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Apr 28
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing capacities stateside, strengthening local OSAT capabilities is seen as the "last mile" in building a domestic supply chain.
China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor industry continues its shift toward advanced packaging.
China-based memory interface chip supplier Montage Technology reported solid first-quarter 2026 results, supported by rising demand for AI servers and accelerating adoption of next-generation memory technologies.
TSMC has fully divested its stake in Arm Holdings, selling approximately 1.11 million shares at US$207.65 each for a total of US$231 million, the company disclosed on April 29, 2026. The transaction generated roughly US$174 million in retained earnings.
Seagate Technology said emerging agentic artificial intelligence workloads are beginning to support demand for hard disk drives, as automated workflows generate and retain larger volumes of unstructured data.
Seagate Technology reported fiscal third-quarter results above market expectations and issued a stronger-than-anticipated outlook, driven by sustained demand from cloud customers and AI-related workloads.
As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international monopolies, and the ability to respond rapidly to disruptions, TSMC has taken multiple actions to nurture local suppliers. Notably, TSMC has played a critical role as a "supply chain stabilizer," stepping in during key moments.

Demand for advanced chips at TSMC is tightening amid the AI boom, with its 3nm process becoming increasingly congested as major customers compete for limited capacity.

The AI boom is pushing memory demand well beyond high-bandwidth memory (HBM). Low-power DRAM is now under pressure too, with shortages emerging as chip developers including Nvidia, Qualcomm, and Tesla adopt LPDDR in next-generation processors, according to Chosun Biz.

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering an immediate halt to tool shipments destined for Hua Hong Semiconductor, China's second-largest foundry.

China's GPU startups, including Moore Threads, MetaX, and Biren, are gaining ground in the AI accelerator market. But as demand shifts from training to inference, cluster stability, software maturity, and cost efficiency are emerging as the real constraints.
Memory distributor Supreme Electronics (Supreme) saw its revenue double in the first quarter of 2026, driven by a sharp rise in memory prices. DRAM and Flash accounted for nearly 90% of total sales, with server revenue share reaching about 40%—surpassing mobile for the first time. Strong demand from cloud service providers (CSPs) is driving server memory prices higher, a trend expected to extend into the second quarter of 2026.