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NEWS TAGGED STATS CHIPPAC
Wednesday 8 March 2017
STATS ChipPAC Taiwan swings back to profitability in 2016
IC backend service supplier STATS ChipPAC Taiwan Semiconductor has reported net profits of NT$611 million (US$19.78 million) for 2016 compared to a net loss of NT$164 million of a...
Thursday 21 July 2016
STATS ChipPAC performing below expectations, says report
The performance of STATS ChipPAC still has been lower than expected in recent quarters following its acquisition by China-based Jiangsu Changjiang Electronics Technology for US$780...
Wednesday 11 May 2016
STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units
STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company...
Thursday 14 April 2016
ASE grabs major SiP module orders for second-generation Apple Watch, sources say
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...
Tuesday 21 April 2015
Two STATS ChipPAC subsidiaries in Taiwan merge
IC testing house STATS ChipPAC Taiwan Semiconductor (SCT), a 52%-hold subsidiary of STATS ChipPAC, will complete its acquisition of STATS ChipPAC Taiwan, a wholly-owned subsidiary...
Tuesday 6 January 2015
STATS ChipPAC to relocate China plant
STATS ChipPAC has announced plans to relocate the company's wholly-owned subsidiary, STATS ChipPAC Shanghai (SCC), to a new manufacturing site in China.
Tuesday 23 December 2014
SMIC joins China group for STATS ChipPAC takeover
Semiconductor Manufacturing International (SMIC) will be part of a group of China-based investors looking to buy STATS ChipPAC. The IC foundry has announced that its subsidiary SilTech...
Friday 7 November 2014
China firm in talks to buy STATS ChipPAC
Jiangsu Changjiang Electronics Technology has made a non-binding proposal to STATS ChipPAC to acquire all the shares in STATS ChipPAC on a fully diluted basis for an aggregate purchase...
Wednesday 25 June 2014
STATS ChipPAC puts up for sale
STATS ChipPAC, the world's fourth-largest IC backend service company, has put itself up for sale with Advanced Semiconductor Engineering (ASE), Changjiang Electronics Technology,...
Friday 14 March 2014
STATS ChipPAC Taiwan posts EPS over NT$4 for 2013
IC backend service company STATS ChipPAC Taiwan saw its net profits climb 11.2% to NT$547.62 million (US$18.04 million) in 2013. The earnings translated into an EPS of NT$4.02 for...
Wednesday 12 March 2014
STATS ChipPAC introduces FlexLine wafer level packaging method
STATS ChipPAC has designed and implemented a new manufacturing method for wafer level packaging (WLP). This new approach is known as FlexLine.
Wednesday 26 February 2014
STATS ChipPAC fcCuBE technology achieves significant growth in 2013
STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and...
Monday 27 January 2014
Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources
Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...
Tuesday 10 September 2013
STATS ChipPAC, Sigurd look to sustained growth in 3Q13
IC backend service companies STATS ChipPAC Taiwan and Sigurd Microelectronics have received a handful of orders that will help them sustain strong revenues in the third quarter of...
Wednesday 21 August 2013
IC backend services firms to see revenues peak in 3Q13
IC backend services companies, including King Yuan Electronics (KYEC), Sigurd Microelectronics, STATS ChipPAC Taiwan Semiconductor and Ardentec, are expected to see their revenues...
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