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    Taiwan's MTI advances in O-RAN and satellite markets with US funding and new deployments
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    NEWS TAGGED TSMC
    Monday 15 December 2025
    TSMC, Broadcom AI outlook signals strong growth for Samsung, SK Hynix in 2026
    Analysts believe that the performance outlook for 2026 from Taiwan Semiconductor Manufacturing Company (TSMC) and Broadcom offers a glimpse into the expected performance of South...
    Monday 15 December 2025
    Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
    These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
    Monday 15 December 2025
    TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
    As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
    Monday 15 December 2025
    Samsung pushes new thermal packaging to win back Qualcomm and Apple

    Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market...

    Saturday 13 December 2025
    Commentary: Uncertainty rises as US delays Section 232 semiconductor tariff ruling after eight months
    The US Department of Commerce (DOC) launched a Section 232 national security investigation on April 1, 2025, targeting semiconductors, manufacturing equipment, and related products...
    Friday 12 December 2025
    TSMC pauses work on second Kumamoto wafer fab amid potential shift to AI chip production
    TSMC, through its Japanese subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has halted construction on its second wafer fabrication facility in Kikuyo Town, Kumamoto...
    Friday 12 December 2025
    Huawei–SMIC chip hits milestone, still lags TSMC’s 5nm

    China is accelerating its semiconductor capabilities through technical gains at Huawei and Semiconductor Manufacturing International Corp.(SMIC)...

    Friday 12 December 2025
    Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
    Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
    Thursday 11 December 2025
    UMC prepares for a leadership change as veteran chiefs phase out
    Following several executives' retirements at TSMC and the company's succession planning, United Microelectronics Corporation (UMC) has initiated a leadership transition plan. TS Wu,...
    Thursday 11 December 2025
    US reportedly reviews TSMC-made Nvidia H200 shipments, weighs 25% duty
    US regulators have introduced a new inspection protocol for Nvidia's H200 accelerators destined for China, requiring chips manufactured by TSMC to be shipped to the US for national...
    Wednesday 10 December 2025
    AI demand drives TSMC to third-highest monthly revenue
    Benefiting from robust demand for AI chips that offset weakening orders in smartphones and other consumer electronics, TSMC reported consolidated revenue of NT$343.614 billion (US$11.23...
    Wednesday 10 December 2025
    TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
    Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
    Tuesday 9 December 2025
    Japan's Cica-Huntek joins TSMC supply chain
    Cica-Huntek Chemical Technology, a joint venture between Japan's Kanto Chemical and Huntek Systems, has entered the TSMC supply chain. The company has benefited from Kanto Chemical's...
    Tuesday 9 December 2025
    Samsung moves to narrow gap with TSMC as silicon photonics race heats up
    Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
    Monday 8 December 2025
    Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
    Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
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    DigiKey India Celebrates Official Launch in Bengaluru
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    MiTwell Unleashes Edge AI Computing Power: Building an OSM + AMC Modular Ecosystem
    Thursday 11 December 2025
    AGI Technology Gears Up for CES 2026, Debuting Ultra-Fast Gen5 SSD and DDR5 Innovations
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