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Jul 23
In-depth: Alibaba builds three-layer AI empire across chips, memory and models
Competition in China's AI industry is moving beyond large language models into chips, memory and computing infrastructure. CXMT's planned IPO on Shanghai's STAR Market has put renewed attention on Alibaba, the Chinese DRAM maker's largest industry investor.

China's AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba's T-Head Semiconductor, Cambricon and Hygon a larger role in a market once dominated by Nvidia.

Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting high-bandwidth memory (HBM) mass production in May 2029.
Apple is gearing up for a broad update to its entire Mac lineup, aiming to ride the wave of demand for high-performance computers driven by AI. New versions of nearly every Mac model are expected to roll out between this fall and next year.
Trumpf builds EUV moat with 40 years of chip tech
Jul 24, 06:22
AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key supplier of CO2 laser light sources for ASML's EUV exposure tools, says its EUV technology was the result of more than 40 years of sustained R&D and more than 20 years of collaboration with ASML to industrialize EUV.
As TSMC expands its investment in Arizona to US$265 billion, the global semiconductor supply chain is accelerating its move into the state, transforming the long-known "Sunshine State" into a new US hub for semiconductors and AI. Arizona has also become a focal point for companies looking to tap into the next wave of growth around advanced manufacturing, data centers, and related services.
Major printed circuit board (PCB) manufacturer Zhen Ding Technology Group has been actively developing its manufacturing base in Thailand. The investment was launched in 2023 and began production in the third quarter of 2025, while also accelerating industry-academia collaboration and local talent development in the country.

Mitsubishi Electric is seeking an agreement with Toshiba and ROHM by September on combining semiconductor operations centered on power devices, as the three Japanese suppliers negotiate product scope and corporate control while seeking government support.

AMD used its Advancing AI 2026 conference in San Francisco this week to do more than launch new hardware — it put its entire AI ecosystem strategy on display in a direct challenge to NVIDIA's grip on the AI infrastructure market.
STMicroelectronics (ST) has raised its revenue ambition for AI data centers to above US$1 billion in 2026 and well above US$2 billion in 2027, staking a larger claim on the AI infrastructure buildout as the European chipmaker swung back to profit in the second quarter of 2026.

Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.

The AI build-out has found its next pinch point. After spreading from Nvidia's accelerators to memory and networking gear, the scramble for capacity has now reached the once-plentiful server processor, and Chinese cloud and internet firms are being pushed into the kind of long-term supply commitments once reserved for the tightest parts of the market.