Powerchip Semiconductor Manufacturing Corp. (PSMC) is emerging as a central manufacturing partner in a new initiative to develop next-generation AI memory, marking a strategic shift for the Taiwanese foundry from mature-node contract manufacturing toward advanced 3D integration for artificial intelligence infrastructure.

Nvidia CEO Jensen Huang's absence from India's AI Impact Summit and his appearance at a late-night engineer gathering in California have drawn attention to the chipmaker's strategic priorities amid intensifying competition over next-generation memory and artificial intelligence hardware.

In a dramatic escalation of global trade tensions, President Donald Trump abruptly raised his newly announced global tariff to 15% on Saturday, effective immediately.

India's semiconductor drive is advancing unevenly, with quicker momentum in packaging and testing but mounting timeline risks in wafer fabrication, underscoring both progress and structural gaps as New Delhi seeks a larger role in global chip supply chains.

SK Group Chairman Chey Tae-won recently traveled to the US for a series of high-level meetings with CEOs from Nvidia, Broadcom, Microsoft, Meta, and Google. The strategic focus extends beyond expanding high-bandwidth memory (HBM) sales; it aims for a head start in the design phase collaboration for next-generation AI chips, aiming to capture key leadership in future AI accelerator architectures.

On February 19, India formally joined the US-led Pax Silica coalition at the India AI Impact Summit 2026, signalling closer strategic cooperation with Washington on semiconductors, critical minerals, and artificial intelligence supply chains.

India's most ambitious semiconductor project, a Tata Group-led wafer fabrication plant in Gujarat, is reportedly facing further delays, raising questions about the pace of the country's push to build a domestic chip industry.

The rules of winning in AI are changing, and one of the semiconductor industry's most prominent executives is calling time on the old playbook.

When chipmakers spend big, it is usually the machines that cost the most. Process equipment — the lithography tools, deposition systems, and etch chambers that define the bleeding edge of semiconductor manufacturing — has historically commanded the largest share of TSMC's capital budget. Facilities and civil construction matter, but they have rarely led the bill. That conventional wisdom is now being tested.