Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint venture to mass-produce next-generation image sensors in Kumamoto, Japan, with commercial production starting as early as 2029, Nikkei reported on August 10. Sony would own about 60% of the venture and TSMC about 40%.

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July 2026, up 5.6% from June and 44.7% from a year earlier, extending strong growth fueled by artificial intelligence and high-performance computing demand.

SuperAlloy Industrial said after its August 7 board meeting that second-quarter 2026 results showed steady improvement in core profitability, even though foreign exchange losses tied to a weaker yen weighed on net income. The Taiwan-based manufacturer is also moving into the semiconductor front-end equipment supply chain in a bid to build a second growth engine alongside high-end automotive and green materials.

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking a sharp improvement from the start of mass production as competition with SK Hynix increasingly shifts toward production capacity and supply stability.

Chinese AI GPU developer Moore Threads is preparing a Hong Kong listing after first-half revenue jumped 147.42% year on year to CNY1.74 billion (approx. US$258 million), supported by stronger AI infrastructure demand and faster commercialization of its computing platforms. Its net loss narrowed 95.73% to CNY11.56 million, from CNY271 million a year earlier.

Apple has tested DRAM from China's ChangXin Memory Technologies in iPhone and MacBook products as AI-driven memory shortages and rising prices strain global supply, according to reports. The testing has also drawn bipartisan pressure from US lawmakers, who are urging the Commerce Department and Apple leadership to tighten restrictions on Chinese suppliers.

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation covers high-bandwidth memory (HBM) and 3D NAND products, alongside parallel litigation in federal court.

The US signed a presidential proclamation on August 6 (ET) imposing a 15% tariff on polysilicon and related products from all countries, with the new measures set to take effect on December 4, 2026. Taiwan's Executive Yuan said the decision was expected to have limited impact on the island's solar sector and highlighted exemptions available to semiconductor-related firms with US investments.