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    China's FAW to become GAC's second-largest shareholder as auto consolidation talk returns
    Sep 15, 19:08
    Column: China tightens rare earth controls, and Taiwan must guard supply chain flexibility
    Sep 15, 19:08
    China’s wafer fabs boost local equipment buying, pressuring South Korean suppliers
    Sep 15, 19:08
    NEWS TAGGED TSMC
    Wednesday 16 September 2026
    Advanced processes have no ready-made answers, says TSMC's COO

    Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

    Wednesday 16 September 2026
    Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

    The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

    Wednesday 16 September 2026
    Taiwan can power its AI chip boom — but not with green energy
    DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

    Tuesday 15 September 2026
    TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
    TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
    Tuesday 15 September 2026
    2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027

    In 2026, major smartphone system-on-chip (SoC) vendors began moving selected flagship processors to 2nm technology, seeking not only...

    Tuesday 15 September 2026
    The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
    "He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
    Monday 14 September 2026
    Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
    Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency,...
    Monday 14 September 2026
    Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
    Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
    Monday 14 September 2026
    Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
    AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

    TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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