Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles and smart glasses. The company said edge AI demand is rising even as AI data centers absorb semiconductor capacity and supply-chain resources.
TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated revenue reached NT$514.81 billion (US$16.3 billion) in August, up 10.1% month-over-month and 53.3% year-over-year. Revenue for the first eight months of 2026 totaled NT$3.387 trillion, representing a 39.3% year-over-year increase.
Taiwanese IC design companies have recently begun highlighting opportunities in physical AI and robotics. Arm's recently announced expansion of its Arm Total Design for Physical AI ecosystem, for example, includes Taiwanese IC designer Realtek Semiconductor.
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates are steadily shifting from technology validation to mass production. Spirox chairman Peter Chin said the company has entered advanced packaging inspection with nonlinear optical technology, with TGV aperture sizes now at 4μm and 3μm still under validation, while materials, foundry, memory and packaging companies in Taiwan, Japan, the US and South Korea have already sent samples for testing.
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment engineering services and customized products. The wafer-testing solutions provider also said its in-house Membrane Probe Card has begun contributing revenue as it moves into customer applications, while the company expands into next-gen test applications for high-speed data transmission, silicon photonics and co-packaged optics (CPO).
Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing relationship to 130nm technology as supply conditions tighten across parts of the 8-inch foundry market.
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the global semiconductor equipment market and opening higher-value opportunities for Taiwan's industrial PC (IPC) suppliers.
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation power semiconductors used in electric vehicles, renewable energy systems, and industrial equipment. The company is targeting volume production in 2027 as SiC manufacturers shift toward larger wafers.
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth within tight power, thermal, and cost limits.
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic GPUs have gone into a 100,000-card core computing cluster at a leading Chinese AI cloud provider. The plan was announced at JD's 2026 Global Technology Explorers Conference in Beijing, according to Yicai.
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where memory, computing, and advanced packaging are developed as one integrated system, affecting global chip supply chains.
More coverage
