Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...

IC backend service companies STATS ChipPAC Taiwan and Sigurd Microelectronics have received a handful of orders that will help them sustain strong revenues in the third quarter of...

IC backend services companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Ardentec, are expected to see their revenues...

STATS ChipPAC has announced it has reduced package-on-package (PoP) height with its ultra thin embedded wafer level ball grid array (eWLB) technology. The eWLB-based PoP solutions...

Wafer probing service provider STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, saw its second-quarter sales increase more than 15% sequentially...

STATS ChipPAC, which provides IC assembly and test services to semiconductor companies and electronics OEMs, has unveiled plans to consolidate manufacturing at its production units...

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments...

STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

Taiwan-based IC testing firms King Yuan Electronics (KYEC) and Ardentec are expected to post sales decreases of up to 10% sequentially in the first quarter of 2013, in line with seasonal...

Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, is expected to enjoy a particularly strong first quarter of 2013 buoyed by strong...