SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES...
The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...
Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
I-Chiun Precision Industry and Taiwan's Industrial Technology Research Institute (ITRI) have established Huizhi Advanced, the country's first startup focused on AI chip thermal design,...
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
Fusion energy, often referred to as an artificial sun, has become a central focus of global sustainable energy development in recent years. However, despite nearly 70 years of worldwide...
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...
As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...
