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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    3h 13min ago
    LB Semicon begins shipments to Qualcomm after two-year partnership
    3h 13min ago
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    3h 13min ago
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    3h 13min ago
    CPO testing shifts upstream as equipment makers vie for integration lead
    3h 13min ago
    NEWS TAGGED DRAM
    Thursday 3 September 2026
    CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

    Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

    Thursday 3 September 2026
    Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
    Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
    Thursday 3 September 2026
    CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
    South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology...
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
    Tuesday 1 September 2026
    Micron opens Tainan plant after 6.5 months amid labor dispute
    Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
    Tuesday 1 September 2026
    SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
    SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
    Tuesday 1 September 2026
    China's memory chipmakers post a record 1H — but not all of it came from chips
    Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
    Tuesday 1 September 2026
    Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
    China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
    Tuesday 1 September 2026
    Samsung locks 70% of memory output as HBM spot prices soar
    Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
    Tuesday 1 September 2026
    Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
    China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
    Tuesday 1 September 2026
    Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
    Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
    Monday 31 August 2026
    CXMT's global DRAM push runs into US curbs

    ChangXin Memory Technologies (CXMT) is suing the Pentagon to overturn its designation as a Chinese military company as the Chinese DRAM...

    Friday 28 August 2026
    China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
    China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
    1/44 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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