The US Department of Commerce's Bureau of Industry and Security (BIS) has extended the suspension of its 50% Affiliates Rule until January 10, 2027, from the previous November 9, 2026 deadline.

The boom in AI demand has triggered a global memory crunch, creating persistent supply shortages and price hikes. The market is currently dominated by Samsung Electronics, SK Hynix, and Micron Technology. While China's ChangXin Memory Technologies (CXMT) has expanded its mass-production capabilities rapidly, US export controls and cybersecurity concerns continue to prevent it from competing directly in the US against American and South Korean rivals.

Solidigm, a subsidiary of SK Hynix, is considering building a NAND flash wafer fab in the US. Funding and the investment timeline have yet to be settled, but DIGITIMES Intelligence believes the project is highly likely to move forward, given AI-driven storage demand and the prospect of US government support.

Samsung Electronics has reportedly agreed to sell approximately 300 semiconductor manufacturing tools from its shuttered 8-inch S7 foundry in Giheung to South Korea's DB Group, as DB HiTek faces tight production capacity and Samsung prepares to withdraw from the 8-inch foundry business.

Infineon Technologies is betting on RISC-V scalability with AURIX RC1, its first RISC-V-based microcontroller (MCU) platform, unveiled this week. A single instruction set lets the platform span everything from very small controllers to real-time vehicle computers and robotic motion controllers, so RC1 can serve automotive, robotics, and industrial customers at the same time.

DIGITIMES observes that as large language models (LLMs) and agentic AI development become increasingly widespread, it is driving not only significant growth in data center CPU demand but also a sharp surge in key-value cache (KV cache) storage requirements. As DRAM and HBM capacity face severe supply shortages, demand for data center SSDs is rising rapidly.

As artificial intelligence reshapes global chipmaking, the UK's strength in design, materials and research is being tested by a longstanding challenge: turning technological breakthroughs into scalable commercial products.

Three US lawmakers asked Nvidia CEO Jensen Huang to attend a closed-door meeting to discuss his interactions with former Megaspeed executive Alice Huang. The request followed recent reports alleging that Alice Huang had fed intelligence to the Chinese government and had developed a "close relationship" with Jensen Huang.

China's Yangtze Memory Technologies (YMTC) plans to source as much as 70% of the manufacturing equipment for its fourth NAND flash factory from domestic suppliers, a substantial increase over the share at its existing operations as the company expands into advanced memory for AI and data centers.

Debt held by Taiwan's science park operating funds reached NT$163.54 billion (approx. US$4.97 billion) as of the end of September 2026, while the National Science and Technology Council (NSTC) remains confident that rising operating cash flow will accelerate repayment. The government continues to develop and expand science parks to meet industry demand, including new sites and expansions across Taiwan.

Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center AI accelerators. The company aims to deliver a lower-cost, more energy-efficient alternative to sixth-generation high-bandwidth memory (HBM4) for AI inference workloads requiring high bandwidth and large buffers.