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    SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale
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    Taiwanese suppliers expand China capacity with AI components in focus
    Aug 24, 18:36
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    Aug 24, 18:36
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    Aug 24, 18:36
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
    Aug 24, 18:36
    Tactical drone market shifts as startups and incumbents compete and cooperate
    Aug 24, 18:36
    Home Tech Semiconductors
    Aug 24
    Nvidia server prices to rise up to 17% as memory costs climb
    Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and other component costs feed through to next-generation data center infrastructure.
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster
    Aug 24
    Taiwan semiconductor materials hit golden opportunity
    Aug 24
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Aug 24
    Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment
    Aug 24
    MORE NEWS
    IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads
    Aug 25, 08:49

    In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could let global enterprises run Arm-native and IBM workloads on the same future systems. The milestone may broaden software choices, accelerate AI adoption, and reshape mission-critical computing for banks, governments, and large cloud operators worldwide.

    Broadcom's debt push signals AI compute is becoming Wall Street asset class
    Aug 25, 08:06
    The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    Aug 25, 08:05
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
    Inergy server share hits 47% on cooling, BBU demand
    Aug 25, 08:03

    Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47% of revenue in the second quarter of 2026, with shipments of system-on-chip (SoC) cooling fan driver ICs set to ramp up in the second half of 2026 and battery backup unit (BBU) demand expected to keep rising as AI moves toward high-voltage direct current power architectures.

    Nvidia memory demand widens the gap between SK Hynix and Samsung
    Aug 25, 08:02

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to Chosun Biz, Nvidia became SK Hynix's biggest customer in the first half of 2026, while it did not rank among Samsung's top five revenue sources.

    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Aug 24
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC manufacturing while reducing dependence on external chip suppliers.
    Etron chair sees memory boom extending to 2028-2030
    Aug 24
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    Aug 24
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August or September. The company is also working with leading outsourced semiconductor assembly and test (OSAT) providers on the project, while its new Thailand production base aims to complete trial runs by year-end and begin volume production in early 2027.
    AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
    Aug 24
    Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck for the AI sector. Applied Materials group vice president and Taiwan president Eric Yu pointed out that semiconductor technology competition in the AI era can no longer focus solely on performance and transistor counts. How to support more computing with less energy will become the core of the next stage of semiconductor innovation.
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    Aug 24
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.
    Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
    Aug 24
    Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's Nemotron models in a bid to compete with China's strength in open-source models, but the deal also puts Nvidia in competition with some of its biggest customers.
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    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.
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    Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
    DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.
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