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NEWS TAGGED STATS CHIPPAC
Friday 31 October 2025
UMC and Samsung present advanced packaging trends at APDC 2025
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
Thursday 30 October 2025
STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

Thursday 30 October 2025
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
Tuesday 5 January 2021
Backend house Winstek to enjoy 10% sales growth in 2021
IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
Wednesday 16 December 2020
Taiwan backend firms developing silicon photonics solutions
ASE Technology and Winstek Semiconductor are developing backend solutions for silicon photonics ICs and modules, according to industry sources.
Monday 7 December 2020
Taiwan backend houses see orders boom
Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Tuesday 1 December 2020
Taiwan backend firms, IC distributors to gain from fresh US ban on Chinese peers
The US Department of Commerce reportedly will place another 89 Chinese tech firms on its MEU (military end user) control list including JCET's subsidiary STATS ChipPAC and IC distributor...
Tuesday 24 November 2020
Winstek set to land more backend orders for blockchain AI chips
IC backend service provider Winstek Semiconductor (formerly STATS ChipPAC Taiwan) is expected to see a surge in demand for blockchain-use AI chips in December, according to company...
Friday 17 July 2020
Top China backend firms gaining significant expansion momentum
China's top-3 backend houses JCET, Huatian Technology and Tongfu Microelectronics, now all among the world's top-10 IC assembly and testing firms, are gaining increasing business...
Thursday 2 July 2020
China top-3 OSAT firms to see combined revenues rise 8% in 2020, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics - are expected to see their combined revenues increase...
Friday 19 June 2020
GPTC to supply equipment for new TSMC packaging plant
Grand Plastic Technology (GPTC), specializing in wet process facilities, will see equipment orders for TSMC's new advanced packaging plant in Taiwan start generating revenues in 2021,...
Thursday 26 December 2019
Chinese backend firm JCET enters supply chain of Samsung, LG
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Thursday 29 August 2019
Sigurd, Winstek step up capacity expansion pace
IC backend houses Sigurd Microelectronics and Winstek Semiconductor both plan to expand production capacity aiming to satisfy growing demand for 5G-related chips and blockchain ASI...
Thursday 7 June 2018
KYEC May revenues reach 8-month high, Sigurd hit record
IC testing service provider King Yuan Electronics (KYEC) saw its May revenues climb to an 8-month high of NT$1.71 billion (US$57.6 million), while fellow company Sigurd Microelectronics...
Tuesday 10 April 2018
KYEC, Sigurd fab utilization rates stay high
IC testing service providers King Yuan Electronics (KYEC) and Sigurd Microelectronics both see their fab utilization rates stay high at between 80% and 85%, driven by robust demand...