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NEWS TAGGED TSMC
Thursday 15 October 2026
TSMC CEO says profitability has no ceiling, plans High-NA EUV adoption in 2030
TSMC chairman and CEO C.C. Wei said on October 15 that the chipmaker sees no ceiling on its profitability as demand for AI accelerators continues to outpace supply. Wei also said AI-related...
Thursday 15 October 2026
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of...
Thursday 15 October 2026
TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins

TSMC expects fourth-quarter 2026 revenue to reach US$52.3 billion to US$54.3 billion, potentially rising as much as 61% year-over-year, with sustained...

Thursday 15 October 2026
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Thursday 15 October 2026
Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem
GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate...
Thursday 15 October 2026
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Memory chipmakers have become the fastest-growing source of demand for ASML, and the two largest of them have reportedly accepted higher replacement-part prices from the Dutch company...
Thursday 15 October 2026
SEMI sees glass substrates entering market by 2028
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Wednesday 14 October 2026
TSMC and MediaTek alumni lead Taiwan's new wave of deep tech startups
At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups made the case that Taiwan's next wave of innovation is being built by chip-industry veterans who are tackling problems...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Tuesday 13 October 2026
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge...
Monday 12 October 2026
Microsoft to scale Maia AI chips to multi-gigawatt deployments, unveils TSMC N2P-based Maia 300
Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services...
Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
Monday 12 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (Å; where 1 nm equals 10 Å), bringing high-numerical-aperture extreme ultraviolet...