ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries while AI-related capacity investment and localization continue to support demand.

China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.

MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers (CSPs) battle for semiconductor output in Taiwan's Hsinchu Science Park. MediaTek has also denied market rumors that its TPU orders have slipped.

Tata Electronics, Apple's contract manufacturing partner, provided INR612.8 billion (US$6.38 billion) in corporate guarantees on behalf of its subsidiaries in fiscal 2026 as it expanded iPhone manufacturing and semiconductor projects, The Economic Times reported.

Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract prices left HBM largely outside the memory price surge.

Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling capacity of mobile devices.

Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September 30, 2026, the design software and IP company raised its long-term revenue goal to mid-teens annual growth through fiscal 2030, lifted its operating margin objective to about 50%, and issued fiscal 2027 guidance roughly two and a half months earlier than usual, anchored by a US$1 billion IP license with Amazon and a new model partnership with OpenAI.

Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate on developing advanced memory cells and structures, multi-chip stacking architectures, and new materials engineering technologies to improve the memory density and performance required in the artificial intelligence (AI) era.

Micron told investors on September 30 that it cannot say when memory supply will catch up with demand. It expects the shortage to get worse over the next two years, even though additional cleanroom space is expected from late 2028.

Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI chip demand is reshaping capacity plans, as customers worldwide race to secure advanced substrate supply for the next several years.

TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems. The shift could reshape semiconductor competition, as demand for compute, bandwidth, power delivery, and cooling rises in tandem. The company outlined the trend at its heterogeneous integration forum during SEMICON Taiwan 2026, saying AI computing transistors in a single CoWoS package are set to rise more than 48-fold by 2029 from 2024 levels, while total HBM bandwidth is expected to increase more than 34-fold.