Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated for Nvidia's next-generation Vera Rubin platform, expanding the company's AI memory strategy beyond HBM into high-performance server storage.

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as one AI semiconductor platform, turning a broad portfolio into a clearer competitive weapon.

China's CXMT has moved from a little-known state-backed DRAM maker to one of the most closely watched companies in the global memory chip race, with Apple testing its chips for China-market devices and Beijing counting on the company to anchor a domestic AI supply chain.

AI servers are tightening Taiwan's power component supply chain, lifting demand for MOSFETs, PMICs, cooling motors and power management products even as weak PC demand limits suppliers' ability to pass on higher costs.

A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path for real-time brain modeling, brain-computer interfaces, and brain disease diagnosis.

Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers continued to expand. The Taiwan-based semiconductor inspection and analysis company also said on July 6 that its board had approved a cash capital increase to support expansion of its AI chip analysis platform, silicon photonics interconnect testing equipment, and mass production of its self-developed tools.

ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates. While first-half shipments came in below plan, chairman Chien-Hui Lee said the business has room to grow more strongly in the fourth quarter.