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NEWS TAGGED DRAM
Wednesday 28 October 2026
SK Hynix says customers want more than twice the HBM it can supply
SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Wednesday 28 October 2026
SK Hynix's next AI memory bet isn't HBM
SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically...
Wednesday 28 October 2026
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
China's CXMT has reportedly declined Apple's inquiry about purchasing DRAM, prioritizing supply to domestic customers instead. As global memory supplies tighten and prices rise, the...
Tuesday 27 October 2026
PSMC capacity crunch holds back Jeju Semiconductor's growth
South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth...
Tuesday 27 October 2026
Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26,...
Tuesday 27 October 2026
DRAM price gains fall short as supply shrinks up to 50%
DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect...
Saturday 24 October 2026
Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open
Nvidia CEO Jensen Huang said the company did not expect memory supply to exceed demand in the coming years and remained open to working with China's ChangXin Memory Technologies (CXMT)...
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

Thursday 22 October 2026
PSMC raises mature-node prices again, targets 20% increase in 2027
Powerchip Semiconductor Manufacturing (PSMC) reported third-quarter 2026 revenue of NT$21.3 billion (US$654.3 million), up 23% quarter-over-quarter, as higher foundry prices, a stronger...
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development,...
Thursday 22 October 2026
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Wednesday 21 October 2026
Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved
With a strike by Micron Taiwan employees looming, Micron Technology said Micron Memory Taiwan and the Taichung chapter of the Taiwan Micron Memory Union had reached agreement on several...
Wednesday 21 October 2026
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...