China's Yangtze Memory Technologies (YMTC) plans to source as much as 70% of the manufacturing equipment for its fourth NAND flash factory from domestic suppliers, a substantial increase over the share at its existing operations as the company expands into advanced memory for AI and data centers.
Debt held by Taiwan's science park operating funds reached NT$163.54 billion (approx. US$4.97 billion) as of the end of September 2026, while the National Science and Technology Council (NSTC) remains confident that rising operating cash flow will accelerate repayment. The government continues to develop and expand science parks to meet industry demand, including new sites and expansions across Taiwan.
Qualcomm has completed initial hardware validation of its high-bandwidth compute (HBC) memory architecture, which will form a key part of its next-generation Dragonfly data-center AI accelerators. The company aims to deliver a lower-cost, more energy-efficient alternative to sixth-generation high-bandwidth memory (HBM4) for AI inference workloads requiring high bandwidth and large buffers.
South Korean chip designer LX Semicon posted its first quarterly operating loss since going public in 2010, as weak demand for display chips and pricing pressure from electronics manufacturers weighed on earnings. The company also nominated a new CEO to lead its turnaround efforts.
National Silicon Industry Group (NSIG) expects to complete its expansion to 1.2 million 300mm silicon wafers per month by the end of 2026, positioning the Chinese semiconductor materials supplier to benefit from recovering wafer prices and growing demand for silicon-on-insulator (SOI) substrates used in silicon photonics (SiPh).
Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages are expected to persist through 2028, DealSite reported.
Taiwan and the UK are deepening technology ties as supply-chain restructuring and industrial security reshape semiconductor strategy. A new bilateral arrangement covers semiconductors, space, communications, net zero, and AI standards, while cooperation could link British research strengths with Taiwan's manufacturing and testing capabilities across more of the chip lifecycle.
Samsung Electronics and SK Hynix are expanding their high-value NAND flash portfolios to meet growing demand for high-performance, high-capacity enterprise solid-state drives (eSSDs). The proliferation of AI agents and long-context services is increasing the need for key-value (KV) caching, prompting both companies to develop next-generation SSDs and tiered memory technologies to reuse AI computation results more efficiently.
Revenue from conventional DDR and LPDDR memory grew faster than that from high-bandwidth memory (HBM) in the third quarter of 2026, as global DRAM revenue surged 369% year over year to nearly US$200 billion, according to Counterpoint Research.
China's second-largest contract chipmaker, Hua Hong Grace Semiconductor, is expanding into silicon photonics and power management chips to capitalise on AI infrastructure demand, following record third-quarter 2026 revenue and a 147.1% surge in profit.
Optoelectronic chip testing equipment maker EnliTech reported self-assessed consolidated revenue of approximately NT$51.504 million (US$1.57 million) in October 2026, up 71.33% year over year and a record high for the month. Revenue exceeded NT$50 million for the second consecutive month, while cumulative revenue for the first 10 months of 2026 reached approximately NT$372 million, up 44.63% from the same period in 2025.
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