Although the International Motor Show Germany (IAA) in Munich this year was smaller in scale compared to past years, the exhibition still highlighted clear trends in the industry...
Malaysia is emerging as a key beneficiary of the intensifying US-China technology rivalry, attracting billions in foreign investment as it seeks to cement its role as a critical player...
Nvidia's grip on the AI surge is forcing a rethink of server design, with thermal management at the forefront. Sources indicate that cooling is shifting rapidly from air to liquid...
South Korea's display industry has strengthened its global position by advancing dual-layer tandem OLED technology, overcoming years of competition from low-cost Chinese LCD panels...
Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...
Apple's new generation iPhone 17 series has officially debuted, sparking renewed market discussion. The three new models each have distinct features. The iPhone 17 Pro series boasts...
The global robotics sector continues to grow as Taiwanese transmission component manufacturer Chieftek Precision announces a strategic focus on robot development, moving beyond humanoid...
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
US electronic design automation (EDA) giant Synopsys faced ongoing challenges from US export restrictions to China and difficulties with key foundry customers. As of July 31, 2025,...
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
Apple unveiled its latest iPhone 17 series on September 9, 2025, introducing four new models, including the highly anticipated iPhone Air. The iPhone Air, noted for its thinnest design...
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making...
ADLINK Technology Inc., a global leader in edge computing solutions, introduces the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000...
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...
