DIGITIMES Semiconductors news

Aug 20

SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders

SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts see it as evidence that HBM competition is shifting into a customized, jointly developed phase.

Nvidia, TSMC, chip gear makers ride AI boom into high-margin club

Aug 20

Marvell issues Google warrant worth $12.2bn at exercise — custom chip work spans five TPU-related categories

Aug 20

CXMT planned to use Samsung process data to develop DRAM, ex-engineer says

Aug 20

Intel Malaysia packaging expansion draws HBM flows from Taiwan

Aug 20

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IC DESIGN, DISTRIBUTIONXiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy

Aug 21, 12:08

Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.

IC MANUFACTURINGJCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

Aug 21, 12:02

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance computing lifting capacity utilization and accelerating the shift toward higher-value advanced packaging.

MEMORY CHIPSSK hynix weighs Japan memory fab in Miyagi, but says no investment is final

Aug 21, 11:27

SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision has been finalized.

IC MANUFACTURINGFOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Aug 21, 10:33

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus as a next-generation packaging technology that converts traditional round wafer formats into rectangular panels, offering potential gains in both production efficiency and cost.

IC MANUFACTURINGAnalyst: CPO gains momentum as AI interconnect demands outpace chip gains

Aug 21, 10:01

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.

MEMORY CHIPSSK hynix outlines CPO roadmap as AI computing shifts from chips to systems

Aug 21, 09:31

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory (HBM) to compete not just on individual chip performance but on how memory, processors, and networking are designed together as AI computing systems scale.

MEMORY CHIPSMicron launches long-horizon research hub to push memory and AI development

Aug 21, 09:15

Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort targets breakthroughs in memory, advanced packaging, and new compute architectures that may shape global technology supply chains, energy use, and access to smarter devices.

IC DESIGN, DISTRIBUTIONCharts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up

Aug 21, 06:17

Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.

IC MANUFACTURINGJCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

Aug 21, 06:16

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities towards denser 2.5D and 3D integration.

IC MANUFACTURINGCharts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers

Aug 21, 06:16

Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring across company filings.

MEMORY CHIPSNitto Denko to expand HDD baseboard capacity for AI data center demand

Aug 21, 06:14

Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by 40% from fiscal 2025 levels. The move is aimed at meeting demand driven by AI-related data center growth.

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