TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues to run short. As a result, outsourced backend orders are set to increase, with Taiwan's two major IC testing and packaging firms — ASE Holdings and KYEC — emerging as key beneficiaries.
PCB manufacturer Gold Circuit Electronics (GCE) posted a record-high full-year consolidated revenue in 2025, surging more than 50% year-over-year, driven by a ramp-up in ASIC server customer orders in the second-half of 2025 that significantly boosted networking and server shipments.
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET News and The Elec, Samsung is in the final evaluation stages of its EUV mask blanks with local supplier S&S Tech and is expected to be completed by January 2026, or by February at the latest. This is the first time Samsung will use domestically produced mask blanks in its EUV process.
Surging demand for AI hardware is prompting memory makers to reassess their product portfolios as resources shift toward higher-margin enterprise and data center markets. Following Micron's decision to exit its Crucial consumer business late last year, market speculation has emerged that SK Hynix may also be reviewing its exposure to consumer-grade memory products.
As China's domestic GPU developers accelerate public listings and expand both technological and capital investment, competition is shifting toward next-generation computing power. Iluvatar CoreX said it will unveil a three-generation GPU roadmap on January 26, 2026, outlining a new GPGPU architecture, cloud-based AI training and inference products, and high-performance computing infrastructure plans.
AI chip startup Cerebras Systems is reportedly in talks to raise US$1 billion in a new financing round, aiming for a valuation of up to US$22 billion, according to Bloomberg. The company plans to continue pursuing its initial public offering (IPO) as part of a broader strategy to expand its AI computing hardware and cloud services.
Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output value growing by 137% annually to reach US$8.1 billion by 2033. Against this backdrop, Taiwan's government has indicated its support for this emerging industry, with efforts underway to advance research, development, and mass production.
Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized testing equipment is increasing as advanced process nodes continue to shrink and packaging architectures become more complex.
Trusval Technology reported record-high revenues for December, the fourth quarter, and full-year 2025. December 2025 revenue reached NT$560 million (US$17.75 million), down 12% from November but up 82% year over year. Cumulative revenue for the fourth quarter totaled NT$1.68 billion, up 1% compared with the third quarter and 59% year over year. Full-year 2025 revenue surpassed NT$6.34 billion, marking a 75% year-over-year increase.
TSMC announced plans in 2020 to establish an advanced wafer fab in the US, marking a major shift toward significant US investments. Initially seen as a political necessity, TSMC's US expansion has evolved over five years into a long-term commitment exceeding US$165 billion, supporting American manufacturing ambitions.
An internal structural photo of Nvidia's Quantum-X Photonics silicon photonics (SiPh) switch revealed that its solid-state drive (SSD) controller chip was branded with the iconic Realtek crab logo. Although it usually keeps a low profile and does not comment on specific partners, this is an indication that Realtek has officially entered the market. Taiwanese IC design companies are expanding into the cloud AI domain through memory-related technologies, driving upgrades throughout the industry.
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