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Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
Samsung weighs power subsidiary to secure semiconductor electricity by 2027
Samsung Group was reported to be considering a dedicated in-house power-procurement subsidiary to secure electricity directly for its semiconductor production facilities, with operations...
Wednesday 12 August 2026
Samsung to add 1 million Galaxy Z Fold8 units as foldable demand surges

Samsung Electronics will increase production of the Galaxy Z Fold8 by 1 million units in 2026 after strong preorder demand for its...

Tuesday 11 August 2026
Samsung races to qualify Taylor fab as 2nm demand turns US capacity into a strategic asset

Following growing momentum behind large-scale infrastructure buildouts in South Korea, the industry is witnessing an aggressive wave...

Tuesday 11 August 2026
Samsung tackles AI memory wall with zHBM, V10 BV-NAND concepts

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

Tuesday 11 August 2026
Samsung set to double BOE TV panel orders as Korean TV makers reshuffle suppliers

Samsung Electronics is expected to double its purchases of TV LCD panels from BOE in 2026 while cutting orders from CSOT, as Samsung...

Tuesday 11 August 2026
South Korean minister warns about CXMT capex as semiconductor profits debate heats up
South Korean Minister of Trade, Industry and Resources Jung-kwan Kim has warned that the country should not rush to redistribute semiconductor profits throughout society just as AI-driven...
Monday 10 August 2026
SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Monday 10 August 2026
Samsung unveils 200MP image sensor as Oppo targets first adoption

Samsung Electronics has launched its next-generation 200-megapixel CMOS image sensor, the ISOCELL HPC, and reports said Oppo is set...

Monday 10 August 2026
High production keeps TV panel prices falling in August

LCD TV panel prices fell across the board in July and have extended their decline in August as high utilization at makers' high-generation...

Saturday 8 August 2026
Analysis: Memory makers hold US$38 billion that isn't theirs to keep

Suppliers locked supply and price floors through 2030. The collateral protecting them runs out first — and that is when procurement...

Friday 7 August 2026
Samsung sounds out Novatek for Galaxy S28 Ultra DDI

Samsung Electronics is considering opening its flagship Galaxy S display driver IC (DDI) supply chain to an outside supplier, a move...

Thursday 6 August 2026
Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...