SK Hynix plans to extend the life of its existing 6F2 DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F2 and three-dimensional (3D) DRAM on its technology roadmap as China's ChangXin Memory Technologies (CXMT) prepares to unveil a product based on a smaller cell design.

Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at Vikram Udyogapuri in Ujjain, Madhya Pradesh, with a total proposed investment of about INR28 billion (US$294.14 million), according to ETElectronicsWorld. The company works in GaN, RF, and power semiconductor design.

AMD is backing one of its largest AI customers with capital and chips. Alongside an update on its hardware work with Meta, the chipmaker said on October 27 that it will invest US$1 billion in Meta's equity offering, joining Nvidia in buying into the social media company's fundraising for AI infrastructure. Critics describe this pattern as circular financing.

Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant, Bloomberg reported, citing people familiar with the discussions.

SK Hynix is looking beyond its position as a leading supplier of high-bandwidth memory (HBM), using venture investments to gain a greater say in how next-generation AI infrastructure is designed.

SK Hynix is reassessing how to finance the US manufacturing expansion of its NAND flash subsidiary Solidigm after shelving a potential initial public offering (IPO), as the South Korean memory maker prepares for higher capital spending in 2027 while committing approximately KRW100 trillion to shareholder returns this year.

Google's tensor processing unit (TPU) business has gained one confirmed and one reported major customer within a week, adding pressure on Nvidia, whose graphics processors still dominate AI computing even as its biggest buyers look for alternatives.

SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically stored in high-bandwidth memory (HBM) and DRAM alone.

Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing (HPC) chip demand drives the need for high-layer-count, large-size IC substrates. The company's board has approved an additional NT$50.9 billion (US$1.57 billion) in long-lead equipment orders and plans to sell its Japanese subsidiary to PCB maker Meiko Electronics.

Taiwanese IC design leaders MediaTek, Realtek, and Parade Technologies will hold their third-quarter 2026 earnings conferences in succession this week, offering the market an early read on conditions heading into late 2026 and early 2027. Parade will go first on October 28, followed by Realtek on October 29 and MediaTek on October 30.

Micron Technology is heading to South Korea to recruit engineers for its Taiwan operations, with interviews scheduled in Seoul in late November, as a bonus dispute at its Taoyuan plant remains unresolved. The company and the Taoyuan union held a second round of negotiations on October 27 without reaching an agreement, and a third round has been tentatively set for November 6. At the same time, Micron is advancing a global compensation overhaul, reflecting how profit sharing and competition for technical talent have become a focus for the industry as AI memory demand expands.