CONNECT WITH US
NEWS TAGGED TSMC
Monday 3 August 2026
TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...
Monday 3 August 2026
Apple says advanced-node capacity tightens amid 2nm race

Apple reported its best-ever third-quarter results for fiscal 2026, but its guidance for the fourth quarter showed much slower growth...

Monday 3 August 2026
Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After...
Monday 3 August 2026
Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices
AI-driven chip shortages, rising memory costs and intensifying foundry competition dominated the technology sector, with Intel reviving DDR4 platforms, Qualcomm raising prices, Samsung...
Saturday 1 August 2026
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

Friday 31 July 2026
Powerchip founder Frank Huang dies at 76; vice chair steps in as acting chief

Powerchip Semiconductor Manufacturing Corp. (PSMC, TWSE: 6770) said in a material-information filing on July 31 that its chairman,...

Friday 31 July 2026
Analysis: The AI buildout stopped being a demand story

For three years, the constraint on artificial intelligence was how much compute the hyperscalers wanted to buy. The June-quarter filings...

Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
Taiwan semiconductor power demand is set to reach 52 billion kWh in 2026

Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in...

Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...