TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...

TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.

Prime Minister Fumio Kishida's administration is drafting legislation to propel further investment in chipmaking capacity at home.

Sharp has made a strategic move to enhance its mobile device wireless communication technology by acquiring communication patents from Foxconn. This acquisition aims to strengthen...

As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.

Fanuc America, a subsidiary of Japan-based Fanuc, has completed construction of its new West Campus facility in Auburn Hills, Michigan. This marks Fanuc's second US facility since...

Thanks to improving demands in the smartphone and notebook markets, Japanese passive component suppliers are likely to raise inductor prices. However, Taiwanese suppliers believe...