DIGITIMES Semiconductors news

Jul 16

TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue

TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations, underscoring sustained demand for AI and high-performance computing (HPC) chips.

C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers

Jul 16

As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore

Jul 16

Korean prosecutors raid Rambus, Montage, and Renesas as memory-interface chip probe goes global

Jul 16

Jensen refutes Vera Rubin's delay, continuing Nvidia's running rebuttal of the rumor mill

Jul 16

Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

Jul 16

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IC MANUFACTURINGCica-Huntek opens Arizona plant to support advanced chip manufacturing in the US

Jul 17, 08:00

Cica-Huntek Chemical Technology said on July 16 that its subsidiary facility in Phoenix, Arizona, had been completed and officially opened after about US$8 million in investment. The move was designed to support a core customer's global production expansion and meet rising demand for advanced semiconductor facility systems in North America.

MEMORY CHIPSMemory shortages deepen as suppliers turn to long-term contracts

Jul 17, 07:58

Memory shortages are rippling through global electronics supply chains, as tightening supply in DRAM and NAND pushes manufacturers to lock in long-term contracts. The squeeze could mean higher prices, longer lead times, and fewer options across servers, industrial systems, and consumer devices.

PASSIVE, PCB, OTHER IC COMPONENTSCapacity reservations and inventory buildup reshape component makers' 3Q26 outlook amid persistent shortages

Jul 17, 07:58

Global investment in AI infrastructure continues to accelerate, yet component shortages across the supply chain have not eased as previously expected. Instead, tightening availability across multiple product categories has intensified supply constraints.

IC MANUFACTURINGChina's AI chips hit three walls — and bet on 3D memory to break through

Jul 17, 07:57

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

MEMORY CHIPSMemory suppliers push prices higher as Apple and automakers face tighter supply

Jul 17, 07:54

Memory suppliers have regained pricing power as AI-driven stockpiling and advance capacity bookings tightened supply for consumer electronics and automotive customers. The shift has become especially visible in the Apple supply chain, where industry sources said the company is now effectively the last major line of defense as vendors push for higher prices and allocate capacity elsewhere.

PASSIVE, PCB, OTHER IC COMPONENTSAI hardware boom lifts Taiwan's rail and CCL suppliers; optical module tells messier story

Jul 16

Taiwan's technology supply chain delivered another month of strong year-over-year revenue growth in June 2026, led by suppliers tied directly to AI server infrastructure, even as the optical module segment showed the sharpest slowdown of any sector tracked and revealed a widening gap between winners and laggards within its own ranks.

IC MANUFACTURINGTSMC says 2nm has four times as many tape-outs as 3nm at the same stage

Jul 16

Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production of its first 2nm process.

IC MANUFACTURINGAI chips are running hotter — and Niching is betting its future on keeping them cool

Jul 16

As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor materials supplier Niching incorporated heat spreader maker Ming Chun Yuan Micro Precise Technology into the group on July 1, 2026, and analysts expect the merger to lift revenue by 30% and gross margin by 10%.

IC MANUFACTURINGTaiwan OSATs expand non-China capacity with US and SEA push

Jul 16

As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China. ASE, SPIL, KYEC, Greatek, and Tong Hsing are all pushing ahead in 2026 to strengthen supply-chain resilience amid geopolitical risk.

IC MANUFACTURINGTSMC boosts US investment by US$100B as C.C. Wei outlines long-term capacity planning with customers

Jul 16

To address structural long-term growth in semiconductor demand, TSMC chairman C.C. Wei said the company works closely with customers — and its customers' customers — to jointly plan future capacity.

IC MANUFACTURINGTSMC eyes record quarter: 2nm ramp drives 3Q26 guidance above US$44B

Jul 16

TSMC is projecting its strongest quarter ever, guiding third-quarter 2026 revenue to between US$44.6 billion and US$45.8 billion on the back of accelerating demand for leading-edge chips and the steep ramp-up of its 2-nanometer process technology.

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