TSMC reported consolidated net revenue of about NT$416.98 billion (approx. US$13.2 billion) in May 2026, up 1.5% from April and 30.1% from a year earlier. The figure set a new monthly record and reinforced expectations that demand for leading-edge chips remains strong.
MicroIP has opened a nearly 300-ping southern R&D center at Kaohsiung's PIER F, with plans to expand smart manufacturing and smart transportation applications. The move signals a deeper push to link AI development with local logistics, industry, and public infrastructure.
AI servers and high-voltage electric vehicles (EVs) are tightening the global supply of high-end multilayer ceramic capacitors (MLCCs), prompting some Taiwan supply chain players to qualify Chinese alternatives such as Chaozhou Three-Circle as lead times lengthen.
Recent market speculation suggests that Nvidia's ambitious transition to a native 800-volt direct-current (800VDC) architecture for AI data centers may be delayed by up to a year, pushing large-scale production and deployment beyond 2028. The reports also claim that major cloud service providers (CSPs) could postpone adoption of the technology.
CanSemi Technology's planned ChiNext listing has exposed the financial strain behind China's push to build mature-node semiconductor capacity, as the Guangzhou-based foundry seeks fresh capital despite persistent losses, negative gross margins and a long road to profitability.
The Czech Republic and other Central and Eastern European countries have gradually become emerging markets for Taiwanese investment and exports. This follows the donation of vaccines during the Covid-19 pandemic from the Czech Republic to Taiwan, underscoring the shared values of democracy and freedom between the two.
As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking hubs.
Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new Taiwan facility, scheduled to be ready before September 2026.
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members seek to expand their role in global chip supply chains.
