ByteDance's large language model (LLM) Doubao (Cici) has quickly emerged as an unexpected front-runner in China's generative AI race....
As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between...
While advanced packaging technologies first gained traction in high-end smartphones, it was the supply crunch of AI chips in 2023 that...
With the momentum behind artificial intelligence (AI) infrastructure continuing to accelerate, industry giants Nvidia and AMD are preparing...
