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Thursday 5 November 2026
EU launches EUR525 million push to close chip design gap
The European Union has launched a EUR525 million (approx. US$590 million) initiative to strengthen its semiconductor design industry, seeking to narrow the gap with the US and China...
Thursday 5 November 2026
Anthropic's Claude reportedly cuts custom chip design timelines with a 15-person team
Anthropic has reportedly told investors that its chip design team, comprising just 15 people, is using its Claude models to design custom chips. It and another frontier lab, OpenAI,...
Thursday 5 November 2026
GlobalFoundries secures nearly US$1 billion in custom chip design wins as it expands into physical AI

GlobalFoundries is gaining traction in custom silicon, processor intellectual property (IP) and physical AI applications, as the chipmaker seeks...

Thursday 5 November 2026
Empyrean's EDA acquisitions could give Korean chip designers cheaper tools—and stronger Chinese rivals
China's efforts to build a complete domestic chip-design software stack are gathering pace through acquisitions and strategic investments. Empyrean Technology's latest transactions...
Wednesday 4 November 2026
Former Intel packaging chief Navid Shahriari joins MediaTek as senior vice president
MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.
Wednesday 4 November 2026
Foxconn's AI infrastructure edge goes beyond assembly — precision manufacturing, vertical integration set a higher bar
Foxconn is leveraging its precision manufacturing and vertical integration capabilities to strengthen its position in AI infrastructure, where rapid server upgrades increasingly demand...
Tuesday 3 November 2026
MediaTek, Marvell, Broadcom battle for ASIC supply through 2028
Competition in the AI application-specific integrated circuit (ASIC) market will extend beyond 2028, industry sources said, with MediaTek, Broadcom, and Marvell competing not only...
Monday 2 November 2026
Taiwan aims to train 60,000 IC specialists by 2030
Taiwan is aggressively pursuing a core strategy of "Team Taiwan to Team Global," according to Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC). Wu noted...
Monday 2 November 2026
South Korea builds SMR ecosystem as SK Innovation advances Natrium tech, Samsung C&T pushes modular construction
South Korean energy and engineering companies are positioning themselves for the emerging small modular reactor (SMR) market, with SK Innovation (SKI) seeking to build expertise through...
Monday 2 November 2026
RichWave sees Wi-Fi 7 reaching 50% share in 2027
Radio frequency (RF) IC design house RichWave Technology stated at its recent investor conference that memory supply constraints, rather than end demand, are curbing networking equipment...
Monday 2 November 2026
China's Empyrean Tech targets digital EDA gaps with US$32.9 million Easy-Logic acquisition
China's leading electronic design automation (EDA) supplier, Empyrean Technology, plans to acquire a controlling stake in Easy-Logic Technology, a specialist in digital logic optimization,...
Monday 2 November 2026
Foxconn nears EV JV agreement with Poland's EMP as European expansion gains momentum
Foxconn is in advanced discussions with Polish electric vehicle (EV) company Electromobility Poland (EMP) to establish a joint venture, with an agreement expected soon, according to...
Sunday 1 November 2026
Six decades in the making: Why the world can't easily copy Taiwan's chip ecosystem
Taiwan's semiconductor strength is often described today through leading-edge process nodes, advanced packaging capacity, or its pivotal role in the global AI supply chain. At the...
Saturday 31 October 2026
TSIA 30: Taiwan builds the AI backbone — but can it capture the AI economy?
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
Saturday 31 October 2026
HHTD26: Foxconn says vertical integration drives 1+1 far beyond 2
Addressing Foxconn's structural competitive advantages at Hon Hai Tech Day (HHTD 2026), rotating CEO Michael Chiang emphasized that the electronics manufacturing giant's core differentiator...