Taiwan-based test interface maker Chunghwa Precision Test Tech (CHPT) expects steady revenue growth through 2026, driven by rising AI ASIC orders and expanded capacity, as stronger visibility in AI demand helps offset pressures from memory shortages and higher component prices affecting smartphones and consumer electronics.

MediaTek president and chief operating officer Joe Chen stated that artificial intelligence (AI) computing is shifting from training to inference applications, with rapid growth expected across cloud data centers and various edge devices. He noted that following the rise of generative AI and agentic AI, physical AI is also anticipated to see more mature applications and development within the next two to three years.

To promote the formal deployment of South Korea's domestic NPU and reduce reliance on Nvidia, LG Consulting & Solutions (CNS), the IT services arm of South Korea's LG Group, has joined forces with local IC design company FuriosaAI. The two will jointly integrate FuriosaAI's second-generation RNGD NPU into LG CNS's enterprise agentic AI platform, targeting the public-sector digital transformation market.

IC design house PixArt held its earnings call on February 6, reporting that its fourth-quarter 2025 performance largely met expectations, with modest revenue growth. Gross margin, however, declined slightly due to a higher proportion of CMOS image sensor (CIS) shipments.

The smartphone industry is facing ongoing challenges from soaring memory prices, with many expecting the market to contract in 2026. Mid- and low-tier smartphones are projected to suffer the most significant impact. Retailers report that the persistent shortage and price surge of generic DDR memory remain unresolved. Smartphone manufacturers have responded with various strategic measures, including adjusting pricing and downgrading specifications for mid- and low-end models.

According to ANI and IANS, Qualcomm Technologies has completed the tape-out of its 2-nanometre semiconductor design with significant contributions from its engineering centres in India, underscoring the country's rising importance in the global race toward next-generation chip technologies and aligning with New Delhi's push to strengthen domestic semiconductor design capabilities.

India and Malaysia used Prime Minister Narendra Modi's official visit to Kuala Lumpur to signal a step-change in their Comprehensive Strategic Partnership, unveiling wide-ranging cooperation across semiconductors, clean energy, digital finance, and security that carries implications for supply chains, the Indo-Pacific balance, and South–South economic integration.

According to The Economic Times, India's Electronics and IT Minister Ashwini Vaishnaw said India Semiconductor Mission (ISM) 2.0 will prioritise chip design companies and startups, followed by building a domestic ecosystem for semiconductor equipment and materials, and strengthening the talent pipeline to support end-to-end semiconductor development.

TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process, signaling Japan's plan to reclaim its semiconductor glory. However, according to supply chain sources, when the Japanese government first invited TSMC to build fabs in Kumamoto, it had already mapped out three major strategies that included advancing advanced packaging and constructing new facilities. Most importantly, Japan aims to leverage its strengths in equipment and materials to reinforce its critical position and bargaining power in the advanced packaging industry chain.

Memory makers Macronix International and Winbond Electronics reported impressive revenue growth for January 2026, signaling a positive trend in the memory market despite the traditional seasonal slowdown.