China is proposing to extend AI technology export controls to chip design, memory technologies, and large-scale computing clusters, introducing specific technical thresholds for ea...
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Rugged edge computing brand – Cincoze has launched its new external EMC solution, the Power Protection Module (PPM), to further strengthen protection against the...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Taiwanese electronics makers are deepening their presence in Mexico's Chihuahua state, drawn by surging US demand for AI servers, officials and business leaders told a seminar in Taipei...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei...
South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC...
Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial...
Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
