging from refrigerators and washing machines to smart-home hubs and service robots, according to ETNews.

SpaceX's earnings call — the first since its IPO disclosure — beat expectations on Aug 4, but the line that moved markets wasn't a revenue figure.

Elon Musk's ambitions across AI, robotics and space infrastructure are moving into a new phase following the unveiling of Terafab, an ambitious semiconductor manufacturing complex designed to secure the compute capacity required by Tesla, SpaceX and xAI.

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate the phaseout of LCD capacity at the 5.5 generation and below, they are splitting into two tracks: selling factories to foundries and outsourced semiconductor assembly and test (OSAT) providers, or keeping lines in-house to develop fan-out panel-level packaging (FOPLP), through-glass via (TGV), redistribution layer (RDL), and glass core technologies.

Winbond Electronics Corp. reported record second-quarter revenue, profit, gross margin, and operating margin as DRAM prices jumped and demand stayed exceptionally strong. The results suggest the memory maker is benefiting from a sharp supply squeeze that could keep pricing elevated into the second half of 2026 and beyond.

Nokia is moving deeper into semiconductor manufacturing by acquiring NXP's Chandler fabrication campus in Arizona, signaling that the AI infrastructure race is expanding beyond GPUs and memory into the optical components needed to connect increasingly dense data-center clusters.

The government-organized 2026 Taiwan Innotech Expo (TIE) will open in Taipei on September 17, with the National Science and Technology Council's (NSTC) Future Tech Pavilion set to showcase the latest research achievements that are ready for proof-of-concept validation and technology licensing. This year's exhibition will spotlight six priority areas: AI applications, semiconductors, precision health, space technology, disaster prevention technology, and net-zero technology.

China's multilayer ceramic capacitor (MLCC) supply chain is accelerating capacity expansion as surging demand from AI servers and automotive electronics fuels one of the industry's strongest growth cycles, with domestic materials suppliers moving quickly to capture opportunities created by tightening global supply.

Nvidia is testing sharply lower-memory versions of its next-generation Rubin Ultra GPU, a sign that the worsening high-bandwidth memory (HBM) shortage is beginning to reshape the specifications of even the AI chip leader's most advanced products. The potential redesign could force cloud providers and AI developers to reconsider how many GPUs they need for large models, while handing memory suppliers greater leverage over the economics of the 2027 AI infrastructure build-out.
Memory module maker Transcend Information reported July 2026 consolidated revenue of NT$5.2 billion (approx. US$161.44 million), surging 308% from a year earlier and 3% from the previous month, with operating performance remaining at a high level.

AMD said on August 6 that it has agreed to buy Taalas, a Toronto-based startup focused on specialized AI inference silicon, in a move aimed at improving the efficiency of AI systems worldwide. The deal could help AMD compete in a rapidly growing market where companies need faster, lower-cost computing for real-time applications.