Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically.

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter.

Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much as HK$4.68 billion (approx. US$601.4 million) in what would be one of the latest semiconductor offerings amid a renewed IPO push by Chinese technology firms.

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona facility, a shift that could reshape supply planning for major chip designers and weaken the long-running narrative that Samsung Electronics stands as the default alternative when TSMC capacity tightens.

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging capacity, as shortages at TSMC push chip designers to seek alternative supply chains through 2026.