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Tuesday 28 April 2026
Samsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scale

Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4,...

Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
AI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%
SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven...
Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Sunday 26 April 2026
Harman hits KRW15.78 trillion in revenue 10 years after Samsung acquisition
Samsung Electronics executive chairman Lee Jae-yong's bold acquisition of premium audio brand Harman for KRW9.4 trillion (approx. US$6.3 billion) a decade ago has paid off, with the...
Sunday 26 April 2026
Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens

Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state...

Sunday 26 April 2026
Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
Sunday 26 April 2026
Samsung bets its HBM leverage can hold Nvidia's LPU orders — but TSMC is pushing back
The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform....
Friday 24 April 2026
Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May
Three major labor unions at Samsung Electronics held a large-scale protest on the afternoon of April 23 in front of the Pyeongtaek semiconductor campus in South Korea. An estimated...
Friday 24 April 2026
Interview: Taiwan-Korea cooperation not limited to memory giants; Hwaseong City aims to expand alliances
When it comes to Taiwan-Korea semiconductor cooperation, the outside world often focuses on orders and R&D between memory giants such as Samsung Electronics, SK Hynix, and TSMC...
Thursday 23 April 2026
SpaceX eyes GPU push as Tesla taps Samsung for chip upgrade

SpaceX is exploring in-house production of graphics processing units (GPUs) as it cites potential chip supply constraints, even as Tesla...

Thursday 23 April 2026
Samsung and LG turn to AI at WIS 2026 to tackle sluggish consumer electronics market
Faced with declining hardware sales as high interest rates and shrinking demand crunch the global consumer electronics market, Samsung Electronics and LG Electronics are pursuing strategies...
Thursday 23 April 2026
Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets
A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor...