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Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory...
Wednesday 22 April 2026
CXMT HBM3 timeline slips, mass production unlikely in 2026
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory...
Wednesday 22 April 2026
Analysis: Tesla's chip ambitions drive a wedge between Samsung and Intel
Tesla's Terafab project is accelerating, with the company targeting substantial in-house chip production to support autonomous driving, robotaxis, humanoid robots, and AI infrastructure...
Tuesday 21 April 2026
Samsung plans NAND expansion at P5 on AI-driven price gains
Surging demand for NAND flash, fuelled by artificial intelligence workloads and data centre expansion, is pushing memory makers into a new investment cycle, with Samsung Electronics...
Tuesday 21 April 2026
Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit...

Tuesday 21 April 2026
Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM)...
Tuesday 21 April 2026
China amping up DRAM integration: GigaDevice expands into DRAM through CXMT tie-up
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could...
Tuesday 21 April 2026
Samsung's HBM4 yield improves, 4nm PMBIST upgrade receives praise from Nvidia
Samsung Electronics is accelerating its catch-up in the high-bandwidth memory (HBM) market against leader SK Hynix by advancing its sixth-generation HBM4. A key factor is Samsung's...
Monday 20 April 2026
Analysis: How TSMC avoids memory's boom-and-bust cycle
Ahead of TSMC's earnings call, DIGITIMES senior analyst Luke Lin explained that TSMC typically does not revise its full-year revenue forecast or capital expenditure during...
Monday 20 April 2026
SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads,...
Monday 20 April 2026
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry...
Monday 20 April 2026
Samsung tests domestic EUV masks to cut Japan reliance at 4nm

Samsung Electronics has begun testing domestic EUV blank masks in its 4nm foundry production line, a shift aimed at cutting reliance on...

Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026:
Monday 20 April 2026
Samsung files injunction to prevent union from occupying chip facilities
Samsung Electronics has taken legal action amid escalating labor disputes with its union, filing for an injunction at a South Korean court on April 16, 2026, to prevent the union from...
Saturday 18 April 2026
Samsung launches voluntary retirement amid chip-device earnings gap

Samsung Electronics has initiated a workforce restructuring through a voluntary retirement program as strong semiconductor earnings contrast...