TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.
A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global markets, according to a new report. The findings suggest the manufacturing push backed by Washington's CHIPS Act may depend on sustained funding and closer industry cooperation to avoid bottlenecks.
A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the supply chains of automakers, industrial firms, and device makers worldwide. The remarks also hint at how shifting global demand could influence where next-generation semiconductors get built.
Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen its position in the AI era.
AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.
