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    Taiwan suppliers target physical AI platforms as robotics race moves beyond hardware
    2min ago
    Jensen Huang deepens LG alliance as Nvidia expands its AI ambitions in South Korea
    12min ago
    Yesiang begins shipping recycled filters as 2nm demand lifts AMC market
    32min ago
    Apple's Siri AI reboot stirs optimism and doubt as Google Gemini role draws attention
    46min ago
    Apple Intelligence expansion hits roadblocks in China and EU, raising fragmentation concerns
    53min ago
    Analysis: How Nvidia turned Computex into its own annual coronation
    Jun 8, 18:46
    Huawei developer conference spotlights AI agents as hype cools and real-world testing begins
    Jun 8, 18:46
    Tencent pursues self-developed AI chips and external partnerships in parallel
    Jun 8, 18:46
    NEWS TAGGED DESIGN
    Tuesday 9 June 2026
    Ultraband & NTT-AT sign MOU to boost RF, Power collaboration

    Ultraband Technologies, an emerging IC design startup, announced today the official signing of a Memorandum of Understanding (MOU) with NTT ADVANCED  TECHNOLOGY...

    Tuesday 9 June 2026
    Taiwan server makers post strong May sales as AI demand continues to drive orders
    Taiwan's leading server manufacturers reported strong May sales, underscoring how global AI infrastructure spending is reshaping demand for data center hardware. The gains point to...
    Tuesday 9 June 2026
    Cooling parts maker Global PMX wins AI server liquid-cooling supply and expects high-margin shipments in second half
    Automotive power and safety parts manufacturer Global PMX said it secured placements in the supply chains of leading AI chip and rack makers and expected a wave of high-margin liquid-cooling...
    Tuesday 9 June 2026
    HiSilicon chip price hikes put China's AI compute supply chain back in focus
    Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after...
    Monday 8 June 2026
    Molex expands in Taiwan as AI interconnect demand splits between copper and optics
    Molex is building out a dual-track strategy for AI interconnects, backing both copper and optical solutions as customers pursue different deployment paths, while expanding its Taiwan...
    Monday 8 June 2026
    Apple M5 Pro teardown points to chiplet strategy shift
    Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
    Monday 8 June 2026
    Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
    Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
    Monday 8 June 2026
    Nvidia and SK Hynix announce multiyear memory partnership covering AI servers, PCs, and robotics
    Nvidia and SK Hynix formally announced a multiyear technology partnership on June 7 at SK's Seorin Building in Seoul, during Jensen Huang's third public meeting with SK Group chairman...
    Sunday 7 June 2026
    Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

    Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to...

    Sunday 7 June 2026
    While China floods the humanoid market, America's top three are quietly building patent moats
    Compared with China's crowded humanoid robot market, where competition is becoming increasingly intense, the US humanoid robot sector is still concentrated among a small number of...
    Friday 5 June 2026
    Huawei's Tau Law stirs debate over China's post-Moore's Law chip path

    Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed...

    Friday 5 June 2026
    Foxconn deepens AI push with Intel on inference racks
    Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal...
    Friday 5 June 2026
    Marvell says SerDes and packaging are key hurdles in switch chip development
    Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
    Friday 5 June 2026
    Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market
    Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly...
    Friday 5 June 2026
    AI cooling demand is pushing server pumps into sharper focus
    As AI pushes liquid cooling into mainstream server thermal design, suppliers are widening their focus beyond Nvidia's benchmark thermal designs. Industry players say pumps are emerging...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook