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Apr 7
Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers to seek alternatives, leaving Intel as the only credible challenger with its EMIB platform.

Industry sources reveal that polarizer manufacturers are preparing a price hike starting in the second quarter of 2026, with increases beginning at 10%, though final approval remains pending. This is because the escalating conflict in Iran has heightened risks to the Middle East energy supply chain, driving up crude oil prices and pushing costs higher for upstream polarizer materials such as PET, adhesives, and plastics.
Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.
The global AI race is no longer just about who builds the fastest chip. Increasingly, it is about who writes the rules.
Indium phosphide (InP), a critical material for long-distance optical communication, has become essential for AI-driven high-speed data transmission. However, China's export restrictions have triggered a shortage of InP substrates, creating a bottleneck in manufacturers' capacity expansion worldwide. The supply chain acknowledges that due to China's export curbs and the technical challenges of producing InP substrates, major international players remain cautious about increasing investments. The timeline for resolving this shortage remains uncertain.
Arm recently unveiled its first self-developed AGI CPU, marking a significant milestone as the company shifts from a pure technology IP licensor to a standard CPU supplier competing directly with Advanced Micro Devices (AMD), Ampere, and Intel.
India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However, the company acknowledged that the headline volume tied to the collaboration is still based on expected customer adoption rather than firm orders.

French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new presence in Canada and gained recognition at the American Physical Society meeting, where it was identified as a potential key player in the emerging quantum computing era.

US lawmakers are moving to tighten semiconductor restrictions, with a bipartisan proposal targeting both equipment exports and downstream controls on advanced chips.

Samsung and SK Hynix delivered record performance in 2025, driven by strong investment in AI infrastructure. Yet the gains have not flowed upstream. Materials and component suppliers are facing a second consecutive year of price cuts, with contract terms for 2026 again revised lower.

MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house "MSS HG" platform at the Electronic Production Equipment Exhibition on April 8.

Memory module maker Innodisk extended its strong growth momentum in March 2026, reporting monthly revenue of NT$5.67 billion (approx. US$177.34 million), up 35.8% month-over-month and 484.8% year-over-year. First-quarter revenue reached NT$13.18 billion, also a record high.