News tagged DRAM at DIGITIMES

NEWS TAGGED DRAM

Friday 11 September 2026

Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...

Friday 11 September 2026

Memory makers gain the upper hand as Apple's iPhones pay the price

Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.

Friday 11 September 2026

China's DRAM supply chain clears another materials hurdle

China's semiconductor localisation effort has reached another upstream materials milestone. Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...

Friday 11 September 2026

d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics

AI chip startup d-Matrix is adopting Nvidia's NVLink Fusion technology to bring its next-generation Raptor inference processors into Nvidia MGX racks, giving the company a path into...

Friday 11 September 2026

Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry...

Thursday 10 September 2026

Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory

Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose...

Thursday 10 September 2026

SK Hynix says 3D DRAM will borrow from logic foundry playbook

SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...

Thursday 10 September 2026

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Wednesday 9 September 2026

CXMT's 10% DRAM share intensifies debate over South Korea's 52-hour workweek

China's rapid advance in DRAM is intensifying debate in South Korea over whether rigid working-hour rules could make it harder to preserve...

Tuesday 8 September 2026

CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation

Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...

Tuesday 8 September 2026

Samsung allocates more than half of 4nm foundry capacity to HBM4

Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...

Monday 7 September 2026

HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days

Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...

Monday 7 September 2026

SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E

SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...

Monday 7 September 2026

Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV

China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...

Sunday 6 September 2026

TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy

Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...

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Sep 11, 08:00

DAS Expands in Taiwan and Unveils World First at SEMICON

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