Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial officer Chih Fang Chiu stated that full-year 2026 revenue is projected to grow by 20% to 30%. Beyond the consolidation benefits of acquiring Ming Chun Yuan Micro Precise Technology in July 2026, growth momentum remains robust across heat spreaders, solid-state drive (SSD) enclosures, and IC substrates, alongside ongoing expansion in thermally conductive adhesives. The company aims to double total revenue within three years.
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.
Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does not.
Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory. But engineers from OpenAI and Intel see limits to using the interconnect as a substitute for high-bandwidth memory (HBM) where bandwidth remains critical.
Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11 million) to lease and convert an idle factory in Kunshan, Jiangsu Province, China, as it moves to capture spillover demand for artificial intelligence (AI) and high-density interconnect (HDI) materials. The expansion budget is to be invested in three phases. Depending on future growth demand, the company will proceed with further capacity expansion investments in the second and third phases.
ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM supplier closer to the core market of domestic rival Yangtze Memory Technologies (YMTC) as enterprise storage becomes a bigger part of the memory growth story.
Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip stage at Samsung Foundry, adding a manufacturing dimension to Samsung's recent investment in the two-year-old company.
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.
