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Monday 10 August 2026
Sony, TSMC to spend US$6.3 billion on Japan image sensor venture, Nikkei says

Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint...

Monday 10 August 2026
TSMC July revenue jumps 44.7% to record US$14.5B, 2026 growth forecast tops 40%

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July...

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Saturday 8 August 2026
TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

Friday 7 August 2026
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
Thursday 6 August 2026
Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...

Thursday 6 August 2026
GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
GlobalFoundries (GF) often presents itself as an essential pillar of US semiconductor sovereignty. That claim is partly true, but requires qualification.
Thursday 6 August 2026
TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Wednesday 5 August 2026
AMD says server CPU market to hit US$220B by 2030

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Tuesday 4 August 2026
Nvidia RTX 50 graphics card prices climb as TSMC and memory costs rise
Nvidia GeForce RTX 50 series graphics card prices in South Korea were set to rise by as much as 30% starting in August 2026 as higher wafer costs at Taiwan Semiconductor Manufacturing...
Tuesday 4 August 2026
Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed...

Monday 3 August 2026
TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...