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Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
Saturday 29 August 2026
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...
Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
Samsung absorbs memory costs to chase smartphone crown
Global smartphone shipments are set to shrink sharply in 2026 as soaring memory and core component prices hit the market, but Samsung Electronics is moving in the opposite direction...
Thursday 27 August 2026
Samsung signals zHBF push as memory race moves beyond HBM
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
Thursday 27 August 2026
SK Hynix questions PIM as thermal, packaging limits constrain HBM
South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026
Supply shortages, price hikes fail to slow new phone wave
Mobile phone sales are under pressure as shortages and price increases for multiple upstream components squeeze the market. But brand makers have stepped up new product launches, with...
Thursday 27 August 2026
Samsung Galaxy A1 DDI packaging shifts to Chipbond
Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
Wednesday 26 August 2026
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Wednesday 26 August 2026
Samsung's 3-year shareholder returns seen topping KRW600T
AI memory excess profits are beginning to change Samsung Electronics' capital-allocation logic. The company recently said that, under its current 2024-2026 shareholder return policy,...
Wednesday 26 August 2026
Samsung, Intel widen AI chip battle into memory, packaging
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...