Hermes Testing Solutions Inc. (HTSI), a semiconductor wafer-testing solutions provider, is expanding its Taiwan operations. Its board approved budget authorisations on October 22 for a new R&D centre in Hsinchu and a manufacturing centre in south-central Taiwan, with total investment expected to exceed NT$7 billion (approx. US$215 million).
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market coverage, including a new 3nm fab at the Southern Taiwan Science Park (STSP), the transfer of Nvidia-related high-bandwidth memory (HBM) base die orders to TSMC, and whether demand for A14 includes Intel server CPUs.
India's tech push opens markets unevenly: foreign suppliers get first crack at Tata's fab, Lam courts local vendors, Jio's IPO tests its 5G pitch, and CleanMax powers AI data centers.
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from a conventional organic package substrate to the silicon interposer carrying the compute chips, increasing bandwidth density and reducing power consumption for future AI system interconnects.
Texas Instruments (TI) held its latest earnings call this week, projecting fourth-quarter 2026 revenue of US$5.8 billion to US$6.3 billion. The midpoint of its guidance is broadly in line with third-quarter revenue, outperforming the seasonal declines typically seen in the fourth quarter.
Since Elon Musk publicly confirmed that Tesla and SpaceX are evaluating a potential merger, the prospect has stirred widespread speculation over what could become the largest corporate transaction in history—and whether combining two of Musk's biggest technology platforms would actually create value beyond the sprawling ecosystem they already share.
Nvidia CEO Jensen Huang said the company did not expect memory supply to exceed demand in the coming years and remained open to working with China's ChangXin Memory Technologies (CXMT). The comments, made during the GTC Berlin conference and reported by CNBC, came as falling market valuations for memory manufacturers and new Chinese dynamic random-access memory (DRAM) developments intensified concerns about oversupply.
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The move marks the first time the FCC has used a new rule targeting devices whose chipmakers are deemed national security risks.
Samsung Electronics has ordered additional equipment to fill the remaining space at its first foundry fab in Taylor, Texas, a move that would lift the plant's 2nm capacity to 20,000 wafers per month in the second half of 2027, ZDNet Korea reported on October 23, citing industry sources.
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a key challenge, and initial demand is expected to come mainly from the United States, where demand related to artificial intelligence is strong.
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