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PCB makers cautious about spending in 2023
GaAs foundries mull price cuts to entice orders for handset PAs
USI to enhance automotive antenna capability with planned acquisition
Before Going to Press
Mar 20, 21:47
NEWS TAGGED XINTEC
Monday 20 March 2023
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with...
Friday 17 February 2023
Backend firm Xintec brace for revenue and profit decreases in 2023
As end-market demand is squelched by the global economic downturn, sensor chip backend specialist Xintec may see revenue and profit decreases in 2023, according to company chairman...
Friday 18 November 2022
Taiwan chipmakers eyeing metalens opportunities
Taiwan-based III-V semiconductor and optical sensor companies are all gearing up for a boom in demand for metalens-based VR and AR devices from Meta, Sony and other vendors, according...
Wednesday 28 September 2022
Handset CIS destocking slow
Lackluster handset sales have led to excess inventories of related CMOS image sensors (CIS), also dragging down wafer reconstitution (RW) demand, according to industry sources.
Tuesday 13 September 2022
Taiwan 3D sensor makers to see 4Q22 sales boosted by new iPhones
Taiwan's 3D sensor supply chain players are expected to see their fourth-quarter revenue performance bolstered by shipments for the newly debuted iPhone 14 series, which, particularly...
Wednesday 24 August 2022
Sensor backend specialists gearing up for metaverse device boom
Sensor backend specialists, such as VisEra Technologies and Xintec, are gearing up for a metaverse device demand boom.
Monday 15 August 2022
WLCSP specialist Xintec on track to expand capacity
Taiwan-based Xintec, a WLCSP (wafer level chip scale package) specialist under TSMC, has approved a capital expense of NT$2.5 billion (US$83.33 million) to expand capacity at existing...
Wednesday 13 July 2022
Taiwan CIS backend firms look to automotive for 2H22 growth
CMOS image sensor backend specialists including Tong Hsing Electronic Industries and Xintec are vying for more orders coming from the automotive sector to offset weakness in handset...
Thursday 7 April 2022
Automotive CIS emerging as new blue-ocean market for supply chain
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Friday 25 March 2022
Mixed levels of price reduction pressure looming for diverse IC segments
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
Friday 18 February 2022
Xintec cautious about 2022
CMOS image sensor backend specialist Xintec has expressed caution about its sales performance this year, citing the ongoing pandemic, labor shortages, and supply-side challenges,...
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Wednesday 8 September 2021
OmniVision to cut back wafer starts at Taiwan foundries, say sources
OmniVision plans to cut back substantially its orders placed with Taiwan's IC manufacturing sector, according to market sources.
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Mar 16, 09:22
NeoGene unlocks direct-to-silicon liquid cooling technology by novel IC package approach
Thursday 9 March 2023
Fibocom collaborates with MediaTek to pioneer FWA market with fast-to-deploy 5G solution based on FG370 module at MWC 2023
Tuesday 7 March 2023
Fibocom to launch leading-edge 5G Sub-6GHz and mmWave module Fx190/Fx180 series based on Snapdragon X75 and X72 5G modem-RF system at MWC 2023
Tuesday 14 February 2023
Wishing-Soft expands into global market through ESH competencies
South Korean chip equipment industry alarmed amid US-China's tech power struggle
TSMC new US fab to dent profits, hard to transfer costs to customers
Wafer foundries in China expected to continue with capacity expansion plans despite geopolitical tensions, says DIGITIMES Research
Chinese chipmaking technology development may stall at 40nm scale
A chip war without winners
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
Taiwan PC monitor makers experiencing declining shipments in 4Q22, says DIGITIMES Research
Samsung develops closer connection in Vietnam than in India, according to DIGITIMES Research
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