LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Business reported.
Fuel cells are emerging as one of the key solutions for future energy supply. Kaori Heat Treatment, one of the suppliers in the Bloom Energy supply chain, said that its fuel cell order visibility has extended from the previous six months to one year. To meet growing demand for fuel cells, liquid cooling systems, and plate heat exchangers, the company plans simultaneous capacity expansions in Kaohsiung, Taoyuan, Taiwan, and Thailand.
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical waste treatment. Techzone Chairman Chen Li-Li said that semiconductor companies are currently pursuing two major approaches in response to ESG requirements: first, establishing outsourced waste treatment channels; and second, building in-house zero-waste centers to process waste within their own facilities. Both approaches involve close cooperation with Techzone.
Trusval Technology reported record 2025 revenue and profit, signaling stronger demand for semiconductor-related construction and industrial systems that matter to global supply chains. The Taiwan-based company said it is entering 2026 with cautious optimism, as it expands green fab solutions, overseas projects, and technology upgrades.
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.
A US$250 million award for I-Pulse's semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply chains used by industries worldwide. The funding is aimed at domestic capacity, but the technologies being developed may shape global competition and access.
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining forward-looking R&D priorities in AI, satellite communications and next-generation connectivity.
South Korea's Ministry of Employment and Labor has launched chemical safety inspections at 25 semiconductor manufacturers, including SK Hynix, after a series of fluorine gas leaks at chip plants raised fresh concerns over industrial accidents.
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