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Thursday 29 October 2026
Nvidia's Rubin Ultra cooling: 0.1mm microchannels vs vapor chambers
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.
Thursday 29 October 2026
AUO's microLED setback in smartwatches, comeback in Peugeot cockpit
French automaker Peugeot has unveiled the all-electric RCZ Vision concept sports car with two transparent microLED displays in the cockpit, supplied by AUO. The screens showcase a...
Thursday 29 October 2026
SiC and GaN demand reshapes design, reliability and supply stability
Applications for silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding across the electronics industry, affecting not only component selection but also product...
Thursday 29 October 2026
Global Technology's first automotive chip headed for Hyundai, Kia
South Korean chip designer Global Technologies (GT) has secured a place in Hyundai Motor and Kia's supply chain with its first automotive semiconductor product, a smart LED module...
Thursday 29 October 2026
Huawei deploys Tau Law in base-station design, rolling out new wireless baseband overseas
Huawei has extended its semiconductor-focused "Tau (τ) Law" framework to 5G base station design, using co-design across algorithms, chip architectures, and high-speed interconnects...
Thursday 29 October 2026
Apple ends its touchscreen holdout with OLED MacBook Pro, with Samsung Display reported as sole panel supplier
Apple's first touchscreen Mac reverses a design stance the company defended for more than a decade and is a premium-priced test of whether touch and tandem OLED can lift Mac demand...
Wednesday 28 October 2026
India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh
Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at...
Wednesday 28 October 2026
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
Tuesday 27 October 2026
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory...
Tuesday 27 October 2026
HCLTech and Rapidus open India centers to support semiconductor engineering
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
Tuesday 27 October 2026
Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI
Cadence Design Systems is betting that chipmakers will want AI models trained on its own design tools and run wherever customers choose. That puts it on a different route from rival...
Tuesday 27 October 2026
Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets
Cadence Design Systems used its third-quarter earnings call to argue that demand for chip design tools is no longer tied only to the AI hardware buildout. It pointed to analog and...
Tuesday 27 October 2026
India sets October 2028 target for homegrown smartphone brand
India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded...
Tuesday 27 October 2026
Cadence raises 2026 outlook as AI design demand drives record backlog
Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying...
Friday 23 October 2026
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Japan's Leading-edge Semiconductor Technology Center (LSTC), Hokkaido University, Fujifilm Corporation, GE HealthCare Japan, and imec announced a joint initiative in Tokyo on October...