TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.
South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.
Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second quarter of 2026. Stronger demand for CCL-related products helped lift quarterly revenue to NT$420 million (US$13 million), up 24.2% year-over-year.
South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors is struggling to move beyond the planning stage because the government has not secured a major anchor company to drive demand and support commercialization, according to ETNews.
Powerchip Semiconductor Manufacturing Corp. (PSMC) will maintain its existing strategy following the sudden death of Chairman Frank Huang and expects business to improve quarter by quarter in the second half of 2026, Acting Chairman Brian Shieh said on August 4th.
China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing sector, claiming that 8 of every 10 humanoid and quadruped robots sold globally are produced by Chinese companies. The remarks came at a July 31 press briefing and also highlighted progress in IC design, semiconductor equipment, wafer fabrication, and packaging and testing.
