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NEWS TAGGED DESIGN
Thursday 17 September 2026
Apple's foldable phone puts thinness, weight in focus

Apple's first foldable phone has sharpened global attention on smartphone design trade-offs, with weight, thickness, and component miniaturization...

Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...
Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...
Wednesday 16 September 2026
Apple's foldable phone faces durability test as suppliers eye crease risks

Apple's first foldable phone is drawing worldwide attention because its design choices could shape how future bendable devices are built...

Wednesday 16 September 2026
DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures

DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom...

Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...

Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
Swiss drone maker shifts production to Taiwan

Shinkong Synthetic Fibers Corporation (SSFC) is working with Swiss drone company Jedsy through its investment in Earthbook, bringing...

Monday 14 September 2026
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
Monday 14 September 2026
AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
Monday 14 September 2026
India's chip show nearly doubles in two years, with suppliers leading the build-out
The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
Friday 11 September 2026
Taiwan govt boosts EDA R&D to target global gaps
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...