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    Germany’s EV subsidies mostly benefited Tesla, while China-made vehicles followed
    5h 47min ago
    Memory supply crunch pushes long-term contracts beyond the big three
    5h 47min ago
    China’s polysilicon makers set a cost floor as solar losses widen
    5h 48min ago
    DB HiTek benefits from TSMC and Samsung 8-inch wafer line scale back
    5h 48min ago
    Memory giants hold US$38 billion in cash collateral as buyer leverage may return in 2029
    5h 48min ago
    Fudan researchers unveil room-temperature single-electron memory using 2D materials
    5h 48min ago
    NEWS TAGGED TSMC
    Tuesday 11 August 2026
    TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

    TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

    Tuesday 11 August 2026
    TSMC finally catching up to AI packaging demand after years of doubling capacity: 'CoWoS guy' Jun He

    TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than...

    Tuesday 11 August 2026
    Microsoft seeks expanded Maia 300 production to tap into demand for cheaper compute
    Microsoft plans to unveil its new Maia 300 accelerator chip this fall, with a public announcement possible as early as next month, according to The Information. Although Microsoft...
    Tuesday 11 August 2026
    Amkor reportedly weighs China stake sale as multinationals reassess footprint
    Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
    Monday 10 August 2026
    Sony, TSMC to spend US$6.3 billion on Japan image sensor venture, Nikkei says

    Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint...

    Monday 10 August 2026
    TSMC July revenue jumps 44.7% to record US$14.5B, 2026 growth forecast tops 40%

    Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July...

    Monday 10 August 2026
    Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
    AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
    Saturday 8 August 2026
    TSMC vs. UMC and beyond: the hostile bids that forged Taiwan's chip dominance

    Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and...

    Friday 7 August 2026
    Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
    TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
    Thursday 6 August 2026
    Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

    Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...

    Thursday 6 August 2026
    GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
    GlobalFoundries (GF) often presents itself as an essential pillar of US semiconductor sovereignty. That claim is partly true, but requires qualification.
    Thursday 6 August 2026
    TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Wednesday 5 August 2026
    AMD says server CPU market to hit US$220B by 2030

    AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

    Wednesday 5 August 2026
    Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
    Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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