Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up chip stocks by focusing attention on the importance of CPUs for agentic AI.
Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full utilization, South Korea's Money Today reported on September 21. The company is also reviewing whether to build a new 2nm production line for base dies in future HBM5 products.
Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and ASE.
MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery life, and wireless performance could shape consumer computing worldwide. The Dimensity CX C10 Max is built for thinner systems, faster multitasking, and privacy-focused Gemini features in markets beyond Asia.
Demand from high-tech companies for new research and manufacturing sites remains strong, prompting Taiwan to advance plans to expand Longtan Science Park by 104 hectares as the government seeks to accommodate continued growth in AI and semiconductor industries.
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.
