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Monday 23 March 2026
Samsung chairman joins Beijing forum as China seeks foreign chip investment

Samsung Electronics chairman Lee Jae-yong is attending the China Development Forum (CDF) in Beijing on March 22-23 and is expected to...

Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
Monday 23 March 2026
An imminent strike looms over Samsung's AI memory supply
Samsung Electronics is facing escalating labor tensions after its largest union secured approval for a strike, raising concerns over potential disruptions to semiconductor production...
Monday 23 March 2026
Weekly news roundup: geopolitics, AI memory, racing for semiconductor control
Below are the most-read DIGITIMES Asia stories from the week of March 16-22, 2026:
Monday 23 March 2026
India roundup: India eyes key hub for semiconductors, clean energy, and advanced manufacturing

India is rapidly positioning itself as a strategic hub for semiconductors, clean energy, and advanced...

Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
Saturday 21 March 2026
Samsung orders 15M mid-range OLED panels from CSOT amid cost pressure
Samsung Electronics is reportedly shifting a significant portion of its mid-range smartphone OLED panel orders to China Star Optoelectronics Technology (CSOT) as rising memory prices...
Saturday 21 March 2026
Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The...
Friday 20 March 2026
Global top-3 memory maker status, 1Q26

Introduction

Friday 20 March 2026
Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
Friday 20 March 2026
Samsung plans over KRW110 trillion investment in AI semiconductor facilities and R&D for 2026
Samsung Electronics announced it will invest more than KRW110 trillion (approx. US$73.4 billion) in facilities and R&D by 2026 to secure a leading position in the AI semiconductor...
Friday 20 March 2026
Samsung foundry shows signs of stabilization as Nvidia, Tesla orders underscore AI chip capabilities

Samsung Electronics' foundry business is showing signs of stabilization after a sustained period of market share decline, as new orders...

Friday 20 March 2026
HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...
Friday 20 March 2026
Samsung reportedly ceasing TriFold smartphone sales

Samsung Electronics is reportedly discontinuing its premium Galaxy Z TriFold smartphone just months after launch, underscoring the device's...