Huawei and ByteDance have jointly unveiled a next-generation AI acceleration chip based on resistive random-access memory (RRAM), developed with Tsinghua University and other Beijing research institutions.
Samsung Electronics and SK Hynix have notified customers of plans to raise DRAM prices in the second quarter of 2026 and have begun price negotiations, South Korean outlet SEDaily reports. Industry sources say the move reflects surging AI-driven demand and changing trading practices that favor large purchasers.
Rohm has reached an agreement to integrate its internal development and manufacturing capabilities for gallium nitride (GaN) power devices with process technology from Taiwan Semiconductor Manufacturing Company (TSMC), with the goal of creating an end-to-end production system within the Rohm Group.
Meta's push to design its own AI chips has reportedly hit major technical and strategic setbacks, forcing the company to scrap its most ambitious in-house training processor and lean more heavily on external suppliers, according to The Information.
Taiwan Semiconductor Manufacturing Co. (TSMC) has reached a critical financial turning point in its high-stakes expansion into the American desert, reporting the first-ever annual profit for its Arizona subsidiary.
As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and power consumption as core bottlenecks in data transmission and switching, elevating the role of optical interconnects and silicon photonics (SiPh). With support from AI chip leader Nvidia, the notion of optics gradually replacing copper has moved to the center of industry debate.
Below are the most-read DIGITIMES Asia stories from the week of Feb 3 - Mar 1, 2026.
At Mobile World Congress (MWC), Nvidia said it and leading operators and infrastructure providers, including Booz Allen, BT Group, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank, and T‑Mobile will build next‑generation wireless networks on AI‑native, open, secure, and trustworthy platforms.
A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise, and India's talent. Alongside this, companies including Foxconn, Polymatech Electronics, Nvidia, AMD, Kaynes Semicon, and IBM are deepening India investments, reflecting rising localization, supply-chain ambitions, and expanding AI, packaging, and materials ecosystems despite policy and trade uncertainties.
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley.
Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both the company and its partners, however, face a complex array of engineering, supply-chain, and data center infrastructure challenges before Rubin can displace prior architectures as the industry standard for large-scale artificial intelligence.
More coverage
