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China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China's Ministry of Commerce said July 16.

OnePlus is exiting the North American and European markets for its future product launches, while sales of new Realme products will be suspended within its home market of China. The changes to both Oppo sub-brands signal the challenges low- to mid-tier brands face amid rising component costs and a tough global smartphone market this year.

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) manufacturing capacity, with the planned investment totaling US$400 million.

TSMC chairman C.C. Wei said at the company's July 16 earnings call that mature-node expansion will be limited, with future capacity additions focused mainly on overseas fabs in Japan and Germany, as well as select products in Taiwan. The remarks have eased concerns among Taiwanese PMIC makers and other analog chip suppliers amid tight mature-node supply.
China-based Montage Technology said its first-half results are expected to rise sharply, underscoring continued demand for AI-linked memory and interconnect chips that matter to data centers and device makers worldwide. The company also disclosed a regulatory search in South Korea, adding an overhang that global investors will be watching closely.
Buoyed by robust shipments of optical communications products, Taiwanese optical communications company WaveSplitter Technologies (WST) nearly doubled its first-quarter revenue in 2026. Chairman and President Sheau Chen said surging AI computing demand will continue to drive the transition from 400G to 800G and 1.6T optical interconnects, with the company positioning its high-power continuous-wave (CW) laser portfolio as its next growth engine.
Moore Threads, a Chinese GPU maker, said its first-half revenue likely more than doubled as demand for artificial intelligence (AI) chips and large-scale computing clusters accelerated. The forecast matters beyond China, as global investors are closely watching how domestic chip firms are competing in the fast-growing AI hardware market.

ChangXin Memory Technologies (CXMT) opened subscriptions for its STAR Market IPO on July 16, launching one of China's largest A-share listings of 2026 and marking the country's first complete DRAM journey from technology acquisition and manufacturing validation to mass production and capital market recognition.

TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.

ChangXin Memory Technologies' (CXMT) STAR Market IPO is more than just one of China's biggest semiconductor listings. It also marks the culmination of Zhu Yiming's two-decade effort to build a domestic memory industry, taking the entrepreneur from founding flash memory designer GigaDevice to creating China's first globally competitive DRAM maker.

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn of the quantum era. While quantum technology is often associated with the distant goal of large-scale computing, a German startup is proving that quantum's most immediate impact may actually be in saving inspection time for the global semiconductor industry that powers the modern world.