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Oct 2
Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move closer to mass production, semiconductor equipment, materials, and optoelectronics suppliers are all moving to capture a share of the emerging market.
Cheap SiC substrates ignite demand wave, reshape ecosystem
Oct 5, 14:54
Prices for low-cost 6-inch silicon carbide (SiC) substrates, after years of capacity expansion and brutal price wars, are now showing clear signs of bottoming out in the second half of 2026. The cheap material has also unleashed wave after wave of demand, with China's domestic stimulus tightening SiC wafer fabrication capacity and spilling over into Taiwan's supply chain.
The resilience of global goods trade amid tariff escalation and an energy shock is real, but it rests on a narrow base. A breakdown of ITC Trade Map export data shows that a handful of AI hardware categories, led by servers, processors and memory chips, account for well over a third of the growth in world exports, and that the gains are flowing overwhelmingly to a small group of East Asian exporters and their North American customers.
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel and TSMC for assistance.
AI server lines accelerate automation, boosting cobot demand
Oct 5, 11:58
The AI server boom is spreading into the market for collaborative robots (cobots). The share of cobots on AI server production lines is rising as Wiwynn expands their use at its Mexico and Texas plants, while Quanta has also deployed robotic arms from Techman Robot on its server lines.
Recent reports citing Anthropic's IPO filings show that Broadcom has agreed to provide up to US$42 billion in convertible-note financing to help fund the AI company's infrastructure spending, with Anthropic expected to become Broadcom's largest compute customer in 2027.
Tesla CEO Elon Musk first said on X that the capacity of the AI5 chip memory would be cut in half to 72GB, but later clarified that AI5 will use 96GB of LPDDR5 instead. The change comes as Tesla seeks to avoid becoming the only company using what Musk described as a minimum-memory LPDDR5 configuration.
General Interface Solution (GIS) Holding is gaining traction in optical communications and other new products despite weak consumer electronics demand caused by rising memory prices. Its laser-source packaging and testing business has entered customer qualification and, if progress stays on track, could begin shipments in the fourth quarter of 2026, with a larger revenue contribution from the first quarter of 2027.
Elite Semiconductor Microelectronics Technology (ESMT) reported September consolidated revenue of NT$7.461 billion (approx. US$234 million), up 470.23% from NT$1.308 billion a year earlier but down 5.62% from August. For the first nine months of 2026, revenue reached NT$43.363 billion, up 343.91% year-on-year.

Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien, a Taiwanese scientist at the Agency for Science, Technology and Research's Institute of Microelectronics (A*STAR IME), is one example.

Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium, disclosed that the chipmaker is in discussions with Elon Musk's Terafab over potential cooperation.
AI data center demand for LPDDR5X DRAM has continued to expand through 2026 and is expected to remain strong into 2027, tightening supply for PCs and smartphones and keeping device prices under pressure.