South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.
Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process, as faster high-bandwidth memory raises pressure on logic performance, power efficiency and heat management.
South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial AI services will shift more infrastructure spending from model training toward inference.
Gallium arsenide (GaAs) foundry WIN Semiconductors (WIN) expects infrastructure revenue to continue growing in the third quarter of 2026, driven by demand from low Earth orbit (LEO) satellites and other aerospace applications, while shipments of smartphone power amplifiers (PAs) and Wi-Fi products are expected to remain broadly flat or post modest growth.
India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process Design Kit (PDK) available through the eChipHub platform, supporting semiconductor design education and research as part of the country's India Semiconductor Mission.
Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP) platform that combines general-purpose computing with long-range wireless connectivity for Internet of Things (IoT) applications, according to announcements by DeshGujarat and The Economic Times.
AI infrastructure, memory and advanced chipmaking led this week's tech agenda, with Intel, Samsung, SK Hynix, CXMT, Alibaba and Foxconn reshaping capacity and supply chains. Below are the most-read DIGITIMES stories from the week of July 20-26, 2026.
China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering to date. The deal gives the memory chipmaker fresh capital to expand capacity, develop advanced processes and accelerate new products, while creating a substantial demand pipeline for China's semiconductor equipment, materials, packaging and memory-module suppliers.
International IDMs such as Texas Instruments (TI) and STMicroelectronics are leaning into AI data-center demand, while the market's shift toward 400V and 800V power architectures is creating a longer runway for power semiconductors. Industry sources said the move could benefit Taiwanese suppliers in midrange products, with pricing gains extending into the second half of 2025 and, in some cases, 2027.
AMD is deepening its robot and physical AI ambitions, and the move could matter far beyond Taiwan's industrial PC sector. By building a broader partner network in edge AI and robotics, the chipmaker aims to challenge Nvidia as global developers and manufacturers seek cheaper, faster paths to autonomous systems.
Samsung Group is recruiting current and former government energy officials for its in-house think tank as electricity infrastructure emerges as a key issue for its semiconductor expansion in Yongin and the proposed Honam chip cluster.
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