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Aug 3
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.
Onsemi's second-quarter results pointed to a broadening recovery in semiconductor demand, with AI data-center applications emerging as the company's fastest-growing business, while the automotive and industrial markets are showing signs of stabilization. The outlook suggests that improving utilization and product mix could support further margin expansion, though the absence of a major upside surprise in third-quarter guidance suggests a broader inventory-replenishment cycle has yet to begin.
As Chinese automakers accelerate in-house chip development, the strategy is increasingly about more than smart vehicles. It is also tied to supply chain self-reliance, overseas expansion, and the longer-term push into artificial intelligence robots, even as advanced chips still rely on external foundries.
AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO Dennis Chen. He said higher upstream costs are flowing through the industry, while shortages in wafer front-opening unified pods (FOUPs) are adding another layer of strain as manufacturers expand capacity and compete for inventory.
China's CXMT drew fresh attention after its parent ChangXin Memory Technology (CXMT) went public, with market estimates of the firm's future valuation ranging from US$160 billion to US$1.1 trillion. The gap underscores uncertainty over how much the memory maker could disrupt the global DRAM market, including competition, pricing, and supply-chain dynamics.
Sandisk and SK Hynix have published a technical specification for high-bandwidth flash through the Open Compute Project, a move that could shape future AI infrastructure worldwide. The standard is meant to help developers build faster, more efficient inference systems as demand rises for memory that sits closer to compute and handles larger workloads.
Yangtze Memory Technologies Corp. (YMTC) has rejected claims that the US Patent and Trademark Office (USPTO) invalidated all 19 claims of a core 3D NAND patent, calling the reports "seriously misleading" while its patent battle with Micron Technology expands across the US, China, and Europe.

Montage Technology has begun pilot production of what it says is the industry's first CXL 3.2 memory expansion controller, targeting growing memory capacity and pooling requirements across AI, cloud computing and data centres.

RichWave says Wi-Fi 7 momentum stays strong in 2H26
Aug 4, 07:52

RichWave Technology said at a recent earnings call that Wi-Fi 7 adoption continues to rise rapidly, with strong demand from telecom operators and retailers. The radio frequency (RF) front-end supplier said that the second half of 2026 should be slightly better than the first half of the year overall, but warned that tight supply of memory and passive components could affect shipment timing.

ChipAgents, a two-year-old startup building autonomous AI agents for chip design and verification, has raised an additional US$60 million in Series A2 funding, taking its total Series A financing to US$134 million just six months after the round first closed.

Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According to Nikkei Asia, the Japanese NAND maker is prioritizing technology leadership over a rapid expansion of equipment spending, reflecting caution shaped by earlier downturns in the memory market.
Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme ultraviolet systems, offering a new route beyond ASML's EUV architecture.