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Monday 15 July 2024
Samsung leverages IDM status to differentiate HBM4 with optimal customization and performance gains
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Monday 15 July 2024
Samsung accelerates SiPh and BSPDN development to catch up with TSMC, Intel
Samsung Electronics unveiled its next-generation process blueprint at the Samsung Foundry Forum 2024 (SFF 2024), but the response from the semiconductor industry has been somewhat...
Friday 12 July 2024
Samsung's new foldables boosted by AI, annual sales growth to exceed 20%
On July 10, Samsung Electronics unveiled its new generation of foldable smartphones. Samsung announced the Galaxy Z Fold 6 and Flip 6 series, along with new products such as the Galaxy...
Friday 12 July 2024
Samsung bolsters South Korean AI, HPC chip design with expanded DSP support and advanced process technologies
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Friday 12 July 2024
New Samsung smartphones showcase foldables, GenAI
Samsung's Galaxy Z Fold6 and Galaxy Z Flip6 models, which were unveiled at the Galaxy Unpacked Event 2024 in Paris on July 10, are the result of the integration of two significant...
Friday 12 July 2024
SK Hynix ramps up talent recruitment to strengthen HBM4 competitiveness
SK Hynix, the South Korean memory giant, is ramping up its recruitment of system semiconductor experts, especially targeting staff from Samsung Foundry and IC design, according to...
Friday 12 July 2024
Texas forges partnership with Samsung and SK Group, eyes future AI and EV collaborations
Texas Governor Greg Abbott's Indo-Pacific trip has brought him to South Korea, where he has focused on strengthening economic ties and exploring technological collaborations. The...
Friday 12 July 2024
Samsung unveils brand-new mobile AI ecosystem; new foldable devices set to launch on July 24
Samsung Electronics held its Galaxy Unpacked 2024 event on the evening of July 10 in Paris, France. The company introduced its new generation of foldable phones, the Galaxy Z Fold...
Friday 12 July 2024
Samsung scores 2nm PFN orders, as TSMC preps GAA for iPhone 17 launch 2025
Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...
Thursday 11 July 2024
Samsung union announces 'indefinite' strike; risk of semiconductor plant shutdown rising
Samsung Electronics' largest union, the National Samsung Electronics Union (NSEU), initially planned a three-day strike starting on July 8. However, the union recently announced that...
Thursday 11 July 2024
Together with over 30 partners, SDC aims to reduce prices of Micro LED TVs to one-tenth within two to three years
Micro LED TVs are considered an important next-gen technology, but their high prices have prevented them from becoming more widespread. Samsung Electronics has made plans to reduce...
Thursday 11 July 2024
Samsung's microLED TV price reduction strategy to drive cost cuts across supply chain
Samsung is initiating a price reduction strategy for microLED TVs, which has inspired its sole microLED chip supplier, PlayNitride, to feel optimistic about the potential for reducing...
Thursday 11 July 2024
Samsung first-ever major strike threatens chip ambitions as union asserts its influence
Samsung Electronics' largest union, the "National Samsung Electronics Union," began a general strike on July 8, 2024, and announced an indefinite two-phase strike on July 10. This...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Samsung reportedly adopts Mo in 3D NAND, to reshape memory industry
Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.