Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years. The rising need for larger HBM capacities is expected to grow exponentially, while 3D DRAM technology emerges as a solution to overcome current process scaling limits.
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a net profit of US$87.9 million in 2025, compared to US$290 million revenue and a net loss of US$484.8 million in 2024.
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues to move forward but remains marked by repeated setbacks alongside visible progress. While construction activity and regulatory milestones indicate momentum, leadership exits and complex site conditions underline the challenges of executing a greenfield fab at global scale.
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies. Building on its strengths in Thin-Film Transistors (TFTs), the company continues to enhance hardware performance while aggressively deploying in Mini LED, Micro LED, and advanced semiconductor packaging. Through technological iteration and capacity optimization, it aims to strengthen its market competitiveness.
Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state drive (SSD) product lines, according to IT Home, citing supply chain sources.
ASML is moving to eliminate a wide range of management roles as part of a broader effort to simplify its organization and improve execution, according to internal documents viewed by Business Insider.
Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix, meanwhile, is preparing to sample its next-generation high-bandwidth memory product as memory makers accelerate their product roadmaps.
2026 has become a major year for IPO fundraising among leading AI players. At the end of 2025, Nvidia CEO Jensen Huang spent US$20 billion to acquire the IP and talent of AI chip startup Groq. In April 2026, The Information reported that OpenAI will purchase more than US$20 billion worth of chips from AI chip startup Cerebras. These two amounts are nearly identical; Nvidia for acquisition, OpenAI for procurement. Although seemingly isolated events, they are symmetrical moves.
The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform. This move not only eliminates a strong competitor but also sparks a fierce battle between Samsung Electronics and TSMC over LPU foundry orders.
Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028.
As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon Robotics is mounting an ambitious strategic push — one that places it in more direct competition with Tesla.
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