DIGITIMES Semiconductors news

Sep 16

Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and Answers for the AI Era" forum on September 15. Students asked how TSMC determines whether a technology is worth long-term investment when information is incomplete and the technological direction remains unclear, as well as how people can develop the ability to judge whether answers generated by artificial intelligence (AI) are true or false in the AI era.

Taiwan, South Korea should stop comparing, says DIGITIMES chairman

Sep 16

SK Hynix, Intel in talks on US production to ease memory crunch

Sep 16

Samsung reportedly weighs Micron's newest memory for Galaxy S27

Sep 16

A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors

Sep 16

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IC MANUFACTURINGTrumpf eyes glass as AI demand drives packaging innovation

Sep 17, 16:32

At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser solutions to advanced chip packaging, specifically for drilling holes in glass substrates.

MEMORY CHIPSSamsung bets on zHBM as 2.5D memory nears its limits

Sep 17, 16:25

Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.

MEMORY CHIPSCXMT cashes in on the DRAM shortage — and takes aim at HBM

Sep 17, 16:19

ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.

IC MANUFACTURINGTSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership

Sep 17, 16:11

TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology Council (NSTC) has not yet approved the related 2027 budget. NSTC Minister Cheng-Wen Wu said the partnership with Taiwan Semiconductor Research Institute (TSRI) and ITRI EOSL remains unchanged, although the location has shifted.

MEMORY CHIPSMemory LTAs lock up 50-70% of capacity

Sep 17, 15:51

The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from three to five years, with many in the industry expecting 2027 to be the tightest year yet. Supply chain sources said Kioxia has about 50% of its LTA capacity tied up, while South Korea's two major vendors reserve about 70% of capacity for LTAs. Micron also has around 60% of its capacity locked into such agreements.

IC MANUFACTURINGArdentec, Sigurd race into silicon photonics TIA testing as US client books capacity

Sep 17, 14:15

The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance amplifier (TIA) testing as AI data-center networks shift toward faster optical interconnects. Ardentec and Sigurd are among the firms benefiting as a major US customer rushes to reserve capacity.

IC DESIGN, DISTRIBUTIONSamsung expands SRAM, IP to speed chip development

Sep 17, 12:30

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster AI chip refresh cycles push customers to demand stronger process competitiveness, faster development, and better-prepared infrastructure including IP. Samsung is responding by expanding memory design options, IP, and development tools through its Samsung Advanced Foundry Ecosystem (SAFE) program.

MEMORY CHIPSAI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Sep 17, 12:29

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.

IC MANUFACTURING20 of China's OSATs push into advanced packaging amid EUV curbs

Sep 17, 12:07

China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's largest outsourced semiconductor assembly and test (OSAT) suppliers to specialist packaging houses and chiplet startups, increasingly targeting AI and high-performance computing (HPC).

MEMORY CHIPSSK Hynix weighs US memory options as buyers lock in 2027 supply

Sep 17, 11:54

SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional capacity.

IC MANUFACTURINGSamsung reportedly starts Tesla chip trial production at Taylor fab

Sep 17, 11:51

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving the US fab into 2nm wafer production and yield verification ahead of full-scale operations.

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