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    Exclusive: China SiC substrate suppliers cut prices as losses persist amid oversupply
    10h 54min ago
    Exclusive: SiC substrate prices stay depressed as 800V HVDC demand rises
    10h 54min ago
    Memory boom driven by DRAM now, but HBM will decide the future
    10h 54min ago
    Huawei's Tau Law puts glass substrates at the center of advanced packaging
    10h 54min ago
    Memory shortage drags down PC market as Apple’s MacBook Neo stands out
    10h 54min ago
    NEWS TAGGED SAMSUNG
    Wednesday 3 June 2026
    Micron's HBM4 push signals bigger Nvidia supply role
    Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
    Wednesday 3 June 2026
    Commentary: Why the world's memory giants are betting on Anthropic
    The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion,...
    Wednesday 3 June 2026
    Google's AI glasses to boost wearable shipments to 17.5 million in 2026
    Google moved into the AI glasses market with new Android XR smart glasses co-developed with Samsung Electronics and partnerships with eyewear brands, and the entry is expected to lift...
    Wednesday 3 June 2026
    BYD is building its own chips and looking abroad to make them

    China's electric vehicle (EV) makers are increasingly designing their own artificial-intelligence (AI) chips. Manufacturing them, however,...

    Wednesday 3 June 2026
    Samsung Foundry eyes Anthropic as OpenAI chip project reportedly stalls

    Samsung Electronics is seeking to secure major artificial intelligence (AI) logic-chip customers as its reported preliminary work on...

    Tuesday 2 June 2026
    Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
    Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
    Tuesday 2 June 2026
    South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
    South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used...
    Tuesday 2 June 2026
    Broadcom, Samsung launch Wi-Fi 8, 5G platform to bring fiber-grade FWA to mass market
    Broadcom and Samsung Electronics have announced a broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 system-on-chip...
    Monday 1 June 2026
    Top memory maker executives gather in Taiwan in preparation for Computex 2026
    After Nvidia CEO Jensen Huang wrapped up his "trillion-dollar banquet" for Taiwan AI supply-chain giants, GTC Taipei is set to become a highlight of Computex 2026. Nvidia will also...
    Monday 1 June 2026
    Nvidia courts Korea's industrial giants ahead of Computex
    Nvidia chief executive Jensen Huang's pre-Computex meetings in Taipei are drawing close attention from South Korean companies seeking a bigger role in the global AI supply chain. With...
    Monday 1 June 2026
    LG denies report on sale to Hisense TV as Chinese rivals gain ground
    LG Electronics has denied a Korean media report that it discussed a possible sale or restructuring of its TV business with China's Hisense, as intensifying competition from Chinese...
    Saturday 30 May 2026
    Samsung tops Micron in automotive memory as AI tightens supply

    Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first...

    Friday 29 May 2026
    Samsung begins shipment of HBM4E samples as AI memory competition intensifies
    Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
    Thursday 28 May 2026
    SK Hynix turns Big Tech's memory scramble into tougher supply terms
    SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give...
    Thursday 28 May 2026
    Samsung foundry targets robotics, auto AI chips with Cadence platform
    Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
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    AsiaCPO
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook