A potential bankruptcy filing by US-based silicon carbide (SiC) wafer maker Wolfspeed is stirring concern across the global semiconductor supply chain and could derail key plans by India's CG Power and Industrial Solutions, industry experts told The Economic Times.

The NTU SoC Center hosted a forward-looking technology forum on June 5, 2025, with artificial intelligence (AI) robotics as the central theme. During the event, MediaTek senior director Bor-Sung Liang highlighted the evolving nature of AI development and the emerging semiconductor opportunities it presents for Taiwan.

Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB manufacturer Lincstech will become apparent was a key focal point.

Hunan Goke Microelectronics Co. (Goke) announced on June 5, 2025, its plan to acquire a 94.366% stake in Ningbo Semiconductor International Corporation (NSI) through a mix of share issuance and cash. To fund the deal, Goke intends to raise capital from up to 35 qualified investors via a private placement. The transaction constitutes a major asset restructuring, and Goke shares resumed trading on June 6, 2025.

Memory module maker Goldkey Technology officially received approval from the Taiwan Stock Exchange on June 5, 2025, for its initial public offering (IPO), with a listing capital of NT$680 million (US$22.71 million). The company is well-positioned to capitalize on the recovery of the global memory industry in 2025 and anticipates significant growth momentum in the second half of the year.

Broadcom reported a 20.2% year-over-year revenue jump to a record US$15 billion in the second quarter of fiscal 2025, driven by surging demand for AI chips and strong contributions from VMware, with profit more than doubling amid improved operating margins.

Broadcom delivered a strong second-quarter performance for fiscal 2025, with AI-driven growth continuing to dominate the company's outlook. In the earnings call, President and CEO Hock E. Tan emphasized a marked uptick in AI inference workloads, highlighting a broader shift among customers from training to deployment as they monetize their AI platforms. The company now expects its AI semiconductor business to maintain a 60% year-over-year growth trajectory into fiscal 2026, underscoring strong demand visibility and deployment momentum across hyperscale clients.

As Lee Jae-myung takes office as South Korea's 21st President, the global tech and industry community is closely monitoring his ambitious economic agenda. Among the key sectors under scrutiny are semiconductors, batteries, shipbuilding, and defense industries that Lee pledged to nurture aggressively during his campaign.

Driven by the established trend of memory manufacturers reducing production, Team Group general manager Gerry Chen stated that memory prices are not expected to decline in 2025. The price gap between DDR4 DRAM and DDR5 will continue to narrow, while NAND flash prices are projected to maintain an overall upward trajectory. As a result, the company holds an optimistic outlook for operations from the second quarter to the third quarter.

Arm has introduced Zena Compute Subsystems (CSS), a pre-integrated, safety-certified automotive compute platform designed to cut chip development timelines by up to 12 months. Announced on June 4, 2025, the launch marks a pivotal move by the semiconductor IP leader into the software-defined vehicle (SDV) market, providing automakers with a unified architecture to fast-track AI capabilities across future car models.

India-based Semicon Fab Technologies has proposed establishing a common semiconductor research and development facility modeled on Taiwan's ITRI (Industrial Technology Research Institute) in Gujarat's Dholera region, aiming to support the country's fledgling chip ecosystem.