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Sep 15
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply models prompted the foundry to adjust its advanced capacity allocation. Supply chain sources said Nvidia and Apple continue to dominate TSMC's advanced process and packaging resources, while AWS has recently expanded AI chip tape-outs, giving Annapurna more 3nm capacity.
The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity, the defining variable of the AI buildout.

Anthropic CEO Dario Amodei's call to slow frontier AI development has stirred debate over safety, but chip industry sources say global demand for AI infrastructure is likely to keep rising. For readers worldwide, the larger issue is not whether AI spending stops, but how quickly it spreads across clouds, devices, and industries.

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.

Of the 94 listed Taiwanese semiconductor companies DIGITIMES tracks, 80 grew year-over-year in August 2026 and 14 declined. Median year-over-year growth was 27%. Sixty-three of the 94 posted faster year-over-year growth in August than in July, when the median was 21%.

Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops: the key-value cache outgrows the HBM on the accelerator, and the usual fallback makes things worse.

As memory shortages worsen, Team Group is aggressively deepening its footprint in the industrial control market. Vice general manager Shao-An Hsia noted that with AI applications accelerating their expansion from the cloud to the edge, industrial and edge system manufacturers must pivot away from competing head-on with cloud giants for component supply. Instead, they need to rely on flexible specification adjustments and specialized hardware protection technologies. In driving edge AI adoption, memory suppliers will serve as "icebreakers" during the commercialization process.

Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing investment plans, as demand from AI servers is expected to remain strong through the end of the decade.

AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO) are steering limited capacity toward high-value server components, tightening conventional supply, lifting prices, and creating an opening for Chinese suppliers in PCs.

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.

DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.