Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.
One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.
Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.
SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting how the industry's migration to larger wafers is beginning to reshape SiC economics across electric vehicles and AI power infrastructure.
Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic Materials focusing on silicon carbide (SiC), a third-generation semiconductor material, and Kentec targeting the AI data center (AIDC) market. Both companies are expected to list on Taiwan's Emerging Stock Board in October 2026.
